WO2013065861A1 - 電子部品の製造装置、電子部品の製造方法、およびｌｅｄ照明の製造方法 - Google Patents

電子部品の製造装置、電子部品の製造方法、およびｌｅｄ照明の製造方法 Download PDF

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Publication number
WO2013065861A1
WO2013065861A1 PCT/JP2012/078557 JP2012078557W WO2013065861A1 WO 2013065861 A1 WO2013065861 A1 WO 2013065861A1 JP 2012078557 W JP2012078557 W JP 2012078557W WO 2013065861 A1 WO2013065861 A1 WO 2013065861A1
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WO
WIPO (PCT)
Prior art keywords
substrate
manufacturing
solder
electronic component
wiring board
Prior art date
Application number
PCT/JP2012/078557
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
恒平 池田
冨田　秀司
塚本　奈巳
Original Assignee
日清紡メカトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日清紡メカトロニクス株式会社 filed Critical 日清紡メカトロニクス株式会社
Priority to CN201280063305.6A priority Critical patent/CN103999560A/zh
Priority to KR1020147014690A priority patent/KR20140087049A/ko
Publication of WO2013065861A1 publication Critical patent/WO2013065861A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1581—Treating the backside of the PCB, e.g. for heating during soldering or providing a liquid coating on the backside

Definitions

  • the present invention relates to an electronic component manufacturing apparatus, an electronic component manufacturing method, and an LED lighting manufacturing method including steps of the manufacturing method for manufacturing an electronic component by mounting an electronic element on a printed wiring board.
  • a reflow method is a main method for soldering the electronic device to the printed wiring board. This is because electronic elements are mounted on the wiring pattern on the surface of the printed wiring board via solder, and then the printed wiring board is transported into a reflow furnace and hot air at a predetermined temperature is blown to the printed wiring board in the reflow furnace. By soldering, the solder paste is melted and the electronic element is soldered to the printed wiring board.
  • the temperature in the reflow furnace is about 250 ° C. to 260 ° C.
  • the reflow method requires a high temperature as described above and heats not only the solder but also the entire substrate and the electronic element. For this reason, there are problems that the substrate is distorted and the quality is affected, the electronic element is adversely affected by heat, or in the case of a long substrate, a long reflow furnace is required. As an adverse effect on the electronic element, if the electronic element is an LED, the fluorescent agent in the LED part deteriorates when exposed to the heat of the reflow furnace for a long time, and as a result, sufficient luminance cannot be obtained. There was also.
  • solder 404 is directly irradiated with light from the surface side of the printed wiring board 422.
  • a method is known in which solder is melted and an electronic element is soldered to a printed wiring board.
  • Patent Document 1 describes a method of irradiating light with a laser from the back side of a printed wiring board on which an electronic component is placed via solder, melting the solder, and soldering the electronic element to the printed wiring board.
  • an electronic element 508 is placed on a wiring pattern 522B of a printed wiring board 522 composed of a flexible substrate 522A mainly composed of polyimide resin and a wiring pattern 522B through solder 504,
  • Light is irradiated from the back surface 524 side of the printed wiring board by a YAG laser or the like.
  • the laser beam does not pass through the substrate 522A, and the substrate 522A absorbs the laser beam.
  • the substrate 522A is heated, and the heat is transferred from the substrate 522A to the solder 504, thereby melting the solder.
  • Patent Document 2 an opening is provided in the substrate, a conductive member and solder on the conductive member are disposed in the opening, and the conductive member is irradiated with light from the back surface side of the substrate. A method of heating solder indirectly through a conductive member is described. JP 2001-111207 A JP 2006-278385 A
  • the conventional soldering method using a laser has the following problems.
  • Patent Document 2 Furthermore, the method described in Patent Document 2 is not practical because an opening is provided in the substrate.
  • An object of the present invention is to provide an electronic component manufacturing apparatus and an electronic component manufacturing method together with an LED lighting manufacturing method including the manufacturing method.
  • a method of manufacturing an electronic component in which an electronic element is mounted on a printed circuit board having a wiring pattern on the substrate and the printed circuit board to obtain an electronic component, and supplying solder onto the wiring pattern of the printed wiring board And a step of placing an electronic element on the solder, and a laser beam having a light emission center wavelength in the near infrared region from the back side of the printed wiring board toward the solder on which the electronic element is placed. Irradiating, and the light passes through the substrate to reach the wiring pattern, heats the wiring pattern to melt the solder, and solders the electronic element to the printed wiring board.
  • a method for manufacturing an electronic component comprising: (2) The method for manufacturing an electronic component according to (1), wherein the transmittance of the substrate at the emission center wavelength of light irradiated from the back surface of the printed wiring board is 20% or more. (3) The method for manufacturing an electronic component according to (1) or (2), wherein the substrate is a flexible substrate. (4) The method for manufacturing an electronic component according to (3), wherein the substrate is a substrate containing PET and / or PEN. (5) The printed wiring board is stretched between a pair of reels, and the plurality of electronic elements are continuously mounted on the printed wiring board while the printed wiring board is running between both reels. ) Or the manufacturing method of the electronic component according to (4).
  • a method for manufacturing LED lighting further comprising a step of manufacturing LED lighting from the electronic component in addition to the steps in the method for manufacturing electronic component according to (8) or (9).
  • An electronic component manufacturing apparatus that mounts an electronic element on a printed circuit board having a wiring pattern on the substrate and the substrate, the supply device supplying solder to the wiring pattern on the printed wiring board, The mounting device for mounting the electronic element on the solder and the light having the emission center wavelength in the near infrared region are irradiated from the back side of the printed wiring board toward the solder on which the electronic element is mounted.
  • a laser and The light passes through the substrate to reach the wiring pattern, heats the wiring pattern to melt the solder, and solders the electronic element to the printed wiring board. Manufacturing equipment.
  • the present invention it is possible to solder the electronic element to the printed wiring board in a shorter time than before by suppressing the damage of the electronic element, the scattering of the solder, and the damage of the substrate.
  • FIG. 1 is a schematic view showing an electronic component manufacturing apparatus according to the present invention.
  • FIG. 2 is an enlarged schematic view showing a portion to be soldered by laser irradiation in the apparatus shown in FIG.
  • FIG. 3 is a schematic perspective view of the LED illumination obtained by the LED illumination manufacturing method according to the present invention.
  • FIG. 4 is an enlarged schematic view showing a soldering portion by laser irradiation in a conventional electronic component manufacturing apparatus.
  • FIG. 5 is an enlarged schematic view showing a soldering portion by laser irradiation in another conventional electronic component manufacturing apparatus.
  • the manufacturing apparatus 100 manufactures an electronic component 112 by mounting an electronic element 108 on a printed wiring board 122 having a substrate 122A and a wiring pattern 122B on the substrate 122A.
  • the “printed wiring board” includes a substrate and a wiring pattern formed on the substrate, and does not include an electronic element to be mounted.
  • the manufacturing apparatus 100 includes a supply device 102 that supplies the solder 104 onto the wiring pattern 122B of the printed wiring board.
  • the supply device 102 is not particularly limited, but is preferably a non-contact dispenser.
  • the non-contact dispenser connects a tank for containing solder, a discharge nozzle for discharging the solder to the printed wiring board from a position separated from the printed wiring board, and a discharge nozzle from the tank.
  • a predetermined amount of solder can be supplied from a position separated from the printed wiring board.
  • the manufacturing apparatus 100 includes a mounting device 106 that mounts the electronic element 108 on the solder 104.
  • the mounting device 106 is not particularly limited, and a conventionally known mounting device such as a chip mounter can be used.
  • the manufacturing apparatus 100 has a laser 110.
  • the laser 100 emits light having an emission center wavelength in the near infrared region toward the solder 104 on which the electronic element 108 is mounted. Irradiate from 124 side. The irradiated light passes through the substrate 122A and reaches the wiring pattern 122B, heats the wiring pattern 122B, and the solder 104 melts. Thus, the electronic element 108 is soldered to the printed wiring board 122.
  • the emitted light preferably has an emission center wavelength in the range of 800 nm to 1100 nm.
  • the present inventors will select the board
  • the laser 110 is not particularly limited as long as the emission center wavelength can be set in the above range, and a semiconductor laser having an emission center wavelength of 920 nm, an Nd-YAG laser of 1064 nm, or the like can be used.
  • the “emission center wavelength” means a wavelength showing the highest light amount in the spectrum of light emitted from the laser.
  • the back surface of the printed wiring board means that the back surface of the pair of main surfaces of the printed wiring board when the surface on which the electronic element is mounted is the front surface, that is, the electronic device is mounted. It means the surface that does not.
  • the manufacturing apparatus 100 may have an inspection apparatus 114.
  • an inspection apparatus 114 For example, when an LED is used as the electronic element 108, an actual spot check device can be used.
  • the method for inserting the printed wiring board into the manufacturing apparatus is not particularly limited. As shown in FIG. 1, the printed wiring board 122 is stretched between a pair of reels 118 and 120, and the printed wiring board 122 runs between both reels. However, a reel-to-reel system in which a plurality of electronic elements 108 are continuously mounted on the printed wiring board 122 can be employed.
  • This manufacturing method includes a step of supplying the solder 104 onto the wiring pattern 122B of the printed wiring board 122, a step of placing the electronic element 108 on the solder 104, and a step toward the solder 104 on which the electronic element 108 is placed. Irradiating light having an emission center wavelength in the near-infrared region with a laser from the back surface 124 side of the printed wiring board 122, and the light passes through the substrate 122A and reaches the wiring pattern 122B. The wiring pattern 122B is heated to melt the solder 104, and the electronic element 108 is soldered to the printed wiring board 122.
  • the present inventors when irradiated with laser light having a light emission center wavelength in the near infrared region from the back side of the printed wiring board including a substrate made of a predetermined material, it has been found that the wiring pattern can be heated while suppressing damage to the substrate.
  • the wiring pattern 122B is heated by the light transmitted through the substrate 122A, and heat is transferred from the wiring pattern 122B having good heat conduction efficiency to the solder 104, so that soldering can be performed in a shorter time than before. It becomes.
  • the laser beam has a very high energy, there is a high probability that the solder 104 will be scattered if the laser beam is directly applied to the solder 104.
  • near infrared light is emitted from the back side of the printed wiring board.
  • the light output from the laser and reaching the substrate is mainly transmitted through the substrate to heat the wiring pattern.
  • the other light is reflected from the back surface of the substrate or slightly absorbed by the substrate. That is, the present invention solders using light transmitted through the substrate, and does not directly use the heat transmitted from the substrate. For this reason, the burden on the substrate in the present invention is very light.
  • soldering is performed using a laser having a high energy density. be able to. Therefore, the present invention can perform soldering in a shorter time than the prior art.
  • a material that is not so strong against heat that has not been considered for use as a mounting substrate until now can also be used as a mounting substrate for electronic devices.
  • the laser beam used in the present invention has an emission center wavelength in the near infrared region. If the emission center wavelength is shorter than the near infrared region, the substrate may be damaged. In addition, when the emission center wavelength is longer than the near-infrared region, the energy is very low, so it takes time to melt the solder, and the effect of the present invention that the soldering in a short time is possible is sufficiently exhibited. There is a risk that it will not be possible. From this viewpoint, the emission center wavelength is preferably in the range of 800 nm to 1100 nm.
  • the transmittance of the substrate at the emission center wavelength of light irradiated from the back surface of the printed wiring board is preferably higher from the viewpoint of energy efficiency. Specifically, it is preferable to select a substrate having a transmittance of 20% or more at the light emission center wavelength. If the transmittance of the substrate is less than 20%, it may take time to melt the solder.
  • the material of the substrate 122A polyethylene terephthalate (PET), polyethylene naphthalate (PEN), glass, or the like is preferable.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • a substrate containing PET and / or PEN is hydrolyzed by heat in the conventional reflow method, but according to the present invention, it can be used without being melted or being burnt.
  • a flexible substrate with a flexible material having a predetermined thickness or less can be selected as the substrate 122A. Since the flexible substrate is vulnerable to heat, use in a reflow method or a method of heating a substrate as disclosed in Patent Document 1 is not practical. Since the load due to heat is small, a flexible substrate can be preferably used. By using a flexible substrate, the above-described reel-to-reel mounting device can be used. Thereby, productivity of an electronic component can be improved.
  • the irradiation diameter of the laser beam is approximately equal to the size of the wiring pattern on the substrate surface. If the pattern size is 20% or less, the substrate may be damaged by excessive energy per unit area, and if it is 100% or more, the electronic device on the upper surface may be damaged.
  • the laser irradiation time should be 1 second or less. Can do. For this reason, productivity can be improved greatly.
  • the electronic element 108 is preferably an LED element.
  • the soldering by the conventional reflow method cannot obtain a sufficient life as described above.
  • the soldering according to the present invention it is possible to manufacture an LED component having a longer life than the conventional one. it can.
  • the electronic elements to be mounted are not limited to LEDs, but include chip capacitors, chip resistors, sensor parts such as CCD (charge coupled devices), general semiconductor parts BGA (ball grid array), GFP (Quad Flat Package), CSP (Chip size package) may be used.
  • the LED lighting manufacturing method further includes a step of manufacturing the LED lighting from the LED component.
  • the above-described method for manufacturing an electronic component is very useful for manufacturing a fluorescent lamp type LED.
  • the temperature distribution is uneven within the long reflow furnace, so if a long printed wiring board of about 1.2 m, for example, is introduced into the reflow furnace, the substrate is distorted and the quality is affected.
  • a long printed wiring board of about 1.2 m for example, is introduced into the reflow furnace, the substrate is distorted and the quality is affected.
  • the currently popular 1.2 m Produced long fluorescent lamp type LED lighting This takes time and labor to connect, and causes problems such as half insertion of the connector and pin misalignment.
  • it is possible to manufacture LED components having a desired length by continuously mounting a plurality of LED elements on a printed wiring board having a desired length.
  • FIG. 3 is a schematic perspective view of the LED illumination obtained by the LED illumination manufacturing method according to the present invention.
  • the LED component 204 is fixed with a heat conductive adhesive 208 on the aluminum base 210 in the diffusion cover 202, and the heat generated from the LED component 204 is heat conduction. The heat is dissipated from the aluminum base 210 by being conducted to the aluminum base 210 through the adhesive 208.
  • Example 1 Manufacture of LED parts
  • a substrate made of PET was used, and in Example 2, a substrate made of PEN was used.
  • a wiring pattern was formed on each substrate by etching a copper foil by a known method, and a printed wiring board was produced.
  • Each of the substrates used in Examples 1 and 2 has a thickness of 50 ⁇ m and has flexibility.
  • Cream solder was supplied onto the wiring pattern on the printed wiring board using a non-contact jet dispenser (Musano Engineering Co., Ltd .: Jet Master).
  • the LED element was mounted on the cream solder using a mounter (Okuhara Electric Co., Ltd .: tabletop mounter).
  • the laser output is adjusted to 12.5 W, the irradiation diameter on the substrate surface is 0.4 mm, and the printed wiring board
  • the solder was applied by irradiating light toward the solder on which the LED element was placed from the back side of the substrate.
  • substrate in the light emission center wavelength in each test example was 75%, when it measured previously using the spectrometer (the Hamamatsu Photonics company make: model number C10082MD).
  • the irradiated light can pass through the substrate and reach the wiring pattern, the wiring pattern can be heated to melt the solder, and the LED can be soldered to the printed wiring board. It was.
  • the LED since the laser was not irradiated from the front side of the printed wiring board, the LED was not damaged.
  • an electronic component can be soldered to a printed wiring board in a shorter time than before by suppressing damage to the electronic element, scattering of solder, and damage to the substrate.
  • a manufacturing apparatus and a manufacturing method of an electronic component can be provided together with a manufacturing method of LED lighting including the manufacturing method.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
PCT/JP2012/078557 2011-10-31 2012-10-30 電子部品の製造装置、電子部品の製造方法、およびｌｅｄ照明の製造方法 WO2013065861A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201280063305.6A CN103999560A (zh) 2011-10-31 2012-10-30 电子部件的制造装置、电子部件的制造方法以及led照明装置的制造方法
KR1020147014690A KR20140087049A (ko) 2011-10-31 2012-10-30 전자 부품의 제조 장치, 전자 부품의 제조 방법, 및 led 조명의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011239654A JP2013098338A (ja) 2011-10-31 2011-10-31 電子部品の製造装置、電子部品の製造方法、およびｌｅｄ照明の製造方法
JP2011-239654 2011-10-31

Publications (1)

Publication Number Publication Date
WO2013065861A1 true WO2013065861A1 (ja) 2013-05-10

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PCT/JP2012/078557 WO2013065861A1 (ja) 2011-10-31 2012-10-30 電子部品の製造装置、電子部品の製造方法、およびｌｅｄ照明の製造方法

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JP (1) JP2013098338A (ko)
KR (1) KR20140087049A (ko)
CN (1) CN103999560A (ko)
TW (1) TW201340424A (ko)
WO (1) WO2013065861A1 (ko)

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JP2019518334A (ja) * 2016-06-10 2019-06-27 クルーシャル マシンズ カンパニー リミテッド リールツーリールレーザーリフロー装置および方法

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CN106475652A (zh) * 2016-12-28 2017-03-08 广东三泰迈高光电科技有限公司 一种led软灯条fpc整板焊接设备
JP6785650B2 (ja) * 2016-12-28 2020-11-18 アズビル株式会社 部品実装装置及び部品実装方法
KR20180081899A (ko) * 2017-01-09 2018-07-18 (주)워프비전 롤투롤 리플로우 장치 및 방법과 이 방법을 이용한 smt공정
CN107538097B (zh) * 2017-07-14 2019-06-11 浙江美科电器有限公司 一种用于加工led灯的模具
CN107477531B (zh) * 2017-07-14 2019-04-12 浙江美科电器有限公司 一种用于led灯具加工的生产线
CA3088725A1 (en) * 2018-01-19 2019-07-25 Ncc Nano, Llc Method for curing solder paste on a thermally fragile substrate
CN108613024B (zh) * 2018-04-03 2021-01-15 澳洋集团有限公司 一种用于led芯片组件的侧向安装调节支架
TWI751449B (zh) * 2019-11-12 2022-01-01 博隆精密科技股份有限公司 雷射加工佈線方法
CN113573497A (zh) * 2020-04-29 2021-10-29 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
KR102176615B1 (ko) * 2020-07-03 2020-11-09 (주)디바이스이엔지 디스플레이 소자의 트랜스퍼 장치 및 트랜스퍼 방법

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JP2000183079A (ja) * 1998-12-17 2000-06-30 Fuji Electric Co Ltd 素子接合装置
JP2003249749A (ja) * 2002-02-22 2003-09-05 Seiko Epson Corp 半導体装置の製造方法及び製造装置
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Publication number Priority date Publication date Assignee Title
JP2019518334A (ja) * 2016-06-10 2019-06-27 クルーシャル マシンズ カンパニー リミテッド リールツーリールレーザーリフロー装置および方法
US11257783B2 (en) 2016-06-10 2022-02-22 Laserssel Co., Ltd. Device and method for reel-to-reel laser reflow
US11515287B2 (en) 2016-06-10 2022-11-29 Laserssel Co., Ltd. Device and method for reel-to-reel laser reflow

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JP2013098338A (ja) 2013-05-20
CN103999560A (zh) 2014-08-20
TW201340424A (zh) 2013-10-01
KR20140087049A (ko) 2014-07-08

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