WO2013054849A1 - 基板処理装置 - Google Patents

基板処理装置 Download PDF

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Publication number
WO2013054849A1
WO2013054849A1 PCT/JP2012/076330 JP2012076330W WO2013054849A1 WO 2013054849 A1 WO2013054849 A1 WO 2013054849A1 JP 2012076330 W JP2012076330 W JP 2012076330W WO 2013054849 A1 WO2013054849 A1 WO 2013054849A1
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WO
WIPO (PCT)
Prior art keywords
transport block
block
processing apparatus
substrate processing
pressure
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PCT/JP2012/076330
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English (en)
French (fr)
Japanese (ja)
Inventor
純也 南田
一成 上田
祥吾 木山
Original Assignee
東京エレクトロン株式会社
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Publication of WO2013054849A1 publication Critical patent/WO2013054849A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement

Definitions

  • the present invention relates to a technique for forming a downflow in a substrate transport block provided in a substrate processing apparatus.
  • a wafer which is a substrate
  • various chemicals cleaning liquids
  • Substrate processing apparatuses that perform various process processes in the substrate processing unit, such as a liquid process for removing a film or a natural oxide film, a resist film application in a photolithography process, and a development process, are used.
  • a plurality of substrate processing units are connected to a transfer block having a wafer transfer mechanism (substrate transfer mechanism) so that a plurality of wafers can be processed in parallel. is there. Furthermore, if a plurality of transfer blocks are connected to the mechanism for delivering wafers from the carrier, the number of substrate processing units can be increased and the number of wafers processed per unit time can be increased.
  • a wafer transfer mechanism substrate transfer mechanism
  • a clean gas for example, clean air
  • FFU fan filter unit
  • the FFU is a device in which a filter capable of collecting minute particles is arranged on the discharge side of the blower fan. By providing this FFU on the ceiling of the transport block, a downflow can be formed in the space below the FFU. it can. By providing an exhaust fan on the bottom side of the transport block and performing so-called push-pull supply and exhaust, the downflow is uniform and less disturbed.
  • Patent Document 2 various processing mechanisms (substrate processing units) such as a resist coating mechanism and a developing mechanism that performs development after exposure are stacked in multiple stages, and a plurality of processing units configured by stacking these processing mechanisms. Describes a resist processing apparatus (substrate processing apparatus) in which a transport path (transport block) extending in the vertical direction is formed by disposing them apart from each other, and a wafer transfer mechanism (substrate transport mechanism) is provided in the transport path. Has been. Further, in this resist processing apparatus, two sets of the processing mechanism and the wafer transfer mechanism are arranged vertically, and clean gas is supplied through a filter portion provided at the upper part of each wafer transfer mechanism, and each of the transfer paths is passed through. A downflow is formed. However, this Patent Document 2 does not describe a method for supplying clean gas into each conveyance path, but describes a method for solving the problems such as restrictions on downsizing of the substrate processing apparatus and increase in energy consumption. There is no mention or suggestion.
  • JP 2005-72374 paragraphs 0029-0030, FIG. Japanese Patent Laid-Open No. 9-171961: claim 10, paragraphs 0019, 0021, FIG.
  • the present invention has been made under such a background, and an object of the present invention is to provide a substrate processing apparatus that is small in size and consumes less energy when forming a downflow in a substrate transport block.
  • the present invention is provided by stacking a first transport block having a first substrate transport mechanism for transporting a substrate to a first substrate processing unit, and a lower side of the first transport block.
  • a second transport block having a second substrate transport mechanism for transporting the substrate to the second substrate processing unit, and an upper portion of the first transport block;
  • a first fan filter unit that supplies a clean gas toward the head, and a second fan filter unit that is provided on an upper portion of the second transport block, and the first transport block has an exhaust port at the bottom.
  • the substrate processing apparatus is characterized in that the second fan filter unit supplies the clean gas taken in through the exhaust port into the second transport block.
  • the above-described substrate processing apparatus may have the following features.
  • the first substrate transport mechanism includes a substrate holding portion and a travel guide mechanism portion that is provided at a bottom portion of the first transport block and travels by the substrate support portion. Is provided with a vent for allowing the down flow in the first transport block to pass toward the second fan filter unit.
  • the travel guide mechanism section is provided with an intermediate fan that sends downflow that has passed through the vent toward the second fan filter unit.
  • An opening for taking in an external atmosphere is provided in a space communicating between the bottom of the first transport block and the suction port provided at the top of the second fan filter unit. .
  • the first fan filter unit and the second fan filter unit are provided with an air volume adjusting unit that adjusts the air flow rate, and the pressure in the first transfer block and the second transfer block And an air pressure adjusting unit so that the pressure in the first transfer block and the pressure in the second transfer block are aligned based on the detection results of the internal pressure detection units. And a control unit that outputs a control signal.
  • an external pressure detection unit for detecting the pressure outside the first transfer block and the second transfer block is provided, and the control unit includes the internal pressure detection unit and the external pressure detection unit. Based on the detection result, outputting a control signal to the air volume adjusting unit so that the pressure in the first transport block and the second transport block is higher than the external pressure.
  • a rectifying plate is provided on the ceiling of the first transport block, and an opening area of a clean gas supply port formed in the rectifying plate is an opening area of the exhaust port provided in the floor plate. Bigger than.
  • the present invention uses the second fan filter unit for forming the downflow in the second transport block as a fan for taking in the downflow flowing in the first transport block, the first transport block No special exhaust fan is required to exhaust the air. As a result, the installation space for the exhaust fan and the exhaust duct can be saved, and the energy consumption can be reduced.
  • the liquid processing apparatus 1 includes a placement block 11 on which a FOUP 100 that is a substrate storage container containing a plurality of wafers W is placed, and a placement block A loading / unloading block 12 for loading / unloading the wafer W from / from the FOUP 100 placed on the substrate 11, a delivery block 13 for delivering the wafer W between the loading / unloading block 12 and the subsequent liquid processing block 14, and a wafer. And a liquid processing block 14 for performing liquid processing on W.
  • the mounting block 11 When the mounting block 11 is in front, the mounting block 11, the carry-in / out block 12, the delivery block 13, and the liquid processing block 14 are provided adjacently in this order from the front side.
  • the mounting block 11 mounts a FOUP 100 that accommodates a plurality of wafers W in a horizontal state on a mounting table 111.
  • the carry-in / out block 12 carries the wafer W paid out from the FOUP 100.
  • the delivery block 13 delivers the wafer W.
  • the carry-in / out block 12 and the delivery block 13 are housed in a housing.
  • the loading / unloading block 12 has a wafer transfer mechanism 121.
  • the wafer transfer mechanism 121 has a transfer arm 122 that holds the wafer W and a mechanism that moves the transfer arm 122 back and forth. Further, the wafer transfer mechanism 121 is a mechanism that moves along a horizontal guide 123 (see FIG. 1) extending in the arrangement direction of the FOUP 100, a mechanism that moves along a vertical guide (not shown) provided in the vertical direction, and a transfer in a horizontal plane. It has a mechanism for rotating the arm 122. The wafer W is transferred between the FOUP 100 and the delivery block 13 by the wafer transfer mechanism 121.
  • the delivery block 13 has a delivery shelf 131 on which the wafer W can be placed.
  • the transfer shelf 131 includes a first transfer shelf 131a in which wafers W are loaded and unloaded with respect to the upper first processing block 141a, and a lower second processing block 141b. And a second delivery shelf 131b where wafers W are carried in and out.
  • the wafer W to be processed in the first processing block 141a is temporarily placed on the second delivery shelf 131b on the lower stage side, and is transferred by the transfer mechanism 132 (see FIG. 1) configured to be movable up and down in the vertical direction. 1 is transferred to one delivery shelf 131a.
  • the processed wafer W is transferred from the first transfer shelf 131a to the second transfer shelf 131b by the transfer mechanism 132, and is transferred toward the FOUP 100 by the wafer transfer mechanism 121. Yes.
  • the liquid processing block 14 is provided by laminating an upper first processing block 141a and a lower second processing block 141b.
  • a plurality of liquid processing units 2 are arranged in each processing block 141a, 141b, and a plurality of wafers W can be processed in parallel.
  • each of the processing blocks 141a and 141b has a plurality of right and left sides with the transport block (the first transport block 142a on the upper stage side and the second transport block 142b on the lower stage side) interposed therebetween. It is the structure which arranged the liquid processing part 2 of the stand.
  • the four liquid processing units 2 are arranged in two rows in two rows along the transport blocks 142a and 142b extending in the front-rear direction with the connection portion with the delivery block 13 as a base end. Therefore, the liquid processing apparatus 1 of this example includes a total of 16 liquid processing units 2.
  • the liquid processing unit 2 connected to the first transport block 142a on the upper side corresponds to the first substrate processing unit, and the liquid processing unit 2 connected to the second transport block 142b on the lower side is the second. Corresponds to the substrate processing section.
  • a wafer transfer mechanism 143 is provided in each stage of the transfer blocks 142a and 142b (the first transfer block 142a is the first substrate transfer mechanism, and the second transfer block 142b is the second transfer block 142a and 142b. Equivalent to a substrate transport mechanism).
  • These wafer transfer mechanisms 143 have substantially the same configuration. For example, as shown in FIG. 5, three fork portions 144 for holding the wafer W and these fork portions 144 in the lateral direction toward the liquid processing units 2.
  • a slide mechanism 147 that is slidable, a base portion 145 that rotatably supports the fork portion 144 and the slide mechanism 147 around a vertical axis, and a vertical guide 146 that is a mechanism for moving the base portion 145 in the vertical direction. It has.
  • the wafer transfer mechanism 143 transfers the wafer W between the above-described delivery shelves 131a and 131b and each liquid processing unit 2. Further, the fork portion 144, the slide mechanism 147, the base portion 145, and the vertical guide 146 correspond to the substrate holding portion of this example.
  • the vertical guide 146 of the wafer transfer mechanism 143 is connected to a drive mechanism provided in the travel guide mechanism portion 16 arranged so as to extend in the front-rear direction at the bottom of each transfer block 142a, 142b.
  • this drive mechanism has one end connected to a rotation motor 171 that can rotate forward and backward, a ball screw 172 that extends in the horizontal direction, and a female screw that can move laterally on the ball screw 172 by the rotation of the ball screw 172.
  • the travel guide mechanism unit 16 includes a special feature for forming a uniform downflow in the first transport block 142a and the second transport block 142b, and details thereof will be described later.
  • Each liquid processing unit 2 provided in the processing blocks 141a and 141b can perform the liquid processing of the wafer W one by one by, for example, spin processing.
  • the liquid processing unit 2 holds the wafer W substantially horizontally by the wafer holding mechanism 23 disposed in the outer chamber 21, and moves the wafer holding mechanism 23 around the vertical axis.
  • the wafer W is rotated by rotating it.
  • the nozzle arm 24 is advanced above the rotating wafer W, and the processing liquid and the rinsing liquid are supplied in a predetermined order from the nozzle 241 provided at the tip of the wafer W, whereby the upper surface side of the wafer (the surface is directed to the upper surface).
  • Liquid treatment is performed on the front surface and the back surface when the back surface is directed to the top surface.
  • Liquid treatment is, for example, removal of particles and organic pollutants with SC1 solution (a mixture of ammonia and hydrogen peroxide solution), which is an alkaline treatment solution, and rinse with deionized water (DIW), which is a rinse solution.
  • SC1 solution a mixture of ammonia and hydrogen peroxide solution
  • DIW deionized water
  • DIW deionized water
  • IPA IsoPropyl Alcohol
  • the first transport block 142a and the second transport block 142b that are stacked one above the other include the transport blocks 142a and 142b.
  • a first FFU 31 (first fan filter unit) and a second FFU 32 (first fan filter unit) for forming a clean gas downflow are provided therein.
  • the liquid processing apparatus 1 of this example cleans the 2nd conveyance block 142b of the lower stage side.
  • the second FFU 32 that supplies the gas is characterized in that it also has a function as an exhaust fan of the first conveyance block 142a on the upper stage side.
  • a first FFU 31 for supplying clean gas from the ceiling surface of the space 142a is provided above the first transfer block 142a.
  • four first FFUs 31 are arranged along the front-rear direction in which the first transport block 142a extends, and these have the same configuration.
  • the first FFU 31 has a configuration in which a blower fan 311 and a filter unit 313 arranged on the discharge side of the blower fan 311 are arranged side by side.
  • the blower fan 311 has the ability to adjust the pressure difference (pressure increase capability) between the suction side and the discharge side so that the atmospheric pressure in the first transport block 142a, the flow rate and flow rate of the downflow are set in advance.
  • an axial flow fan For example, an axial flow fan.
  • the blower fan 311 rotates the impeller with electric power supplied from a power source (not shown) and takes air taken from outside (for example, the atmosphere in the clean room where the liquid processing apparatus 1 is disposed) toward the first transport block 142a. Send it out.
  • the blower fan 311 can change the rotation speed by an inverter or the like, and can increase or decrease the amount of blown air.
  • the blower fan 311 constitutes the air volume adjusting unit of the present embodiment.
  • the blower fan 311 is disposed in a fan casing 312 having an upper surface and a lower surface opened, and the suction side faces the opening on the upper surface and the discharge side faces the opening on the lower surface.
  • the configuration of the blower fan 311 applicable to the first FFU 31 of this example is not limited to the axial flow type, and any type such as a mixed flow type or a centrifugal type can be adopted.
  • the direction in which the fan casing 312 guides the airflow toward the filter unit 313 may be adjusted in accordance with the direction in which the air is discharged.
  • the filter unit 313 is configured by an air filter that can collect minute particles, such as a HEPA (High Efficiency Particulate Air) filter or an ULPA (Ultra Low Penetration Air) filter.
  • the filter unit 313 is disposed in a filter casing 314 whose upper surface and lower surface are open, and the filter casing 314 is connected to the fan casing 312 with the upper surface side opening facing the discharge side of the blower fan 311.
  • the opening on the lower surface side of the filter casing 314 is connected to the ceiling surface of the casing constituting the first transport block 142a, and the filter portion 313 is located between the upper surface and the lower surface opening of the filter casing 314. It is arranged in the horizontal direction to block it. Moreover, the filter part 313 is arrange
  • the first transport block is prepared by arranging the clean gas supplied from each of the first FFUs 31 connected to the ceiling of the first transport block 142a in a uniform flow.
  • a rectifying plate 315 for supplying the air into the space 142a is provided (see FIG. 6).
  • the rectifying plate 315 is provided with a number of through holes formed by punching or the like as supply ports 316, and the flow of the clean gas supplied from each first FFU 31 is arranged in the first transport block 142 a. Can be supplied.
  • the second conveyance on the lower stage side is used as an exhaust fan for forming a stable downflow in the first conveyance block 142a.
  • a second FFU 32 for forming a downflow is used in the block 142b.
  • the floor plate 15 provided at the bottom of the first transfer block 142a has an exhaust port 151 for exhausting the downflow, and the lower side of the floor plate 15 (the outlet of the exhaust port 151).
  • the second FFU 32 is disposed on the side).
  • the second FFU 32 on the lower side is in the space below the floor plate 15 of the first transport block 142 a along the front-rear direction in which the first and second transport blocks 142 a and 142 b extend.
  • the second FFUs 32 have the same configuration as each other.
  • the second FFU 32 has a configuration in which a blower fan 321 provided in the fan casing 322 and a filter unit 323 provided in the filter casing 324 are vertically stacked.
  • a rectifying plate 325 having a large number of through holes (supply ports 326) formed by punching or the like is disposed on the outlet side of the filter portion 323.
  • the detailed configuration of the blower fan 321 and the filter unit 323 is the same as that of the first FFU 31 described above, and thus the description thereof is omitted.
  • the second FFU 32 also includes the air pressure in the second transport block 142b, It has the ability to increase the pressure so that the flow rate and flow rate of the downflow are set in advance, and the amount of air flow can be increased or decreased by changing the rotational speed of the air blowing fan 321. Accordingly, the blower fan 321 of the second FFU also corresponds to the air volume adjusting unit of the present embodiment.
  • the air flow rate of both the blower fans 311 and 321 can be adjusted so that the pressure in the first and second transport blocks 142a and 142b, the flow rate and the flow rate of the downflow are equal. .
  • the wafer W can be processed under uniform conditions without greatly changing the processing atmosphere in the liquid processing unit 2 connected to the transfer blocks 142a and 142b.
  • a small FFU is also provided in the ceiling portion of each liquid processing unit 2, and a clean gas downflow is also formed in the space in which the liquid processing unit 2 is stored.
  • a clean gas downflow is also formed in the space in which the liquid processing unit 2 is stored.
  • the pressure state in each of the transfer blocks 142a and 142b and the flow state of the downflow via the loading / unloading port of the wafer W into the liquid processing unit 2 are processed in the liquid processing unit 2. May affect the atmosphere. Therefore, when a plurality of transport blocks 142a and 142b are provided as in this example, the pressure and flow velocity in these spaces 142a and 142b (if the cross-sectional areas of both spaces 142a and 142b are the same, the down flow is performed.
  • the flow rate is required to be as uniform as possible, and the difference is preferably within about ⁇ 5%.
  • the atmosphere in each of the transfer blocks 142a and 142b to which the wafer W after the liquid processing is transferred leaks outside atmosphere with a contamination source such as particles without passing through a filter or the like. It is necessary to prevent the atmosphere containing chemicals from flowing in. Therefore, the amount of air blown from each of the blower fans 311 and 321 and the exhaust described later are set so that the pressure in the transport blocks 142a and 142b is higher than the external pressure of the liquid processing apparatus 1 and the pressure outside the liquid processing unit 2. The exhaust amount from the fan 331 is adjusted.
  • the second FFU 32 takes in the downflow of the first transport block 142a that has passed through the exhaust port 151 of the floor board 15 by the blower fan 321, and clean gas from which particles have been removed by the filter unit 323 is supplied to the second transport block 142b. To supply. Thereby, a down flow is formed in the second transport block 142b.
  • the second FFU 32 of the present example is configured to take in the downflow from the first transport block 142a and form the downflow in the second transport block 142b.
  • the floor plate 15 and the travel guide mechanism 16 exist at the bottom of the first transport block 142a, which causes a decrease in pressure on the suction side of the blower fan 321. Further, a part of the downflow flowing in the first transport block 142 a flows into the space for storing the liquid processing unit 2 and cannot be taken in by the blower fan 321.
  • the lower blower fan 321 has a lower suction side pressure and less air supply than the upper blower fan 311 that incorporates the external atmosphere of the liquid processing apparatus 1 such as the air in the clean room. Will be operational. Under these conditions, if the pressure condition in the second transport block 142b on the lower stage side, the flow rate and flow rate of the down flow are made the same as those of the first transport block 142a on the upper stage side, the second FFU 32 on the lower stage side will be used. Requires a blower fan 321 having a larger blowing capacity, which increases the cost of the apparatus. In addition, it is necessary to supplement the air lost on the first transport block 142a side.
  • the liquid processing apparatus 1 of the present example has various technical features to compensate for such a pressure drop and a drop in the flow rate of the dow flow from the upper first transport block 142a.
  • the floor plate 15 of the first transport block 142a is provided with a number of through holes formed by punching or the like as exhaust ports 151 (see FIGS. 5 and 6). . By adjusting the area of these through holes, the number of openings, and the like, the pressure loss when the downflow passes through the floor plate 15 can be adjusted.
  • the opening area S 1 of the supply port 316 per unit area of the first conveying block rectifying plate 315 provided in the ceiling portion of the 142a, outlet per unit area of the floor plate 15 provided on the bottom side 151 When compared with the opening area S 2 , S 1 > S 2 .
  • the first FFU 32 disposed below the floor plate 15 causes the first loss.
  • the pressure in the first transfer block 142a is set to the outside (the atmosphere in the liquid processing apparatus 1 or the atmosphere in the liquid processing unit 2). It is easy to adjust the pressure higher than the pressure.
  • the cover member of the travel guide mechanism unit 16 provided at the bottom of the first transfer block 142a and storing the drive mechanism of the wafer transfer mechanism 143 is punched.
  • a large number of through holes formed by the above are provided as vent holes 161.
  • An intermediate fan 18 for sending the airflow that has flowed into the travel guide mechanism 16 through the vent 161 toward the second FFU 32 is provided at the bottom of the travel guide mechanism 16.
  • a plurality are installed along the extending direction of the.
  • these intermediate fans 18 only need to have a boosting capability that compensates for at least the pressure loss when the downflow passes through the travel guide mechanism section 16, a general-purpose small blower fan can be used. Compared with the case where the capacity of the blower fan 321 is further increased, the cost of the device is low. Further, as the intermediate fan 18, a structure having a pressure increasing capability larger than that for compensating for the pressure loss when passing through the travel guide mechanism portion 16 is used, and the pressure loss when the downflow passes through the floor plate 15 is also compensated. Also good.
  • the floor plate 15 is formed at the bottom of the travel guide mechanism portion 16 without installing the intermediate fan 18. It is good also as a structure which only provides many through-holes.
  • an air filter is disposed on the discharge side of each intermediate fan 18 in order to prevent particles generated by the driving mechanism of the wafer transfer mechanism 143 from being supplied to the second transfer block 142b via the second FFU 32. May be.
  • a space for storing the second FFU 32 as shown in FIG. 2 in order to compensate for the loss of the airflow flowing from the first transport block 142a into each liquid processing unit 2 and the like.
  • An opening 119 provided with a filter is provided on the side wall of the space (the space that communicates the bottom of the first transfer block 141a and the suction port of the second FFU 32), and an external atmosphere (atmosphere in the clean room) is taken in.
  • an auxiliary fan for taking in outside air may be provided in the opening 119.
  • the opening 119 may be provided in, for example, the pipe storage unit 19 provided on the lower side of the space for storing the liquid processing unit 2, and the external atmosphere may be taken in via the pipe storage unit 19.
  • the pipe storage unit 19 is a space for storing pipes for supplying a chemical solution to the nozzle 241, pipes through which the liquid discharged from the drain ports 211 and 221 and the exhaust from the exhaust port 212 flow (in FIG. 3, these pipes). The description is omitted).
  • the external atmosphere is taken into the pipe storage unit 19 through, for example, another opening provided on the outer wall surface of the casing constituting the pipe storage unit 19, and the second FFU 32 is supplied from the pipe storage unit 19. Supplied to the inlet side.
  • the floor plate at the bottom of the second transfer block 142b is formed with a number of through-holes that form an exhaust port in the same manner as the floor plate 15 shown in FIG. 5, and on the outlet side of the exhaust port, FIGS.
  • an exhaust fan 331 is provided. Further, the discharge side of the exhaust fan 331 is connected to the exhaust duct 332, and the downflow of the second transport block 142 b on the lower stage side is discharged to the outside through the exhaust fan 331 and the exhaust duct 332.
  • the second FFU as the exhaust fan of the first transport block 142a, a unique exhaust duct for exhausting the downflow of the first transport block 142a becomes unnecessary, contributing to space saving of the liquid processing apparatus 1. To do.
  • the vent 161 and the intermediate fan 18 are also provided in the travel guide unit 16 of the wafer transfer mechanism 143 provided in the second transfer block 142b.
  • the pressure loss at the time of a downflow passing through the exhaust port provided in the floor board of the 2nd conveyance block 142b is supplemented.
  • the opening area S 1 ′ of the supply port 326 per unit area of the rectifying plate 315 provided on the ceiling portion side of the second transport block 142b, and the exhaust port per unit area of the floor plate provided on the bottom side are provided.
  • the relationship with the opening area S 2 ′ is also S 1 ′> S 2 ′, which makes it easy to adjust the pressure in the first transfer block 142b to be higher than the outside.
  • the exhaust fan is not necessarily used. 331 may not be provided. However, even in this case, the load of the exhaust fan common to the factory can be reduced by using the downflow of the first transfer block 142a for the downflow of the second transfer block.
  • the liquid processing apparatus 1 having the above-described configuration is connected to the control unit 4 as shown in FIG.
  • the control unit 4 includes a computer having a CPU and a storage unit (not shown).
  • the storage unit takes out the operation of the liquid processing apparatus 1, that is, the wafer W from the FOUP 100, and stores the mounting shelf 131 and the upper and lower transfer blocks 142a and 142b. Steps (commands) related to the operation from when the wafer W is transferred to the respective liquid processing units 2 and liquid processing is performed on the wafer W until the wafer W is transferred and stored in the FOUP 100 through a path opposite to that at the time of loading. )
  • a grouped program is recorded. This program is stored in a storage medium such as a hard disk, a compact disk, a magnetic optical disk, or a memory card, and installed in the computer therefrom.
  • the control unit 4 has a function of adjusting the pressure in these blocks 142a, 142b to be higher than the external pressure.
  • internal pressure gauges 4a and 4b are provided in the first and second transport blocks 142a and 142b, and the pressures of these atmospheres are detected outside the liquid processing apparatus 1 and in each liquid processing unit 2. Therefore, a plurality of pressure gauges are provided. And based on the detection result of each pressure gauge, the rotation speed of the blower fans 311 and 321 of the first and second FFUs 31 and 32 is adjusted, and the pressure in the first and second transport blocks 142a and 142b is externally adjusted.
  • Control is performed to make the pressure higher than the external pressure (the external atmosphere of the liquid processing apparatus 1 or the liquid processing unit 2) detected by the pressure gauge 4c.
  • the pressure gauge that detects the pressure inside the first and second transport blocks 142a and 142b corresponds to the internal pressure detection unit, and detects the pressure outside the liquid processing apparatus 1 and inside each liquid processing unit 2.
  • the rotational speed of the auxiliary fan and exhaust fan 331 provided in the intermediate fan 18 and the opening 119 described above is adjusted, and the opening degree of a damper (not shown) provided in the exhaust duct 332 is adjusted.
  • the pressure in the second transport blocks 142a and 142b may be controlled.
  • the wafer W is taken out from the FOUP 100 placed on the placement block 11 by the wafer transfer mechanism 121 and placed on the delivery shelf 131, and this operation is continuously performed.
  • a part of the wafer W placed on the delivery shelf 131 (second delivery shelf 131 b in FIG. 2) is transferred to the first delivery shelf 131 a on the upper stage side by the transfer mechanism 132, and is transferred by the wafer transfer mechanism 143. It is taken out, transported through the first transport block 142a, and transported into each liquid processing unit 2.
  • the first FFU 31, the second FFU 32, and the intermediate fan 18 are operating on the ceiling surface side and the bottom side of the first transport block 142 a, and clean gas is contained inside the first transport block 142 a.
  • the down flow is formed, and the wafer W is transported in a clean space where there is little rolling of particles or the like.
  • the rotational speed of the blower fans 311 and 321 of each FFU 31 and 32 is adjusted based on the detection result of each pressure gauge, and the pressure in the first transport block 142a is external (external atmosphere of the liquid processing apparatus 1 or The pressure is controlled to be higher than the pressure of the atmosphere in the liquid processing unit 2.
  • the remaining wafer W is taken out from the second delivery shelf 131b by the wafer transfer mechanism 143, transferred in the second transfer block 142b on the lower side, and transferred into each liquid processing unit 2.
  • the second FFU 32 and the exhaust fan 331 are operating on the ceiling surface side and the bottom side of the second transport block 142b, and the downflow that has passed through the first transport block 142a on the upper stage side is the second flow block 142b. It is captured by the FFU 32.
  • a downflow is formed in the second transfer block 142b on the lower stage side, and the wafer W is transferred in a clean space with little particle lifting.
  • the intermediate fan 18 since the intermediate fan 18 is operating, the pressure loss of the downflow when passing through the first conveyance block 142a on the upper stage side is compensated, and the outside air is taken in from the opening 119, so that the first The loss of airflow lost when passing through one transport block 142a is compensated.
  • the blower fan 311 of the first FFU 31 Using the blower fan 321 having substantially the same boosting ability, the pressure in the upper and lower transfer blocks 142a and 142b, the flow rate of the downflow, and the flow velocity can be made uniform. Further, the pressure in the second transport block 142b is controlled to be higher than the external pressure by adjusting the rotational speed of the blower fan 321 or the like.
  • the SC1 liquid, DHF, and DIW are supplied in the order described with reference to FIG. 4, and liquid processing is performed.
  • IPA is supplied to the surface of the rotating wafer W to perform IPA drying, and the processing of the wafer W is completed.
  • the wafer W is unloaded from the liquid processing unit 2 by the wafer transfer mechanism 143 and placed on the delivery shelf 131 (the wafer placed on the first delivery shelf 131a on the upper stage side). W is transferred to the second delivery shelf 131 b on the lower side), and the wafer W is returned from the delivery shelf 131 to the FOUP 100 by the wafer transfer mechanism 121. Then, the plurality of liquid processing units 2 provided in the liquid processing apparatus 1 perform the processing and the transfer operation on the wafer W described above in parallel, and the liquid processing on the plurality of wafers W is performed.
  • the liquid processing apparatus 1 has the following effects. Since the second FFU 32 for forming a downflow is used in the second conveyance block 142b on the lower stage side as a fan for taking in the downflow flowing in the first conveyance block 142a on the upper stage side, the first A dedicated exhaust fan for exhausting the transfer block 142a is not required. As a result, it is possible to save installation space for the exhaust fan and the exhaust duct and reduce energy consumption.
  • the air flow rate may be adjusted by changing the rotational speed of the intermediate fan 18 that sends the airflow passing through the travel guide mechanism unit 16 to the suction side of the second FFU 32 using an inverter or the like.
  • an auxiliary fan may be provided in the opening 119 for taking in the external atmosphere, and the same adjustment may be performed.
  • pressure gauges are provided in the first transport block 142a and the second transport block 142b, and control is performed to change the rotational speed of the intermediate fan 18 and the auxiliary fan so that the pressures in both spaces are uniform.
  • pressure gauges are provided on the suction side and the discharge side of the second FFU 32, and the rotational speed of the intermediate fan 18 and the auxiliary fan is changed so that the pressure difference becomes a predetermined value (for example, a design value), Thereby, the pressures of the first transport block 142a and the second transport block 142b may be indirectly adjusted.
  • the first and second FFUs 31 and 32 have shown the case where the air flow rate is increased or decreased by changing the rotation speed of the air blowing fans 311 and 321, but the configuration of the air volume adjusting unit is not limited thereto. It is not something that can be done.
  • an openable / closable louver that is an air volume adjusting unit is provided on the outlet side of the first and second FFUs 31 and 32, and the control unit 4 adjusts the opening degree of the louver based on the pressure detection value by each pressure gauge. Good.
  • stacked the 1st conveyance block 142a, the 2nd conveyance block 142b, and the liquid processing part 2 connected to these up and down from a viewpoint of the reduction of a footprint was employ
  • the second FFU 32 has a configuration capable of taking the downflow from the first transport block 142a and forming the downflow of the second transport block 142b, the transport blocks 142a and 142b are stacked. It does not have to be.
  • a first transport block 142a and a second transport block 142b to which a plurality of liquid processing units 2 are connected are arranged side by side in the horizontal direction, and an exhaust section for downflow from the first transport block 142a, You may connect the suction part of FFU32 with a duct.
  • the substrate processing apparatus to which this example is applicable is not limited to the liquid processing apparatus 1 including the liquid processing unit 2 as a substrate processing unit.
  • the present invention is applied to a coating / developing apparatus provided with, as a substrate processing section, a resist coating section for applying a resist solution to a substrate, a developing section for performing development after exposure, and a heating section for performing post-exposure heat treatment after resist coating. May be.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
PCT/JP2012/076330 2011-10-14 2012-10-11 基板処理装置 WO2013054849A1 (ja)

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JP2011-227104 2011-10-14

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CN111868910A (zh) * 2018-03-15 2020-10-30 昕芙旎雅有限公司 Efem
CN112748639A (zh) * 2019-10-31 2021-05-04 沈阳芯源微电子设备股份有限公司 气流分区调控的ffu整流板和调整胶形的涂胶工艺
CN115598928A (zh) * 2022-10-31 2023-01-13 宁波润华全芯微电子设备有限公司（Cn） 一种匀胶显影单元的排风系统及其控制方法

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KR102096948B1 (ko) * 2013-07-04 2020-04-06 세메스 주식회사 기판 처리 설비
JP6503281B2 (ja) 2015-11-13 2019-04-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102467054B1 (ko) * 2015-12-14 2022-11-15 세메스 주식회사 기판 처리 장치 및 방법
JP6815912B2 (ja) * 2017-03-23 2021-01-20 株式会社荏原製作所 洗浄装置及び基板処理装置
JP6895341B2 (ja) * 2017-08-10 2021-06-30 株式会社荏原製作所 基板処理装置
JP6655206B2 (ja) * 2019-03-25 2020-02-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7370277B2 (ja) 2020-02-26 2023-10-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7464471B2 (ja) * 2020-07-10 2024-04-09 株式会社日立ハイテク 基板搬送装置
JP7555210B2 (ja) * 2020-07-29 2024-09-24 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

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CN111868910A (zh) * 2018-03-15 2020-10-30 昕芙旎雅有限公司 Efem
CN111868910B (zh) * 2018-03-15 2024-04-19 昕芙旎雅有限公司 Efem
CN112748639A (zh) * 2019-10-31 2021-05-04 沈阳芯源微电子设备股份有限公司 气流分区调控的ffu整流板和调整胶形的涂胶工艺
CN115598928A (zh) * 2022-10-31 2023-01-13 宁波润华全芯微电子设备有限公司（Cn） 一种匀胶显影单元的排风系统及其控制方法

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