WO2013051587A1 - Dispositif de refroidissement à plaque plate et son procédé d'utilisation - Google Patents

Dispositif de refroidissement à plaque plate et son procédé d'utilisation Download PDF

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Publication number
WO2013051587A1
WO2013051587A1 PCT/JP2012/075575 JP2012075575W WO2013051587A1 WO 2013051587 A1 WO2013051587 A1 WO 2013051587A1 JP 2012075575 W JP2012075575 W JP 2012075575W WO 2013051587 A1 WO2013051587 A1 WO 2013051587A1
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WO
WIPO (PCT)
Prior art keywords
flat plate
flat
cooling device
refrigerant
container
Prior art date
Application number
PCT/JP2012/075575
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English (en)
Japanese (ja)
Inventor
有仁 松永
坂本　仁
吉川　実
正樹 千葉
賢一 稲葉
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2013537522A priority Critical patent/JP6024665B2/ja
Priority to US14/349,034 priority patent/US20150034288A1/en
Publication of WO2013051587A1 publication Critical patent/WO2013051587A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device such as a semiconductor device or an electronic device, and more particularly, to a flat plate cooling device using a boiling cooling system that transports and dissipates heat by a vaporization and condensation cycle of a refrigerant and a method of using the same.
  • cooling cooling device using a boiling cooling method that transports and dissipates heat by a cycle of vaporization and condensation of the refrigerant does not require a drive unit such as a pump. Therefore, since it is suitable for downsizing, it is expected as a cooling device for semiconductor devices and electronic devices.
  • An example of a cooling device using such a boiling cooling system (hereinafter also referred to as “boiling cooling device”) is described in Patent Document 1.
  • FIG. 9A and 9B are cross-sectional views showing the configuration of a related boiling cooling device 500 described in Patent Document 1.
  • the related boiling cooling device 500 includes a refrigerant tank 510 and a heat radiating unit 520, and cools heating elements 530 and 531 such as semiconductor elements.
  • the refrigerant tank 510 is a refrigerant container having a flat box shape as a base, and is provided so that a heat receiving surface 511 and a heat radiating surface 512 as outer surfaces face each other.
  • Heat generating elements 530 and 531 are respectively fixed to substantially the center of the heat receiving surface 511 and the heat radiating surface 512.
  • the heat dissipating part 520 includes a plurality of heat dissipating tubes communicating two headers and heat dissipating fins interposed between the heat dissipating tubes.
  • the two headers are assembled so as to be substantially upright from the heat radiation surface 512 on one end side of the refrigerant tank 510, and are provided in communication with the internal space of the refrigerant tank 510.
  • the refrigerant tank 510 is provided with a tank unit 513 as a water level adjusting unit.
  • the tank part 513 is disposed so as to protrude from the heat radiation surface 512 to the same side as the heat radiation part 520 on the other end side of the refrigerant tank 510.
  • a predetermined amount of refrigerant is sealed in the internal space of the refrigerant tank 510.
  • the coolant level is determined as shown in FIG. 9A. To be between.
  • FIG. 9B when the heat receiving surface 511 and the heat radiating surface 512 are oriented in the horizontal direction with the heat radiating portion 520 facing upward (horizontal orientation), the inside of the refrigerant tank 510 excluding the tank portion 513 is the refrigerant. Is set to be satisfied by.
  • the tank unit 513 makes the refrigerant not to flow into the heat radiating unit 520 while contacting the inner wall of the refrigerant tank 510 in the vicinity of the region where the heating elements 530 and 531 are attached. Yes.
  • the heat of the heating elements 530 and 531 is increased. It can be reliably transmitted to the refrigerant and can be cooled. JP 2004-34952 A (paragraphs “0017” to “0027”)
  • the related boiling cooling device 500 has a configuration in which the tank unit 513 as the water level adjusting unit is protruded and arranged in the refrigerant tank 510 in order to improve the degree of freedom of arrangement when mounted on the electronic device. . Therefore, there has been a problem that the cooling device is increased in size. Further, when the vertical orientation is turned upside down, the heat dissipating part 520 is positioned vertically below the boiling cooling device 500. In this case, since the recirculation of the refrigerant is not promoted and the cooling performance is remarkably deteriorated, there is a problem that such an arrangement cannot be used as a cooling device.
  • the object of the present invention is the cooling device using the boiling cooling system, which is the above-described problem, and the device becomes larger when the degree of freedom of arrangement when mounted on an electronic device is improved, and sufficient arrangement freedom is achieved.
  • An object of the present invention is to provide a flat plate cooling device and a method for using the same that solves the problem that the degree cannot be obtained.
  • the flat plate cooling device of the present invention includes a flat plate container provided with a first flat plate and a second flat plate facing the first flat plate, a refrigerant sealed in the flat plate container, a first flat plate, Connecting the second flat plate, and having a guiding wall portion for controlling the flow of the refrigerant in the flat plate container, the flat plate container generating heat at least on one of the first flat plate and the second flat plate
  • a heat receiving region that is thermally connected to the body is provided, the conductive wall portion includes a pair of conductive walls, and the conductive wall is disposed with the heat receiving region interposed therebetween.
  • the method of using the flat plate cooling device of the present invention includes a flat plate cooling device of the present invention, a first arrangement state in which a straight line parallel to one side in the longitudinal direction of the flat plate container is parallel to the vertical direction, It is used by switching between this arrangement state and the second arrangement state arranged upside down with respect to the vertical direction.
  • a small boiling cooling type flat plate cooling device having an improved degree of freedom in arrangement when mounted on an electronic device can be obtained.
  • FIG. 1 is a perspective view schematically showing a usage state of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing the configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 3 is a plan sectional view showing the configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 4 is a plan sectional view for explaining the operation of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 5 is a perspective view schematically showing another usage state of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 6 is a plan sectional view showing the configuration of a flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 7 is a plan sectional view for explaining the operation of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 8A is a plan sectional view for explaining an arrangement state of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 8B is a cross-sectional plan view for explaining an arrangement state of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 8C is a plan sectional view for explaining an arrangement state of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 8D is a cross-sectional plan view for explaining an arrangement state of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 9A is a cross-sectional view showing a configuration of a related boiling cooling apparatus.
  • FIG. 9B is a cross-sectional view showing a configuration of a related boiling cooling apparatus.
  • FIG. 1 is a perspective view schematically showing a usage state of the flat plate cooling device 100 according to the first embodiment of the present invention.
  • the flat plate cooling device 100 has a flat container in which a refrigerant is sealed.
  • a heating element 300 such as a semiconductor device is thermally connected to the outer surface of a flat container constituting the flat cooling device 100 for use.
  • the flat plate cooling device 100 has a configuration using a boiling cooling system in which heat is transported and released by a refrigerant vaporization and condensation cycle. The configuration of the flat plate cooling device 100 will be described in more detail with reference to FIGS. 2 and 3. 2 is an exploded perspective view of the flat plate cooling device 100, and FIG. 3 is a plan sectional view.
  • the flat plate cooling device 100 includes a flat plate container 110 including a first flat plate 111 and a second flat plate 112 facing the first flat plate 111, and a refrigerant 120 sealed in the flat plate container 110. And the 1st flat plate 111 and the 2nd flat plate 112 are connected, and the guide wall part 130 which controls the flow of the refrigerant
  • the flat container 110 includes a heat receiving region 140 that is thermally connected to the heating element 300 disposed on at least one of the first flat plate and the second flat plate.
  • the guide wall part 130 consists of a pair of guide walls 131 and 132, and the guide walls 131 and 132 are arrange
  • the hatched portion in the flat container 110 indicates the refrigerant in the liquid phase state
  • the dotted line in the hatched portion indicates the interface between the refrigerant in the liquid phase (liquid phase refrigerant) and the refrigerant in the gas phase state (gas phase refrigerant) ( Hereinafter, it is referred to as “a gas-liquid interface of the refrigerant”).
  • the refrigerant for example, hydrofluorocarbon or hydrofluoroether, which is an insulating and inert material, can be used.
  • the flow path of the refrigerant is limited by the guide wall portion 130 regardless of the arrangement state. A boil cooling type flat plate cooling device is obtained.
  • the flat container 110 has a structure in which a first flat plate 111 and a second flat plate 112 are arranged to face each other with a side frame portion 113 interposed therebetween, for example.
  • the guiding wall 130 is disposed so as to connect the first flat plate 111 and the second flat plate 112.
  • metals having excellent heat conduction characteristics such as aluminum and copper, can be used.
  • the flat container 110 and the conducting wall 130 are manufactured by joining together using a brazing material such as a silver alloy.
  • the present invention is not limited to this, and the side frame 113, the first flat plate 111, and the second flat plate 112 may be fixed with screws or the like using a seal member such as an O-ring (O-ring). Further, a part of the first flat plate 111 or the second flat plate 112 and the side surface frame portion 113 can be integrally manufactured by cutting or pressing.
  • an inlet is formed in the side surface frame portion 113, the refrigerant 120 is injected, and after evacuating through the inlet, the inlet is sealed, so that the inside of the flat container 110 is saturated with the saturated vapor pressure of the refrigerant 120. Can be maintained.
  • a path through which the refrigerant 120 flows in the flat plate cooling device 100 is indicated by an arrow in FIG.
  • the liquid phase refrigerant present in the heat receiving region 140 takes the amount of heat from the heating element 300 and vaporizes, becomes bubble refrigerant 121 and rises toward the gas-liquid interface of the refrigerant by buoyancy.
  • the refrigerant in a gas phase state diffuses in the flat container 110 due to a pressure difference, dissipates heat, and condensates.
  • the refrigerant in the liquid phase is refluxed vertically downward by gravity and used again for heat transport of the heating element 300.
  • the pair of guide walls 131 and 132 constituting the guide wall portion 130 are arranged with the heat receiving region 140 interposed therebetween.
  • the guiding walls 131 and 132 are arranged to extend in parallel with one side in the long side direction of the flat container 110.
  • the distance between the pair of guide walls 131 and 132 can be set to be not less than one time the width of the heat receiving area 140 and not more than the length of the outer periphery of the heat receiving area 140.
  • coolant can be generated efficiently, and the circulation of a refrigerant
  • the gas-liquid two-phase flow means that the gas phase and the liquid phase flow in a mixed state. That is, when the distance between the pair of guiding walls 131 and 132 is narrower (less than 1 time) than the width of the heat receiving region 140, the bubble refrigerant 121 is generated outside the guiding walls 131 and 132.
  • the gap between the guide walls 131 and 132 is wider than the width of the heat receiving region 140, the gas phase refrigerant flows out through all the outer peripheral boundaries of the heat receiving region 140, and the liquid phase refrigerant flows in. Generation of gas-liquid two-phase flow is suppressed. Therefore, it is desirable that the interval between the guiding walls 131 and 132 be equal to or less than the length of the outer periphery of the heat receiving region 140. As described above, in the flat plate cooling device 100 of the present embodiment, heat is transported and diffused by changing the phase of the liquid refrigerant into a gas phase refrigerant.
  • the cooling performance can be improved.
  • the liquid refrigerant needs to be in thermal contact with the heat receiving region 140. For this reason, it is conceivable to increase the amount of the liquid refrigerant, but if so, the volume occupied by the gas refrigerant in the flat container 110 is reduced. In this case, since the gaseous refrigerant has the ability to transport a large amount of heat, it is difficult to improve the cooling performance.
  • the flat plate cooling device 100 of the present embodiment has a configuration in which the pair of guide walls 131 and 132 constituting the guide wall portion 130 are disposed with the heat receiving region 140 interposed therebetween, and thus this problem can be avoided.
  • the reason is as follows.
  • the bubble refrigerant 121 generated by the phase change by receiving heat from the heating element 300 is limited in diffusion by the guiding walls 131 and 132, and moves along the guiding wall portion 130 vertically upward by buoyancy.
  • the refrigerant becomes a gas-liquid two-phase flow, and the gas refrigerant rises while entraining the liquid refrigerant. Therefore, it becomes possible for the liquid refrigerant to reach the heat receiving region 140 located vertically above the gas-liquid interface of the refrigerant.
  • the gas-liquid interface of the refrigerant only needs to be positioned above the lower limit of the heat receiving region 140 in the vertical direction.
  • the amount of liquid refrigerant can be reduced, and the volume of the space occupied by the gas refrigerant can be increased.
  • the cooling performance of the flat plate cooling device 100 can be improved.
  • the flow path of the liquid refrigerant is lengthened by the guide wall 130.
  • the flat plate cooling device 100 is arranged upside down with respect to the vertical direction.
  • the amount of the liquid refrigerant in the case where the heat receiving region 140 is used in two arrangements upside down by setting the heat receiving region 140 at the approximate center of one side in the long side direction of the flat container 110 is minimized.
  • FIG. The rough surface region has a concavo-convex structure, and this concavo-convex structure serves as a bubble generation nucleus for the refrigerant in the heat receiving region 140, and serves as a condensation nucleus for the gas phase refrigerant in the region where the gas phase refrigerant exists. Therefore, the phase change of the refrigerant is activated and the cooling performance can be further increased.
  • the size of the concavo-convex structure is determined by an optimum value depending on physical properties such as the surface tension of the refrigerant and the amount of heat generated by the heating element.
  • the optimum bubble nucleus size is in the range of submicron to about 100 ⁇ m in centerline average roughness. . Therefore, an uneven structure having the same size can be formed by performing machining using abrasive grains or sand blasting, or chemical treatment such as plating.
  • thermally connecting the thermal radiation part 400 which consists of a thermal radiation fin etc.
  • the flat container 110 includes a heat radiating region thermally connected to the heat radiating portion 400 disposed on at least one of the first flat plate 111 and the second flat plate 112, and the heat radiating region is in the flat container 110. It can be set as the structure arrange
  • FIG. 6 is a plan sectional view showing a configuration of a flat plate cooling device 200 according to the second embodiment of the present invention.
  • the flat plate cooling device 200 includes a flat plate container 110 having a first flat plate 111 and a second flat plate 112 facing the first flat plate 111, and a refrigerant 120 sealed in the flat plate container 110. And the 1st flat plate 111 and the 2nd flat plate 112 are connected, and the guide wall part 230 which controls the flow of the refrigerant
  • the flat container 110 includes a heat receiving region 140 that is thermally connected to the heating element 300 disposed on at least one of the first flat plate and the second flat plate.
  • the guide wall portion 230 includes a pair of guide walls 231 and 232, and the guide walls 231 and 232 are arranged with the heat receiving region 140 interposed therebetween.
  • the flat plate cooling device 200 according to the present embodiment is different from the flat plate cooling device 100 of the first embodiment in the configuration of the guiding wall portion 230. That is, the guide walls 231 and 232 constituting the guide wall portion 230 are disposed so as to be inclined with respect to a straight line parallel to one side in the long side direction of the flat container 110, as shown in FIG.
  • the pair of guide walls 231 and 232 may be arranged symmetrically with respect to a straight line parallel to one side in the long side direction of the flat container 110.
  • the flow path of the refrigerant is limited by the guiding wall portion 230 regardless of the arrangement state, and thus the degree of freedom in arrangement when mounted on an electronic device is improved, and the small size.
  • a boil cooling type flat plate cooling device is obtained. That is, as shown in FIG. 7, the flat plate cooling device 200 can be used even in an arrangement state in which a straight line parallel to one side in the longitudinal direction of the flat container 110 is perpendicular to the vertical direction. .
  • the flat plate cooling device 200 includes the first arrangement state in which a straight line parallel to one side in the longitudinal direction of the flat container 110 is parallel to the vertical direction, and the first vertical state to the vertical direction. It can be used by switching between three arrangement states. Further, similarly to the first embodiment, the flat plate cooling device 200 can be used even in a state where it is arranged upside down with respect to the vertical direction. That is, as shown in FIGS. 8A to 8D, according to the flat plate cooling device 200 of the present embodiment, the first arrangement state (FIG.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif de refroidissement miniaturisé à plaque plate, permettant de refroidir une ébullition et présentant un degré de liberté accru en ce qui concerne le positionnement du dispositif lorsqu'il est incorporé dans un appareil électronique. Ledit dispositif de refroidissement à plaque plate comprend : un récipient sous forme de plaque plate (110) qui est doté d'une première plaque plate et d'une seconde plaque plate qui fait face à la première plaque plate; un fluide frigorigène (120), qui remplit le récipient sous forme de plaque plate (110); et une section de paroi conductrice (130) qui relie la première plaque plate et la seconde plaque plate et qui contrôle l'écoulement du fluide frigorigène à l'intérieur du récipient sous forme de plaque plate (110). Ledit récipient sous forme de plaque plate (110) présente une région de réception de chaleur (140), qui est thermiquement connectée à un élément chauffant qui est agencé sur la première et/ou la seconde plaque plate; et ladite section de paroi conductrice (130) est constituée d'une paire de parois conductrices (131, 132), qui sont agencées de manière à prendre en sandwich la région de réception de chaleur (140).
PCT/JP2012/075575 2011-10-04 2012-09-26 Dispositif de refroidissement à plaque plate et son procédé d'utilisation WO2013051587A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013537522A JP6024665B2 (ja) 2011-10-04 2012-09-26 平板型冷却装置及びその使用方法
US14/349,034 US20150034288A1 (en) 2011-10-04 2012-09-26 Flat Plate Cooling Device and Method for Using the Same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011219887 2011-10-04
JP2011-219887 2011-10-04

Publications (1)

Publication Number Publication Date
WO2013051587A1 true WO2013051587A1 (fr) 2013-04-11

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US (1) US20150034288A1 (fr)
JP (1) JP6024665B2 (fr)
WO (1) WO2013051587A1 (fr)

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JP7527008B2 (ja) 2021-01-29 2024-08-02 株式会社ファナティック 冷却システムおよび電子機器

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KR102140092B1 (ko) * 2018-11-16 2020-07-31 한국에너지기술연구원 슬롯다이 코팅유닛

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Publication number Priority date Publication date Assignee Title
JP2000074536A (ja) * 1998-08-31 2000-03-14 Denso Corp 沸騰冷却装置
JP2007115917A (ja) * 2005-10-20 2007-05-10 Fuji Electric Holdings Co Ltd 熱分散プレート
JP2010522996A (ja) * 2007-03-26 2010-07-08 ヴァプロ，インク． 沸騰を用いた薄型熱拡散液体チャンバ
WO2012161002A1 (fr) * 2011-05-20 2012-11-29 日本電気株式会社 Dispositif de refroidissement à plaques plates et son procédé d'utilisation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7527008B2 (ja) 2021-01-29 2024-08-02 株式会社ファナティック 冷却システムおよび電子機器

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JPWO2013051587A1 (ja) 2015-03-30
US20150034288A1 (en) 2015-02-05

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