WO2012161002A1 - Dispositif de refroidissement à plaques plates et son procédé d'utilisation - Google Patents

Dispositif de refroidissement à plaques plates et son procédé d'utilisation Download PDF

Info

Publication number
WO2012161002A1
WO2012161002A1 PCT/JP2012/062241 JP2012062241W WO2012161002A1 WO 2012161002 A1 WO2012161002 A1 WO 2012161002A1 JP 2012062241 W JP2012062241 W JP 2012062241W WO 2012161002 A1 WO2012161002 A1 WO 2012161002A1
Authority
WO
WIPO (PCT)
Prior art keywords
flat plate
heat
heat receiving
cooling device
flat
Prior art date
Application number
PCT/JP2012/062241
Other languages
English (en)
Japanese (ja)
Inventor
吉川　実
坂本　仁
正樹 千葉
賢一 稲葉
有仁 松永
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP2013516292A priority Critical patent/JP5874935B2/ja
Publication of WO2012161002A1 publication Critical patent/WO2012161002A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a cooling device such as a semiconductor device or an electronic device, and more particularly, to a flat plate cooling device using a boiling cooling system that transports and dissipates heat by a vaporization and condensation cycle of a refrigerant and a method of using the same.
  • a cooling device using a boiling cooling method that transports and dissipates heat by a cycle of vaporization and condensation of the refrigerant does not require a drive unit such as a pump. Therefore, since it is suitable for downsizing, it is expected as a cooling device for semiconductor devices and electronic devices.
  • An example of a cooling device using such a boiling cooling system (hereinafter also referred to as “boiling cooling device”) is described in Patent Document 1.
  • the related boiling cooling apparatus 500 includes a boiling unit 520 that is hollow inside and in which the low boiling point refrigerant 510 is sealed, and a condensing unit 530 that is in communication with the hollow flow path in the boiling unit 520 and is filled with the vapor 512 of the low boiling point refrigerant 510. It is comprised as a flat type airtight container which has. Then, the power semiconductor element 540 is attached to the heat receiving part 520 ⁇ / b> A that is the outer wall surface of the boiling part 520.
  • the heat loss of the power semiconductor element 540 is transmitted through the heat receiving portion 520A to the boiling heat transfer surface 520B in the boiling portion 520 by heat conduction.
  • Bubble nuclei are generated from the foaming point of the boiling heat transfer surface 520B, grow into bubbles 514, and dissociate from the boiling heat transfer surface 520B, whereby heat loss is transmitted from the boiling heat transfer surface 520B to the low boiling point refrigerant 510.
  • the detached bubbles 514 rise to the liquid level by buoyancy, and the heat loss is carried to the condensing unit 530.
  • the heat loss carried to the condenser 530 is radiated by the cooling air.
  • the heating element such as the power semiconductor element 540 needs to be disposed on the outer wall surface of the boiling portion 520 filled with the low boiling point refrigerant 510.
  • the condensing unit 530 is disposed above the boiling unit 520. Therefore, the condensing part 530 is arrange
  • the related boiling cooling apparatus has a problem that the apparatus becomes larger than the area where the heating element is arranged.
  • the condensing unit having the heat radiating unit 630 is arranged in the same region as the region where the heating element 640 is arranged, thereby Consider miniaturization.
  • the space occupied by the gas-phase refrigerant in the container 610 decreases, so that the internal pressure of the container 620 increases and the boiling point of the refrigerant 610 increases.
  • the cooling performance of the related another boiling cooling device 600 is lowered.
  • the related boiling cooling device has a problem that the cooling performance is lowered when the device is downsized.
  • An object of the present invention is a flat plate cooling device that solves the problem that cooling performance decreases when the size of the device is reduced in the cooling device using the boiling cooling system, which is the above-described problem, and the same It is to provide a method of use.
  • the flat plate cooling device of the present invention includes a flat plate container including a first flat plate and a second flat plate facing the first flat plate, a refrigerant sealed in the flat plate container, a first flat plate, A plurality of guide plates arranged on at least one of the first flat plate and the second flat plate.
  • the guide wall portion connects the second flat plate and controls the flow of the refrigerant in the flat plate container.
  • a plurality of heat receiving regions thermally connected to the heat generating body, and a heat radiating region thermally connected to a heat radiating portion disposed on at least one of the first flat plate and the second flat plate, and a plurality of heat receiving regions Includes at least one heat-dissipating part heat-receiving region arranged in the heat-dissipating region, the conducting wall part is composed of a pair of conducting walls, and the conducting wall is arranged across the first adjacent heat-receiving region adjacent to the heat-dissipating part heat-receiving region.
  • FIG. 1A is a side sectional view showing a configuration of a flat plate cooling device according to a first embodiment of the present invention.
  • FIG. 1B is a cross-sectional plan view showing the configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 2A is a plan sectional view showing another configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 2B is a plan sectional view showing another configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 3 is a plan sectional view showing still another configuration of the flat plate cooling device according to the first embodiment of the present invention.
  • FIG. 4 is a side cross-sectional view showing the configuration of a flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 5A is a plan sectional view showing a configuration of a flat plate cooling device according to a second embodiment of the present invention.
  • FIG. 5B is a cross-sectional plan view showing a configuration of a flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 6 is a plan sectional view showing another configuration of the flat plate cooling device according to the second embodiment of the present invention.
  • FIG. 7A is a side cross-sectional view showing a configuration of a flat plate cooling device according to a third embodiment of the present invention.
  • FIG. 7B is a plan sectional view showing a configuration of a flat plate cooling device according to the third embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing a configuration of a related flat plate cooling device.
  • FIG. 9A is a side view showing another configuration of the related flat plate cooling device.
  • FIG. 9B is a plan view showing another configuration of the related flat plate cooling device.
  • FIG. 1A and 1B are views showing a configuration of a flat plate cooling device 100 according to a first embodiment of the present invention, in which FIG. 1A is a side sectional view and FIG. 1B is a plan sectional view.
  • the flat plate cooling device 100 includes a flat plate container 110 including a first flat plate 111 and a second flat plate 112 facing the first flat plate 111, and a refrigerant 120 sealed in the flat plate container 110. And the 1st flat plate 111 and the 2nd flat plate 112 are connected, and the guide wall part 130 which controls the flow of the refrigerant
  • the inside of the flat container 110 can always be maintained at the saturated vapor pressure of the refrigerant 120.
  • the hatched portion in the flat container 110 indicates a refrigerant in a liquid phase state
  • a dotted line in the hatched portion indicates an interface between the liquid phase state refrigerant and a gas phase state refrigerant (hereinafter referred to as “refrigerant gas-liquid interface”).
  • refrigerant gas-liquid interface for example, hydrofluorocarbon or hydrofluoroether, which is an insulating and inert material, can be used.
  • the material which comprises the flat container 110 and the conducting-wall part 130 can use the metal excellent in the heat conductivity, for example, aluminum, copper, etc.
  • the flat plate cooling apparatus 100 is used by disposing a plurality of heat generating elements 180 and heat dissipating portions 190 including heat dissipating fins on at least one of the first flat plate and the second flat plate, and thermally connecting them.
  • FIG. 1A shows a case where a plurality of heating elements 180 are provided on the first flat plate 111 and a heat radiating portion 190 is provided on the second flat plate 112. The amount of heat from the heating element 180 is transmitted to the refrigerant 120 through the flat container 110, and the refrigerant 120 is vaporized.
  • the flat plate cooling device 100 is configured to use a boiling cooling system in which heat is transported and radiated by a refrigerant vaporization and condensation cycle.
  • the flat container 110 includes a plurality of heat receiving regions 140 that are thermally connected to the plurality of heating elements 180, and a heat radiating region 150 that is thermally connected to the heat radiating unit 190.
  • the plurality of heat receiving areas 140 include at least one heat radiating portion heat receiving area 140 ⁇ / b> A disposed in the heat radiating area 150.
  • the guiding wall portion 130 is composed of a pair of guiding walls 131 and 132, and the guiding walls 131 and 132 are arranged with at least the first adjacent heat receiving region 140B adjacent to the heat radiating portion heat receiving region 140A interposed therebetween.
  • FIG. 1B the structure which has arrange
  • the gas-liquid interface of the refrigerant 120 is located between the heat radiating portion heat receiving area 140A and the first adjacent heat receiving area 140B in a state where the plurality of heat receiving areas 140 are arranged in the vertical direction (vertical direction in the drawing). Show the case.
  • a path through which the refrigerant 120 flows in the flat plate cooling device 100 is indicated by an arrow in FIG. 1B.
  • the liquid-phase state refrigerant present in the heat receiving area 140 takes the amount of heat from the heating element 180 and vaporizes, and rises inside the flat container 110 toward the heat radiating area 150 by buoyancy.
  • the gas-phase refrigerant that has reached the heat radiation area 150 is cooled and condensed, and is refluxed downward by gravity.
  • the conducting wall portion 130 is arranged with the first adjacent heat receiving region 140B adjacent to the heat radiating portion heat receiving region 140A interposed therebetween. Therefore, the gas-liquid two-phase flow of the refrigerant generated in the first adjacent heat receiving area 140B can efficiently reach the heat radiating section heat receiving area 140A.
  • the gas-liquid two-phase flow means that the gas phase and the liquid phase flow in a mixed state.
  • the heat radiation part heat receiving area 140A is not filled with the liquid phase refrigerant, the heat quantity from the heating element 180 is deprived by the gas-liquid two-phase flow of the refrigerant generated in the first adjacent heat receiving area 140B. Therefore, the heating element 180 in the heat radiating portion heat receiving area 140A can be cooled.
  • the boiling cooling device when the space occupied by the gas-phase refrigerant in the container decreases, the internal pressure of the container increases and the boiling point of the refrigerant rises, so that the cooling performance of the boiling cooling device decreases. . In order to avoid this, the related boiling cooling apparatus has led to an increase in the size of the apparatus.
  • the space occupied by the refrigerant in the gas phase can be expanded without increasing the volume of the flat container 110. That is, it is possible to cool by disposing a heating element also in the heat radiation region 150 where the refrigerant in the gas phase radiates heat. Therefore, a small boiling cooling type flat plate cooling device having excellent cooling performance can be obtained.
  • the phase change cooling in the boiling cooling method since the heat is transferred by latent heat, the temperature of the refrigerant itself does not change. That is, since the refrigerant temperature does not increase due to sensible heat, the temperature of the heating element in the heat radiating portion heat receiving region 140A does not increase due to the gas-liquid two-phase flow.
  • the structure on the heat radiation region 150 side of the guide wall portion 130 is not a loop shape but an open end so that the gas-liquid two-phase flow in which the gas-phase refrigerant entrains the liquid-phase refrigerant is likely to rise. It is desirable.
  • the distance between the pair of guide walls 131 and 132 is preferably set to be equal to or larger than the width of the first adjacent heat receiving region 140B in order to efficiently increase the generated gas-liquid two-phase flow. Since the amount of gas-liquid two-phase flow generated is proportional to the number of heat receiving regions 140, the distance between the pair of heat conducting walls 131 and 132 can be increased according to the number of heat receiving regions 140 arranged on the conducting wall portion 130. it can.
  • the distance 131, 132 between the pair of conductive walls is not less than one time the width of the first adjacent heat receiving region 140B and not more than the number of heat receiving regions 140 disposed below the gas-liquid interface of the refrigerant. can do.
  • the arrangement of the heat receiving region 140 and the conducting wall portion 130 is not limited to the case shown in FIG. 1B, and the heat receiving region 140 may be arranged in a region other than the conducting wall portion 130 as shown in FIG. 2A.
  • a plurality of heat radiating part heat receiving areas 140A may be arranged in one heat radiating area 150, and the conducting wall part 130 may be arranged for each heat radiating part heat receiving area 140A. Also, as shown in FIG.
  • the gas-liquid interface of the refrigerant 120 (the dotted line in the hatched portion in the figure) is between the first adjacent heat receiving area 140B and the second adjacent heat receiving area 140C adjacent thereto. It can be set as the structure located.
  • the position of the gas-liquid interface here is a position in a state where the plurality of heat receiving regions 140 are arranged in the vertical direction (vertical direction in the drawing).
  • the guide wall 130 is disposed with at least the second adjacent heat receiving region 140C interposed therebetween.
  • the distance between the pair of guide walls 131 and 132 constituting the guide wall portion 130 is one or more times the width of the second adjacent heat receiving region 140C, and from the gas-liquid interface of the refrigerant.
  • the number of heat receiving regions 140 disposed below is less than the number of heat receiving regions 140. Also in this case, the gas-liquid two-phase flow of the refrigerant generated in the second adjacent heat receiving region 140C in the liquid phase refrigerant reaches the first adjacent heat receiving region 140B and the heat radiating unit heat receiving region 140A by the guide wall 130. Is possible. That is, also in the first adjacent heat receiving region 140B and the heat radiating portion heat receiving region 140A that are not filled with the liquid phase refrigerant, the heat generator 180 takes heat away from the heat generator 180 due to the gas-liquid two-phase flow of the refrigerant. It is possible to perform cooling.
  • FIG. 4 is a side sectional view showing a configuration of a flat plate cooling device 200 according to the second embodiment of the present invention
  • FIGS. 5A and 5B are plan sectional views.
  • the flat plate cooling device 200 includes a flat plate container 210 having a first flat plate 211 and a second flat plate 212 facing the first flat plate 211, and a refrigerant 220 enclosed in the flat plate container 210. And the 1st flat plate 211 and the 2nd flat plate 212 are connected, and the guide wall part 230 which controls the flow of the refrigerant
  • the flat plate cooling device 200 uses a plurality of heat generating elements 280 and heat dissipating portions 290 made of heat dissipating fins on at least one of the first flat plate and the second flat plate, and is used by thermally connecting them.
  • the flat plate cooling device 200 is thermally connected to, for example, the heat dissipating units 290 disposed in two places, an upper portion and a lower portion of the flat plate container 210. That is, as shown in FIGS. 4, 5 ⁇ / b> A, and 5 ⁇ / b> B, the flat container 210 has a plurality of heat receiving regions 240 that are thermally connected to the plurality of heating elements 280 and a heat dissipation that is thermally connected to the two heat radiating units 290.
  • the region 250 is provided in two places.
  • the plurality of heat receiving areas 240 include two heat radiating portion heat receiving areas 240 ⁇ / b> A arranged in the two heat radiating areas 250 and the heat receiving areas 240 arranged between the heat radiating areas 250.
  • the guide wall portion 230 includes a pair of guide walls 231 and 232, and the guide walls 231 and 232 are disposed with at least the first adjacent heat receiving region 240B adjacent to the heat radiating portion heat receiving region 240A interposed therebetween.
  • the flat plate cooling apparatus 200 includes the two heat radiating portion heat receiving regions 240A thermally connected to the two heat radiating portions 290, and therefore, as shown in FIGS. Even if it is the structure which turned the container 210 upside down, it can be used.
  • positioning at the time of using the flat type cooling device 200 can be increased.
  • the pair of guide walls 231 and 232 constituting the guide wall portion 230 connects the heat radiating portion heat receiving area 240A and the first adjacent heat receiving area 240B to the plate-like container 210. It can be set as the structure which inclined and arrange
  • the flat plate cooling device 200 can be used even in a configuration in which the flat plate cooling device 200 is rotated 90 degrees with respect to the use state of FIGS. 5A and 5B.
  • the gas-liquid interface of the refrigerant 220 is parallel to a straight line connecting two heat radiation areas 250 and parallel to one side of the flat container 210, and the plurality of heat receiving areas 240 are gas-liquid interfaces. It becomes the structure arrange
  • the flat plate cooling device 200 has a straight line connecting the heat radiating portion heat receiving area 240A and the first adjacent heat receiving area 240B and parallel to one side of the flat container 210.
  • first arrangement state An arrangement state parallel to the direction.
  • second arrangement state a straight line connecting the heat radiating portion heat receiving area 240A and the first adjacent heat receiving area 240B and parallel to one side of the plate-like container 210 is perpendicular to the vertical direction.
  • the flat plate cooling device 200 of the present embodiment can be used by switching between the first arrangement state and the second arrangement state. Thereby, the freedom degree of arrangement
  • FIG. 7A and 7B are views showing a configuration of a flat plate cooling device 300 according to the third embodiment of the present invention, in which FIG. 7A is a side sectional view and FIG. 7B is a plan sectional view.
  • the flat plate cooling apparatus 300 includes a flat plate container 110 including a first flat plate 111 and a second flat plate 112 facing the first flat plate 111, and a refrigerant 120 sealed in the flat plate container 110. And the 1st flat plate 111 and the 2nd flat plate 112 are connected, and the guide wall part 130 which controls the flow of the refrigerant
  • the flat container 110 includes a plurality of heat receiving regions 140 that are thermally connected to the plurality of heating elements 180, and a heat radiating region 150 that is thermally connected to the heat radiating unit 190.
  • the plurality of heat receiving areas 140 include at least one heat radiating portion heat receiving area 140 ⁇ / b> A disposed in the heat radiating area 150.
  • the guiding wall portion 130 is composed of a pair of guiding walls 131 and 132, and the guiding walls 131 and 132 are arranged with at least the first adjacent heat receiving region 140B adjacent to the heat radiating portion heat receiving region 140A interposed therebetween. Since the configuration up to here is the same as that of the flat plate cooling device 100 according to the first embodiment, detailed description thereof is omitted.
  • the flat plate cooling apparatus 300 includes a heat transfer member 350 that connects the first flat plate 111 and the second flat plate 112 in the heat dissipation region 150 and thermally connects the heat generator 180 and the heat dissipating unit 190.
  • the configuration was as follows.
  • a material constituting the heat transfer member 350 a metal having excellent thermal conductivity, such as aluminum or copper, can be used. With this configuration, even when only the heat dissipating part heating element 380 that is the heating element disposed in the heat dissipating part heat receiving area 140A not filled with the liquid-phase refrigerant operates, the heat dissipating part heating element 380 is cooled. Is possible.

Abstract

Lorsque la taille d'un dispositif de refroidissement utilisant le procédé de refroidissement par ébullition est réduite, les propriétés de refroidissement du dispositif diminuent. Par conséquent, le dispositif de refroidissement à plaques plates de la présente invention est pourvu d'un contenant plat présentant une première plaque plate et une seconde plaque plate faisant face à la première plaque plate, d'un réfrigérant enfermé dans le contenant plat, et d'une partie paroi conductrice raccordée à la première plaque plate et à la seconde plaque plate et destinée à réguler l'écoulement du réfrigérant à l'intérieur du contenant plat, le contenant plat présentant une pluralité de régions de réception de la chaleur raccordées thermiquement à une pluralité de corps chauffants disposés sur la première plaque plate et/ou la seconde plaque plate et une région de dégagement de chaleur raccordée thermiquement à une partie de dégagement de la chaleur disposée sur la première plaque plate et/ou la seconde plaque plate, la pluralité de régions de réception de la chaleur comprenant au moins une région de réception de la chaleur de l'unité de dégagement de la chaleur disposée sur la région de dégagement de la chaleur, la partie paroi conductrice étant constituée d'une paire de parois conductrices, et les parois conductrices sont disposées de façon à prendre en sandwich une première région de réception de la chaleur adjacente qui est adjacente à la région de réception de la chaleur de l'unité de dégagement de la chaleur.
PCT/JP2012/062241 2011-05-20 2012-05-07 Dispositif de refroidissement à plaques plates et son procédé d'utilisation WO2012161002A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013516292A JP5874935B2 (ja) 2011-05-20 2012-05-07 平板型冷却装置及びその使用方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011113684 2011-05-20
JP2011-113684 2011-05-20

Publications (1)

Publication Number Publication Date
WO2012161002A1 true WO2012161002A1 (fr) 2012-11-29

Family

ID=47217082

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/062241 WO2012161002A1 (fr) 2011-05-20 2012-05-07 Dispositif de refroidissement à plaques plates et son procédé d'utilisation

Country Status (2)

Country Link
JP (1) JP5874935B2 (fr)
WO (1) WO2012161002A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013051587A1 (fr) * 2011-10-04 2013-04-11 日本電気株式会社 Dispositif de refroidissement à plaque plate et son procédé d'utilisation
WO2017180524A1 (fr) * 2016-04-11 2017-10-19 Qualcomm Incorporated Dispositif de dissipation de chaleur à phases multiples pour dispositif électronique
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327052U (fr) * 1986-08-02 1988-02-22
JPH10173115A (ja) * 1996-12-06 1998-06-26 Toshiba Corp 沸騰冷却装置及びその製造方法
JP2000074536A (ja) * 1998-08-31 2000-03-14 Denso Corp 沸騰冷却装置
JP2010010204A (ja) * 2008-06-24 2010-01-14 Toyota Industries Corp 沸騰冷却装置
JP2010007893A (ja) * 2008-06-24 2010-01-14 Toyota Industries Corp 沸騰冷却装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6327052U (fr) * 1986-08-02 1988-02-22
JPH10173115A (ja) * 1996-12-06 1998-06-26 Toshiba Corp 沸騰冷却装置及びその製造方法
JP2000074536A (ja) * 1998-08-31 2000-03-14 Denso Corp 沸騰冷却装置
JP2010010204A (ja) * 2008-06-24 2010-01-14 Toyota Industries Corp 沸騰冷却装置
JP2010007893A (ja) * 2008-06-24 2010-01-14 Toyota Industries Corp 沸騰冷却装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013051587A1 (fr) * 2011-10-04 2013-04-11 日本電気株式会社 Dispositif de refroidissement à plaque plate et son procédé d'utilisation
WO2017180524A1 (fr) * 2016-04-11 2017-10-19 Qualcomm Incorporated Dispositif de dissipation de chaleur à phases multiples pour dispositif électronique
US10353445B2 (en) 2016-04-11 2019-07-16 Qualcomm Incorporated Multi-phase heat dissipating device for an electronic device
US10746474B2 (en) 2016-04-11 2020-08-18 Qualcomm Incorporated Multi-phase heat dissipating device comprising piezo structures
US9999157B2 (en) 2016-08-12 2018-06-12 Qualcomm Incorporated Multi-phase heat dissipating device embedded in an electronic device
US11181323B2 (en) 2019-02-21 2021-11-23 Qualcomm Incorporated Heat-dissipating device with interfacial enhancements

Also Published As

Publication number Publication date
JP5874935B2 (ja) 2016-03-02
JPWO2012161002A1 (ja) 2014-07-31

Similar Documents

Publication Publication Date Title
US7369410B2 (en) Apparatuses for dissipating heat from semiconductor devices
US7188484B2 (en) Heat dissipating structure for mobile device
US7304842B2 (en) Apparatuses and methods for cooling electronic devices in computer systems
JP4978401B2 (ja) 冷却装置
WO2011145618A1 (fr) Dispositif de refroidissement à ébullition
WO2013102973A1 (fr) Dispositif de refroidissement, et appareil électronique mettant en œuvre celui-ci
EP3405733B1 (fr) Réalisation de caloduc oscillant à niveaux multiples dans un module de carte à circuits électroniques
US20100269517A1 (en) Module for cooling semiconductor device
US8773855B2 (en) Heat-dissipating device and electric apparatus having the same
JP2009088125A (ja) 冷却装置およびそれを備えた電子機器
US10962297B2 (en) Multidimensional heat transfer system for cooling electronic components
JP5874935B2 (ja) 平板型冷却装置及びその使用方法
US20070151275A1 (en) Methods and apparatus for microelectronic cooling using a miniaturized vapor compression system
US20100032141A1 (en) cooling system utilizing carbon nanotubes for cooling of electrical systems
WO2015146110A1 (fr) Refroidisseur à changement de phase et procédé de refroidissement à changement de phase
US10907910B2 (en) Vapor-liquid phase fluid heat transfer module
JP2007263427A (ja) ループ型ヒートパイプ
JP2013007501A (ja) 冷却装置
JP2007115917A (ja) 熱分散プレート
EP3518072B1 (fr) Module de transfert de chaleur
WO2013005622A1 (fr) Dispositif de refroidissement et son procédé de fabrication
JP2013033807A (ja) 冷却装置およびそれを用いた電子機器
WO2015128951A1 (fr) Dispositif de refroidissement d'élément à semi-conducteur et appareil électronique
US20070295488A1 (en) Thermosyphon for operation in multiple orientations relative to gravity
WO2013089162A1 (fr) Structure de refroidissement pour électronique à profil mince, et dispositif électronique employant ladite structure

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12789417

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2013516292

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12789417

Country of ref document: EP

Kind code of ref document: A1