WO2013047604A1 - ダイヤモンド切削工具の加工装置 - Google Patents
ダイヤモンド切削工具の加工装置 Download PDFInfo
- Publication number
- WO2013047604A1 WO2013047604A1 PCT/JP2012/074748 JP2012074748W WO2013047604A1 WO 2013047604 A1 WO2013047604 A1 WO 2013047604A1 JP 2012074748 W JP2012074748 W JP 2012074748W WO 2013047604 A1 WO2013047604 A1 WO 2013047604A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- polishing surface
- holding
- diamond
- axis
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B3/00—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools
- B24B3/34—Sharpening cutting edges, e.g. of tools; Accessories therefor, e.g. for holding the tools of turning or planing tools or tool bits, e.g. gear cutters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
Definitions
- the present invention relates to a diamond cutting tool processing device for obtaining a diamond cutting tool by polishing a rough diamond.
- a diamond cutting tool in which a single crystal diamond ore is provided with a cutting edge and fixed to a base metal or a shank by a mechanical method such as brazing, clamping, or caulking. Since such a diamond cutting tool is used for ultra-precision machining such as an aspherical lens mold, the cutting edge has a highly accurate contour shape (arc shape). The arc shape is usually formed by polishing.
- Patent Document 1 discloses a holding arm (holding arm) that holds a diamond bite having a diamond rough stone and a polishing dish that rotates horizontally (holding arm).
- a polishing apparatus is disclosed.
- the first step is to grind the rough diamond by pressing the rough diamond against a rotating polishing dish and to measure the polished surface of the rough diamond
- the polygonal shape approximated to the circular arc is produced by repeating the measurement with a vessel and confirming the polishing state of the surface to be polished.
- a method of manufacturing a diamond cutting tool having an arc-shaped cutting edge by continuously swinging the diamond cutting tool around the axis of the holding arm by finish polishing is employed. (See the embodiment of Patent Document 1).
- Patent Document 2 discloses a method of forming a cutting edge of a diamond tool by laser processing
- Patent Document 3 discloses a method of forming by a focused ion beam (FIB) processing.
- FIB focused ion beam
- the contact point to the polished surface is reciprocated on the polished surface so that the polished surface does not wear unevenly and so that no polishing streaks are formed on the rough diamond. I am letting. Since this reciprocating direction is usually the radial direction of the polished surface (the direction along the axial direction of the holding arm), the processing direction remains almost constant with respect to the polished surface of the rough diamond.
- the processing direction of the polishing surface May be fixed in a difficult processing direction with respect to the crystal plane orientation of the diamond rough, and at that time, the processing in that plane orientation does not proceed.
- the processing of a general diamond tool as belonging to the first step of Patent Document 1 requires a much larger processing amount than finishing. For this reason, the polished surface of the rough diamond is rough, but the processing speed is improved by increasing the diameter of the diamond abrasive grains used in comparison with the finish processing.
- the increase in surface roughness of the polished surface caused by coarse abrasive grains during molding processing is caused by finer abrasive grains and rough diamonds during finishing processing. Since the contact with the surface to be polished is hindered, there is a problem that a long time is required for finishing and at the same time the processing accuracy is deteriorated.
- the present invention has been made in view of the above circumstances, and one of its purposes is a diamond cutting tool processing apparatus that can perform cutting and polishing processing with high contour accuracy faster and easier than before. It is to provide.
- the processing device for a diamond cutting tool of the present invention includes a pedestal portion, a holding mechanism that is provided on the pedestal portion and holds an object to be polished having a rough diamond, and is provided on the pedestal portion, and rotates the polishing surface around its central axis. And a polishing mechanism that polishes the contour of the rough diamond into an arc shape by the rotating polishing surface.
- the processing apparatus of the present invention includes a polishing mechanism provided in the processing apparatus.
- the polishing surface side rotation mechanism section includes a polishing surface side bearing section that rotatably supports the rotating polishing body. Further, the lifting mechanism on the polishing surface side raises and lowers the polishing surface in the Z-axis direction with respect to the rough diamond.
- the lifting mechanism portion on the polishing surface side moves the inner bottom portion of the bearing portion on the polishing surface side that pivotally supports the rotating polishing body in the Z-axis direction, so that it can move against the rough diamond.
- the polishing surface can be lifted and lowered in the Z-axis direction
- the rotating polishing body can include a lifting and lowering configuration of the polishing body that is detachably supported by the bearing portion on the polishing surface side.
- the polishing surface side lifting mechanism portion 7 is integrated with the inner bottom portion 60 c of the bearing portion 60 on the polishing surface side.
- the inner member 7i and the annular outer member 7o disposed on the outer periphery of the inner member 7i, and the outer peripheral surface of the inner member 7i and the inner peripheral surface of the outer member 7o are screw-fitted. Can do. In that case, when the outer member 7o is rotated, the inner bottom portion 60c integrated with the inner member 7i moves up and down in the Z-axis direction by sending out the screw.
- the fixed cutting depth can be set by the feed amount by the screw of the rotating abrasive body for the diamond rough fixed to the rigid holding arm (and holding side rotating mechanism). Therefore, it is possible to suppress the deterioration of contour accuracy due to the hardness anisotropy of diamond.
- the tool blade edge can be formed with shape accuracy based on the rotation accuracy of the rotating abrasive body.
- the surface of the polishing surface can be corrected together with the rotary polishing body. Furthermore, if there are a plurality of rotating abrasive bodies with different surface conditions of the polishing surface, the surface state of the polishing surface that affects the processing accuracy can be easily replaced with the polishing surface that is always in the best condition. While performing, stable and highly accurate machining can be performed without delaying the work.
- the rotating abrasive body is a diamond wheel, and during precision finishing, the metal polishing surface to which loose diamond abrasive grains are attached is used. It is possible to make a selection. In this way, by selecting an appropriate polishing surface for each processing step, it is possible to perform processing more quickly and with high contour accuracy.
- the removal and removal of the rotating abrasive body can be performed with the diamond rough stone fixed to the holding arm, when replacing the rotating abrasive body in accordance with the process, the clearance angle and the radius of the arc shape can be set. It can be put out accurately.
- the lifting mechanism portion on the polishing surface side advances and retracts the entire bearing portion on the polishing surface side in the Z-axis direction, so that the polishing surface is oriented in the Z-axis direction with respect to the rough diamond.
- the bearing unit on the polishing surface side is configured to be lifted and lowered, and a lifting / lowering mode of the bearing unit fixed to the lifting mechanism unit on the polishing surface side can be exemplified.
- the polishing surface side raising and lowering mechanism portion 7 ′ includes a base 70 ′ fixed on the pedestal portion ⁇ , And a top plate 71 ′ supported so as to be movable up and down in the Z-axis direction on the base, and a configuration in which a bearing portion 60 ′ on the polishing surface side is mounted on the top plate 71 ′.
- the holding mechanism for holding the object to be polished is fixed to a portion other than the top plate 71 ′ on the pedestal part ⁇ , it is possible to perform a fixed-size notch for approaching the polished surface to the rough diamond to be polished. it can.
- the fixed size cutting of a rough diamond can be performed similarly to the polishing body raising / lowering form.
- the configuration in which the rotating polishing body is detachable from the polishing surface side bearing portion in the polishing body lifting / lowering configuration by making the polishing surface side bearing portion detachable from the lifting mechanism portion on the polishing surface side in the bearing portion lifting / lowering configuration In the same manner, it is easy to replace the polishing surface according to the application.
- a holding mechanism is extended along the Y-axis direction, the holding member which has a holding arm which hold
- a holding-side rotation mechanism that reciprocally rotates along an arc around the axis, and the polishing mechanism reciprocates linearly or arcuately in the direction close to the X axis in a direction close to the X-axis.
- the polishing surface may be provided with a reciprocating mechanism on the polishing surface side.
- the rotating mechanism portion on the polishing surface side is linear or arcuate in a direction close to the X axis perpendicular to the reciprocating rotation axis (Y axis) of the holding arm. Go back and forth. That is, the polishing surface of the rotating polishing body that is pivotally supported by the rotation mechanism portion on the polishing surface side also reciprocates linearly or arcuately in a direction close to the X axis.
- Finishing with a high arc shape can be performed.
- the approach direction of the polishing surface with respect to the crystal orientation of the rough diamond is constant. Will remain.
- the processing may not proceed at all depending on the angle of the rough diamond with respect to the polished surface.
- the contact point between the rough diamond and the polishing surface is the vertex.
- the angle ⁇ formed by the contact point between the rough diamond and the polishing surface is preferably in the range of 5 ° to 180 °. .
- the angle change in the processing direction of the rough diamond is 5 ° to 180 °, and the processing direction of the high-order crystal plane generated by the conical processing is also changed in the range of 5 ° to 180 °.
- the frequency with which the machining direction matches the conditions that can be machined increases.
- the angle ⁇ is 180 °, the contact point between the rough diamond and the polishing surface is located on the locus formed by the center of rotation on the polishing surface of the rotating polishing body by the reciprocating motion.
- the holding mechanism includes a base placed on the pedestal, a holding arm, a gonio stage, a rotary stage, and a holding-side lifting mechanism.
- the holding arm extends along the Y-axis direction and holds the object to be polished in a cantilever shape at the tip.
- the gonio stage supports the base side of the holding arm so that the tip of the holding arm can rotate along an arc around the X axis.
- the rotary stage pivotally supports the gonio stage so as to be rotatable around the Y axis.
- the holding-side lifting mechanism unit moves the holding arm, the gonio stage, and the rotary stage integrally with respect to the base in the Z-axis direction.
- the holding-side lifting mechanism portion allows the rough diamond to be positioned at an appropriate position on the Z axis at the time of processing, and the rough diamond can be easily placed above the Z axis at the end of processing. Since it can be released, the rough diamond can be removed more safely than the holding arm.
- the angles (pitch angle and bank angle) of the rough diamond with respect to the polished surface can be adjusted with high accuracy. Specifically, by measuring the three-dimensional shape of the rough diamond attached to the holding arm and determining the angle of the surface to be polished based on the measured shape, polishing is performed with a predetermined dimensional accuracy and shape accuracy. It can be performed. In particular, it is effective when natural diamond having a constant size and shape is used as a rough diamond or when facets are formed on a rough diamond.
- a contact pressure adjusting mechanism part having a rod-like body and a weight member can be provided.
- the rod-shaped body is attached to the side of the rotary stage opposite to the side where the gonio stage is provided.
- the weight member is slidably attached to the rod-shaped body.
- the contact pressure adjusting mechanism unit adjusts the balance between the load of the member that moves integrally by the holding side lifting mechanism unit and the load on the weight member side by changing the position of the weight member in the longitudinal direction of the rod-shaped body, By adjusting the balance, the pressure at which the object to be polished comes into contact with the polishing surface is adjusted.
- rough processing of the rough diamond may be performed by a high energy processing machine without using the processing apparatus of the present invention, and only the finishing process for continuously reciprocating the diamond rough may be performed by the processing apparatus of the present invention.
- the diamond cutting tool processing apparatus of the present invention it is possible to produce a diamond cutting tool with high skill and less skill.
- FIG. 3 is an enlarged partial cross-sectional view of a rotary polishing body and a bearing portion on the polishing surface side provided in the polishing mechanism.
- Each drawing shows an X axis, a Y axis, and a Z axis orthogonal to each other (the XY plane is a horizontal plane, and the Z axis is a vertical axis).
- the same reference numerals are used for the same or corresponding members.
- a diamond cutting tool processing apparatus 100 shown in FIG. 1 is installed on a pedestal portion ⁇ (only the top plate of the pedestal portion ⁇ is shown in the drawing) and the upper surface of the pedestal portion ⁇ , and holds a polishing object including a rough diamond.
- the polishing surface 5s is provided in parallel to the horizontal plane (XY plane).
- the pedestal portion ⁇ is a box-shaped housing (only the top plate is shown in the drawing), and a power supply unit for driving the mechanisms ⁇ and ⁇ and a control for controlling the mechanisms ⁇ and ⁇ inside the box-shaped housing. Etc. are provided.
- a control panel having a power button of the processing apparatus 100 and an input button (which may be a touch panel or the like) for inputting polishing conditions may be provided on the top plate of the pedestal part ⁇ .
- the processing apparatus 100 may be connected to a personal computer by wire or wireless, and the processing apparatus 100 may be operated from the personal computer.
- the holding mechanism ⁇ includes a holding member 1 that holds the object to be polished in a cantilever shape, a holding side rotating mechanism portion 2 that rotates the holding member 1 around the Y axis, and a support end side of the holding member 1 (a holding side bearing described later).
- a holding-side turning mechanism 3 that turns the portion 20) along an arcuate trajectory around the X-axis.
- the holding member 1 includes a holding arm 10 that holds the object 9 to be polished, and a rotation base 11 to which the holding arm 10 is attached.
- the rotation base 11 is a member that supports the holding arm 10, but is also a constituent member of the holding-side rotation mechanism unit 2 described later.
- the holding arm 10 is an arm-like member having a grip portion (see the shape of FIG. 1A) whose tip side is formed in a “[” shape.
- the polishing object 9 arranged in the gripping part may be fixed directly by screwing, or may be fixed via a spacer (not shown) so that the polishing object 9 is pressed against the gripping part with equal pressure. good.
- the object 9 to be gripped may be one in which a rough diamond 90 is fixed to the tip of the shank 91 by a brazing method or a mechanical method such as caulking or clamping, as shown in the figure, or a rough diamond 90 itself may be sufficient.
- an acoustic sensor 10a is attached in the vicinity of the grip portion of the holding arm 10.
- the acoustic sensor 10 a is a sensor that detects vibration of the holding arm 10.
- the fact that the vibration of the holding arm 10 can be detected means whether or not the polishing surface 5s (see FIG. 1) is in contact with the polishing object 9 held by the holding arm 10 and, to what extent is the contact degree. Can be grasped accurately.
- the rotation base 11 to which the holding arm 10 is attached includes a shaft portion 11a and a disk portion 11b formed on one end side of the shaft portion 11a.
- a plurality of screw holes 11h are formed in the disk portion 11b at equal intervals in the circumferential direction.
- the holding arm 10 is attached to any one of these screw holes 11h. That is, the holding arm 10 is attached to the vicinity of the outer peripheral edge which is a position deviated from the center of the disk part 11 b of the rotation base 11.
- a weight member 10b (see FIGS. 2, 5, and 6) can be attached to the screw hole 11h located at a position facing the screw hole 11h to which the holding arm 10 is attached. preferable.
- the servo motor that reciprocates the rotation base 11 when rotating the rotation base 11 or polishing the rough diamond 90 is used. A heavy load is applied.
- the weight member 10b by attaching the weight member 10b to the opposite side of the rotation base 11 and taking the balance, it is possible to reduce the load on the servo motor and at the same time suppress the shaking of the holding arm 10.
- positioning which arrange
- the holding-side rotation mechanism unit 2 includes the rotation base 11 and a holding-side bearing unit 20 that rotatably supports the shaft portion 11a of the rotation base 11. Inside the holding-side bearing portion 20 are provided a hydrostatic bearing 20a using gas and a drive source 20b such as a motor for applying a rotational force to the shaft portion 11a.
- a hydrostatic bearing 20a using gas and a drive source 20b such as a motor for applying a rotational force to the shaft portion 11a.
- the holding arm 10 provided on the disk portion 11a of the rotation base 11 can be reciprocally rotated along an arc trajectory around the Y axis (see the white arrow in FIG. 2A).
- the reciprocating rotation range of the holding arm 10 is preferably increased by about 10 ° at both ends with respect to the angle range for which the contour accuracy is required for the arc.
- the holding arm 10 may be reciprocally rotated in the range of 140 ° by increasing the total angle by 20 ° by 10 ° at both ends with respect to the angle range.
- an arc-shaped rake face can be formed on the rough diamond 90 as described in the item of the polishing method described later.
- the holding-side turning mechanism unit 3 includes a box-shaped stand unit 30.
- the stand portion 30 is a portion that serves as a base for the entire holding mechanism ⁇ , and is erected on the top plate of the pedestal portion ⁇ (see FIG. 1).
- An arc-shaped slit 30s is provided on a side surface (a surface parallel to the YZ plane) of the stand unit 30, and a support shaft 30r that is reciprocally disposed along the slit 30s is disposed.
- the holding side bearing portion 20 is supported on the side surface of the stand portion 30 by the support shaft 30r. Therefore, the holding-side bearing portion 20 that is the support end of the holding member 1 is rotatable along an arcuate track around the X axis (see the white arrow in FIG. 2B).
- the degree of turning of the holding side bearing portion 20 may be adjusted manually.
- the support shaft 30r that supports the holding-side bearing portion 20 is a bolt, the bolt is loosened, the holding-side bearing portion 20 is moved along the slit 30s, and then the bolt is retightened.
- a drive source or the like for moving the support shaft 30 r is disposed inside the stand unit 30.
- the inclination of the holding arm 10 with respect to the polishing surface 5 s can be changed as described in the item of the polishing method described later.
- the clearance angle can be formed continuously.
- the inclination of the holding arm 10 with respect to the polishing surface 5s is changed without substantially changing the position of the holding arm 10 in the height direction (position in the direction orthogonal to the polishing surface 5s). Therefore, the raising / lowering mechanism part 7 (refer FIG. 4) by the side of the grinding
- the polishing mechanism ⁇ includes leg pieces 4 erected on the top plate of the pedestal portion ⁇ .
- the upper surface of the leg piece 4 is provided with two rails 4r extending in parallel in the X-axis direction.
- a slide table 4B having a guide 4g is placed on the rail 4r. Therefore, the slide table 4B can be moved on the rail 4r along the extending direction (X-axis direction) of the rail 4r.
- a rotating polishing body 5 having a polishing surface 5s, a rotating mechanism 6 on the polishing surface side for rotating the rotating polishing body 5 around the Z axis, and the rotating polishing body 5 as a Z axis. Polishing by reciprocating in the X-axis direction on the XY plane (surface parallel to the polishing surface 5s) and the lifting mechanism portion 7 (described later with reference to FIG. 4) on the polishing surface side that moves up and down in the direction. A reciprocating mechanism 8 on the surface side.
- these configurations will be described.
- the rotary polishing body 5 includes a cylindrical shaft portion 5a and a disk portion 5b provided at the tip of the shaft portion 5a.
- a polished surface 5s is formed on the upper surface of the disk portion 5b.
- Part of the disk part 5b including the polished surface 5s can be configured to be detachable from the remaining part.
- the portion including the polishing surface 5s can be, for example, a diamond wheel to which diamond abrasive grains are attached, or a cast iron polishing plate.
- the diamond wheel is preferably used for rough polishing of the rough diamond 90
- the cast iron polishing plate is preferably used for precise polishing of the rough diamond 90.
- a thrust ball 5c is attached to the lower end portion (the end portion opposite to the disc portion 5b) of the rotary polishing body 5. For this reason, when the rotary polishing body 5 is inserted into a bearing portion 60 on the polishing surface side described later, the rotary polishing body 5 is supported on the inner bottom portion 60c of the bearing portion 60 on the polishing surface side via the thrust ball 5c.
- a driven pulley 62b is integrally provided at the base of the disk portion 5b.
- the driven pulley 62b is a member that constitutes a part of the transmission unit 62 of the rotating mechanism unit 6 on the polishing surface side, which will be described below. If the driven pulley 62b rotates, the rotating polishing body 5 also rotates accordingly. To do.
- the rotating mechanism unit 6 on the polishing surface side includes a bearing unit 60 on the polishing surface side that houses the rotating polishing body 5 with the polishing surface 5 s exposed, and the rotating polishing body 5.
- a power source unit 61 having a built-in motor serving as a power source to be rotated and a transmission unit 62 for transmitting the rotational force of the motor to the rotating polishing body 5 are provided.
- the bearing portion 60 on the polishing surface side is a cylindrical body in which the rotary polishing body 5 can be accommodated.
- a flange portion 60f is provided on the outer peripheral surface of the intermediate portion in the longitudinal direction of the bearing portion 60 on the polishing surface side, and the bearing portion 60 on the polishing surface side is fixed to the slide table 4B (see FIG. 3) by the flange portion 60f.
- hydrostatic bearings 60a and 60b using gas which is a kind of fluid bearing, are formed inside the bearing portion 60 on the polished surface side.
- the hydrostatic bearings 60a and 60b of the present embodiment are of the porous type, and the gas introduced from the intake port 601 is introduced into the bearing portion 60 on the polishing surface side, and the gas is used for the bearing portion 60 on the polishing surface side.
- the rotary polishing body 5 is rotatably supported inside. Excess gas is exhausted from the exhaust port 602.
- the total length of the hydrostatic bearings 60a and 60b (the axial length of the rotating abrasive body 5) is preferably at least twice the diameter of the shaft portion 5a of the rotating abrasive body 5. By doing so, rotation of the rotary polishing body 5 can be stabilized.
- a recess in which the thrust ball 5c of the rotating abrasive body 5 is disposed is formed in the inner bottom portion 60c of the bearing portion 60 on the polishing surface side. Therefore, if the rotating abrasive body 5 accommodated in the bearing portion 60 on the polishing surface side is rotated, the rotation of the rotating abrasive body 5 is stabilized by the gyro effect.
- a thrust sphere may be provided on the inner bottom portion 60c, and a recess for receiving the thrust sphere may be provided in the rotary polishing body 5.
- the clearance between the inner peripheral surface of the bearing portion 60 on the polishing surface side (portions where the hydrostatic bearings 60a and 60b are not formed) and the outer peripheral surface of the rotating polishing body 5 is preferably 5/100 to 1/10 mm. preferable. By setting the clearance within this range, the rotating abrasive body 5 can be easily removed from the bearing portion 60 on the polishing surface side. Although the clearance in this range is larger than the clearance in a normal hydrostatic bearing, the rotating abrasive body 5 rotates stably without the rotating shaft being shaken due to the gyro effect.
- the power source unit 61 is fixed on the slide table 4 ⁇ / b> B in the same manner as the bearing unit 60 on the polishing surface side.
- a main driving pulley 62 a is provided at the tip of the motor provided in the power source 61.
- the transmission unit 62 includes a main driving pulley 62a attached to the motor of the power source unit 61, a driven pulley 62b provided on the rotary polishing body 5, and a belt 62c spanned between the pulleys 62a and 62b.
- the main pulley 62a is rotated by the motor, the rotary polishing body 5 including the driven pulley 62b is rotated via the belt 62c.
- the lifting mechanism portion 7 on the polishing surface side of the present embodiment is supported by the inner bottom portion 60 c via the thrust ball 5 c by moving the inner bottom portion 60 c of the bearing portion 60 on the polishing surface side.
- the rotating polishing body 5 is moved up and down.
- the lifting mechanism portion 7 on the polishing surface side includes an inner member 7i provided on the outer periphery of the inner bottom portion 60c and an outer member 7o provided on the outer periphery of the inner member 7i.
- the inner peripheral surface of the inner member 7i is fitted to the inner bottom portion 60c, and both 7i and 60c are integrated. Further, threads are formed on the outer peripheral surface of the inner member 7i and the inner peripheral surface of the outer member 7o, and the inner member 7i moves up and down by rotating the outer member 7o. Therefore, by rotating the outer member 7o, the rotating polishing body 5 (that is, the polishing surface 5s) supported by the inner bottom portion 60c also moves up and down in the vertical direction (Z-axis direction).
- the ascending / descending rate of the rotating abrasive body 5 depends on the thread pitch of the annular members 7i and 7o. If the pitch is narrowed, it is easy to finely adjust the amount of elevation of the rotary polishing body 5. For example, if the polishing surface 5s moves up and down by 1 mm each time the outer member 7o is rotated once, the rough diamond 90 can be polished with high accuracy.
- the polishing surface side reciprocating mechanism portion 8 includes a power source portion 80 provided on the front side of the stand portion 30 (see also FIG. 1B) of the holding mechanism ⁇ .
- a motor and a crank mechanism are built in the power source unit 80.
- One end of the crank rod 80r of the crank mechanism is connected to the slide base 4B.
- the slide table 4B is slidably mounted on the rail 4r. Therefore, when the motor of the power source unit 80 is operated, the slide table 4B moves on the horizontal plane (polishing surface) on the X axis. Reciprocates in the direction.
- the polishing surface side rotation mechanism 6 fixed to the slide base 4B and the rotating polishing body 5 rotated by the polishing surface side rotation mechanism 6 also reciprocate in the X-axis direction.
- the slide table 4B including the guide 4g and the rail 4r can be regarded as the reciprocating mechanism unit 8 on the polishing surface side.
- a polishing object 90 in which a rough diamond 90 is fixed to a shank 91 is fixed to the tip of the holding arm 10, and the holding arm 10 is kept in a horizontal state. Then, while rotating the rotating polishing body 5 with the rotating mechanism unit 6 on the polishing surface side, the lifting mechanism unit 7 on the polishing surface side is manually operated to raise the rotating polishing unit 5, and the polishing surface 5 s becomes the rough diamond 90. Make a forced cut to approach. At this time, the rotation base 11 to which the holding arm 10 is fixed is firmly fixed by the holding side bearing portion 20 and the holding arm 10 does not shake in the vertical direction, so that precise polishing can be performed.
- the holding-side rotation mechanism 2 (see FIG. 2) of the holding mechanism ⁇ and the reciprocating mechanism 8 on the polishing surface side of the polishing mechanism ⁇ (see FIG. 3) are also operated.
- the holding arm 10 that holds the rough diamond 90 reciprocates along an arc trajectory around the Y axis as shown in FIG. 5A (see the white arrow).
- a circular arc shape can be formed in the diamond original stone 90.
- the polishing surface 5s reciprocates along a linear track extending in the X-axis direction on the XY plane (horizontal plane) ( See white arrow).
- the processing direction of the polishing surface 5s with respect to the rough diamond 90 changes as shown by a solid arrow and a dotted arrow in FIG.
- the hardness of diamond has anisotropy, there are directions that are easy to process and directions that are difficult to process.
- the rough diamond 90 can be efficiently polished.
- the reciprocating range of the polishing surface 5s is as follows. First, a triangle (indicated by a two-dot chain line in the drawing) having a contact point between the rough diamond 90 and the polishing surface 5s as a vertex and a trajectory formed by a rotation center point on the polishing surface 5s of the rotating polishing body by a reciprocating motion as a base. Think. Then, the reciprocating range of the polishing surface 5s was defined so that the angle ⁇ formed by the contact point between the rough diamond 90 and the polishing surface 5s was 140 °.
- the machining state can be determined.
- the processing sound is intermittent, but the arcuate contour is processed smoothly as the processing proceeds, Processing sound is continuous. As processing continues further, the processing noise decreases. Using this phenomenon, it may be determined that the processing has been completed when the processing sound is below a certain volume. As described above, the processing state is determined by the acoustic sensor 10a, so that highly accurate processing can be performed efficiently.
- a clearance angle is formed on the rough diamond 90 this time.
- the polishing surface 5s is once lowered, and the holding-side turning mechanism 3 is operated as shown in FIG. 6 so that the holding-side bearing 20 holding the holding arm 10 has an arc orbit around the Y axis. Move along. By doing so, the inclination of the rough diamond 90 with respect to the polished surface 5s can be changed.
- the rotary polishing body 5 is raised while being rotated, and the diamond rough stone 90 is polished by performing reciprocal rotation by the holder-side rotation mechanism unit 2 as necessary.
- the rough diamond 90 has a skillless and highly accurate contour shape without being affected by the hardness anisotropy of the rough diamond 90. Can be polished. Further, according to the processing apparatus 100, the arcuate shape processing of the diamond rough 90 is performed from the processing apparatus 100 to the diamond rough 90 while replacing the rotary polishing body 5 with an optimum one in accordance with the polishing process from roughing to finishing. Can be done without removing.
- FIG. 7 is a front view of the holding mechanism ⁇ ′.
- the holding mechanism ⁇ ′ includes a base 2 ′, a holding arm 10 ′, a gonio stage 11, a rotary stage 12 ′, a holding-side lifting mechanism 15 ′, and a contact pressure adjusting mechanism 16 ′.
- the holding-side lifting mechanism unit 15 ' includes a micro head 152' and a linear guide 154 '.
- the contact pressure adjusting mechanism portion 16 ' includes a rod-shaped body 13', a weight member 14 ', and a crosshead mechanism 162'.
- the base 2 ′ includes a magnet base 20 ′ erected on the pedestal ⁇ , a rail 22 ′ provided on the magnet base 20 ′, and a slide base supported so as to be slidable in the YY direction on the rail 22 ′. 21 '.
- a holding table 23 ' is further formed on the slide table 21'.
- the holding arm 10 ′ is a member that extends along the Y-axis direction and holds the object 9 to be polished in a cantilever shape at the tip.
- the base side of the holding arm 10 ' is fixed to a gonio stage 11' described below.
- the gonio stage 11 ' supports the base side of the holding arm 10' so that the tip of the holding arm 10 'can rotate along an arc around the X axis (see the white arrow in the drawing).
- a micro head 111 ′ is attached to the gonio stage 11 ′ for adjusting the inclination of the holding arm 10 ′ on the tip side. For example, when the micro head 111 ′ is turned by one scale, the holding arm 10 ′ is rotated by 0.006 ° around the X axis.
- the angle (pitch angle) of the polishing object 9 with respect to the polishing surface 5s see FIG. 1 etc.
- the mounting error of the polishing object 9 with respect to the holding arm 10 ′ can be corrected. it can.
- the rotary stage 12 ' pivotally supports the gonio stage 11' so as to be rotatable around the Y axis.
- the holding arm 10' rotates about 0.013 ° around the Y axis.
- the angle (bank angle) of the polishing object 9 with respect to the polishing surface 5s can be adjusted, and the mounting error of the polishing object 9 with respect to the holding arm 10 ′ can be corrected. it can.
- the rotary stage 12' is fixed by screwing or the like.
- the holding-side lifting mechanism 15 ′ is a mechanism that supports the rotary stage 12 ′, the goniostage 11 ′, and the holding arm 10 ′ so as to be integrally movable in the Z-axis direction with respect to the holding base 23 ′ of the base 2 ′. It is. Specifically, the rotary stage 12 'is slidably supported with respect to the holding base 23' via a linear guide 154 '. That is, the holding stage lifting / lowering mechanism unit 15 ′ can move the rotary stage 12 ′, the gonio stage 11 ′, and the holding arm 10 ′ in the Z-axis direction while maintaining an angle with respect to the rotary polishing body 5 (see FIG. 1 and the like). .
- the holding side lifting mechanism 15 ' includes a micro head 152' that defines the position of the lowest point of the rotary stage 12 '.
- the tip of the spindle of the microhead 152 ′ comes into contact with the object to be stopped on the holding base 23 ′, thereby positioning the lowest point of the rotary stage 12 ′.
- the position of the lowest point can be finely adjusted by adjusting the protrusion amount of the spindle of the micro head 152 '.
- the holding arm 10 ′ and the gonio stage 11 ′ integrated with the rotary stage 12 ′ are allowed to slide above the position defined by the microhead 152 ′ by the holding-side lifting mechanism 15 ′.
- the sliding downward from the prescribed position is restricted. Accordingly, it is possible to suppress the polishing object 9 from being excessively polished.
- the contact pressure adjusting mechanism 16 ' is a mechanism for adjusting the contact pressure with respect to the polished surface 5s of the rough diamond 90.
- a rod-shaped body 13 ', a weight member 14' and a crosshead mechanism 162 ' are used.
- the rod-shaped body 13 ' is a member that extends toward the opposite side of the rotary stage 12' from the side where the gonio stage 11 'is provided.
- a weight member 14 ' is slidably attached to the rod-like body 13'.
- the rod-shaped body 13 ' is connected to the rotary stage 12', the goniostage 11 ', and the holding arm 10' via a crosshead mechanism 162 '.
- the swing of the rod-like body 13 ′ around the fulcrum 156 ′ is converted into a reciprocating motion on the Z axis applied to the holding arm 10 ′, the gonio stage 11 ′ and the rotary stage 12 ′ by the crosshead mechanism 162 ′.
- the rotary stage 12 ′, the goniometer stage 11 ′ integrated with the rotary stage 12 ′, and the holding arm 10 ′ are lifted upward.
- the power can be changed. That is, by changing the position of the weight member 14 ′ in the longitudinal direction of the rod-like body 13 ′, the rotary stage 12 ′, the gonio stage 11 ′, and the holding arm 10 ′ (moving object to be polished) that are integrally moved by the holding-side lifting mechanism 15 ′. 9) and the load on the weight member 14 'side can be adjusted, and by adjusting the balance, the pressure at which the polishing object 9 contacts the polishing surface 5s (see FIG.
- both stages 12 ′ and 11 ′ are lifted upward while the angle of the polishing object 9 with respect to the polishing surface 5s is kept constant. If the force to be polished is reduced, the contact pressure of the object 9 to be polished with respect to the polishing surface 5s is increased, and the weight member 14 'is moved away from the rotary stage 12', both stages 12 'and 11' will be lifted upward. And the contact pressure of the polishing object 9 with respect to the polishing surface 5s decreases.
- the tip of the spindle of the microhead 152 ′ is to be stopped by an appropriate balance between the load on the weight member 14 ′ side and the load of the member that moves integrally by the holding side lifting mechanism 15 ′.
- the polishing object 9 is brought into contact with the polishing surface 5s with an appropriate contact pressure.
- the rough diamond 90 of the polishing object 9 attached to the holding arm 10 ' can be subjected to planar polishing. Further, the attachment error of the polishing object 9 to the holding arm 10 'can be accurately corrected by the gonio stage 11' and the rotary stage 12 '.
- the processing apparatus of the present embodiment further includes a holding-side reciprocating mechanism unit 3 ′ that reciprocates the polishing target 9 in the YY direction.
- the holding-side reciprocating mechanism unit 3 ′ includes a power source unit 30 ′ (swing motor) attached to the magnet base 21 ′ and a crank mechanism 31 ′.
- One end side of the crank rod 310 ′ provided in the crank mechanism 31 ′ is attached to the power source unit 30 ′, and the other end side is attached to the upper surface of the slide base 21 ′, and the slide base 21 is operated by operating the crank mechanism 31 ′.
- 'Goes back and forth in the YY direction As a result, the holding table 23 ′ provided on the slide table 21 ′ also reciprocates in the YY direction, and the holding arm 10 ′ holding the polishing target 9 attached to the holding table 23 ′ also reciprocates in the YY direction.
- the holding-side reciprocating mechanism 3 ′ may be operated when the rough diamond 90 is polished. By doing so, it is possible to suppress uneven wear of the polishing surface 5s of the rotating polishing body 5 (see FIG. 1 and the like) and to prevent a polishing streak from being generated on the rough diamond 90. Further, by using the magnet base 21 ′, the mounting position of the magnet base 21 ′ can be easily changed on the pedestal portion ⁇ . As a result, even when the movement direction of the polishing surface 5s of the rotary polishing body 5 is a difficult processing direction with respect to the crystal orientation of the diamond rough stone 90 and the processing is difficult to proceed, the holding arm 10 'moves with respect to the rotary polishing body 5s. By changing the angle, the processing direction can be easily shifted from the difficult processing direction.
- the processing apparatus of this embodiment is also configured such that the polishing surface 5s approaches the diamond rough 90, but at the end of the polishing of the diamond rough 90, the holding-side lifting mechanism 15 ′ is operated to perform polishing.
- the rough diamond is preferably separated from the surface 5s. In that case, there is a low possibility that the rough diamond 90 is damaged when the rough diamond 90 is separated.
- the rotating polishing body 5 is configured to be detachable with respect to the bearing portion 60 on the polishing surface side. Therefore, the rotating polishing body 5 is simply replaced. Thus, the polished surface 5s can be renewed.
- the reaction force of the fixed cut is concentrated on the thrust ball 5c that supports the rotating polishing body 5 in the bearing portion 60 on the polishing surface side and the receiving portion (dent). Therefore, when the polishing is performed for a long time, the thrust ball 5c and the receiving portion thereof are deformed, and when the rotating polishing body 5 is rotated, surface wobbling of the polishing surface 5s occurs, or the rotating polishing body. There is a risk that the elevating accuracy of 5 will be lowered. Therefore, the polishing mechanism ⁇ ′ that can eliminate such a problem is employed in the third embodiment.
- the rotating polishing body 5 ′ of the polishing mechanism ⁇ ′ includes a disk portion 5b ′ having a polishing surface 5s ′, and an air bearing (bearing portion 60a ′ on the polishing surface side) which will be described later. ), And a spacer 5c ′ for connecting and fixing to the rotating portion 60b ′.
- the spacer 5c ' may be prepared separately from the disk portion 5b' and connected to the disk portion 5b 'later.
- the rotating surface portion 6 ′ on the polishing surface side includes a polishing surface side bearing portion 60 ′ that rotatably supports the rotating polishing body 5 ′.
- a rotating portion 60b ′ Inside the bearing portion 60 ′, there is a rotating portion 60b ′.
- An air bearing (hydrostatic bearing 60a ′) having an air supply part 60c ′ is accommodated.
- the rotating part 60b 'of the air bearing 60a' is fixed to the air supply part 60c 'in the rotation axis direction and the rotation radial direction via an air layer. Therefore, the rotating abrasive body 5 ′ fixed to the rotating portion 60 b ′ of the air bearing 60 a ′ is difficult to shake when rotating.
- a power source 61 ' is fixed inside the bearing 60', and a rotating part 60b 'of the air bearing 60a' is directly connected to the power source 61 '. 5 'is directly rotated.
- the air bearing 60a ′ receives and disperses the reaction force of the fixed cut through the air layer, so there is no portion where the reaction force is concentrated,
- the polishing mechanism ⁇ ′ of the present embodiment shown in FIG. 8 has no fear that the rotational accuracy is deteriorated due to deformation of the constituent elements as in the configuration in which the rotating abrasive body 5 is supported at one point by the thrust ball 5c shown in FIG. .
- the power source 61 ' is built in the bearing 60'. Instead of this, the power from the power source installed outside as shown in FIGS. It is also possible to adopt a method of rotating the rotary polishing body 5 ′ by transmitting it.
- the drive force of the external power source unit is transmitted by the pulley and the belt to obtain the drive force of the polishing rotator 5 ′, the external power source unit can be slightly slid so that the belt can be easily attached and detached. A mechanism should be provided.
- a rotating body unit in which the rotating polishing body 5 ′ and the rotating surface side rotation mechanism 6 ′ are integrated is adopted, and the polishing surface 5s ′ is moved up and down in this rotating body unit. It does not include the mechanism to make it. Therefore, in the present embodiment, a lifting mechanism 7 'on the polishing surface side that lifts and lowers the entire rotating body unit is employed.
- the raising / lowering mechanism part 7 ′ on the polishing surface side includes a base 70 ′ fixed on the pedestal part ⁇ and a top plate supported on the base 70 ′ so as to be movable up and down in the Z-axis direction with respect to the base 70 ′. 71 ′.
- the configuration of the base 70 ′ that supports the top plate 71 ′ so as to be movable up and down is not particularly limited.
- a known configuration such as a fluid jack system using a hydraulic pressure or a mechanical jack system can be used.
- a base 70 ′ illustrated in FIG. 8 is a mechanical jack system, and includes two supports 701 ′ and 702 ′ in surface contact with each other and a screw shaft 703 ′.
- the lower support 701 ′ is configured to be slidable in the left-right direction on the paper surface by a screw shaft 703 ′, and the upper support 702 ′ can move in the vertical direction (Z-axis direction) on the paper surface along a slide mechanism (not shown). It is configured not to move in the left-right direction on the paper. Therefore, if the screw shaft 703 ′ is rotated to move the lower support 701 ′ to the right side of the drawing, the upper support 702 ′ rises, and if the lower support 701 ′ is moved to the left of the drawing, The upper support 702 ′ is lowered.
- the base 70 ′ having such a configuration is suitable for moving a heavy object up and down with high accuracy.
- the polishing surface side bearing portion 60 ′ (that is, the rotating body unit) is bolted onto the top plate 71 ′ of the polishing surface side lifting mechanism portion 7 ′.
- a holding mechanism (not shown in FIG. 8) that holds the rough diamond to be polished on the polishing surface 5s 'is attached to a portion other than the top plate 71' (typically on the pedestal portion ⁇ ).
- the polishing surface correcting mechanism 900 is attached to the processing apparatus, and the polishing surface 5s' is simply corrected on the processing apparatus. Also good.
- the polishing surface correcting mechanism 900 includes a grindstone 910 that grinds the polishing surface 5s ′, a grindstone holding portion 920 that holds the grindstone 910 on the polishing surface 5s ′, and a grindstone support base 930 that supports the grindstone holding portion 920 on the top. And having.
- the grindstone support base 930 includes a magnet base 931, a base 932 fixed on the magnet base 931, and a slide base 933 slidably mounted on the base 932 in the horizontal direction.
- a grindstone holding part 920 is fixed on the top.
- the grindstone holding part 920 has an arm 921 extending in the horizontal direction toward the polishing surface 5s ′, and a grindstone mounting tool 922 for mounting the grindstone 910 is provided on the tip side thereof.
- the grindstone 910 is held on the polishing surface 5s ′.
- the grindstone 910 is a cup-type grindstone, but it is also possible to use a flat grindstone in addition to the cup-type grindstone.
- the grindstone support base 930 can reciprocate the slide base 933 in the left-right direction on the paper surface by a rocking means (not shown) such as a rocking motor. It can be swung in the longitudinal direction.
- the grindstone 910 attached to the grindstone fixture 922 of the grindstone holding part 920 can be swung in the radial direction of the polishing surface 5s' (see the white arrow).
- the grindstone fixture 922 is provided with a rotating means (not shown) such as a rotation motor for rotating the grinding surface of the grindstone 910 that contacts the polishing surface 5s, and the grindstone 91 is rotated by this rotating means (black). Can be referred to).
- the grindstone support base 930 is detachably attached to the upper surface of the top plate 71 ′ by the magnetic force of the magnet base 931.
- the grindstone support 930 may be attached to the pedestal portion ⁇ as long as the height of the grindstone 910 matches the position of the polishing surface 5s.
- the polishing surface correction mechanism 900 is attached to the top plate 71 ′, and the grindstone 910 is rotated with the rotating polishing body 5 ′ rotated.
- the polishing surface 5s ′ is corrected while rotating and swinging.
- the polishing surface correction mechanism 900 is removed from the top plate 71'.
- the polishing surface correcting mechanism 900 described above the polishing surface 5 s ′ can be corrected without removing the rotating mechanism portion 6 ′ on the polishing surface side from the top plate 71 ′. Can be modified.
- the polishing surface correction mechanism 900 can also be used for surface correction in the processing apparatuses of the first and second embodiments.
- the polishing surface side reciprocating mechanism 8 As a processing apparatus for the diamond cutting tool, the polishing surface side reciprocating mechanism 8 (see FIGS. 1 and 3) may be removed from the configurations of the first to third embodiments. This is because the polishing surface side reciprocating mechanism 8 is not directly related to a configuration capable of cutting a rough diamond, which is a feature of the present invention.
- the mechanism unit 8 may be configured such that the reciprocating track by the reciprocating mechanism unit 8 on the polishing surface side becomes an arc track.
- the diamond cutting tool processing apparatus of the present invention can be suitably used, for example, for manufacturing a diamond cutting tool.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
Description
<全体構成>
図1に示すダイヤモンド切削工具の加工装置100は、台座部α(図面上は台座部αの天板のみを示す)と、台座部αの上面に設置され、ダイヤモンド原石を含む研磨対象を保持する保持機構βと、同じく台座部αの上面に設置され、保持機構βに保持されたダイヤモンド原石を研磨する研磨機構γと、を備える。なお、本実施形態では研磨面5sは水平面(XY平面)に平行に設けられる。以下、各構成を詳細に説明する。
台座部αはボックス状の筐体(図面上は天板のみを図示する)で、その内部に各機構β,γを駆動するための電源部や、各機構β,γを制御するための制御部などが設けられている。台座部αの天板には、加工装置100の電源ボタンや、研磨条件を入力する入力ボタン(タッチパネルなどとしても良い)を有する制御パネルを設けても良い。もちろん、有線や無線にて加工装置100をパソコンに接続し、パソコンから加工装置100を操作しても構わない。
保持機構βは、研磨対象を片持ち状に保持する保持部材1と、保持部材1をY軸周りに回転させる保持側回転機構部2と、保持部材1の支端側(後述する保持側軸受部20)をX軸周りの円弧軌道に沿って旋回させる保持側旋回機構部3と、を備える。
図2に示すように、保持部材1は、研磨対象9を把持する保持アーム10と、保持アーム10が取り付けられる回転ベース11と、を備える。なお、回転ベース11は、保持アーム10を支持する部材であるが、後述する保持側回転機構部2の構成部材でもある。
保持側回転機構部2は、上記回転ベース11と、この回転ベース11の軸部11aを回転自在に軸支する保持側軸受部20と、を備える。保持側軸受部20の内部には、気体を用いた静圧軸受20aと、軸部11aに回転力を与えるモータなどの駆動源20bが設けられている。このような構成により、回転ベース11の円盤部11aに設けられる保持アーム10を、Y軸周りの円弧軌道に沿って往復回転させることができる(図2(A)の白抜き矢印参照)。保持アーム10の往復回転範囲は、円弧に対して輪郭精度を求められる角度範囲に対して両端で10°程度ずつ大きくすると良い。例えば、120°の範囲で輪郭精度が求められる場合、その角度範囲に対して両端で10°ずつ、合計20°大きくして、140°の範囲で保持アーム10を往復回転させればよい。
保持側旋回機構部3は、ボックス状のスタンド部30を備える。スタンド部30は、保持機構β全体の土台となる部分であって、台座部α(図1参照)の天板上に立設される。スタンド部30の側面(YZ平面に平行な面)には円弧状のスリット30sが設けられており、そのスリット30sに沿って往復自在に配置される支持軸30rが配置されている。そして、この支持軸30rによって保持側軸受部20がスタンド部30の側面に支持されている。そのため、保持部材1の支端である保持側軸受部20は、X軸周りの円弧軌道に沿って旋回自在となっている(図2(B)の白抜き矢印参照)。
図3に示すように、研磨機構γは、台座部αの天板上に立設される脚片4を備える。脚片4の上面には、X軸方向に向かって平行に伸びる二本のレール4rが備わっている。レール4r上にはガイド4gを備えるスライド台4Bが載置されている。そのため、スライド台4Bは、レール4r上をレール4rの延伸方向(X軸方向)に沿って移動できるようになっている。
回転研磨体5は、図4に示すように、円柱状の軸部5aと、軸部5aの先端に設けられる円盤部5bと、を備える。円盤部5bの上面には研磨面5sが形成される。
図3に示すように、研磨面側の回転機構部6は、研磨面5sを露出させた状態で上記回転研磨体5を内部に収納する研磨面側の軸受部60と、回転研磨体5を回転させる動力源となるモータを内蔵する動力源部61と、モータの回転力を回転研磨体5に伝達する伝達部62と、を備える。
研磨面側の軸受部60は、図4に示すように、その内部に回転研磨体5を収納することができる筒状体である。研磨面側の軸受部60の長手方向中間部の外周面にはフランジ部60fが設けられており、そのフランジ部60fによって研磨面側の軸受部60はスライド台4B(図3参照)に固定される。
動力源部61は、図3に示すように、研磨面側の軸受部60と同様にスライド台4B上に固定されている。動力源部61に備わるモータの先端には主動プーリ62aが設けられている。
伝達部62は、動力源部61のモータに取り付けられる主動プーリ62aと、回転研磨体5に設けられる従動プーリ62bと、両プーリ62a,62bに掛け渡されるベルト62cと、を備える。モータにより主動プーリ62aを回転させれば、ベルト62cを介して従動プーリ62bを備える回転研磨体5が回転する。
本実施形態の研磨面側の昇降機構部7は、図4に示すように、研磨面側の軸受部60の内底部60cを昇降させることで、内底部60cにスラスト球5cを介して支持される回転研磨体5を昇降させる。具体的には、研磨面側の昇降機構部7は、内底部60cの外周に設けられる内側部材7iと、その内側部材7iのさらに外周に設けられる外側部材7oとを備える。
研磨面側の往復機構部8は、図3に示すように、保持機構βのスタンド部30(図1(B)を合わせて参照)の正面側に設けられる動力源部80を備える。動力源部80の内部にはモータとクランク機構が内蔵されている。クランク機構のクランクロッド80rの一端は、スライド台4Bに接続されている。既に述べたように、スライド台4Bは、レール4r上にスライド自在に取り付けられているので、動力源部80のモータを動作させれば、スライド台4Bは、水平面(研磨面)上をX軸方向に往復動作する。即ち、スライド台4Bに固定される研磨面側の回転機構部6と、研磨面側の回転機構部6により回転させられる回転研磨体5もX軸方向に往復動する。上述のように、動力源部80に加えて、ガイド4gを備えるスライド台4Bとレール4rも含めて研磨面側の往復機構部8と見做すことができる。
上述したダイヤモンド切削工具の加工装置100を用いたダイヤモンド切削工具の研磨手順を図5,6に基づいて説明する(必要に応じて図1~4を参照のこと)。
実施形態2では、研磨対象9を保持する実施形態1の保持機構βを、図7に示す保持機構β’に入れ換えた構成を説明する。保持機構β’以外の構成は、実施形態1と同様であるため、以降は図7を参照して保持機構β’の構成を中心に説明する。なお、言うまでもないが、本実施形態の構成も、ダイヤモンド原石90に対して研磨面5s(図1などを参照)がアプローチする構成である。
実施形態3では、研磨対象9を研磨する実施形態1,2の研磨機構γを、図8に示す研磨機構γ’に入れ替えた構成を説明する。研磨機構γ’以外の構成は、実施形態1,2と同様であるため、以降は図8を参照して研磨機構γ’の構成を中心に説明し、保持機構については図示、説明共に省略する。なお、この実施形態3では、研磨面5s’の修正を行うことができる研磨面修正機構900についても合わせて説明する。
ダイヤモンド切削工具の加工装置として、実施形態1~3の構成から研磨面側の往復機構部8(図1,3を参照)を抜いた構成としても良い。研磨面側の往復機構部8は、本発明の特徴であるダイヤモンド原石を定寸切込することができる構成と直接関係がないからである。
α 台座部
β 保持機構
1 保持部材
10 保持アーム 10a 音響センサ 10b 錘部材
11 回転ベース 11a 軸部 11b 円盤部 11h ネジ穴
2 保持側回転機構部
20 保持側軸受部 20a 静圧軸受 20b 駆動源
3 保持側旋回機構部
30 スタンド部 30s スリット 30r 支持軸
γ 研磨機構
4 脚片 4B スライド台 4r レール 4g ガイド
5 回転研磨体
5s 研磨面 5a 軸部 5b 円盤部 5c スラスト球
6 研磨面側の回転機構部
60 研磨面側の軸受部 60a,60b 静圧軸受 60c 内底部
60f フランジ 601 吸気口 602 排気口
61 動力源部
62 伝達部 62a 主動プーリ 62b 従動プーリ 62c ベルト
7 研磨面側の昇降機構部
7i 内側部材 7o 外側部材
8 研磨面側の往復機構部
80 動力源部 80r クランクロッド
β’ 保持機構
10’ 保持アーム
11’ ゴニオステージ 111’ マイクロヘッド
12’ 回転スージ
13’ 棒状体 14’ 錘部材
15’ 保持側昇降機構部
152’ マイクロヘッド 154’ リニアガイド 156’ 支点
16’ 接触圧調整機構部
162’ クロスヘッド機構
2’ 基部
20’ マグネットベース 21’ スライド台 22’ レール
23’ 保持台
3’ 保持側往復機構部
30’ 動力源部 31’ クランク機構 310’ クランクロッド
γ’ 研磨機構
5’ 回転研磨体
5s’ 研磨面 5b’ 円盤部 5c’ スペーサ
6’ 研磨面側の回転機構部
60’ 研磨面側の軸受部 61’ 動力源部
60a’ エアベアリング(静圧軸受) 60b’ 回転部 60c’ エア供給部
7’ 研磨面側の昇降機構部
70’ 基台 71’ 天板
701’,702’ 支持体 703’ ネジ軸
9 研磨対象
90 ダイヤモンド原石 91 シャンク
900 研磨面修正機構
910 砥石
920 砥石保持部
921 アーム 922 砥石取付具
930 砥石支持台
931 マグネットベース 932 架台 933 スライドベース
Claims (6)
- 台座部と、
前記台座部上に設けられ、ダイヤモンド原石を有する研磨対象を保持する保持機構と、
前記台座部上に設けられ、研磨面をその中心軸周りに回転させ、その回転する研磨面により前記ダイヤモンド原石を研磨する研磨機構と、
を備えるダイヤモンド切削工具の加工装置であって、
互いに直交するX軸、Y軸、Z軸を規定し、前記研磨面の中心軸を前記Z軸としたときに、
前記研磨機構は、
前記研磨面を有する回転研磨体と、
前記回転研磨体を回転可能に軸支する研磨面側の軸受部を有する研磨面側の回転機構部と、
前記ダイヤモンド原石に対して前記研磨面を前記Z軸方向に昇降させる研磨面側の昇降機構部と、
を備えることを特徴とするダイヤモンド切削工具の加工装置。 - 前記研磨面側の昇降機構部は、前記回転研磨体を軸支する研磨面側の軸受部の内底部を前記Z軸方向に進退させることで、前記ダイヤモンド原石に対して前記研磨面を前記Z軸方向に昇降させる構成であり、
前記回転研磨体は、前記研磨面側の軸受部に着脱自在に軸支されていることを特徴とする請求項1に記載のダイヤモンド切削工具の加工装置。 - 前記研磨面側の昇降機構部は、前記研磨面側の軸受部全体を前記Z軸方向に進退させることで、前記ダイヤモンド原石に対して前記研磨面を前記Z軸方向に昇降させる構成であり、
前記研磨面側の軸受部は、前記研磨面側の昇降機構部に着脱自在に固定されていることを特徴とする請求項1に記載のダイヤモンド切削工具の加工装置。 - 前記保持機構は、
前記Y軸方向に沿って伸び、その先端で前記研磨対象を片持ち状に保持する保持アームを有する保持部材と、
前記Y軸周りの円弧に沿って前記保持部材を往復回転させる保持側回転機構部と、を備え、
前記研磨機構は、
前記研磨面側の回転機構部を、前記X軸に平行に近い方向に、直線状あるいは円弧状に往復させる研磨面側の往復機構部を備えることを特徴とする請求項1~3のいずれか一項に記載のダイヤモンド切削工具の加工装置。 - 前記保持機構は、
前記台座部上に載置される基部と、
前記Y軸方向に沿って伸び、その先端で前記研磨対象を片持ち状に保持する保持アームと、
前記保持アームの先端が前記X軸周りの円弧に沿って回転可能となるように前記保持アームの根元側を支持するゴニオステージと、
前記ゴニオステージを前記Y軸周りに回転可能に軸支する回転ステージと、
前記保持アーム、前記ゴニオステージおよび前記回転ステージを前記基部に対して一体的に前記Z軸方向に移動させる保持側昇降機構部と、
を備えることを特徴とする請求項1~3のいずれか一項に記載のダイヤモンド切削工具の加工装置。 - 前記回転ステージにおける前記ゴニオステージが設けられる側とは反対側に取り付けられる棒状体と、
前記棒状体にスライド自在に取り付けられる錘部材と、を有し、
前記棒状体の長手方向における錘部材の位置を変えることで、前記保持側昇降機構部により一体的に動く部材の荷重と前記錘部材側の荷重とのバランスを調整し、そのバランス調整によって前記研磨対象が前記研磨面に接触する圧力を調整する接触圧調整機構部を備えることを特徴とする請求項5に記載のダイヤモンド切削工具の加工装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013536338A JP5689974B2 (ja) | 2011-09-26 | 2012-09-26 | ダイヤモンド切削工具の加工装置 |
CN201280046334.1A CN103889653B (zh) | 2011-09-26 | 2012-09-26 | 金刚石切割工具的加工装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011-209943 | 2011-09-26 | ||
JP2011209943 | 2011-09-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013047604A1 true WO2013047604A1 (ja) | 2013-04-04 |
Family
ID=47995634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2012/074748 WO2013047604A1 (ja) | 2011-09-26 | 2012-09-26 | ダイヤモンド切削工具の加工装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5689974B2 (ja) |
CN (1) | CN103889653B (ja) |
WO (1) | WO2013047604A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109483339A (zh) * | 2019-01-03 | 2019-03-19 | 浙江东精工量具有限公司 | 一种自动研磨机 |
CN113305655A (zh) * | 2021-05-27 | 2021-08-27 | 深圳信息职业技术学院 | 一种金刚石刀具加工装置 |
CN116214372A (zh) * | 2023-02-10 | 2023-06-06 | 陕西航空宏峰精密机械工具有限责任公司 | 一种螺纹磨砂轮的修整装置 |
CN117140286A (zh) * | 2023-11-01 | 2023-12-01 | 无锡法狮盾贸易有限公司 | 一种用于夹芯复合材料板的抛光装置 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105290960A (zh) * | 2015-12-04 | 2016-02-03 | 河源富马硬质合金股份有限公司 | 一种刨刀片磨圆弧装配体 |
CN106862556B (zh) * | 2017-04-11 | 2018-10-16 | 吉林大学 | 金刚石切削工具的金刚石自动定位装置及方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121874A (ja) * | 1984-11-19 | 1986-06-09 | Matsushita Electric Ind Co Ltd | 自動研削機械 |
JPS61159357A (ja) * | 1984-12-28 | 1986-07-19 | Takahiro Imahashi | 硬脆材研磨装置 |
JPH01146649A (ja) * | 1987-12-04 | 1989-06-08 | Hitachi Ltd | 切削工具研磨装置 |
JPH03190607A (ja) * | 1989-12-19 | 1991-08-20 | Nec Corp | 微細溝形成装置及びそれに使用するダイヤモンド工具の研磨方法 |
JPH11114819A (ja) * | 1997-10-15 | 1999-04-27 | Kanefusa Corp | 工具研削盤 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4342354B2 (ja) * | 2004-03-18 | 2009-10-14 | パナソニック株式会社 | 研磨方法及び装置 |
CN101530975B (zh) * | 2009-04-22 | 2010-11-03 | 天津大学 | 圆弧刃金刚石车刀制备方法 |
-
2012
- 2012-09-26 JP JP2013536338A patent/JP5689974B2/ja active Active
- 2012-09-26 WO PCT/JP2012/074748 patent/WO2013047604A1/ja active Application Filing
- 2012-09-26 CN CN201280046334.1A patent/CN103889653B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61121874A (ja) * | 1984-11-19 | 1986-06-09 | Matsushita Electric Ind Co Ltd | 自動研削機械 |
JPS61159357A (ja) * | 1984-12-28 | 1986-07-19 | Takahiro Imahashi | 硬脆材研磨装置 |
JPH01146649A (ja) * | 1987-12-04 | 1989-06-08 | Hitachi Ltd | 切削工具研磨装置 |
JPH03190607A (ja) * | 1989-12-19 | 1991-08-20 | Nec Corp | 微細溝形成装置及びそれに使用するダイヤモンド工具の研磨方法 |
JPH11114819A (ja) * | 1997-10-15 | 1999-04-27 | Kanefusa Corp | 工具研削盤 |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109483339A (zh) * | 2019-01-03 | 2019-03-19 | 浙江东精工量具有限公司 | 一种自动研磨机 |
CN109483339B (zh) * | 2019-01-03 | 2024-04-02 | 浙江东精工量具有限公司 | 一种自动研磨机 |
CN113305655A (zh) * | 2021-05-27 | 2021-08-27 | 深圳信息职业技术学院 | 一种金刚石刀具加工装置 |
CN116214372A (zh) * | 2023-02-10 | 2023-06-06 | 陕西航空宏峰精密机械工具有限责任公司 | 一种螺纹磨砂轮的修整装置 |
CN116214372B (zh) * | 2023-02-10 | 2024-03-12 | 陕西航空宏峰精密机械工具有限责任公司 | 一种螺纹磨砂轮的修整装置 |
CN117140286A (zh) * | 2023-11-01 | 2023-12-01 | 无锡法狮盾贸易有限公司 | 一种用于夹芯复合材料板的抛光装置 |
CN117140286B (zh) * | 2023-11-01 | 2024-01-30 | 无锡法狮盾贸易有限公司 | 一种用于夹芯复合材料板的抛光装置 |
Also Published As
Publication number | Publication date |
---|---|
CN103889653B (zh) | 2016-10-26 |
JP5689974B2 (ja) | 2015-03-25 |
CN103889653A (zh) | 2014-06-25 |
JPWO2013047604A1 (ja) | 2015-03-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5689974B2 (ja) | ダイヤモンド切削工具の加工装置 | |
KR101584265B1 (ko) | 접시형 숫돌을 이용한 렌즈 구면의 연삭 가공 방법 | |
CN106903560B (zh) | 加工圆弧刃金刚石刀具刀尖圆弧的微摆研抛装置 | |
JP3363587B2 (ja) | 脆性材料の加工方法及びその装置 | |
CN112605720B (zh) | 一种圆弧刃金刚石刀具刀尖材料的均匀去除方法 | |
KR100935150B1 (ko) | 다이아몬드 바이트 연마장치 | |
JP5456550B2 (ja) | レンズ加工装置 | |
JP2011177873A (ja) | 研磨装置及び研磨方法 | |
CN109590905A (zh) | 一种砂轮修整机 | |
US7597034B2 (en) | Machining method employing oblique workpiece spindle | |
JP2006320970A (ja) | 加工装置 | |
CN209579235U (zh) | 一种砂轮修整机 | |
TWI468254B (zh) | Lens processing device | |
CN2858178Y (zh) | 水晶宝石切磨和抛光机 | |
CN116061021A (zh) | 一种圆柱磨光机 | |
US20090047086A1 (en) | Machining apparatus with oblique workpiece spindle | |
JP2004082261A (ja) | ねじ研削盤 | |
JP2010221338A (ja) | 加工皿の作製装置及び修正方法 | |
JP7351611B2 (ja) | ウェーハの面取り加工装置 | |
JP2009066724A (ja) | レンズの球面研削方法及び装置 | |
JPS63232957A (ja) | 曲面研摩機 | |
JP2002079448A (ja) | レンズ面取り装置および方法 | |
JP2010120147A (ja) | 同軸度調整方法および研磨装置 | |
JPS6335382B2 (ja) | ||
KR200493639Y1 (ko) | 스핀들의 복합적 요동운동을 이용한 초정밀 구심연마시스템 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12836352 Country of ref document: EP Kind code of ref document: A1 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
ENP | Entry into the national phase |
Ref document number: 2013536338 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 09.09.2014) |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12836352 Country of ref document: EP Kind code of ref document: A1 |