WO2013047157A1 - 強化ガラス板切断方法 - Google Patents

強化ガラス板切断方法 Download PDF

Info

Publication number
WO2013047157A1
WO2013047157A1 PCT/JP2012/072938 JP2012072938W WO2013047157A1 WO 2013047157 A1 WO2013047157 A1 WO 2013047157A1 JP 2012072938 W JP2012072938 W JP 2012072938W WO 2013047157 A1 WO2013047157 A1 WO 2013047157A1
Authority
WO
WIPO (PCT)
Prior art keywords
tempered glass
glass plate
modified region
along
cutting
Prior art date
Application number
PCT/JP2012/072938
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
大祐 河口
Original Assignee
浜松ホトニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浜松ホトニクス株式会社 filed Critical 浜松ホトニクス株式会社
Publication of WO2013047157A1 publication Critical patent/WO2013047157A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025—Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a tempered glass sheet cutting method for cutting a tempered glass sheet along a cutting line.
  • a glass plate processing apparatus described in Patent Document 1 As a conventional technique for cutting a plate-like workpiece made of glass, for example, a glass plate processing apparatus described in Patent Document 1 is known.
  • This processing apparatus is provided with a support for forming a cut line, a cut line forming means, a support for folding, and a folding means.
  • a cut line is formed on the surface of the glass plate by the cut line forming means.
  • the glass plate on which the cut line is formed is conveyed to the support for folding, the glass plate is cut along the cut line by the folding means.
  • the tempered glass plate can be obtained, for example, by immersing a normal glass plate in a potassium solution and replacing sodium ions and potassium ions on the surface of the glass plate (that is, applying chemical strengthening). Stress is maintained inside such a tempered glass plate. Therefore, when cutting the tempered glass plate, if a cut line is formed on the surface by the above-described conventional processing apparatus, the internal stress is released from the cut line, and as a result, cracks progress in an unexpected direction. Therefore, in the above-described conventional processing apparatus, it has been difficult to cut the tempered glass sheet into a desired shape.
  • This invention is made
  • the present inventor has conducted extensive research and, as a result, in order to cut the tempered glass plate into a desired shape, the inside of the tempered glass plate along the line to be cut by laser irradiation. It was found that it is effective to form a modified region.
  • the modified region becomes a starting point for releasing internal stress.
  • the tempered glass plate can be cut along the planned cutting line, that is, in a desired shape.
  • the present inventor performed the laser beam irradiation for forming the modified region at a predetermined pulse pitch, so that a crack generated from the modified region after a predetermined time has elapsed since the modified region was formed. Has been found to be able to reach the front and back of the tempered glass plate.
  • the present invention has been made based on these findings.
  • the method for cutting a tempered glass plate irradiates the tempered glass plate with a laser beam along the planned cutting line of the tempered glass plate, and thereby the inside of the tempered glass plate along the planned cutting line.
  • the generated cracks reach at least one of the front and back surfaces of the tempered glass sheet after a predetermined time has elapsed since the modified region was formed due to the internal stress of the tempered glass sheet. Characterized in that the pitch.
  • the tempered glass sheet is irradiated with laser light at a predetermined pulse pitch along the planned cutting line.
  • a modified region is formed inside the tempered glass plate along the planned cutting line.
  • the modified region formed inside the tempered glass plate serves as a starting point for releasing internal stress. For this reason, the crack progresses along the modified region by releasing the internal stress. Therefore, according to this tempered glass sheet cutting method, the tempered glass sheet can be cut along a planned cutting line, that is, in a desired shape.
  • laser beam irradiation for forming a modified region is performed after a predetermined time has elapsed since a crack generated from the modified region has been formed. It is carried out at a pulse pitch that reaches the front and back surfaces of the plate. For this reason, since it can suppress that a crack extends along a modification area
  • the predetermined pulse pitch can be 20 ⁇ m or more and 100 ⁇ m or less. In this case, it is possible to ensure that cracks reach the front and back surfaces of the tempered glass sheet after a predetermined time has elapsed since the modified region was formed.
  • the tempered glass sheet includes an outer part including an edge of the tempered glass and an inner part positioned on the inner side of the outer part to form a modified region.
  • the modified region can be formed so as to extend over the entire inner portion along the planned cutting line, and the modified region can not be formed in the outer region.
  • the outer portion where the modified region is not formed becomes a pawl for releasing internal stress, so that the tempered glass plate can be prevented from being cut at an unintended timing.
  • the tempered glass sheet cutting method in the step of cutting the tempered glass sheet, after cutting the outer portion from the tempered glass sheet, the tempered glass sheet is left to stand and is cut by internal stress.
  • the tempered glass plate can be cut by extending the crack along the planned line.
  • the process of cutting the tempered glass plate can be simplified as compared with the case of cutting the tempered glass plate by applying stress from the outside.
  • the tempered glass sheet in the step of cutting the tempered glass sheet, is cut by applying stress to the tempered glass sheet along the planned cutting line. be able to. In this case, the tempered glass plate can be cut at a desired timing.
  • the tempered glass sheet includes an outer part including an edge of the tempered glass and an inner part positioned on the inner side of the outer part to form a modified region.
  • the modified region can be formed so as to extend over the entire outer portion and the inner portion along the planned cutting line.
  • the tempered glass plate by leaving the tempered glass plate, the tempered glass plate can be cut by extending a crack along the planned cutting line by internal stress.
  • the tempered glass plate can be cut by applying stress to the tempered glass plate along the planned cutting line. In these cases, the step of cutting the tempered glass sheet can be simplified as compared with the case of cutting out the outer portion.
  • the tempered glass sheet cutting method can further include a step of removing the modified region from the cut surface of the effective portion cut out from the tempered glass sheet after cutting the tempered glass sheet. .
  • the bending strength of the effective portion can be improved.
  • a tempered glass sheet cutting method capable of cutting a tempered glass sheet into a desired shape can be provided.
  • FIG. 3 is a cross-sectional view taken along the line III-III of the workpiece in FIG. 2. It is a top view of the processing target after laser processing.
  • FIG. 5 is a cross-sectional view taken along the line VV of the workpiece in FIG. 4.
  • FIG. 5 is a cross-sectional view taken along line VI-VI of the workpiece in FIG. 4. It is a figure for demonstrating the main processes of the tempered glass board cutting method which concerns on one Embodiment of this invention.
  • a cutting start point is formed inside the tempered glass sheet along the scheduled cutting line.
  • a modified region is formed. First, the formation of the modified region will be described with reference to FIGS.
  • a laser processing apparatus 100 includes a laser light source 101 that oscillates a laser beam L, a dichroic mirror 103 that is arranged to change the direction of the optical axis (optical path) of the laser beam L by 90 °, and And a condensing lens 105 for condensing the laser light L. Further, the laser processing apparatus 100 includes a support base 107 for supporting the workpiece 1 irradiated with the laser light L condensed by the condensing lens 105, and a stage 111 for moving the support base 107. And a laser light source control unit 102 for controlling the laser light source 101 in order to adjust the output, pulse width, etc. of the laser light L, and a stage control unit 115 for controlling the drive of the stage 111.
  • the laser light L emitted from the laser light source 101 has its optical axis changed by 90 ° by the dichroic mirror 103, and the inside of the processing object 1 placed on the support base 107.
  • the light is condensed by the condensing lens 105.
  • the stage 111 is moved, and the workpiece 1 is moved relative to the laser beam L along the planned cutting line 5. As a result, a modified region along the planned cutting line 5 is formed on the workpiece 1.
  • a scheduled cutting line 5 for cutting the workpiece 1 is set in the workpiece 1.
  • the planned cutting line 5 is a virtual line extending linearly.
  • the modified region is formed inside the workpiece 1, as shown in FIG. 3, the laser light L is cut along the planned cutting line 5 in a state where the focused point P is aligned with the inside of the workpiece 1. (Ie, in the direction of arrow A in FIG. 2).
  • the modified region 7 is formed inside the workpiece 1 along the planned cutting line 5, and the modified region 7 formed along the planned cutting line 5 is formed. It becomes the cutting start area 8.
  • the condensing point P is a location where the laser light L is condensed.
  • the planned cutting line 5 is not limited to a straight line, but may be a curved line, or may be a line actually drawn on the surface 3 of the workpiece 1 without being limited to a virtual line.
  • the modified region 7 may be formed continuously or intermittently. Further, the modified region 7 may be in the form of a line or a dot. In short, the modified region 7 only needs to be formed at least inside the workpiece 1.
  • a crack may be formed starting from the modified region 7, and the crack and modified region 7 may be exposed on the outer surface (front surface, back surface, or outer peripheral surface) of the workpiece 1.
  • the laser beam L passes through the workpiece 1 and is particularly absorbed in the vicinity of the condensing point P inside the workpiece 1, thereby forming a modified region 7 in the workpiece 1 ( That is, internal absorption laser processing). Therefore, since the laser beam L is hardly absorbed by the surface 3 of the workpiece 1, the surface 3 of the workpiece 1 is not melted. In general, when a removed portion such as a hole or a groove is formed by being melted and removed from the front surface 3 (surface absorption laser processing), the processing region gradually proceeds from the front surface 3 side to the back surface side.
  • the modified region formed in the present embodiment refers to a region in which the density, refractive index, mechanical strength, and other physical properties are different from the surroundings.
  • the reforming region include a melting treatment region (meaning a region including at least one of a region once solidified after melting, a region in a molten state, and a region in the middle of resolidifying from a molten state).
  • a crack region, a dielectric breakdown region, a refractive index change region, and the like there is a region in which these are mixed.
  • the modified region there are a region where the density of the modified region in the material to be processed is changed compared to the density of the non-modified region, and a region where lattice defects are formed. Also known as the metastatic region).
  • the area where the density of the melt-processed area, the refractive index changing area, the modified area is changed compared to the density of the non-modified area, and the area where lattice defects are formed are further added to the interior of these areas or the modified areas.
  • cracks are included in the interface between the region and the non-modified region.
  • the included crack may be formed over the entire surface of the modified region, or may be formed in only a part or a plurality of parts.
  • the processing object 1 include a substrate or wafer made of silicon, glass, LiTaO 2 or sapphire (Al 2 O 2 ), or a material including such a substrate or wafer.
  • the modified region 7 is formed by forming a plurality of modified spots (processing marks) along the planned cutting line 5.
  • the modified spot is a modified portion formed by one pulse shot of pulsed laser light (that is, one pulse of laser irradiation: laser shot), and the modified spot gathers to become the modified region 7.
  • Examples of the modified spot include a crack spot, a melting treatment spot, a refractive index change spot, or a mixture of at least two of them.
  • the size and length of cracks that occur Is preferably controlled appropriately.
  • FIG. 8 is a partial cross-sectional view taken along line VIII-VIII in FIG.
  • This tempered glass sheet cutting method forms a modified region inside the tempered glass plate along the planned cutting line by irradiating the tempered glass plate with laser light along the planned cutting line of the tempered glass plate, and then cuts Cut the tempered glass plate along the planned line.
  • the tempered glass member used for the touch panel of a portable terminal etc. can be manufactured from a tempered glass board, for example.
  • a rectangular tempered glass sheet 1 as a processing object is prepared.
  • a scheduled cutting line 5 is set.
  • the planned cutting line 5 can be arbitrarily set according to the shape of the tempered glass plate 1, the shape of the desired tempered glass member, and the like.
  • the planned cutting line 5 is set in a rectangular lattice shape along the surface 3 of the tempered glass plate 1. Therefore, the tempered glass member manufactured using this tempered glass sheet cutting method becomes a rectangular plate shape.
  • the tempered glass is a glass having a tensile stress layer and a compressive stress layer formed so as to cover the tensile stress layer. That is, stress is held inside the tempered glass.
  • Tempered glass can be produced by, for example, immersing ordinary glass in a potassium solution and replacing the surface sodium ions and potassium ions to form a compressive stress layer on the surface (chemical strengthening). Law).
  • the tempered glass can be produced, for example, by heating normal glass and then rapidly cooling it by blowing air onto the surface (rapid quenching method).
  • the prepared tempered glass plate 1 is placed on the support base 107 of the laser processing apparatus 100.
  • the back surface 4 of the tempered glass plate 1 faces the support surface side of the support base 107 (that is, the front surface 3 of the tempered glass plate 1 faces the condensing lens 105 side), and the tempered glass plate 1 is supported by the support base 107. (See FIG. 1).
  • the tempered glass plate 1 is placed directly on the support base 107. That is, a sheet such as a dicing film is not attached to the back surface 4 of the tempered glass plate 1.
  • the condensing point P of the laser light L is positioned at a predetermined distance from the front surface 3, the back surface 4, and the side surface 6 of the tempered glass plate 1.
  • the position of the condensing point P of the laser beam L can be changed, for example, by driving the stage 111 and moving the support 107 under the control of the stage control unit 115.
  • the tempered glass is formed along one of the plurality of scheduled cutting lines 5 using the surface 3 of the tempered glass plate 1 as the laser light incident surface.
  • the plate 1 is irradiated with laser light L. That is, the condensing point P of the laser light L is relatively moved (scanned) along the planned cutting line 5 (that is, along the direction of the arrow A in the drawing).
  • the relative movement of the condensing point P of the laser light L here can also be performed, for example, by driving the stage 111 and moving the support 107 under the control of the stage control unit 115.
  • the pulse pitch (speed V / frequency F) PT of the laser light L is adjusted by adjusting the pulse oscillation frequency F of the laser light L and the moving speed V of the condensing point P of the laser light L. That is, in this step, the tempered glass plate 1 is irradiated with the laser light L at a predetermined pulse pitch PT along the scheduled cutting line 5.
  • the pulse pitch PT is a distance between the condensing points P1 and P2 adjacent to each other in the part (b) of FIG. 8, for example.
  • the pulse pitch PT is determined after the cracks generated from the modified region 7 formed by the irradiation of the laser beam L form the modified region 7 by the internal stress of the tempered glass plate 1 (more specifically, The pitch reaches the at least one of the front surface 3 and the rear surface 4 of the tempered glass sheet 1 after a predetermined time has elapsed (after the internal stress can be released starting from the mass region 7).
  • pulse pitch PT can be made into the range of 20 micrometers or more and 100 micrometers or less, for example.
  • the modified region 7 is formed inside the tempered glass plate 1 along the planned cutting line 5. Since the laser beam L is applied to the tempered glass plate 1 at a predetermined pulse pitch PT, the modified region 7 is formed of the modified spots 9 formed inside the tempered glass plate 1 at intervals according to the pulse pitch PT. Configured as a set.
  • the modified region 7 (that is, the modified spot 9) formed at this time includes, for example, a crack region (crack spot), a melt processing region (melt processing spot), and the like.
  • FIG. 9 is an enlarged plan view of the tempered glass plate when the laser beam L is actually irradiated.
  • the processing conditions in this case are as follows.
  • modified spots 9 are formed inside the tempered glass plate 1 at intervals according to the pulse pitch PT.
  • a plurality of cracks 9 a extend from the modified spot 9.
  • the modified region 7 includes these modified spots 9 and cracks 9a.
  • the lattice-shaped modified region 7 along the planned cutting line 5 is tempered glass plate. 1 is formed inside. A portion surrounded by the modified region 7, that is, a portion corresponding to each of the cells defined by the lattice-shaped modified region 7 becomes an effective portion 12 for the tempered glass member.
  • Each of the effective portions 12 is defined by a modified region 7a extending along the first direction and a modified region 7b extending along the second direction intersecting the first direction. .
  • the modified region 7a and the modified region 7b cross each other even at the corners CP of the series of effective portions 12 located on the outermost part.
  • the modified region 7a and the modified region 7b further extend beyond the corner portion CP of the effective portion 12 located on the outermost side in each extending direction.
  • the corner portion CP of the effective portion 12 can be easily processed.
  • the irradiation with the laser beam L is performed on the inner side by a predetermined distance from the side surface 6 of the tempered glass plate 1. That is, the tempered glass plate 1 includes a rectangular annular outer portion 1a including an edge of the tempered glass plate 1 and a rectangular inner portion 1b positioned inside the outer portion 1a, and the laser beam L is applied only to the inner portion 1b.
  • the modified region 7 is formed so as to exist.
  • the modified region 7 is not formed in the outer portion 1a. Therefore, the modified region 7 is not exposed on the side surface 6 of the tempered glass plate 1.
  • the tempered glass plate 1 in which the modified region 7 is formed is transferred from the support base 107 to another support base 108. More specifically, the tempered glass plate 1 is removed from the support base 107 for irradiating the laser beam L, and transferred to and placed on another support base 108 for cutting in a later step. At this time, the tempered glass plate 1 is placed on the support table 108 with the back surface 4 of the tempered glass plate 1 facing the support surface side of the support table 108. As described above, since a sheet such as a dicing film is not attached to the back surface 4 of the tempered glass plate 1, the tempered glass plate 1 is placed directly on the support base 108. The tempered glass plate 1 can be transferred using, for example, a suction pad.
  • the tempered glass plate 1 is cut.
  • the tempered glass plate 1 is left by leaving the tempered glass plate 1 without applying stress to the tempered glass plate 1 along the planned cutting line 5 (that is, along the modified region 7).
  • the tempered glass plate 1 is cut by applying stress to the tempered glass plate 1 along the planned cutting line 5 (that is, along the modified region 7).
  • the case where the tempered glass plate 1 is cut while leaving the tempered glass plate 1 without applying stress to the tempered glass plate 1 along the modified region 7 will be described.
  • the outer portion 1a is cut from the tempered glass plate 1. More specifically, first, as shown in part (a) of FIG. 11, a plurality (four in this case) of scratches 11 are formed on the side surface 6 of the tempered glass plate 1.
  • the scratch 11 is formed in the outer portion 1 a of the tempered glass plate 1.
  • the scratch 11 can be formed using, for example, a scribe forming apparatus such as a diamond cutter or a laser scriber.
  • the tempered glass plate 1 is cut along the straight line (broken line BL in the figure: extending direction of the wound part 11) connecting the wound part 11 and the side surface 6 facing the wound part 11 using the wound part 11. .
  • outer part 1a is cut out from tempered glass board 1, and tempered glass board 1A is formed.
  • the modified region 7 is formed in the inner portion 1b of the tempered glass plate 1 so as to extend over the entire portion. Therefore, the modified region 7 is exposed on the cut surface 6A of the tempered glass plate 1A. As a result, the internal stress can be released starting from the modified region 7.
  • the tempered glass sheet 1A is allowed to stand for a predetermined time without applying stress to the tempered glass sheet 1A along the modified region 7.
  • region 7 reaches
  • the cracks extend along the modified region 7 due to the release of the internal stress, and the tempered glass sheet 1 ⁇ / b> A is naturally cut along the modified region 7.
  • the time required for cutting the tempered glass plate 1A (that is, the time required for the crack generated from the modified region 7 to reach the front surface 3 and the back surface 4 of the tempered glass plate 1A) is, for example, the above-described modification. It can be controlled by adjusting the pulse pitch PT in the step of forming the region 7. More specifically, when the pulse pitch PT is shortened, this time is shortened, and when the pulse pitch PT is lengthened, this time is also lengthened.
  • the pulse pitch PT By setting the pulse pitch PT to 20 ⁇ m or more, as soon as the laser beam L is irradiated (that is, as soon as the modified region 7 is formed, the internal stress can be released). Immediately) the tempered glass plate 1 can be prevented from being naturally cut. In other words, if the pulse pitch PT is set to be shorter than 20 ⁇ m, the internal stress is released when the laser beam L is irradiated, and cracks progress in an unexpected direction including a portion where the laser beam L is not irradiated. May end up. For this reason, if the pulse pitch PT is set shorter than 20 ⁇ m, the processing quality is deteriorated.
  • the pulse pitch PT by setting the pulse pitch PT to 100 ⁇ m or less, it is possible to prevent the tempered glass plate 1A from being cut. In other words, if the pulse pitch PT is longer than 100 ⁇ m, the effect of releasing internal stress is weakened, and thus the tempered glass plate 1A may not be cut naturally. For these reasons, in the step of forming the modified region 7 described above, it is desirable that the pulse pitch PT be in the range of 20 ⁇ m to 100 ⁇ m.
  • the tempered glass sheet 1 is cut by applying stress to the tempered glass sheet 1 along the modified region 7
  • stress is applied to the tempered glass plate 1 along the tempered glass plate 1 using a break device such as a knife edge.
  • the tempered glass plate 1 is cut along the modified region 7.
  • the tempered glass plate 1 can be cut at a desired timing by adjusting the timing of applying stress to the tempered glass plate 1 along the scheduled cutting line 5.
  • the effective portion (cut piece) 12 is cut out from the tempered glass plate 1 (tempered glass plate 1A). As shown in FIG. 12, the modified region 7 is exposed at the cut surface 12 a of the cut out effective portion 12. For this reason, in the subsequent process, the modified region 7 is removed from the cut surface 12 a of the effective portion 12.
  • the removal of the modified region 7 can be performed by, for example, mechanically polishing the cut surface 12a of the effective portion 12.
  • the modified region 7 can be removed by etching the cut surface 12a of the effective portion 12 using acid or alkali. If the modified region 7 is removed from the cut surface 12a of the effective portion 12 in this way, the bending strength can be improved.
  • the cut surface 12a of the effective portion 12 after removing the modified region 7 can be strengthened.
  • the cut surface 12a of the effective portion 12 can be strengthened by, for example, providing a resin film or an aluminum oxynitride film on the cut surface 12a.
  • strengthening of 12a of the effective part 12 can be performed by giving chemical strengthening with respect to the cut surface 12a, for example.
  • the effective portion 12 is cut out from the tempered glass plate 1 (tempered glass plate 1A), and a tempered glass member is manufactured from the effective portion 12.
  • the tempered glass sheet 1 is irradiated with the laser light L at a predetermined pulse pitch PT along the scheduled cutting line 5.
  • the modified region 7 is formed inside the tempered glass plate 1 along the planned cutting line 5.
  • the modified region 7 formed inside the tempered glass plate 1 serves as a starting point for releasing internal stress. For this reason, cracks develop along the modified region 7 due to the release of internal stress. Therefore, according to this tempered glass sheet cutting method, the tempered glass sheet 1 can be cut along the planned cutting line 5, that is, in a desired shape.
  • the irradiation with the laser beam L for forming the modified region 7 is caused after the crack generated from the modified region 7 forms the modified region 7 (
  • the pulse pitch PT is reached so as to reach the front surface 3 and the rear surface 4 of the tempered glass plate 1.
  • the tempered glass plate 1 is cut at an unintended timing (for example, timing when the tempered glass plate 1 is on the support base 107 or timing when the tempered glass plate 1 is transferred from the support base 107). Can be suppressed. Therefore, according to this tempered glass sheet cutting method, handling of the tempered glass sheet 1 after forming the modified region 7 becomes easy.
  • the modified region 7 is formed only in the inner portion 1b of the tempered glass plate 1 (that is, the modified region 7 is included in the edge of the tempered glass plate 1). Not outer part 1a).
  • the outer portion 1a serves as a pawl for releasing the internal stress of the tempered glass plate 1, and the tempered glass plate 1 can be prevented from being cut at an unintended timing as described above.
  • the tempered glass sheet 1 is directly placed on the support bases 107 and 108 without attaching a sheet such as a dicing film to the back surface 4 of the tempered glass sheet 1. .
  • sheets, such as a dicing film do not prevent release of internal stress in tempered glass board 1 (tempered glass board 1A). Therefore, the tempered glass plate 1 can be cut reliably.
  • the tempered glass sheet cutting method according to the present invention is not limited to the above-described tempered glass sheet cutting method.
  • the above-described tempered glass sheet cutting method can be arbitrarily changed within a range not changing the gist of each claim.
  • the modified region 7 is formed by irradiating only the inner portion 1b of the tempered glass plate 1 with the laser beam L.
  • the step of forming the modified region 7 is in this mode. It is not limited. That is, in the step of forming the modified region 7, by irradiating (scanning) the laser beam L over the entire outer portion 1a and inner portion 1b of the tempered glass plate 1 along the planned cutting line 5, A modified region 7 is formed so as to extend over the entire outer portion 1a and the inner portion 1b along the planned cutting line 5 (that is, to extend over the entire tempered glass plate 1). Also good.
  • the internal stress can be released simultaneously with the formation of the modified region 7, but the tempered glass plate 1 can be cut during a predetermined time by setting the pulse pitch PT as described above. It can be prevented from happening. Even in this case, as described above, the tempered glass plate 1 may be cut by leaving the tempered glass plate 1 without applying stress to the tempered glass plate 1 along the planned cutting line 5, The tempered glass plate 1 may be cut by applying stress to the tempered glass plate 1 along the planned cutting line 5. Thus, if the modified region 7 is formed so as to extend over the entire tempered glass plate 1, the process of cutting the tempered glass plate 1 is simplified.
  • the irradiation conditions of the laser light L other than the pulse pitch PT described above may be adjusted. For example, by shortening the pulse width of the laser light L, the processing performance is improved and the processing energy can be reduced. Further, by positioning the condensing point P of the laser light L closer to the laser light incident surface (here, the surface 3) than the center of the tempered glass plate 1 (that is, by processing a portion closer to the surface 3) ), The modified region 7 can be easily formed, and the processing energy can be reduced.
  • FIG. 13 is an enlarged plan view of the tempered glass plate when the modified region is formed by two types of processing energy.
  • the modified region 7A is formed when the processing energy is relatively small
  • the modified region 7B is formed when the processing energy is relatively large.
  • the size of the modified region that is, the modified spot 9 and the crack 9a
  • the bending strength can be improved and the man-hour for the end face treatment can be reduced.
  • the processing conditions the conditions described with the description of FIG. 9 are desirable, but can be appropriately changed according to the degree of strengthening of the tempered glass plate 1 and other various conditions.
  • the higher laser output is desirable from the viewpoint of more reliable cutting (as an example, it is desirable that the laser output is 20 ⁇ J or more).
  • the condensing position of the laser light L is a position relatively close to the front surface 3 and the back surface 4 of the tempered glass plate 1 (for example, 70 ⁇ m).
  • the thickness of the tempered glass plate 1 is 100 ⁇ m or more, it is desirable to set the condensing position of the laser light L about 50 ⁇ m from each of the front surface 3 and the back surface 4 of the tempered glass plate 1. .
  • the tempered glass plate 1 is cut after a predetermined time has elapsed from the irradiation of the laser beam L (that is, immediately after the irradiation of the laser beam L, the tempered glass).
  • the range of 20 ⁇ m to 100 ⁇ m is desirable (so that the plate 1 is not cut).
  • the range may be, for example, 8 ⁇ m to 12 ⁇ m.
  • the tempered glass plate 1 is cut immediately after the irradiation with the laser beam L, and the cutting of the tempered glass is almost completed when the irradiation with the laser beam L is completed.
  • the pulse pitch PT is in the range of 20 ⁇ m to 100 ⁇ m, the bending strength of the effective portion 12 is improved and the number of the modified spots 9 is increased as compared with the case where the pulse pitch PT is in the range of 8 ⁇ m to 12 ⁇ m. Since less is required, the polishing process of the cut surface 12a of the effective portion 12 is facilitated.
  • the pulse pitch PT when cutting out a relatively large effective portion 12 such as a touch panel of a portable terminal, it is particularly effective to set the pulse pitch PT in the range of 20 ⁇ m to 100 ⁇ m.
  • the pulse pitch PT may be in the range of 8 ⁇ m to 12 ⁇ m.
  • the pulse pitch PT can be a combination of the range of 8 ⁇ m to 12 ⁇ m and the range of 20 ⁇ m to 100 ⁇ m.
  • an IR cut coat may be provided on the incident surface of the laser light L, and in this case, the wavelength of the laser light L is preferably about 532 nm (the wavelength is 1064 nm). Not transparent in some cases).
  • the pulse width is preferably 100 ps or more (for example, about 100 ps to 800 ps) from the viewpoint of suitably extending the cracks from the modified region 7.
  • the polarization direction of the laser light L may be changed.
  • the processing performance can be changed according to the change in the polarization direction of the laser light L.
  • the modified region 7 can be formed with low processing energy by increasing the light collecting performance of the condensing lens 105.
  • the size of the modified region 7 can be controlled by changing the beam shape of the laser light L.
  • multi-point processing can be performed in the process of forming the modified region 7. In this case, by simultaneously condensing the laser beam L at a plurality of points inside the tempered glass plate 1, it is possible to improve the processing performance due to the effect of heating induction and internal stress release.
  • a tempered glass sheet cutting method that can cut a tempered glass sheet into a desired shape can be provided.
PCT/JP2012/072938 2011-09-30 2012-09-07 強化ガラス板切断方法 WO2013047157A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011217739A JP5864988B2 (ja) 2011-09-30 2011-09-30 強化ガラス板切断方法
JP2011-217739 2011-09-30

Publications (1)

Publication Number Publication Date
WO2013047157A1 true WO2013047157A1 (ja) 2013-04-04

Family

ID=47995196

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/072938 WO2013047157A1 (ja) 2011-09-30 2012-09-07 強化ガラス板切断方法

Country Status (3)

Country Link
JP (1) JP5864988B2 (zh)
TW (1) TWI629249B (zh)
WO (1) WO2013047157A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015046088A1 (ja) * 2013-09-25 2015-04-02 旭硝子株式会社 光学ガラス
CN106414352A (zh) * 2014-05-29 2017-02-15 旭硝子株式会社 光学玻璃及玻璃基板的切断方法
US10280113B2 (en) 2013-11-26 2019-05-07 AGC Inc. Glass member and manufacturing method of glass member

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (de) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
EP2781296B1 (de) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN107073642B (zh) 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
CN107073641B (zh) 2014-07-14 2020-11-10 康宁股份有限公司 接口块；用于使用这种接口块切割在波长范围内透明的衬底的系统和方法
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
HUE055461T2 (hu) 2015-03-24 2021-11-29 Corning Inc Kijelzõ üveg kompozíciók lézeres vágása és feldolgozása
CN107666983B (zh) 2015-03-27 2020-10-02 康宁股份有限公司 可透气窗及其制造方法
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
KR102078294B1 (ko) 2016-09-30 2020-02-17 코닝 인코포레이티드 비-축대칭 빔 스폿을 이용하여 투명 워크피스를 레이저 가공하기 위한 기기 및 방법
KR102428350B1 (ko) 2016-10-24 2022-08-02 코닝 인코포레이티드 시트형 유리 기판의 레이저 기반 기계 가공을 위한 기판 프로세싱 스테이션
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192368A (ja) * 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工装置
WO2006013763A1 (ja) * 2004-08-06 2006-02-09 Hamamatsu Photonics K.K. レーザ加工方法及び半導体装置
JP2006256944A (ja) * 2005-03-14 2006-09-28 Lemi Ltd 脆性材料の割断方法及び装置
WO2008108332A1 (ja) * 2007-03-02 2008-09-12 Nippon Electric Glass Co., Ltd. 強化板ガラスとその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002192368A (ja) * 2000-09-13 2002-07-10 Hamamatsu Photonics Kk レーザ加工装置
WO2006013763A1 (ja) * 2004-08-06 2006-02-09 Hamamatsu Photonics K.K. レーザ加工方法及び半導体装置
JP2006256944A (ja) * 2005-03-14 2006-09-28 Lemi Ltd 脆性材料の割断方法及び装置
WO2008108332A1 (ja) * 2007-03-02 2008-09-12 Nippon Electric Glass Co., Ltd. 強化板ガラスとその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015046088A1 (ja) * 2013-09-25 2015-04-02 旭硝子株式会社 光学ガラス
JPWO2015046088A1 (ja) * 2013-09-25 2017-03-09 旭硝子株式会社 光学ガラス
US10249664B2 (en) 2013-09-25 2019-04-02 AGC Inc. Optical glass
US10280113B2 (en) 2013-11-26 2019-05-07 AGC Inc. Glass member and manufacturing method of glass member
CN106414352A (zh) * 2014-05-29 2017-02-15 旭硝子株式会社 光学玻璃及玻璃基板的切断方法

Also Published As

Publication number Publication date
TWI629249B (zh) 2018-07-11
JP5864988B2 (ja) 2016-02-17
TW201329005A (zh) 2013-07-16
JP2013075802A (ja) 2013-04-25

Similar Documents

Publication Publication Date Title
JP5864988B2 (ja) 強化ガラス板切断方法
KR101802527B1 (ko) 가공 대상물 절단 방법
JP5113462B2 (ja) 脆性材料基板の面取り方法
JP4198123B2 (ja) レーザ加工方法
JP4776994B2 (ja) 加工対象物切断方法
KR100849696B1 (ko) 취성재료의 스크라이브 방법 및 스크라이브 장치
WO2014156828A1 (ja) レーザ加工方法
JP4414473B2 (ja) 切断方法
JP2013043808A (ja) 強化ガラス板切断用保持具及び強化ガラス板の切断方法
JP5322418B2 (ja) レーザ加工方法及びレーザ加工装置
JP6012186B2 (ja) 加工対象物切断方法
JP5037082B2 (ja) レーザ加工方法及びレーザ加工装置
JP2013203630A (ja) 強化ガラス板の切断方法
WO2007094160A1 (ja) ガラス基板の面取り方法および装置
JP2006074025A (ja) レーザ加工方法
WO2013039012A1 (ja) レーザ加工方法及びレーザ加工装置
JP2006035710A (ja) レーザによるガラス加工方法ならびに装置
TW201514109A (zh) 自載體分離玻璃片的方法
JP2010264471A (ja) 広領域非均一温度分布による脆性材料の熱応力割断
JP2005012203A (ja) レーザ加工方法
JP6050002B2 (ja) レーザ加工方法
JP2007118207A (ja) 積層体の加工方法
JP5894754B2 (ja) レーザ加工方法
JP2005338281A (ja) 薄膜デバイスの製造方法およびガラス基板の貼り合わせ方法
JP2012240107A (ja) レーザ加工方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12836147

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12836147

Country of ref document: EP

Kind code of ref document: A1