WO2013046501A1 - Module optique et dispositif d'émission optique - Google Patents

Module optique et dispositif d'émission optique Download PDF

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Publication number
WO2013046501A1
WO2013046501A1 PCT/JP2012/003795 JP2012003795W WO2013046501A1 WO 2013046501 A1 WO2013046501 A1 WO 2013046501A1 JP 2012003795 W JP2012003795 W JP 2012003795W WO 2013046501 A1 WO2013046501 A1 WO 2013046501A1
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WIPO (PCT)
Prior art keywords
optical
polymer waveguide
hole
light
wiring board
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PCT/JP2012/003795
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English (en)
Japanese (ja)
Inventor
健一郎 屋敷
柳町　成行
惣太 各務
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日本電気株式会社
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Publication of WO2013046501A1 publication Critical patent/WO2013046501A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details

Definitions

  • the present invention relates to an optical module including a light emitting element or a light receiving element and an electric element, and an optical transmission device including the same.
  • an optical transmission device including an optical transmitter / receiver that converts an electrical signal into an optical signal and converts the optical signal into an electrical signal is required in a place where the conventional electrical transmission path is only used. Since the conventional optical transmission device has high costs such as component cost and assembly cost, the actual situation is that the optical interconnection has been introduced only into expensive devices such as HPC or high-end routers. Cost reduction is desired for the spread of optical interconnection.
  • a multimode optical transceiver and a multimode optical fiber are used.
  • the multimode optical transceiver includes a light emitting device such as a vertical cavity surface emitting laser (VCSEL) and a laser diode driver (LDD) that supplies current to the light emitting device to drive the light emitting device.
  • An optical transmitter including an electric element, a light receiving element such as a photodiode (Photo Diode, PD), and an electric such as an impedance amplifier (Trans Impeadance Amp: TIA) that converts and amplifies a weak current output from the light receiving element into a voltage.
  • an optical receiver including the element.
  • a light emitting element and a light receiving element are collectively referred to as an “optical element”.
  • FIG. 1 of Non-Patent Document 3 describes an optical transmission device including an optical element (VCSEL / PD), an electric element (LDD / TIA), a lens, an electric wiring, an optical wiring, a mirror, and an optical connector. .
  • an optical element VCSEL / PD
  • an electric element LDD / TIA
  • a lens By using the lens, high-efficiency coupling between the optical element and the optical wiring can be realized.
  • expensive lenses and lens frames are used, the number of parts is large and the cost is high.
  • the following document proposes an optical transmission device that does not use an expensive lens.
  • No. 1 describes an optical transmission apparatus in which an optical element (VCSEL / PD) and a polymer waveguide are directly coupled via a 45-degree reflection mirror.
  • Non-Patent Document 2 an optical package (optical transceiver) in which an optical element (VCSEL / PD) and an electric element (LDD / TIA) are mounted on a substrate having an optical through hole is disposed on the electric socket.
  • An optical transmission device is described in which an optical connector is sandwiched between a package and an optical element and an external optical transmission line are optically coupled via an optical through hole of the optical package.
  • Patent Document 1 shows that an optical package (optical transceiver) in which an optical element (VCSEL / PD) and an electric element (LDD / TIA) are mounted on a substrate having an optical through hole is a substrate with a waveguide. And an optical transmission device that realizes optical coupling between an optical element and a substrate with a waveguide through an optical through hole of an optical package.
  • an optical package optical transceiver
  • an optical element VCSEL / PD
  • LDD / TIA electric element
  • Patent Document 2 As a related technique of the present invention. The contents will be described later.
  • Non-Patent Document 3 In the configuration described in Non-Patent Document 3, it is necessary to use an expensive lens and a lens frame, and the component cost, assembly cost, and mounting cost are high.
  • a multimode optical fiber that is generally popular is usually used to connect the housings.
  • the optical element is connected to the MMF via an optical transmission path such as a polymer waveguide formed on the board.
  • an optical transmission path such as a polymer waveguide formed on the board.
  • the transmission side will be specifically described as an example.
  • a light-emitting element (VCSEL) and a waveguide are coupled without a lens
  • the light emission angle from the light-emitting element (VCSEL) is reduced or the numerical aperture of the waveguide It is required to increase NA.
  • a difference in refractive index between the core portion and the clad portion of the waveguide can be ensured on the order of several percent. Therefore, even if the light emission angle from the VCSEL is not so narrow, the full angle is 40 degrees.
  • the light up to about is totally reflected at the interface between the core portion and the clad portion of the polymer waveguide. For this reason, it is possible to realize highly efficient coupling between the VCSEL and the polymer waveguide.
  • the NA of MMF is generally smaller than the NA of polymer waveguides.
  • the light propagating through the polymer waveguide propagates reflecting the radiation angle component of the VCSEL and reaches the MMF.
  • the light emission angle of the VCSEL is designed to be larger than the NA of the MMF in order to strengthen the optical confinement in the VCSEL in order to ensure the transmission rate. Therefore, if the polymer waveguide is a step index type, the light emission angle between the polymer waveguide and the MMF is as wide as holding the emission angle component of the VCSEL.
  • the coupling between the polymer waveguide and the MMF light of NA of MMF or more enters the MMF. Therefore, if a component such as a lens that converts the radiation angle is not inserted between the polymer waveguide and the MMF, coupling loss occurs.
  • the present invention has been made in view of the above circumstances, and includes an optical module that includes an optical element composed of a light emitting element or a light receiving element, and that can couple a polymer waveguide and an optical fiber with high efficiency and low cost. It is intended to provide.
  • the present invention also includes an optical module including an optical element composed of a light-emitting element or a light-receiving element and an electric element, and a polymer waveguide, so that the optical element, the polymer waveguide, and the optical fiber can be coupled with high efficiency.
  • An object of the present invention is to provide a low-cost optical transmission device.
  • the first optical module of the present invention is On one surface side of the wiring board, an optical element composed of a light emitting element that emits light to the wiring board side and an electric element that drives the optical element are provided.
  • the wiring board is an optical module in which an optical through hole having a core portion and a cladding portion, which penetrates the wiring substrate, is formed immediately below the optical element, The optical through hole has a graded index type refractive index profile, and the thickness of the wiring board is a thickness that substantially minimizes the radiation angle of light emitted from the optical through hole. .
  • the second optical module of the present invention is On one surface side of the wiring board, an optical element composed of a light receiving element on which light enters from the wiring board side, and an electric element that amplifies an electric signal output from the optical element,
  • the wiring board is an optical module in which an optical through hole having a core portion and a cladding portion, which penetrates the wiring substrate, is formed immediately below the optical element,
  • the optical through hole has a graded index refractive index profile
  • the thickness of the wiring board is a thickness that substantially minimizes the near-field image size of light on the exit surface of the optical through hole. is there.
  • the first optical transmission apparatus of the present invention is The other surface side of the first optical module of the present invention has a mounting substrate provided with a polymer waveguide having a core portion and a cladding portion, and an optical connector for connecting an optical fiber connected to the polymer waveguide.
  • the polymer waveguide has a core diameter equal to or less than the core diameter of the optical fiber,
  • the polymer waveguide and the optical fiber are coupled without a lens.
  • the second optical transmission apparatus of the present invention is The other surface side of the second optical module of the present invention has a mounting substrate provided with a polymer waveguide having a core portion and a cladding portion, and an optical connector for connecting an optical fiber connected to the polymer waveguide.
  • the polymer waveguide has a core diameter equal to or greater than the core diameter of the optical fiber, and has a numerical aperture NA equal to or greater than the numerical aperture NA of the optical fiber,
  • the polymer waveguide and the optical fiber are coupled without a lens.
  • the cross-sectional shape of the core portion of the optical fiber is circular, and the cross-sectional shape of the core portion of the polymer waveguide is rectangular.
  • the core diameters of both are “equal” means that the cross-sectional rectangular size of the core portion of the polymer waveguide is between the size inscribed in the circular cross-section of the core portion of the optical fiber and the size circumscribing. It is defined as that.
  • the optical module provided with the optical element which consists of a light emitting element or a light receiving element, and can couple
  • an optical module including a light element or a light receiving element and an optical element including an electric element and a polymer waveguide are provided, and the optical element, the polymer waveguide, and the optical fiber can be coupled with high efficiency.
  • a possible low-cost optical transmission device can be provided.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 3 is a manufacturing process diagram of a wiring board constituting the optical transmission device of FIGS. 1 and 2.
  • FIG. 1 is a plan view of a main part of the optical transmission apparatus according to the present embodiment.
  • FIG. 2 is a cross-sectional view of a main part of the optical transmission apparatus according to the present embodiment.
  • 3A to 3F are manufacturing process diagrams of the wiring board constituting the optical transmission apparatus of this embodiment. Each figure is a schematic diagram, and is simplified by being appropriately different from the actual one.
  • the optical transmission apparatus 1 of the present embodiment includes two optical modules 105 (105X and 105Y).
  • the first optical module 105X has a light emitting element such as a surface emitting diode (Vertical Cavity Surface Emitting Laser: VCSEL) that emits light to the one side (the upper surface in FIG. 2) of the wiring substrate 104.
  • a light emitting element such as a surface emitting diode (Vertical Cavity Surface Emitting Laser: VCSEL) that emits light to the one side (the upper surface in FIG. 2) of the wiring substrate 104.
  • LDD Laser Diode Driver
  • the second optical module 105Y includes a light receiving element (optical diode) such as a photodiode (Photo-Diode, Pin-PD) in which light is incident on one surface (the upper surface in FIG. 2) of the wiring substrate 104 from the wiring substrate 104 side.
  • a light receiving element such as a photodiode (Photo-Diode, Pin-PD) in which light is incident on one surface (the upper surface in FIG. 2) of the wiring substrate 104 from the wiring substrate 104 side.
  • This is an optical receiving module including an element 101Y and an electric element (optical IC) 102Y such as an impedance amplifier (TransImpandance Amp: TIA) that converts and amplifies the weak current output from the light receiving element 101Y into a voltage.
  • TransImpandance Amp TransImpandance Amp: TIA
  • optical module 105 when the optical modules 105X and 105Y or their constituent elements are described together, they will be described with reference numerals with X and Y removed.
  • optical module 105 the optical modules 105X and 105Y are collectively referred to as “optical module 105”.
  • an optical through hole 103 having a core portion 103A and a cladding portion 103B penetrating the wiring substrate 104 is formed immediately below the optical element 101.
  • the wiring substrate 104 is not particularly limited, and a multilayer wiring substrate is preferably used.
  • the mounting mode of the optical element 101 and the electric element 102 on the wiring board 104 is not particularly limited, and in the present embodiment, the optical module 105 is implemented by a reflow process using solder balls.
  • Non-Patent Document 1 listed in the “Background Technology” section, there is a problem of parts replacement costs. Assuming that the optical device is mounted on the same substrate as the LSI that performs signal processing such as FPGA, the optical device has a shorter life than the electronic device. Therefore, when the optical device fails, the LSI does not wait for the life of the LSI. Each board needs to be replaced. In order to prevent the board from being replaced, it is desirable to package the optical device.
  • the wiring board 104 and the optical element 101 and the electric element 102 mounted thereon are packaged.
  • the optical element 101 and the electric element 102 are covered and sealed with a metal electromagnetic shielding frame 111 and packaged, and solder mounting and replacement repair are possible.
  • the upper surface of the electric element 102 and the electromagnetic shielding frame 111 are in contact with each other through a heat conductive resin.
  • the electromagnetic shielding frame 111 functions as a protective material for the optical element 101 and the electric element 102 and also serves as a heat dissipation material for the electric element 102.
  • a heat radiating material such as a heat radiating plate.
  • the space between the optical element 101 and the optical through hole 103 may be left as it is, or a curable translucent resin may be injected.
  • the refractive index of the translucent resin is preferably about 1.5.
  • a curable translucent resin is injected between the optical element 101 and the optical through hole 103 so as to cover the optical element 101 and the electric element 102. Resin sealing may be used to prevent oxidation or moisture.
  • the optical module 105 of the present embodiment is easy to package and has a structure excellent in solder reflow resistance, and the optical module 105 can be replaced by local heating of the solder even when solder mounting is performed. .
  • the other surface (the lower surface in FIG. 2) side of the optical module 105 is connected to the polymer waveguide 106 having the core portion 106 ⁇ / b> A and the cladding portion 106 ⁇ / b> B, and to the optical fiber 110 connection. It is mounted on a mounting board 109 provided with an optical connector 108 for use.
  • an optical path conversion member 107 such as a 45-degree reflection mirror is disposed immediately below the through hole 103.
  • An LSI 112 including a CPU is mounted on the mounting substrate 109, and signals are exchanged with the optical module 105.
  • a wiring substrate such as a multilayer wiring substrate is preferably used.
  • an expensive electrical socket is used, which is expensive.
  • the mounting mode of the optical module 105 on the mounting substrate 109 is not particularly limited, and in the present embodiment, the mounting is performed by a reflow process using solder balls.
  • the polymer waveguide 106 can be preferably formed by a photolithography method including a dry etching process. In such a forming method, a plurality of polymer waveguides 106 can be formed at one time, so that the productivity is excellent and the cost is low. In addition, since the polymer waveguide 106 can be formed on the mounting substrate 109 with an electrical wiring by a free design, the optical connector 108 to which the optical fiber 110 is connected can be arranged at an arbitrary position, and the overall layout design freedom is high. preferable.
  • an optical path conversion member 107 is disposed in the polymer waveguide 106 immediately below the optical through hole 103.
  • a 45-degree reflection mirror is used as the optical path conversion member 107.
  • An optical path conversion member 107 such as a 45-degree reflection mirror is disposed in the polymer waveguide 106 to convert the optical path between the optical through hole 103 and the polymer waveguide 106 by 90 degrees, and the mounting substrate 109 is parallel to the substrate surface. So that light is transmitted.
  • the optical path changing member 107 is not accompanied by energy transfer to the higher order side in the transverse mode, it is not limited to a 45 degree reflecting mirror.
  • the 45 degree reflection mirror can be formed by dicing or laser processing.
  • the mounting substrate 109 can be diced from the back surface to form a 45 ° inclined surface, which can be used as a 45 ° reflection mirror. Since the refractive index difference between air and the polymer is large, total reflection is obtained at the reflecting surface.
  • a metal thin film having a high reflectance may be formed on the 45 ° inclined surface. Examples of the material for the metal thin film having a high reflectance include Ti, Pt, Au, Ni, Cu, Ag, Sn, and combinations thereof.
  • the wavelength can be selected as appropriate in consideration of the wavelength band of light to be used, adhesion to the substrate material, and the like.
  • the optical transmission in this embodiment is short-distance optical transmission of about 100 m or less
  • the optical modules 105X and 105Y are multimode optical transmission modules / optical reception modules
  • the optical fiber 110 is a multimode optical fiber (MMF).
  • the optical fiber 110 has a core part 110A and a clad part 110B.
  • an MMF array in which a plurality of optical fibers (MMF) 110 are arrayed is used.
  • two optical modules 105 (105X, 105Y) and one optical connector 108 are connected, and the MMF array can be coupled to the optical connector 108.
  • each optical module 105 and the optical transmission channel of the polymer waveguide 106 optically coupled to each optical module 105 are multichannel.
  • the number of optical transmission channels and the like are designed as appropriate.
  • the optical transmission device 1 according to the present embodiment has a plurality of optical modules 105 mounted on a mounting substrate 109, and the mounting substrate 109 includes the number of optical modules 105.
  • a smaller number of optical connectors 108 are mounted, and a plurality of optical modules 105 and a smaller number of optical connectors 108 than the plurality of optical modules 105 are connected via a plurality of polymer waveguides 106. Yes.
  • Such a configuration is preferable because the number of expensive optical connectors 108 is small.
  • each polymer waveguide 106 is connected to a plurality of straight lines.
  • the optical path conversion member 113 is disposed between a plurality of linear waveguides.
  • the optical path conversion member 113 is a 45 degree reflection mirror. The inclination angle of the mirror surface is set according to the arrangement design of the plurality of linear waveguides.
  • the polymer used as the material of the optical through hole 103 and the polymer waveguide 106 is not particularly limited as long as it is a translucent polymer.
  • PMMA polymethyl methacrylate
  • polycarbonate polystyrene
  • polyetherimide polyetherimide
  • cyclohexane Olefin polyphenylene ether
  • polyphenylene sulfide polyether sulfone
  • polyimide fluorinated polyimide
  • deuterated polyimide polynorbornene
  • epoxy resin epoxy-novolak resin
  • cyanate resin cyanate resin
  • BT bismaleimide / triazine
  • benzocyclobutene Fluorinated benzocyclobutene
  • polysiloxane deuterated polysiloxane
  • alkyl-substituted siloxane silicone resin
  • UV curable epoxy resins UV curable acrylic
  • the optical through hole 103 formed in the wiring board 104 has a graded index (GI) refractive index profile, and the thickness of the wiring board 104 is optical. The thickness is designed so that the radiation angle of the light emitted from the through hole 103 is substantially minimized.
  • GI graded index
  • the transmission side polymer waveguide 106 is a step index type polymer waveguide having a core diameter equal to or smaller than the core diameter of the optical fiber (MMF) 110.
  • the transmitting polymer waveguide 106 is desirably made of the same material as the receiving polymer waveguide 106 in order to reduce manufacturing costs.
  • the polymer waveguide 106 on the transmission side has a numerical aperture NA larger than the numerical aperture NA (for example, 0.2) of the optical fiber 110.
  • NA the numerical aperture
  • bending loss can be reduced by increasing the refractive index difference between the core portion and the clad portion of the polymer waveguide 106.
  • a step index type polymer waveguide having a large refractive index difference between the core and the clad has a large NA.
  • the NA is 0.2, which is about the same as the optical fiber
  • the refractive index difference is 2%
  • the NA is 0.3
  • the refractive index difference is 4%
  • the NA is estimated to be 0.44. It is.
  • the optical through hole 103 formed in the wiring board 104 has a graded index (GI) type refractive index profile, and the thickness of the wiring board 104 is optical.
  • the thickness is designed so that the near-field image size of light on the exit surface of the through hole 103 is substantially minimized.
  • the polymer waveguide 106 on the receiving side has a core diameter equal to or larger than the core diameter of the optical fiber (MMF) 110 and a step index type polymer having a numerical aperture NA larger than the numerical aperture NA of the optical fiber 110. It is a waveguide.
  • the optical through hole 103 has a graded index type refractive index profile and exhibits a so-called GRIN lens effect.
  • the optical through hole 103 formed in the wiring board 104 exhibits the GRIN lens effect, it is not necessary to mount a lens as an individual component, so that mass production and cost reduction can be realized.
  • the optical through hole 103 having a graded index type refractive index profile and the step index type polymer waveguide 106 having a larger numerical aperture NA than the optical fiber (MMF) 110 the polymer waveguide 106 and the optical fiber (MMF) are used. ) 110 is not necessary, and the cost can be reduced.
  • the square distribution of the refractive index can be expressed by a parabola of a quadratic curve
  • a beam trajectory as shown in FIG. 7.17 of Non-Patent Document 4 mentioned in the “Background Art” section is obtained.
  • the trajectory of light is given by the sine function of Equation 7.49 described in Non-Patent Document 4.
  • the light emitting element 101X and the optical through hole 103 are directly coupled.
  • the period of the sin curve is T
  • the thickness of the wiring board 104 is (T / 4 ⁇ 0.8 + T / 2 ⁇ m) to (T / 4 ⁇ 1.2 + T). / 2 ⁇ m), the coupling efficiency can be optimized. That is, in order to “design the thickness of the wiring board 104 to a thickness that minimizes the radiation angle of the light emitted from the light through hole 103”, specifically, the thickness of the wiring board 104 is designed within the above range, for example. do it. If the wiring substrate 104 needs to be thick due to the wiring pattern, m may be adjusted.
  • the wiring board 104 is composed of a multilayer wiring board. In this case, since the lowermost wiring board is a board for extracting signals, the entire thickness of the wiring board 104 can be adjusted by the thickness of the lowermost wiring board.
  • the numerical aperture of the optical through hole 103 is NA
  • the maximum refractive index of the core portion 103A is Nmax
  • the core diameter is 2Xo
  • the refractive index of the cladding portion 103B is Nc.
  • the change of the optical axis when passing through the optical through hole 103 is related as follows. Attached.
  • X 2
  • , Nmax ⁇ sin ⁇ sin ⁇ (1)
  • tan ⁇
  • , Nmax ⁇ sin ⁇ sin ⁇ ⁇ (2) (Where X 1 is the deviation of the optical axis of the incident light from the center of the optical through hole, ⁇ is the incident angle, X 2 is the deviation of the exit position of the optical through hole from the center of the optical through hole, and ⁇ is the outgoing angle. (The exit position depends on the incident angle but does not depend on the incident position.)
  • the full angle is 44 degrees, and it is possible to sufficiently cover the radiation angle of light emitting elements that are generally distributed.
  • T 0.64 mm.
  • the maximum incident angle is 15 degrees, and high-efficiency coupling is possible by using the light emitting element 101X having a total radiation angle of less than 30 degrees.
  • T 1.28 mm. If the size of the light emitting surface is 10 ⁇ m in diameter, the angular variation is estimated to be ⁇ 2.1 degrees.
  • Xo corresponds to the boundary between the core portion 103X and the clad portion 103Y. Desirably, Xb ⁇ Xo.
  • Light emitted from the optical module 105X on the transmission side and passed through the optical through hole 103 having a graded index type refractive index profile is converted into collimated light having an emission angle smaller than the emission angle from the light emitting element 101X.
  • the collimated light is smaller than the diameter of the polymer waveguide 106 and enters the polymer waveguide 106 on the transmission side. Therefore, even if an optical path conversion member 107 such as a 45-degree reflection mirror is disposed between the optical through hole 103 and the transmission-side polymer waveguide 106, the light exiting the optical through hole 103 has a small radiation angle. Spatial expansion when the optical path is converted by the conversion member 107 and coupled to the polymer waveguide 106 on the transmission side can be suppressed, and lensless and low-loss coupling can be realized.
  • the polymer waveguide 106 since the polymer waveguide 106 has a step index type structure, the light incident on the polymer waveguide 106 propagates while maintaining the radiation angle of the light exiting the optical through hole 103, and is an optical fiber (MMF). Reach up to 110. Even when a plurality of polymer waveguides 106 are aggregated into one optical connector 108, the radiation angle is preserved.
  • MMF optical fiber
  • the polymer waveguide 106 on the transmission side has a core diameter that is equal to or smaller than the core diameter of the optical fiber (MMF) 110. Therefore, the radiation angle from the polymer waveguide 106 is changed to the optical fiber ( The numerical aperture NA of the MMF) 110 can be reduced, and low-loss coupling can be realized between the polymer waveguide 106 and the optical fiber (MMF) 110.
  • the coupling efficiency between the polymer waveguide 106 and the optical fiber (MMF) 110 is indirectly increased by reducing the radiation angle of light incident on the polymer waveguide 106 on the transmission side.
  • the core diameter of the polymer waveguide 106 is designed to be equal to or larger than the core diameter of the optical fiber (MMF) 110. Since the numerical aperture NA of the polymer waveguide 106 is larger than the numerical aperture NA of the optical fiber (MMF) 110, a low-loss coupling can be realized between the optical fiber (MMF) 110 and the polymer waveguide 106 on the receiving side. .
  • the core diameter 2Xo of the optical through hole 103 on the reception side is designed to be equal to or larger than the core diameter of the polymer waveguide 106 on the reception side.
  • the beam divergence is smaller than 2Xo. can do.
  • the beam size when reaching the light receiving element 101Y is determined by the incident angle of light incident on the light through hole 103, and a beam size suitable for high-speed operation of 10G or more can be obtained.
  • the light emitted from the polymer waveguide 106 spreads by the width of the polymer waveguide 106 instead of having a small emission angle.
  • the exit angle from the polymer waveguide 106 is equal to or less than the numerical aperture NA of the optical fiber (MMF) 110.
  • the beam size of the light reaching the light receiving element 101Y is determined by the incident angle of the light entering the optical through hole 103. That is, the output position of the optical through hole 103 varies by the angle of the output from the polymer waveguide 106.
  • the output position variation of the optical through hole 103 is ⁇ 13.7 ⁇ m.
  • the output position variation of the optical through hole 103 is estimated to be ⁇ 27.5 ⁇ m.
  • the area of the light receiving portion of the light receiving element 101Y affects the junction capacitance, so the area is limited. For example, 60 ⁇ m ⁇ 60 ⁇ m for 10 Gbps operation and 30 ⁇ m ⁇ 30 ⁇ m for 25 Gbps operation can ensure a good eye opening. . Therefore, a beam size that can finally cope with a high-speed operation of 10 Gbps or more can be realized.
  • the core diameter of the optical through hole 103 is 40 ⁇ m
  • the path of the free space generated by the optical path conversion member 107 such as a 45-degree reflection mirror is 20 to 100 ⁇ m
  • the core diameter of the optical through hole 103 is preferably set to 48 to 80 ⁇ m or more.
  • the size of the light receiving element 101Y can be reduced.
  • the junction capacitance of the light receiving element 101Y can be reduced, and a high-speed optical receiving module 105Y can be realized.
  • the thickness of the wiring board 104 is ( It is preferable to set between T / 4 ⁇ 0.95 + T / 2 ⁇ m) to (T / 4 ⁇ 1.05 + T / 2 ⁇ m). Since the beam position changes abruptly in the vicinity of the locus of the sin curve, the thickness of the wiring board is preferably defined under conditions that are more severe than the thickness accuracy on the transmission side.
  • the optical transmission apparatus 1 with reduced coupling loss through the entire optical signal path can be realized by the above-described effects.
  • the “GRIN lens” is not used in Patent Document 1 and Non-Patent Document 2 listed in the “Background Art” section.
  • the problem of coupling loss in Patent Document 1 and Non-Patent Document 2 can be improved at low cost.
  • Patent Document 2 As a related technique of the present invention, there is Patent Document 2 cited in the section of “Background Art”.
  • Patent Document 2 a graded index optical fiber having a GRIN lens effect is used.
  • the radiation angle is adjusted by using a graded index type optical fiber with a specified length.
  • the GRIN lens effect is given to the optical through hole 103, and the GRIN lens length is adjusted by the thickness of the wiring substrate 104.
  • a manufacturing process that is superior in mass productivity can be provided and the cost is lower than when a graded index optical fiber is used.
  • 3A to 3F are cross-sectional views corresponding to FIG.
  • a wiring substrate 104 is prepared in which wirings for the optical element 101 and the electric element 102 are provided and the optical through hole 103 is not formed.
  • the wiring board 104 a multilayer wiring board in which a plurality of wiring boards are bonded together can be used.
  • a first through-hole 201 is formed at a position where the optical through hole 103 of the wiring substrate 104 is formed using a laser or a drill.
  • the temporary substrate 202 is temporarily fixed to the surface (the lower surface in the drawing) opposite to where the optical element 101 and the electric element 102 are formed in the wiring substrate 104.
  • the resin 203B for the clad portion 103B of the optical through hole 103 is poured into the first through hole 201 from the surface (upper surface in the figure) on which the optical element 101 and the electric element 102 are formed.
  • the second through hole having a diameter smaller than that of the first through hole 201 is filled in the first through hole 201 filled with the resin 203B for the clad portion 103B by a laser or a drill. Hole 204 is formed.
  • the resin 203A for the core portion 103A of the optical through hole 103 is poured into the second through hole 204 from the surface (upper surface in the figure) on which the optical element 101 and the electric element 102 are formed. Come on. Thereafter, holding for a certain period of time at a temperature lower than the curing temperature, the mutual diffusion of the resin 203A for the core part and the resin 203B for the clad part 103B is advanced. By this mutual diffusion, a graded index type refractive index profile is obtained.
  • the temporary substrate 202 is removed, the resin 203A for the core portion 103A and the resin 203B for the clad portion 103B are cured at a curing temperature, and both surfaces of the wiring substrate 104 are polished to form electrodes on both surfaces. Expose.
  • the wiring substrate 104 if the wiring on the back surface opposite to where the optical element 101 and the electric element 102 are formed is formed with vias filled with metal, the wiring is obtained by polishing this surface. The thickness of the entire substrate 104 can be adjusted.
  • optical through-hole 103 is formed after preparing a multilayer wiring board on which a plurality of wiring boards are bonded.
  • An optical through hole may be formed in the substrate, and these may be bonded to form a multilayer.
  • an optical through hole 103 having a graded index type refractive index profile having a GRIN lens effect is provided immediately below the optical element 101 in the wiring substrate 104.
  • the thickness of the wiring substrate 104 is set to a thickness that minimizes the radiation angle of the light emitted from the optical through hole 103, and the polymer waveguide 106 has a core diameter equal to or smaller than the core diameter of the optical fiber 110.
  • the polymer waveguide 106 and the optical fiber 110 are coupled without using a lens.
  • the thickness of the wiring substrate 104 is set to a thickness that substantially minimizes the near-field image size of light on the exit surface of the optical through hole 103, and the polymer waveguide 106 has a core that is equal to or larger than the core diameter of the optical fiber 110. It has a diameter and a numerical aperture NA larger than the numerical aperture NA of the optical fiber 110, and the polymer waveguide 106 and the optical fiber 110 are coupled without a lens. According to the present embodiment having the above configuration, as described above, the optical transmission device 1 in which the coupling loss is reduced through the entire optical signal path can be realized.
  • the plurality of polymer 106 waveguides connected to the plurality of optical modules 105 are aggregated into one optical connector 108 having a smaller number than the plurality of optical modules 105, the number of optical connectors 108 is reduced, and the number of optical connectors 108 is reduced. Cost reduction can be realized.
  • the polymer waveguide 106 is configured by a plurality of linear waveguides, and the optical path conversion member 113 of a 45-degree reflection mirror is disposed between the plurality of linear waveguides. The reflection angle is maintained, and the transition of the transverse mode to the higher order mode of the light transmitted through the polymer waveguide 106 can be reduced.
  • the area occupied by the optical path conversion member is smaller than in the case of using a bent waveguide, and the degree of freedom in layout design is great. As a result, the area required for the plurality of polymer waveguides 106 can be reduced, and the plurality of polymer waveguides 106 can be collectively formed by a photolithography method, so that cost reduction can be realized.
  • the polymer waveguide 106 may be formed of a curved waveguide at least partially.
  • the optical path conversion can be performed without using the optical path conversion member 113 such as a 45-degree reflection mirror.
  • bending loss of the polymer waveguide 106 occurs as compared with the case where only the straight waveguide is used.
  • the polymer waveguide when the polymer waveguide is a multimode waveguide and includes a bent waveguide in the middle, energy transfer can occur between transverse modes propagating in the polymer waveguide.
  • the energy transfer between the transverse modes becomes significant when the ratio of the radius of curvature of the bent waveguide / the width of the waveguide is small.
  • the width of the polymer waveguide 106 is equal to that of the optical fiber (MMF) 110 connected thereto, and is usually several tens of ⁇ m.
  • the polymer waveguide 106 has a refractive index of about 1.5, and the difference in refractive index between the core portion 106A and the cladding portion 106B is several percent. Therefore, the loss of the bent waveguide is about 1 mm in radius of curvature. Increase.
  • the polymer waveguide 106 is used with a radius of curvature with a small waveguide loss, the radius of curvature / waveguide width can be sufficiently increased, energy transfer between the transverse modes can be reduced, and light emission before and after the polymer waveguide 106 can be achieved.
  • the angle can be kept below a certain angle.
  • the bent portion makes the core portion 106A a light-reflective metal, preferably the core portion. What is necessary is just to surround with the metal with a high reflectance with respect to the light which propagates around 106A. In this case, in order to suppress the movement of energy between the transverse modes, it is preferable to set the minimum radius of curvature with respect to the waveguide width at the bent portion to 10 times or more (minimum radius of curvature / waveguide width ⁇ 10 times).
  • the optical module 105 in which the optical element 101 and the electric element 102 are mounted on the wiring substrate 104 has a package structure having solder reflow resistance, a plurality of optical modules 105 are formed with polymer waveguides 106. It can be easily mounted on the mounting substrate 109. Therefore, it is easy to mount, replace, and correct a plurality of optical modules 105, and the optical transmission device 1 can be provided at a low cost.
  • the optical element 101 including the light emitting element or the light receiving element is provided, and the light that can couple the polymer waveguide 106 and the optical fiber 110 with high efficiency and low cost.
  • a module 105 can be provided.
  • the optical module 105 including the optical element 101 made of a light emitting element or a light receiving element and the electric element 102 and the polymer waveguide 106 are provided, and the optical element 101, the polymer waveguide 106, and the optical fiber 110 are provided. It is possible to provide a low-cost optical transmission device 1 capable of coupling the two at high efficiency.
  • Example 1 The optical transmission device 1 shown in FIGS. 1 and 2 was produced.
  • the pitch of the optical elements 101 in each optical module 105 was 250 ⁇ m.
  • the light through hole 103 in the wiring substrate 104 was formed by the process shown in FIGS. 3A to 3F using a light transmitting polymer (fluorinated acrylic resin).
  • the optical through hole 103 has a graded index type refractive index profile, and has a core diameter of 50 ⁇ m and a cladding diameter of 100 ⁇ m.
  • the optical through hole 103 had a maximum refractive index Nmax of the core portion of 1.5 and a refractive index Nc of the cladding portion of 1.454.
  • the refractive index distribution of the optical through hole 103 showed a distribution close to the following formula.
  • An optical element (VCSEL and PD) 101 and an electric element (LDD and TIA) 102 are mounted on a wiring board 104 in which an optical through hole 103 is formed, and these are covered and sealed with a metal electromagnetic shielding frame 111 for transmission. And optical modules 105X and 105Y for reception were manufactured. The obtained optical modules 105X and 105Y both have a structure that allows solder mounting and replacement repair.
  • the light emitting element (VCSEL) used had a full radiation angle of 30 degrees and Xb was 13 ⁇ m or less.
  • the core refractive index of the polymer waveguide 106 on the transmission side was 1.5
  • the cladding refractive index Nc was 1.454
  • the core size was 40 ⁇ m ⁇ 40 ⁇ m.
  • the coupling loss between the light emitting element (VCSEL) 101X and the polymer waveguide 106 can be suppressed to 1 dB or less including variation.
  • the polymer waveguide 106 On the receiving side, similarly to the transmitting side, the polymer waveguide 106 has a core refractive index of 1.5, a cladding refractive index Nc of 1.454, and a core size of 40 ⁇ m ⁇ 40 ⁇ m.
  • the MMF array side of the polymer waveguide 106 had a 127 ⁇ m pitch and was connected to a 127 ⁇ m pitch MMF array.
  • the coupling loss between the polymer waveguide 106 on the transmission side and the polymer waveguide 106 on the reception side and the MMF 110 of the GI 50 was 0.5 dB or less.
  • the optical through hole 103 on the receiving side has the same structure as the transmitting side.
  • the optical path conversion member 107 made of a 45-degree reflection mirror was formed in the polymer waveguide 106 by dicing from the back surface of the mounting substrate.
  • the optical path conversion member 107 By forming a 45-degree reflecting mirror in the polymer waveguide 106 as the optical path conversion member 107, the free space between the optical through hole 103 and the polymer waveguide 106 could be reduced to 20 ⁇ m.
  • the coupling loss between the polymer waveguide 106 and the optical through hole 103 was 0.5 dB or less.
  • the beam size at the output of the optical through hole 103 on the receiving side was 25 ⁇ m.
  • the light receiving surface size of the light receiving element (PD) 101Y was 30 ⁇ m ⁇ 30 ⁇ m square. Light could be coupled from the light through hole 103 to the light receiving surface of the light receiving element (PD) 101Y with an external quantum efficiency of 70%. Finally, error-free operation could be confirmed with 24 ch ⁇ 25 Gbps operation, which showed practicality.
  • the optical transmission apparatus of the present invention can be preferably applied to short-distance optical transmission such as servers, routers, and HPCs.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

La présente invention porte sur un module optique (105) qui a un élément optique (101) sur un côté d'un substrat de câblage (104) et le substrat de câblage (104) a un trou traversant optique (103), qui passe à travers le substrat de câblage (104), juste au-dessous de l'élément optique (101). Le trou traversant optique (103) a un profil à gradient d'indice. Dans un module optique d'émission (105), l'épaisseur du substrat de câblage (104) est conçue de telle sorte que l'angle de rayonnement d'une lumière qui est émise depuis le trou traversant optique (103) est sensiblement minimale. Dans un module optique de réception (105), l'épaisseur du substrat de câblage (104) est conçue de telle sorte que la dimension dans un motif en champ proche à la surface d'émission de lumière du trou traversant optique (103) est sensiblement minimale. Ainsi, il est possible de fournir un module optique ayant un élément optique constitué par un élément émettant de la lumière ou un élément recevant de la lumière, qui peut être couplé à un guide d'onde polymère et une fibre optique à un faible coût et avec un rendement élevé.
PCT/JP2012/003795 2011-09-27 2012-06-11 Module optique et dispositif d'émission optique WO2013046501A1 (fr)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110865441A (zh) * 2018-08-27 2020-03-06 苏州旭创科技有限公司 一种光模块

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105902A (ja) * 1987-10-19 1989-04-24 Nec Corp 薄膜装荷型導波路構造
JP2000028871A (ja) * 1998-07-15 2000-01-28 Nippon Telegr & Teleph Corp <Ntt> 光半導体モジュールの実装形態
JP2003337237A (ja) * 2002-03-15 2003-11-28 Hitachi Maxell Ltd 光通信部品および積層型光通信モジュール
JP2005092032A (ja) * 2003-09-19 2005-04-07 Fujikura Ltd 平面型光導波路の製造方法
JP2005338704A (ja) * 2004-05-31 2005-12-08 Shinko Electric Ind Co Ltd 光結合機能付配線基板及びその製造方法と光結合システム
JP2006208527A (ja) * 2005-01-26 2006-08-10 Fuji Xerox Co Ltd 光導波路を備えた回路モジュール及びその製造方法
WO2006115248A1 (fr) * 2005-04-25 2006-11-02 Kyocera Corporation Structure de couplage optique, substrat avec fonction de transmission optique intégrée et procédé de fabrication d’un tel substrat
JP2008015040A (ja) * 2006-07-03 2008-01-24 Fuji Xerox Co Ltd 光導波路および光モジュール
JP2011028306A (ja) * 2010-11-12 2011-02-10 Kyocera Corp 光接続構造およびそれを用いた光電気モジュール、並びに光導波路ユニット
JP2011075688A (ja) * 2009-09-29 2011-04-14 Toppan Printing Co Ltd 光配線コネクタ及び光配線の接続方法
JP2011151402A (ja) * 2004-10-22 2011-08-04 Intel Corp Ｖｃｓｅｌ及びフォトダイオードアレイ用表面実装（ｓｍｔ）コネクタ
JP2011164357A (ja) * 2010-02-09 2011-08-25 Olympus Corp 光伝送装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01105902A (ja) * 1987-10-19 1989-04-24 Nec Corp 薄膜装荷型導波路構造
JP2000028871A (ja) * 1998-07-15 2000-01-28 Nippon Telegr & Teleph Corp <Ntt> 光半導体モジュールの実装形態
JP2003337237A (ja) * 2002-03-15 2003-11-28 Hitachi Maxell Ltd 光通信部品および積層型光通信モジュール
JP2005092032A (ja) * 2003-09-19 2005-04-07 Fujikura Ltd 平面型光導波路の製造方法
JP2005338704A (ja) * 2004-05-31 2005-12-08 Shinko Electric Ind Co Ltd 光結合機能付配線基板及びその製造方法と光結合システム
JP2011151402A (ja) * 2004-10-22 2011-08-04 Intel Corp Ｖｃｓｅｌ及びフォトダイオードアレイ用表面実装（ｓｍｔ）コネクタ
JP2006208527A (ja) * 2005-01-26 2006-08-10 Fuji Xerox Co Ltd 光導波路を備えた回路モジュール及びその製造方法
WO2006115248A1 (fr) * 2005-04-25 2006-11-02 Kyocera Corporation Structure de couplage optique, substrat avec fonction de transmission optique intégrée et procédé de fabrication d’un tel substrat
JP2008015040A (ja) * 2006-07-03 2008-01-24 Fuji Xerox Co Ltd 光導波路および光モジュール
JP2011075688A (ja) * 2009-09-29 2011-04-14 Toppan Printing Co Ltd 光配線コネクタ及び光配線の接続方法
JP2011164357A (ja) * 2010-02-09 2011-08-25 Olympus Corp 光伝送装置
JP2011028306A (ja) * 2010-11-12 2011-02-10 Kyocera Corp 光接続構造およびそれを用いた光電気モジュール、並びに光導波路ユニット

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110865441A (zh) * 2018-08-27 2020-03-06 苏州旭创科技有限公司 一种光模块

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