Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
  • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
  • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
  • C08F220/10—Esters
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
  • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
  • C09J133/04—Homopolymers or copolymers of esters
  • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
  • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
  • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
  • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
  • H05K2201/10007—Types of components
  • H05K2201/10128—Display
  • H05K2201/10136—Liquid Crystal display [LCD]

Definitions

• the present invention relates to a circuit connection material, a connection method for connecting a pair of circuit members using the circuit connection material, and a connection structure obtained by the connection method.
• the circuit connection member include an anisotropic conductive film (ACF), a connection surface on which a wiring electrode of a substrate is formed via an anisotropic conductive film, and a terminal electrode (bump of an electronic component).
• ACF anisotropic conductive film
• the anisotropic conductive film is temporarily attached on the connection surface of the substrate, and the anisotropic conductive film and the connection surface of the electronic component are opposed to each other on the anisotropic conductive film.
• An electronic component is placed on and heat-pressed.
• the electroconductive particle in an anisotropic conductive film is inserted
• the terminal electrode of the electronic component and the wiring electrode of the substrate are electrically connected via the conductive particles.
• the conductive particles that are not between the terminal electrode and the wiring electrode are present in the insulating adhesive composition of the anisotropic conductive film and maintain an electrically insulated state. That is, electrical conduction is achieved only between the terminal electrode and the wiring electrode.
• an adhesive composition constituting such a circuit connecting member there is a conventional one containing an epoxy resin or the like.
• This adhesive composition generally contains an epoxy resin, a curing agent such as a phenol resin that reacts with the epoxy resin, a latent curing agent that accelerates the reaction between the epoxy resin and the curing agent, and the like.
• (meth) acrylate derivatives tend to have a large curing shrinkage during polymerization and a large internal stress after curing compared to epoxy resins and the like. For this reason, generally, when a circuit connection material containing a radical curable adhesive composition is used, bubbles may be generated at the interface between the adhesive layer and a substrate such as an LCD panel, which may reduce connection reliability. is there. In particular, in the TFT (Thin-Film-Transistor) LCD panel, this bubble generation becomes significant at the interface with the silicon nitride (SiN) film used as an insulating film on the panel wiring, resulting in poor adhesion, resulting in connection reliability. May be greatly reduced.
• SiN silicon nitride
• the present invention has been proposed in view of such a conventional situation, and when subjected to a high-temperature and high-humidity treatment, the adhesion with the interface with the silicon nitride film is improved to provide excellent connection reliability. It is an object to provide a circuit connection material that can be exhibited, a connection method for connecting a pair of circuit members using the circuit connection material, and a connection structure obtained by the connection method.
• the circuit connection material of the present invention includes (1) a polyfunctional (meth) acrylate monomer, (2) a radical polymerization initiator that generates free radicals by heat or light, and (3)
• the monofunctional (meth) acrylate monomer is contained, and the monofunctional (meth) acrylate monomer is represented by the chemical formula (1).
• R is a biphenyl group or a naphthalene group, and R is bonded thereto.
• the bonding position with the oxygen atom is ortho, meta, or para, and n is 1 to 10.
• connection structure of the present invention is a circuit member that faces each other by interposing a circuit connection material between a pair of circuit members arranged so that circuit electrodes face each other.
• the circuit connection material comprises (1) a polyfunctional (meth) acrylate monomer, (2) a radical polymerization initiator that generates free radicals by heat or light, and (3) a monofunctional (meth) acrylate monomer, wherein the monofunctional (meth) acrylate monomer is represented by chemical formula (1),
• R is a biphenyl group or a naphthalene group, the bonding position of R and the oxygen atom bonded thereto is ortho, meta, or para, and n is 1 to 10. And butterflies.
• the connection method of the present invention includes a circuit connection material interposed between a pair of circuit members arranged so that circuit electrodes face each other, and is subjected to thermal pressurization.
• the circuit connection material is (1) a polyfunctional (meth) acrylate monomer.
• the radical polymerization initiator that generates free radicals by heat or light
• a monofunctional (meth) acrylate monomer is represented by the chemical formula (1).
• R is a biphenyl group or a naphthalene group
• the bonding position of R and the oxygen atom bonded thereto is the ortho position, the meta position, or the para position
• n is 1 to 10. It is characterized in.
• the circuit connection material capable of improving the adhesion with the interface with the silicon nitride film and exhibiting excellent connection reliability, and the circuit connection A connection method for connecting a pair of circuit members using a material and a connection structure obtained by the connection method can be provided.
• circuit connection material The circuit connecting material in the present embodiment is interposed between a pair of circuit members arranged so that circuit electrodes face each other, and electrically and mechanically connects the facing circuit members.
• the circuit connection material in the present embodiment is applied to an anisotropic conductive film formed into a film shape by dispersing a plurality of conductive particles in an insulating adhesive composition.
• the insulating adhesive composition contains a polyfunctional (meth) acrylate compound, a monofunctional (meth) acrylate monomer, a radical polymerization initiator that generates free radicals by heat or light, and a film-forming resin.
• (meth) acrylate includes acrylate and methacrylate.
• Both polyfunctional (meth) acrylate compounds and monofunctional (meth) acrylate monomers are radical polymerizable resins and form a crosslinked structure in the insulating adhesive composition when the anisotropic conductive film is heated. Thus, the adhesive composition is cured.
• Monofunctional (meth) acrylate monomer is represented by chemical formula (1).
• R is a biphenyl group or a naphthalene group.
• the bonding position between R and the oxygen atom O bonded thereto is the ortho, meta, or para position.
• n is 1 to 10, and 1 to 3 is particularly preferable. When n is too large, the cross-linked structure becomes loose, and the adhesion (adhesiveness) of the anisotropic conductive film to the silicon nitride film is lowered.
• the internal stress after curing is reduced, the generation of bubbles at the interface between the adhesive layer and the silicon nitride film of the substrate is suppressed at the time of connection, and the connection can be made with high adhesion. That is, by including such a monofunctional (meth) acrylate monomer in the anisotropic conductive film, it is possible to obtain high connection reliability in a connection structure formed by using this anisotropic conductive film. it can.
• Examples of the monofunctional (meth) acrylate monomer include ethoxylated o-phenylphenol acrylate represented by the chemical formula (2).
• the bonding position of the biphenyl group and the oxygen atom bonded thereto is not limited to the ortho position as shown in chemical formula (2), but is meta-position (ethoxylated m-phenylphenol acrylate) or para-position (ethoxylated p-phenyl). Phenol acrylate).
• the bonding position between the naphthalene group and the oxygen atom bonded thereto may be any of the ortho position, the meta position, and the para position.
• the blending amount of the monofunctional (meth) acrylate monomer in the insulating adhesive composition is 3 to 20% by mass (3 to 20 parts by mass with respect to 100 parts by mass of the insulating adhesive composition). preferable.
• the content is less than 3% by mass, the effect of the monofunctional (meth) acrylate monomer is difficult to obtain, and the adhesive strength is weakened.
• it exceeds 20 mass% it will become a hardened
• the adhesiveness with the interface with the silicon nitride film is improved while suppressing the fluctuation of the resistance value between the circuit electrodes when subjected to the high temperature and high humidity treatment. It is possible to exhibit excellent connection reliability.
• polyfunctional (meth) acrylate compound examples include polyfunctional (meth) acrylate monomers, polyfunctional (meth) acrylate oligomers, polyfunctional (meth) acrylate polymers, and the like.
• Bifunctional (meth) acrylates include bisphenol F-EO-modified di (meth) acrylate, bisphenol A-EO-modified di (meth) acrylate, polypropylene glycol di (meth) acrylate, polyethylene glycol (meth) acrylate, and tricyclodecanedi. Examples include methylol di (meth) acrylate and dicyclopentadiene (meth) acrylate.
• trifunctional (meth) acrylate examples include trimethylolpropane tri (meth) acrylate, trimethylolpropane PO-modified (meth) acrylate, and isocyanuric acid EO-modified tri (meth) acrylate.
• tetrafunctional or higher functional (meth) acrylates examples include dipentaerythritol penta (meth) acrylate, pentaerythritol hexa (meth) acrylate, pentaerythritol tetra (meth) acrylate, and ditrimethylolpropane tetraacrylate.
• polyfunctional urethane (meth) acrylates can also be used.
• the radical polymerization initiator is a curing agent that decomposes by heat or light to generate free radicals, and a known radical polymerization initiator can be selected.
• peroxide polymerization initiators such as diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, azo polymerization initiator such as azobisbutyronitrile, redox System polymerization initiators and the like.
• the blending amount of the radical polymerization initiator in the insulating adhesive composition is too small, curing is insufficient, and if it is too large, the cohesive force of the anisotropic conductive film is reduced, so that the (meth) acrylate compound 100 mass.
• the amount is preferably 1 to 10 parts by mass, more preferably 3 to 7 parts by mass with respect to parts.
• thermoplastic elastomer such as epoxy resin, polyester resin, polyurethane resin, phenoxy resin, polyamide, EVA, or the like
• polyester resins, polyurethane resins, phenoxy resins, particularly phenoxy resins such as bis A type epoxy resins and phenoxy resins having a fluorene skeleton can be mentioned.
• Adhesive composition It is 80 to 30 parts by mass, more preferably 70 to 40 parts by mass with respect to 100 parts by mass.
• the conductive particles used in conventional anisotropic conductive films can be used.
• metal particles such as gold particles, silver particles, and nickel particles, benzoguanamine resins, styrene resins, etc.
• examples thereof include metal-coated resin particles whose surfaces are coated with a metal such as gold, nickel, and zinc.
• the average particle diameter of the conductive particles is preferably 1 to 20 ⁇ m, more preferably 2 to 10 ⁇ m, from the viewpoint of connection reliability.
• the average particle density of the conductive particles in the insulating adhesive composition is preferably 500 to 50000 / mm 2 , more preferably 1000 to 30000 / mm 2 from the viewpoint of connection reliability and insulation reliability. .
• Insulating adhesive composition can contain phosphate acrylate in order to improve adhesion to metal.
• the insulating adhesive composition includes other additive compositions such as dilution monomers such as various acrylic monomers, fillers, softeners, colorants, flame retardants, thixotropic agents, silane coupling agents. Further, silica fine particles and the like can be contained.
• silane coupling agent By including a silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
• silica fine particles, the storage elastic modulus, the linear expansion coefficient, etc. can be adjusted to improve the connection reliability.
• the anisotropic conductive film of the present embodiment is a radically polymerizable resin, a polyfunctional (meth) acrylate compound, a monofunctional (meth) acrylate monomer represented by the chemical formula (1), a (meth) acrylate compound,
• the conductive particles are uniformly dispersed and mixed by a known dispersion method, and the resulting mixture is used as a silicone release treatment polyester film or the like. It can be manufactured by applying to a release film by a known coating method such as a bar coater so as to have a dry thickness of 10 to 50 ⁇ m, and putting it in a thermostat at 50 to 90 ° C. and drying it.
• a known coating method such as a bar coater
• the release film for example, PET (PolyPoEthylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), etc. are coated with a release agent such as silicone. While preventing the conductive conductive film from drying, the shape of the anisotropic conductive film is maintained.
• the anisotropic conductive film of the present embodiment by including the monofunctional (meth) acrylic monomer having the structure represented by the chemical formula (1), between the circuit electrodes when subjected to high temperature and high humidity treatment While suppressing the fluctuation of the resistance value, it is possible to improve the adhesion with the interface with the silicon nitride film and to exhibit excellent connection reliability. ⁇ 2. Connection method>
• connection method in which a glass substrate constituting an LCD (Liquid Crystal Display) panel and a COF (Chip On Film) as a wiring material are crimped and connected via the anisotropic conductive film of the present embodiment.
• Wiring electrodes are formed on the glass substrate at a fine pitch.
• terminal electrodes are formed on the COF according to the wiring pattern of the wiring electrodes.
• the connection structure is obtained by anisotropically connecting the wiring electrode of the glass substrate and the terminal electrode of the COF.
• a connection method in which the glass substrate and the COF are crimped and connected via an anisotropic conductive film will be specifically described.
• a surface on which a wiring electrode on a glass substrate is formed and an anisotropic conductive film are temporarily attached to the glass substrate (temporary attaching step).
• the heating temperature is a low temperature (for example, a predetermined value of 60 to 80 ° C.) such that the insulating adhesive composition flows but does not cure.
• the pressure applied in the temporary sticking step is a predetermined value of 0.5 MPa to 2 MPa, for example.
• the heat pressurizing time in the temporary sticking step is, for example, a predetermined time of 1 to 3 seconds (sec).
• the COF is placed on the anisotropic conductive film so that the bump and the wiring electrode are opposed to each other (placement step).
• the pressurizing pressure in the connecting step is a predetermined value of 1 MPa to 5 MPa, for example.
• the heating temperature in the connecting step is a temperature (for example, a predetermined value of 160 to 210 ° C.) at which the insulating particles are melted and the insulating adhesive composition is cured.
• the heat pressurizing time in the connecting step is a predetermined time of 3 to 10 seconds, for example.
• connection structure in which the glass substrate and the COF are anisotropically conductively connected is obtained.
• the obtained connection structure can exhibit excellent connection reliability and conduction reliability while maintaining good insulation reliability.
• an anisotropic conductive film is used as the anisotropic conductive adhesive member.
• the structure of the anisotropic conductive adhesive member is not limited to this, and may be, for example, a two-layer anisotropic conductive film in which an insulating adhesive layer is further laminated.
• a conductive adhesive paste in which conductive particles are contained in an insulating adhesive composition, and an insulating adhesive paste made of an insulating adhesive composition are applied in layers. By doing so, it is good also as two adhesive layers.
• the glass substrate is not limited to this, for example, a PDP substrate (PDP panel) ), A glass substrate constituting an organic EL substrate (organic EL panel) or the like.
• the case where a glass substrate is used as the substrate has been described.
• other substrates such as a rigid substrate and a flexible substrate may be used.
• COF is used as an electronic component
• other electronic components such as an IC chip and TAB may be used.
• the present invention is applied to FOG (Film On Glass) has been described.
• the present invention is applied to other mounting methods such as COG (Chip On Glass) and FOB (Film On Board) It can also be applied to.
• Silane coupling agent Product name: KBM-503, Shin-Etsu Chemical Co., Ltd. 1 part by mass (1 mass) %), Phosphoric acid acrylate (trade name: P-1M, manufactured by Kyoei Chemical Co., Ltd.) 1 part by weight (1% by weight), radical polymerization initiator (trade name: Perheki) C, manufactured by Nippon Oil & Fats Co., Ltd.)
• conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) have a particle density of 10,000. / Mm 2 was uniformly dispersed, and the conductive particle-containing composition was applied onto a release film by a bar coater and dried to prepare a circuit connection material having a thickness of 15 ⁇ m.
• an IZO coated glass substrate (all surface IZO coating, glass thickness 0.7 mm) is used for subsequent conduction resistance measurement
• an SiN coated glass substrate all surface SiN coating
• an anisotropic conductive film was slit to a width of 1.5 mm on the surface of the glass substrate on which the wiring electrodes were formed, and temporarily pasted on the glass substrate (temporary pasting step).
• the pressure surface of the head part heated to a low temperature of the pressure bonder was lightly pressed against the upper surface of the conductive particle-containing layer and pressed at a low pressure.
• the heating temperature was set to 70 ° C., which is a low temperature such that the insulating particles do not dissolve and the insulating adhesive composition flows but does not cure.
• the pressurization pressure in the temporary sticking process was 1 MPa.
• the heat-pressing time in the temporary sticking process was 2 seconds.
• the COF was disposed on the anisotropic conductive film so that the terminal electrode of the COF and the wiring electrode of the glass substrate were opposed to each other (arrangement step).
• the pressurizing pressure in the connection process was 4 MPa.
• the heating temperature in the connection process was 190 ° C. Further, the heat pressurizing time in the connecting step was 5 seconds.
• connection structure conductive particles were sandwiched between the wiring electrodes and the bumps, the adhesive composition was cured, and the glass substrate and the COF were electrically and mechanically connected to obtain a connection structure.
• Example 2 32 parts by mass of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• EB-600 radically polymerizable resin
• A-LEN-10 ethoxylated o-phenylphenol acrylate
• a circuit connection material was produced under the same conditions as in Example 1 except that the amount was 2 parts by mass.
• Example 3 31 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• a circuit connecting material was produced under the same conditions as in Example 1 except that the amount was 3 parts by mass.
• Example 4 30 parts by mass of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• radically polymerizable resin trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.
• ethoxylated o-phenylphenol acrylate trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.
• Example 5 29 parts by mass of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• radically polymerizable resin trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.
• ethoxylated o-phenylphenol acrylate trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.
• Example 6 19 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• a circuit connection material was produced under the same conditions as in Example 1 except that the amount was 15 parts by mass.
• Example 7 14 parts by mass of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• EB-600 radically polymerizable resin
• A-LEN-10 ethoxylated o-phenylphenol acrylate
• Example 8 9 parts by mass of radical polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, manufactured by Shin-Nakamura Chemical Co., Ltd.)
• a circuit connection material was produced under the same conditions as in Example 1 except that the amount was 25 parts by mass.
• ⁇ Comparative Example 1 Circuit connection under the same conditions as in Example 1 except that 34 parts by mass of a radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) is contained and no ethoxylated o-phenylphenol acrylate is contained. The material was made.
• a radically polymerizable resin trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.
• connection structures prepared in Examples 1 to 8 and Comparative Example 1 For the connection structures prepared in Examples 1 to 8 and Comparative Example 1, the initial resistance and the resistance after a TH test (Thermal Humidity Test) at a temperature of 85 ° C., a humidity of 85% RH, and 500 hours were measured. . The measurement was performed using a digital multimeter (digital multimeter 7561, manufactured by Yokogawa Electric Corporation) to measure the connection resistance when a current of 1 mA was passed by the four-terminal method.
• a TH test Thermal Humidity Test
• the measurement was performed using a digital multimeter (digital multimeter 7561, manufactured by Yokogawa Electric Corporation) to measure the connection resistance when a current of 1 mA was passed by the four-terminal method.
• connection structures of Examples 1 to 8 and Comparative Example 1 were pulled up to 90 degrees (Y-axis direction) at a peeling speed of 50 mm / min using a tensile tester (Tensilon, manufactured by Orientec Co., Ltd.), and adhesive strength (N / cm).
• Comparative Example 1 since no ethoxylated o-phenylphenol acrylate is contained, curing shrinkage during polymerization increases and internal stress after curing also increases, which causes nitridation of the adhesive layer and the substrate during connection. It is considered that bubbles were generated at the interface with the silicon film, resulting in a decrease in adhesive strength.

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• Engineering & Computer Science (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Manufacturing & Machinery (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Medicinal Chemistry (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Health & Medical Sciences (AREA)
• Polymers & Plastics (AREA)
• Wire Bonding (AREA)
• Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
• Combinations Of Printed Boards (AREA)
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• Non-Insulated Conductors (AREA)
• Adhesive Tapes (AREA)

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