WO2013033932A1 - 湿蚀刻装置及方法 - Google Patents

湿蚀刻装置及方法 Download PDF

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Publication number
WO2013033932A1
WO2013033932A1 PCT/CN2011/079877 CN2011079877W WO2013033932A1 WO 2013033932 A1 WO2013033932 A1 WO 2013033932A1 CN 2011079877 W CN2011079877 W CN 2011079877W WO 2013033932 A1 WO2013033932 A1 WO 2013033932A1
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Prior art keywords
wet etching
etching apparatus
substrate holder
fixing portion
vibration device
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PCT/CN2011/079877
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English (en)
French (fr)
Inventor
郑文达
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深圳市华星光电技术有限公司
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Application filed by 深圳市华星光电技术有限公司 filed Critical 深圳市华星光电技术有限公司
Priority to US13/379,657 priority Critical patent/US20130062015A1/en
Publication of WO2013033932A1 publication Critical patent/WO2013033932A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068—Apparatus for etching printed circuits

Definitions

  • the present invention relates to the field of etching technology, and in particular, to a wet etching apparatus and method.
  • Liquid crystal display (Liquid Crystal Display, LCD) is a flat panel display device that uses the characteristics of liquid crystal materials to display images (Flat Panel) Display, FPD), which has the advantages of light weight, low driving voltage and low power consumption compared to other display devices, has become the mainstream product in the entire consumer market.
  • FPD display images
  • the matrix process in the previous stage is to produce a thin film transistor (TFT) array substrate and a color filter (CF) substrate; the middle segment forming process combines the TFT substrate and the CF plate, and injects liquid crystal between the two and cuts according to the product size.
  • TFT thin film transistor
  • CF color filter
  • the panel; the rear-end modular process is a process of assembling the panel and the backlight module, the panel driving circuit, the outer frame, and the like.
  • a metal layer is deposited on a glass substrate and etched into a wire by wet etching.
  • wet etching technique generally, the characteristics of forward etch and side etch are included. The rates of the two etches will determine the lateral curvature of the wire after the etch is completed.
  • the lateral curvature is the side of the wire and the glass substrate. The angle between the angles, the smaller the angle, the greater the lateral curvature.
  • the lateral curvature of the wire affects the degree of film coverage of the next coating process.
  • the etched wire generally requires a large lateral curvature, so that the coverage of the next layer is better, that is, the angle between the side of the wire and the glass substrate is small, and the coverage of the next coating process is better.
  • the etching liquid After the etching liquid is sprayed onto the glass substrate, the etching liquid etches the metal layer deposited on the glass substrate, and the etching of the etching liquid is isotropic, that is, the etching rate of the etching liquid in various directions of the metal layer in contact therewith. Basically the same, in the prior art, the etching rate of the etching liquid to different positions of the metal layer cannot be realized, and the lateral curvature of the etched wire cannot be increased.
  • a primary object of the present invention is to provide a wet etching apparatus for a glass substrate, which is intended to increase the lateral curvature of the etched wire.
  • the invention provides a wet etching device for a glass substrate, comprising a transmission device, a bearing platform, a vibration device and a substrate fixing frame; wherein
  • the substrate holder is connected to the vibration device
  • the vibration device is fixed on the carrying platform to drive the substrate holder to reciprocate;
  • the carrier platform is disposed on the transmission and moves as the transmission moves.
  • the vibration device is a linear motor or a spiral motor.
  • the vibration device includes an electromagnetic device connected to the substrate holder, and the electromagnetic device generates magnetic or magnetic disappearance according to control of an external circuit, and drives the substrate holder to move toward or away from the electromagnetic device.
  • the plurality of vibrating devices are distributed on the carrying platform at intervals.
  • the substrate holder includes a linkage rod and a fixing portion, and the linkage rod is pivotally connected to a rotating shaft of the vibration device, and the fixing portion is coupled to the linkage rod.
  • the fixing portion is a suction cup or a clip.
  • the carrying platform is further provided with an air flotation device or a ball.
  • the transmission is a roller or a drive belt.
  • the invention also provides a wet etching method comprising the following steps:
  • the driving device is controlled to drive the substrate holder fixed on the carrying platform to reciprocate.
  • the method further includes:
  • the invention drives the vibrating device to drive the glass substrate to reciprocate in a direction to accelerate the etching speed, so that the etched material can increase the probability of colliding with the etching liquid, and the side etching rate can be accelerated, thereby increasing the etched glass.
  • the lateral curvature of the wires in the substrate thereby improving the bonding rate of the next coating process and reducing the abnormality of the coating of the glass substrate.
  • FIG. 1 is a schematic structural view of an embodiment of a wet etching apparatus of the present invention
  • FIG. 2 is a schematic top plan view of the glass substrate of FIG. 1;
  • FIG. 3 is a schematic structural view of another embodiment of the wet etching apparatus of the present invention.
  • FIG. 4 is a flow chart showing an embodiment of a wet etching method of the present invention.
  • the wet etching apparatus of the present invention includes a transmission device, a load bearing platform 120, a vibration device 130, and a substrate holder 140.
  • a glass substrate 2 is fixed to an upper portion of the substrate holder 140, and a bottom portion thereof is connected to the vibration device 130.
  • the vibration device 130 is fixed on the carrying platform 120 to drive the substrate holder 120 to reciprocate.
  • the transmission device is a roller 110.
  • the bearing platform 120 is disposed on the roller 110 and can move along with the movement of the roller 110.
  • the transmission device may also be a transmission belt, and the transmission belt drives the bearing platform 120 to move.
  • the vibration device 130 drives the substrate holder 140 to reciprocate, thereby driving the glass substrate 2 to reciprocate in a horizontal plane with respect to the loading platform 120 , the reciprocating motion
  • the direction coincides with the direction in which the etching speed of the glass substrate 2 is to be accelerated.
  • the vibration device 130 drives the glass substrate 2 to reciprocate in the x direction in the plane thereof; if the direction in which the etching speed is to be accelerated is the glass substrate 2 In the y direction, the vibrating device 130 drives the glass substrate 2 to reciprocate in the y direction in its plane.
  • the direction in which the etching speed is to be accelerated may be other directions, and the vibrating device 130 drives the glass substrate 2 to reciprocate in a plane thereof in a direction in which the etching speed is to be accelerated.
  • the invention drives the glass substrate 2 to reciprocate in the direction in which the etching speed is to be accelerated by the vibration device 130, so that the material to be etched can increase the probability of collision with the etching liquid, and the side etching rate can be accelerated, thereby increasing the etching rate.
  • the lateral curvature of the wires in the glass substrate 2 further improves the bonding ratio of the next plating process, and reduces the abnormality of the plating of the glass substrate 2.
  • the vibration device 130 may include a motor, the motor is provided with a rotating shaft (not shown), and the substrate holder 140 includes a linkage rod 141 and a fixing portion 142.
  • the linkage rod 141 is pivotally connected to the rotating shaft, and one end of the fixing portion 142 is The interlocking rod 141 is connected, and the other end of the fixing portion fixes the glass substrate 2. Therefore, the substrate holder 140 can be driven to reciprocate by the rotation of the motor, thereby driving the glass substrate 2 to reciprocate.
  • the motor can be a linear motor or a spiral motor.
  • the fixing portion 142 may be a suction cup, and the glass substrate 2 may be supported and fixed, or may be a clip, and fixed from the side surface of the glass substrate 2.
  • the above-mentioned vibration device 130 may also include an electromagnetic device, and the electromagnetic device is controlled by an external circuit.
  • the electromagnetic device and the interlocking rod 141 are connected by an elastic member 143 for fixing the glass substrate 2.
  • the electromagnetic device can generate magnetism by the control of the external circuit, and the driving linkage rod 141 presses the elastic member 143 to move toward the electromagnetic device.
  • the elastic member 143 will return to the elasticity.
  • the drive interlocking lever 141 is moved in a direction away from the electromagnetic device, and therefore, the reciprocating motion of the glass substrate 2 can be realized by the control of the external circuit.
  • the above vibration device 130 may be one, and is disposed only at a center position of the carrying platform 120.
  • the vibrating device 130 may also be two, disposed at opposite ends of the carrying platform 120.
  • the vibrating device 130 may also be four, two of which are disposed at one opposite end of the carrying platform, and the other two are disposed at the other opposite ends of the carrying platform.
  • a plurality of vibration devices 130 may be disposed at different positions.
  • the plurality of vibrating devices are uniformly disposed at opposite ends of the carrying platform 120.
  • An air floating device (not shown) is further disposed on the carrying platform 120.
  • the air floating device is disposed on the carrying platform 120, and the air floating device blows gas to the glass substrate 2 to reduce the movement resistance of the glass substrate 2;
  • the gas blown by the air flotation device can support the glass rod substrate to prevent its central position from sinking.
  • a plurality of balls may be disposed on the carrying platform 120, and the glass substrate 2 is disposed on the balls, and the effect of supporting the glass substrate 2 and reducing the motion resistance thereof can also be achieved.
  • FIG. 4 is a flow chart showing an embodiment of a wet etching method of the present invention.
  • the wet etching method of the present invention comprises the following steps:
  • step S101 the glass substrate is fixed on the substrate holder; the glass substrate 2 is fixed to the substrate holder 140 by the fixing portion 142.
  • Step S102 controlling the movement of the transmission device 110 to drive the loading platform 120 disposed thereon to move;
  • the control transmission 110 is moved such that the carrier platform 120 disposed on the transmission will move with the movement of the transmission 110.
  • Step S103 the vibration device 130 is controlled to operate, and the substrate holder fixed on the carrying platform 120 is driven to reciprocate.
  • the method further includes the step of starting the air flotation device.
  • the air floating device is disposed on the carrying platform 120. During the process of the vibration device 130 driving the substrate fixing frame to reciprocate, the air floating device is activated to support the glass substrate 2 and reduce the movement resistance thereof.
  • the present invention controls the operation of the vibration device 130 to drive the glass substrate 2 to reciprocate in a direction in which the etching speed is to be accelerated, so that the material to be etched can increase the probability of collision with the etching liquid, thereby accelerating the side etching rate thereof.
  • the lateral curvature of the wires in the glass substrate 2 after etching can be increased, thereby improving the bonding rate of the next plating process and reducing the abnormality of the plating of the glass substrate 2.

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Abstract

一种玻璃基板（2）的湿蚀刻装置及方法，该湿蚀刻装置包括传动装置、承载平台（120）、振动装置（130）及基板固定架（140），基板固定架（140）上部固定有玻璃基板（2），底部与振动装置（130）连接；振动装置（130）固定在承载平台（120）上，驱动基板固定架（140）往复运动；承载平台（120）设置在传动装置上，随着传动装置的运动而移动。通过控制振动装置（130）驱动玻璃基板（2）在欲加快蚀刻速度的方向上进行往复运动，从而可以使得被蚀刻的材料增加与蚀刻液碰撞的机率，加快其侧蚀刻率，由此可增大蚀刻后玻璃基板（2）中导线的侧向曲度，进而提高下一道镀膜制程的贴合率，减少玻璃基板（2）的镀膜异常。

Description

湿蚀刻装置及方法
技术领域
本发明涉及蚀刻技术领域，尤其涉及一种湿蚀刻装置及方法。
背景技术
液晶显示器（Liquid Crystal Display，LCD）是利用液晶材料的特性来显示图像的一种平板显示装置（Flat Panel Display，FPD），其相较于其他显示装置而言具轻薄、低驱动电压及低功耗等优点，已经成为整个消费市场上的主流产品。现今液晶显示面板的制作过程中，大致可分为前段矩阵（Array）工艺、中段成盒（Cell）工艺及后段模块化（Module）工艺。前段的矩阵工艺为生产薄膜式晶体管（TFT）阵列基板及彩色滤光片（CF）基板；中段成盒工艺则将TFT基板与CF板组合，并两者之间注入液晶并切割符合产品尺寸的面板；后段模块化工艺则为组装的面板与背光模块、面板驱动电路、外框等的工艺。
在矩阵工艺中，包括在玻璃基板上沉积金属层，并通过湿蚀刻的方式将其蚀刻成导线。在湿蚀刻技术中，一般包括正向向下蚀刻与侧蚀刻两种特性，这两种蚀刻的速率将决定蚀刻完成后导线的侧向曲度，侧向曲度为导线的侧面与玻璃基板之间的夹角，夹角越小，侧向曲度越大。而导线的侧向曲度会影响下一道镀膜制程的膜覆盖贴合程度。蚀刻后的导线一般要求侧向曲度大，这样下一道的覆盖率会比较好，即导线的侧面与玻璃基板的夹角小，下一道镀膜制程的覆盖率比较好。
但是，在蚀刻液喷洒到玻璃基板上后，蚀刻液对玻璃基板上沉积的金属层进行蚀刻，由于蚀刻液的蚀刻为等向性，即蚀刻液对与之接触的金属层各个方向的蚀刻率基本相同，因此现有技术中无法实现蚀刻液对金属层不同位置的蚀刻率不同，也就无法增大蚀刻后的导线的侧向曲度。
发明内容
本发明的主要目的是提供一种玻璃基板的湿蚀刻装置，旨在增大蚀刻后的导线的侧向曲度。
本发明提供了一种玻璃基板的湿蚀刻装置，包括传动装置、承载平台、振动装置及基板固定架；其中，
所述基板固定架与所述振动装置连接；
所述振动装置固定在所述承载平台上，驱动所述基板固定架往复运动；
所述承载平台设置在所述传动装置上，随着所述传动装置的运动而移动。
优选地，所述振动装置为线性马达或者螺旋式马达。
优选地，所述振动装置包括电磁装置，其与所述基板固定架连接，所述电磁装置根据外部电路的控制而产生磁性或磁性消失，驱动基板固定架向靠近或者远离电磁装置的方向运动。
优选地，所述振动装置为多个，间隔分布在所述承载平台上。
优选地，所述基板固定架包括连动杆及固定部，所述连动杆与振动装置的转轴枢接，所述固定部与连动杆连接。
优选地，所述固定部为吸盘或夹子。
优选地，所述承载平台上还设有气浮装置或滚珠。
优选地，所述传动装置为滚轮或传动皮带。
本发明还提供了一种湿蚀刻方法，包括以下步骤：
将玻璃基板固定在基板固定架上；
控制传动装置运动，带动设置于其上的承载平台移动；
控制驱动装置工作，驱动固定在承载平台上的基板固定架进行往复运动。
优选地，执行控制驱动装置工作的步骤的同时，还包括：
启动气浮装置。
本发明通过控制振动装置驱动玻璃基板在欲加快蚀刻速度的方向上进行往复运动，从而可以使得被蚀刻的材料增加与蚀刻液碰撞的机率，加快其侧蚀刻率，由此可增大蚀刻后玻璃基板中导线的侧向曲度，进而提高下一道镀膜制程的贴合率，减少玻璃基板的镀膜异常。
附图说明
图1是本发明湿蚀刻装置一实施例的结构示意图；
图2是图1中玻璃基板的俯视结构示意图；
图3是本发明湿蚀刻装置另一实施例的结构示意图；
图4是本发明湿蚀刻方法一实施例的流程示意图。
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说明。
具体实施方式
以下将结合附图及实施例，对实现发明目的的技术方案作详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。
参照图1，本发明湿蚀刻装置包括传动装置、承载平台120、振动装置130及基板固定架140。该基板固定架140的上部固定有玻璃基板2，其底部与振动装置130连接。振动装置130固定在所述承载平台120上，驱动基板固定架120往复运动。在本实施例中，所述传动装置为滚轮110，该承载平台120设置在滚轮110上，可随着滚轮110的运动而移动。当然，在其他实施方式中，所述传动装置也可为传动皮带，由传动皮带带动承载平台120移动。
在滚轮110带动承载平台120沿图1中箭头方向移动的同时，振动装置130驱动基板固定架140做往复运动，从而带动玻璃基板2相对于承载平台120在水平面内做往复运动，该往复运动的方向与欲加速玻璃基板2的蚀刻速度的方向一致。如图2所示，如果欲加快蚀刻速度的方向为玻璃基板2的x方向，则振动装置130驱动玻璃基板2在其平面内沿x方向往复运动；如果欲加快蚀刻速度的方向为玻璃基板2的y方向，则振动装置130驱动玻璃基板2在其平面内沿y方向往复运动。当然，欲加快蚀刻速度的方向也可以为其他方向，则振动装置130驱动玻璃基板2在其平面内沿欲加快蚀刻速度的方向往复运动。
本发明通过振动装置130驱动玻璃基板2在欲加快蚀刻速度的方向上进行往复运动，从而可以使得被蚀刻的材料增加与蚀刻液碰撞的机率，加快其侧蚀刻率，由此可增大蚀刻后玻璃基板2中导线的侧向曲度，进而提高下一道镀膜制程的贴合率，减少玻璃基板2的镀膜异常。
上述振动装置130可以包括马达，该马达设有一转轴（图未示），而基板固定架140则包括连动杆141及固定部142，连动杆141与转轴枢接，固定部142的一端与连动杆141连接，固定部的另一端固定玻璃基板2。因此，通过马达的转动可以驱动基板固定架140往复运动，从而带动玻璃基板2做往复运动。该马达可以是线性马达，也可以是螺旋式马达。该固定部142可以为吸盘，支撑并固定玻璃基板2，也可以为夹子，从玻璃基板2的侧面将其固定。
如图3所示，上述振动装置130也可以包括电磁装置，由外部电路控制电磁装置进行工作，电磁装置与连动杆141通过弹性元件143连接，固定部142用于固定玻璃基板2。而且电磁装置可以通过外部电路的控制而产生磁性，驱动连动杆141挤压弹性元件143向靠近电磁装置的方向运动，当电磁装置通过外部电路的控制而磁性消失后，弹性元件143将恢复弹性而驱动连动杆141向远离电磁装置的方向运动，因此，通过外部电路的控制可以实现玻璃基板2的往复运动。
上述振动装置130可以为一个，仅设置在承载平台120的中心位置。该振动装置130也可以为两个，设置在承载平台120的相对的两端。该振动装置130也可以为4个，其中两个设置在承载平台的一相对两端，另外两个设置在承载平台的另一相对两端。当然，为了可以更好地控制玻璃基板2的往复运动，可以在不同的位置设置多个振动装置130。例如，振动装置为多个，均匀设置在承载平台120的相对两端。
上述承载平台120上还设置有气浮装置（图未示），该气浮装置设置在承载平台120上，该气浮装置向玻璃基板2的吹出气体，用于减少玻璃基板2的运动阻力；此外，对于大尺寸玻璃基板，气浮装置吹出的气体可支撑玻璃棒基板为避免其中央位置下陷。当然，在其他实施方式中，也可在承载平台120上设置多个滚珠，玻璃基板2设置在滚珠上，同样能够达到支撑玻璃基板2并减小其运动阻力的效果。
图4是本发明湿蚀刻方法一实施例的流程示意图。
参照图4，本发明湿蚀刻方法包括以下步骤：
步骤S101、将玻璃基板固定在基板固定架上；通过固定部142将玻璃基板2固定在基板固定架140上。
步骤S102、控制传动装置110运动，带动设置于其上的承载平台120移动；
控制传动装置110运动，从而设置于传动装置上的承载平台120将随着传动装置110的运动而移动。
步骤S103、控制振动装置130工作，驱动固定在承载平台120上的基板固定架进行往复运动。
执行上述步骤S103的同时，还包括步骤：启动气浮装置。该气浮装置设置在承载平台120上，在振动装置130驱动基板固定架做往复运动的过程中，启动气浮装置，用于支撑玻璃基板2并减少其运动阻力。
本发明通过控制振动装置130的工作，从而驱动玻璃基板2在欲加快蚀刻速度的方向上进行往复运动，从而可以使得被蚀刻的材料增加与蚀刻液碰撞的机率，加快其侧蚀刻率，由此可增大蚀刻后玻璃基板2中导线的侧向曲度，进而提高下一道镀膜制程的贴合率，减少玻璃基板2的镀膜异常。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (18)

  1. 一种湿蚀刻装置，其特征在于，包括传动装置、承载平台、振动装置及基板固定架；
    所述基板固定架与所述振动装置连接；
    所述振动装置固定在所述承载平台上，驱动所述基板固定架往复运动；
    所述承载平台设置在所述传动装置上，随着所述传动装置的运动而移动。
  2. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述振动装置为线性马达或者螺旋式马达。
  3. 根据权利要求2所述的湿蚀刻装置，其特征在于，所述振动装置为多个，间隔分布在所述承载平台上。
  4. 根据权利要求2所述的湿蚀刻装置，其特征在于，所述基板固定架包括连动杆及固定部，所述连动杆与振动装置的转轴枢接，所述固定部与连动杆连接。
  5. 根据权利要求4所述的湿蚀刻装置，其特征在于，所述固定部为吸盘或夹子。
  6. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述振动装置包括电磁装置，其与所述基板固定架连接，所述电磁装置根据外部电路的控制而产生磁性或磁性消失，驱动基板固定架向靠近或者远离电磁装置的方向运动。
  7. 根据权利要求6所述的湿蚀刻装置，其特征在于，所述振动装置为多个，间隔分布在所述承载平台上。
  8. 根据权利要求6所述的湿蚀刻装置，其特征在于，所述基板固定架包括连动杆及固定部，所述连动杆与振动装置的转轴枢接，所述固定部与连动杆连接。
  9. 根据权利要求8所述的湿蚀刻装置，其特征在于，所述固定部为吸盘或夹子。
  10. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述振动装置为多个，间隔分布在所述承载平台上。
  11. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述基板固定架包括连动杆及固定部，所述连动杆与振动装置的转轴枢接，所述固定部与连动杆连接。
  12. 根据权利要求11所述的湿蚀刻装置，其特征在于，所述固定部为吸盘或夹子。
  13. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述承载平台上还设有气浮装置。
  14. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述承载平台上还设有滚珠。
  15. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述传动装置为滚轮。
  16. 根据权利要求1所述的湿蚀刻装置，其特征在于，所述传动装置为传动皮带。
  17. 一种湿蚀刻方法，其特征在于，包括以下步骤：
    将玻璃基板固定在基板固定架上；
    控制传动装置运动，带动设置于其上的承载平台移动；
    控制驱动装置工作，驱动固定在承载平台上的基板固定架进行往复运动。
  18. 根据权利要求17所述的湿蚀刻方法，其特征在于，执行控制驱动装置工作的步骤的同时，还包括：
    启动气浮装置。
PCT/CN2011/079877 2011-09-09 2011-09-20 湿蚀刻装置及方法 WO2013033932A1 (zh)

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