WO2013011649A1 - Démultiplexeur - Google Patents

Démultiplexeur Download PDF

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Publication number
WO2013011649A1
WO2013011649A1 PCT/JP2012/004401 JP2012004401W WO2013011649A1 WO 2013011649 A1 WO2013011649 A1 WO 2013011649A1 JP 2012004401 W JP2012004401 W JP 2012004401W WO 2013011649 A1 WO2013011649 A1 WO 2013011649A1
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WIPO (PCT)
Prior art keywords
electrode
filter element
ground
transmission
terminal
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PCT/JP2012/004401
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English (en)
Japanese (ja)
Inventor
竹村　忠治
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株式会社村田製作所
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Publication of WO2013011649A1 publication Critical patent/WO2013011649A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72—Networks using surface acoustic waves
    • H03H9/725—Duplexers
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576—Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices

Definitions

  • the present invention relates to a duplexer including a first filter element and a second filter element having different pass bands.
  • the conventional branching circuit 500 shown in FIG. 10 described in Patent Document 1 includes a low-frequency filter 501 and a high-frequency filter 502.
  • the low-frequency filter 501 is formed by a transmission line Lf1 connected to the common terminal 503, a series resonance circuit including a transmission line Lf2 connected between the low-frequency terminal 504 and the ground, and a capacitor Cf1.
  • the high frequency filter 502 includes a capacitor Cf2 connected to the common terminal 503, a capacitor Cf3 connected between the capacitor Cf2 and the high frequency terminal 505, and a connection point between the capacitors Cf2 and Cf3 and the ground. It is formed by a direct resonance circuit composed of a connected transmission line Lf3 and a capacitor Cf4.
  • the transmission lines Lf1 to Lf3 and the capacitors Cf1 to Cf4 forming the low frequency filter 501 and the high frequency filter 502 are built in the laminated substrate as electrode patterns, but the duplexer 500 is further downsized. Therefore, the following problems may occur when the electrode patterns are arranged close to each other and incorporated in the multilayer substrate. That is, the circuit pattern (transmission line Lf3, capacitors Cf2 to Cf4) forming the circuit element (transmission line Lf3, capacitors Cf2 to Cf4) forming the high frequency filter 502 is configured. If the electrode patterns to be arranged are opposed to each other with the dielectric layer of the laminated substrate interposed therebetween, parasitic capacitance may be generated between the two electrode patterns, and the two electrode patterns may be coupled electromagnetically.
  • the electrode pattern constituting the transmission line Lf1 forming the low frequency filter 501 and the electrode pattern constituting the capacitor Cf2 forming the high frequency filter 501 are electromagnetic It arrange
  • the electrode patterns that form both filters 501 and 502 are arranged so as not to overlap in the stacking direction of the stacked substrate, the generation of parasitic capacitance between the two electrode patterns is suppressed. It is possible to prevent the two electrode patterns from being electromagnetically coupled, to reduce the size of the duplexer 500, and to improve the isolation characteristics between the filters 501 and 502.
  • a transmission filter element 601 and a reception filter element 602 having different pass bands are mounted on a mounting substrate 603, and the transmission filter element 601 and the reception filter element 602 are mounted.
  • a duplexer 600 formed by being protected by a resin mold layer 604 is also known.
  • the wiring electrode 606 connected to the transmission terminal 605 that is the input side of the transmission filter element 601 the wiring electrode 608 that is connected to the common terminal 607 that is the output side, and the output side of the reception filter element 602.
  • a wiring electrode 610 connected to the receiving terminal 609, a ground electrode 612 connected to the ground terminal 611 of the receiving filter element 602, and the like are built in the mounting substrate 603.
  • the duplexer 600 As described above, parasitic capacitance is generated between the wiring electrodes 606, 608, 610, and the wiring electrodes 606, 608, 610 are electromagnetically coupled, thereby transmitting the filter element 601.
  • the wiring electrodes 606, 608, and 610 for signal transmission are arranged so as not to overlap in the stacking direction of the stacked substrate 603.
  • a part of the configuration such as the wiring electrode is omitted for easy explanation.
  • a grounding ground electrode having a large-area flat pattern shape is provided on the multilayer substrate or the mounting substrate 603. ing.
  • a ground electrode for grounding having a large-area flat pattern shape in a laminated substrate or a mounting substrate, the following problems may occur.
  • the ground electrode 612 having a flat pattern shape with a large area is arranged on the mounting substrate 603 so as to overlap the signal transmission wiring electrodes 608 and 610 in plan view. . Therefore, as shown in a region surrounded by a dotted line in FIG. 11, parasitic capacitance is generated between the wiring electrode 608 and the ground electrode 612 facing each other with the dielectric layer of the mounting substrate 603 interposed therebetween, and the wiring electrode 608 is formed.
  • the ground electrode 612 is electromagnetically coupled, a signal transmitted by the wiring electrode 608 may leak to the ground electrode 612.
  • the ground electrode 612 is ideal due to a parasitic inductance generated in the via conductor 612a connected to the ground electrode 612 and the like. There is a possibility that it is not grounded. In this case, a signal leaking from the wiring electrode 608 to the ground electrode 612 is transmitted to the wiring electrode 610 connected to the reception terminal 609 of the reception filter element 602 via the ground electrode 612, whereby the transmission filter element 601 and the reception filter 601 are received. There is a possibility that the isolation characteristics between the filter elements 602 may be deteriorated, and improvement of the technique has been demanded.
  • the present invention has been made in view of the above-described problems, and an object thereof is to provide a technique capable of improving the isolation characteristics between the first and second filter elements included in the duplexer. .
  • a duplexer includes a first filter element and a second filter element having different pass bands, and a mounting substrate on which the first and second filter elements are mounted. And first and second wiring electrodes for signal transmission and first and second ground electrodes for grounding provided respectively for the first and second filter elements on the mounting substrate, The first ground electrode connected to the ground terminal of the first filter element and the second wiring electrode connected to the signal terminal of the second filter element do not overlap in a plan view. It is characterized by being arranged (Claim 1).
  • first ground electrode and the second ground electrode connected to the ground terminal of the second filter element are disposed in an electrically insulated state ( Claim 2).
  • the second filter element includes a transmission filter for a transmission signal, and the second filter element includes a transmission terminal connected to the input side of the transmission filter and a common terminal connected to the output side.
  • the second wiring electrode is a transmission electrode connected to the transmission terminal and a common electrode connected to the common terminal of the second filter element (Claim 3).
  • the second wiring electrode further includes a pattern electrode that forms a filter circuit connected to the transmission terminal (claim 4).
  • the first wiring electrode is connected to a signal terminal of the first filter element, the first filter element includes a reception signal reception filter, and the first filter element includes: A common terminal connected to the input side of the reception filter and a reception terminal connected to the output side are provided as the signal terminals of the first filter element, and the first wiring electrode is the first wiring electrode A common electrode connected to a common terminal of the filter element and a reception electrode connected to the reception terminal, wherein the common electrode of the first wiring electrode and the common electrode of the second wiring electrode are electrically And the first ground electrode is disposed between the transmission electrode and the common electrode of each of the first and second wiring electrodes and the reception electrode in plan view.
  • the first ground electrode leaks a transmission signal for communication with a large output that transmits the common electrode of each of the transmission electrode and the first and second wiring electrodes to the reception electrode. Therefore, the isolation characteristic between the first and second filter elements can be further improved.
  • the first filter element is provided with a plurality of ground terminals, and the first ground electrode is a flat plate disposed so as to overlap the ground terminals of the first filter element in plan view. It has the pattern shape of (6).
  • the mounting board further includes a plurality of mounting electrodes provided on the back surface of the mounting substrate, and some of the mounting electrodes connected to the first ground electrode are larger than the other mounting electrodes.
  • the first ground electrode and the part of the mounting electrodes have an area and are electrically connected by a plurality of via conductors (Claim 7). For example, by disposing a part of the mounting electrode having a large area between the plurality of other mounting electrodes connected to the first and second wiring electrodes, the electric power between the plurality of other mounting electrodes can be reduced. Interference can be suppressed.
  • the first ground electrode connected to the ground terminal of the first filter element and the second wiring electrode connected to the signal terminal of the second filter element overlap in plan view. Therefore, the generation of parasitic capacitance between the first ground electrode and the second wiring electrode is suppressed, and the first ground electrode and the second wiring electrode are electromagnetically coupled. Can be prevented. Therefore, the signal transmitted through the second wiring electrode is prevented from leaking to the first ground electrode, and the signal transmitted through the second wiring electrode is transmitted to the first wiring electrode via the first ground electrode. Since transmission can be prevented, the isolation characteristics between the first and second filter elements provided in the duplexer can be improved.
  • FIG. 1st Embodiment of the splitter of this invention It is a block diagram which shows the internal structure of the splitter of FIG. It is a top view which shows an example of the electrode shape of the board
  • FIG. 1 is a diagram showing a first embodiment of a duplexer according to the present invention.
  • FIG. 2 is a block diagram showing the internal configuration of the duplexer of FIG.
  • FIG. 3 is a plan view showing an example of the electrode shape of the mounting substrate.
  • FIGS. 3A to 3C show the electrode shapes of the dielectric layers of the mounting substrate, respectively.
  • FIG. 4 is a view showing a state in which the electrode shapes in the respective dielectric layers of the mounting substrate shown in FIG.
  • the duplexer 1 is used to separate a transmission signal and a reception signal having different frequencies, and a circuit such as a high-frequency antenna switch module mounted on a mother board or the like included in a communication portable terminal such as a mobile phone or a portable information terminal. Implemented in the module. Then, by mounting the circuit module on which the duplexer 1 is mounted on a mother board or the like, various signal lines such as an antenna line ANT, a ground line GND, a reception signal line Rx, and a transmission signal line Tx provided on the mother board or the like. The power supply line and the duplexer 1 are connected, and transmission / reception signals are input / output between the mother board and the duplexer 1.
  • the duplexer 1 includes a reception filter element 2 (corresponding to a “first filter element” of the present invention) and a transmission filter element 3 (corresponding to the present invention) having different high-frequency signal passbands.
  • a reception filter element 2 corresponds to a “first filter element” of the present invention
  • a transmission filter element 3 correspond to the present invention having different high-frequency signal passbands.
  • LPF low-pass filter
  • the reception filter element 2 and the transmission filter element 3 include a reception filter for reception signals and a transmission filter for transmission signals, respectively.
  • the reception filter element 2 and the transmission filter element 3 are each formed by a SAW (surface acoustic wave) filter element.
  • the reception filter element 2 has a balanced output type reception filter. .
  • the reception filter element 2 is provided with a common terminal 21 (antenna terminal) connected to the input side of the reception filter and a reception terminal 22 connected to the output side as signal terminals, and the ground terminal 23 is a ground terminal. It is provided as.
  • the transmission filter element 3 is provided with a transmission terminal 31 connected to the input side of the transmission filter and a common terminal 32 (antenna terminal) connected to the output side as a signal terminal, and a ground terminal 33 is a ground terminal. It is provided as.
  • the reception filter element 2 and the transmission filter element 3 included in the duplexer 1 are formed by SAW filter elements.
  • SAW filter elements a plurality of resonators and coils are connected.
  • the reception filter and the transmission filter may be formed, and if the transmission signal and the reception signal having different frequencies can be reliably demultiplexed, the reception filter element 2 and the transmission filter element 3 may be a dielectric filter, Any device such as a BAW filter element may be used.
  • the LPF 4 is connected to the transmission terminal 31 of the transmission filter element 3 and filters the transmission signal input from the transmission signal line Tx. That is, the output of the transmission signal input to the transmission filter element 3 via the transmission signal line Tx is amplified by a power amplifier for communication, and second-order or higher harmonic components included in the transmission signal are also amplified by the power amplifier. It is amplified by. Accordingly, the LPF 4 attenuates second-order or higher harmonic components included in the transmission signal amplified by the power amplifier.
  • the mounting substrate 5 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers 51 to 53 formed of ceramic green sheets.
  • the ceramic green sheets forming the respective dielectric layers 51 to 53 are obtained by forming a sheet in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed by a molding machine. It is formed so that it can be fired at a low temperature of about 1000 ° C. at a so-called low temperature. Then, via holes are formed in the ceramic green sheet cut into a predetermined shape by laser processing or the like, and the formed via holes are filled with a conductive paste containing Ag, Cu, etc. Via conductors are formed, and various electrode patterns are formed by printing with a conductor paste to form the dielectric layers 51 to 53.
  • via conductors and electrode patterns are appropriately formed in each of the dielectric layers 51 to 53, so that a signal transmission second layer provided for the reception filter element 2 and the transmission filter element 3 respectively on the mounting substrate 5 is provided.
  • the first and second wiring electrodes 7 and 8 and the first and second ground electrodes 9 and 10 are built in, and a plurality of mounting electrodes 11 are formed on the back surface of the mounting substrate 5.
  • electrode patterns and via conductors are appropriately provided in the dielectric layers 51 to 53, and the first and second wiring electrodes 7, 8, the first and second ground electrodes 9, 10 and the mounting electrode 11 are provided.
  • the reception filter element 2 and the transmission filter element 3 mounted on the mounting substrate 5 and the mounting electrode 11 are electrically connected to each other.
  • circuit elements such as capacitors and coils are formed by the electrode patterns and via conductors formed in the respective dielectric layers 51 to 53, and LPF 4 and the like are formed by the formed circuit elements such as capacitors and coils.
  • a filter circuit, a matching circuit, or the like may be formed.
  • the first wiring electrode 7 for signal transmission of the reception filter element 2 has a common electrode 71 connected to the common terminal 21 of the reception filter element 2 and a reception electrode 72 connected to the reception terminal 22.
  • the second wiring electrode 8 for signal transmission of the transmission filter element 3 is connected to the transmission electrode 81 connected to the transmission terminal 31 of the transmission filter element 3, the common electrode 82 connected to the common terminal 32, and the transmission terminal 31.
  • the pattern electrode 83 for forming the LPF 4 is provided.
  • a coil is formed by the pattern electrode 83, and the LPF 4 is formed by a capacitor (not shown) built in the transmission filter element 3 and a coil formed by the pattern electrode 83.
  • the common electrode 71 of the first wiring electrode 7 and the common electrode 82 of the second wiring electrode 7 formed on the dielectric layer 51 are electrically formed by being formed with the same electrode pattern. (See FIG. 3A).
  • the reception filter element 2 and the transmission filter element 3 are provided with a plurality of ground terminals 23 and 33, respectively.
  • the ground terminals 23 and 33 are respectively connected to the first and second ground electrodes 9 and 10, respectively. Grounded.
  • the mounting electrode 11 includes a mounting common electrode 11a, a mounting receiving electrode 11b, a mounting transmitting electrode 11c, mounting ground electrodes 11d and 11e, and a mounting unconnected electrode 11f (see FIG. 3 (c)).
  • the mounting common electrode 11a is connected to the common terminals 21 and 32 of the reception filter element 2 and the transmission filter element 3 via the common electrodes 71 and 82, respectively.
  • the mounting receiving electrode 11 b is connected to the receiving terminal 22 of the receiving filter element 2 via the receiving electrode 72.
  • the mounting transmission electrode 11 c is connected to the transmission terminal 31 of the transmission filter element 3 via the transmission electrode 81 and the pattern electrode 83.
  • the mounting ground electrode 11d is connected to the ground terminal 23 of the reception filter element 2 via the first ground electrode 9, and the mounting ground electrode 11e is connected to the ground terminal 33 of the transmission filter element 3 and the second ground. It is connected via the electrode 10. Further, the mounting unconnected electrode 11f is provided on the back surface of the mounting substrate 5 in order to improve mounting strength when the duplexer 1 is mounted on the module substrate of the circuit module.
  • the pattern electrode 84 that connects the second ground electrode 10 to which the ground terminal 33 of the transmission filter element 3 is connected and the mounting ground electrode 11 e is the second wiring electrode 8. It is provided on the dielectric layer 52 (see FIG. 3B).
  • a coil is formed by forming a coil with the pattern electrode 84, and an attenuation pole that improves the attenuation characteristic of the transmission filter of the transmission filter element 3 is formed by the resonator configured with the pattern electrode 84.
  • the electrodes formed by the same electrode pattern formed in each of the dielectric layers 51 to 53 are a plurality of electrodes corresponding to the respective electrodes formed by the same electrode pattern. Reference numerals are assigned to the same electrode pattern. Further, in FIG. 3, only the first and second wiring electrodes 7 and 8, the first and second ground electrodes 9 and 10 and the mounting electrode 11 and main via conductors are shown for easy explanation. The other electrodes and via conductors are not shown. Further, only the arrangement position of the via conductor is indicated by a circle.
  • the mounting electrode 11 is actually provided on the back surface of the dielectric layer 53, but in FIG. 3C, it is provided on the dielectric layer 53.
  • the mounting positions of the mounting electrodes 11 in plan view are indicated by solid lines. Note that FIGS. 5 to 8 used in the following description are also illustrated in the same manner as in FIG.
  • the first dielectric layer 51 which is the mounting surface of the mounting substrate 5, is connected to the common terminal 21 when the reception filter element 2 is mounted.
  • a common electrode 71, a receiving electrode 72 to which the receiving terminal 22 is connected, and a first ground electrode 9 to which the ground terminal 23 is connected are formed.
  • the first ground electrode 9 has a flat pattern shape formed by cutting out the center portion of the substantially convex base portion, and the convex portion on the right side of the dielectric layer 51 in FIG. Are arranged so as to overlap each ground terminal 23 of the reception filter element 2 in plan view.
  • the plurality of ground terminals 23 of the reception filter element 2 are connected to the position G1 of the first ground electrode 9, respectively.
  • the common electrode 71 has a crank-shaped pattern shape, and is disposed substantially below the center of the dielectric layer 51 of FIG. 3A. In a plan view, the crank-shaped piece portion is a first ground electrode. It is arrange
  • the common terminal 21 of the reception filter element 2 is connected to the position A1 of the common electrode 71.
  • the receiving electrode 72 has a rectangular shape with a tongue-shaped portion, and two receiving electrodes 72 are arranged on the right side of the dielectric layer 51 in FIG. It is arrange
  • the two reception terminals 22 of the reception filter element 2 are connected to the position R1 of the reception electrode 72, respectively.
  • a second ground electrode 10 to which 82 and the ground terminal 33 are connected is formed.
  • Three second ground electrodes 10 are disposed on the dielectric layer 51 in FIG. 3A, and one second ground electrode 10 is disposed on the upper side of the approximate center of the dielectric layer 51 in FIG. A ground electrode 10 is disposed, and two second ground electrodes 10 are disposed vertically on the left side of the dielectric layer 51.
  • the plurality of ground terminals 33 of the transmission filter element 3 are connected to the position G2 of the second ground electrode 10, respectively. Further, an unconnected terminal (not shown) of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10.
  • the transmission electrode 81 has a shape in which a rectangular line-shaped extending portion is provided, and is disposed in the upper left portion of the dielectric layer 51 in FIG. 3A.
  • the transmission terminal 31 of the transmission filter element 3 is , Connected to the position T2 of the transmission electrode 81.
  • the common electrode 81 is formed by the same electrode pattern as the common electrode 71, and the common terminal 32 of the transmission filter element 3 is connected to the position A ⁇ b> 2 of the common electrode 81.
  • the dielectric layer 52 disposed below the dielectric layer 51 has the same electrode pattern having a substantially L-shaped flat pattern arranged on the right side.
  • First and second ground electrodes 9 and 10 are formed.
  • the first and second ground electrodes 9 and 10 of the dielectric layer 52 are arranged so as to substantially overlap with the first and second ground electrodes 9 and 10 to which the dielectric layer 51 is hatched. ing.
  • the first and second ground electrodes 9, 10 of the dielectric layer 52 and the first and second ground electrodes 9, 10 to which the dielectric layer 51 is hatched are electrically connected by via conductors. ing.
  • the first and second ground electrodes 9 and 10 disposed on the dielectric layers 51 and 52 are formed as large as possible to be connected to the first and second ground electrodes 9 and 10.
  • the ground state of the ground terminal 23 of the second filter element 2 can be made favorable.
  • two rod-shaped receiving electrodes 72 are arranged vertically on the right side of the dielectric layer 52, and the two receiving electrodes 72 and via conductors arranged on the right side of the dielectric layer 51, respectively. Are electrically connected.
  • common electrodes 71 and 82 are formed by the same rod-shaped electrode pattern disposed substantially below the center of the dielectric layer 52, and the common electrodes 71 and 82 of the dielectric layer 51 and via conductors are used. Electrically connected. As shown in FIG.
  • the common electrodes 71 and 82 and the first and second ground electrodes 9 and 10 are arranged as far apart as possible, so that the dielectric layer
  • the transmission signal transmitted through the 52 common electrodes 71 and 82 is prevented from leaking to the first and second ground electrodes 9 and 10 of the dielectric layer 52.
  • a spiral pattern electrode 83 is disposed in the upper left portion of the dielectric layer 52 and is electrically connected to the transmission electrode 81 of the dielectric layer 51 by a via conductor.
  • a substantially U-shaped pattern electrode 84 is disposed in the lower left portion of the dielectric layer 52, and is electrically connected to the second ground electrode 10 disposed in the lower left portion of the dielectric layer 51 and via conductors.
  • a rod-shaped second ground electrode 10 is disposed on the left side of the dielectric layer 52, and the ground electrode 10 is disposed on the left side of the dielectric layer 51 and is not connected to the transmission filter element 3. The second ground electrode 10 connected to the terminal is electrically connected to the via conductor.
  • a plurality of mounting ground electrodes 11d and 11e are disposed on the back surface of the dielectric layer 53 disposed below the dielectric layer 52.
  • some of the mounting ground electrodes 11d and 11e that are disposed near the upper and lower right portions of the center of the dielectric layer 53 and are hatched are dielectric
  • the first and second ground electrodes 9 and 10 to which the layer 52 is hatched are electrically connected by via conductors.
  • the center The mounting ground electrodes 11d and 11e provided on the upper side have a larger area than the other mounting electrodes 11, and the first and second dielectric layers 52 are hatched by a plurality of via conductors.
  • the two ground electrodes 9 and 10 are electrically connected. If comprised in this way, the grounding state of the 1st, 2nd ground electrodes 9 and 10 provided in the dielectrics 51 and 52 connected to the said mounting electrodes 11d and 11e can be made favorable. .
  • the mounting ground electrode 11e provided in the lower left portion of the dielectric layer 53 is electrically connected to the pattern electrode 84 of the dielectric layer 52 by a via conductor.
  • a mounting common electrode 11a is disposed substantially below the center of the dielectric layer 53, and is electrically connected to the common electrodes 71 and 82 of the dielectric layer 52 by via conductors.
  • two mounting receiving electrodes 11b are arranged one above the other in the upper right portion of the dielectric layer 53, and the two receiving electrodes 72 and via conductors provided in the upper right portion of the dielectric layer 52, respectively. Are electrically connected.
  • a mounting transmission electrode 11c is disposed on the upper left portion of the dielectric layer 53, and is electrically connected to the pattern electrode 83 of the dielectric layer 52 by a via conductor. Further, the mounting unconnected electrode 11f is disposed on the left side of the approximate center of the dielectric layer 53, and is formed by the second ground electrode 10 and the via conductor disposed on the left side of the approximate center of the dielectric layer 52. Electrically connected.
  • each hatched electrode is a first ground. It is electrically connected to the electrode 9.
  • the transmission electrode 81, the pattern electrode 83, and the mounting transmission electrode 11c filled with dots transmit the transmission signal before being subjected to the filtering process by the transmission filter, and the common electrodes 71 and 82 filled with dots and In the mounting common electrode 11a, the transmission signal after being subjected to the filter processing by the transmission filter is transmitted.
  • each electrode electrically connected to the first ground electrode 9 and hatched, common electrodes 71 and 82 filled with a point where a transmission signal is transmitted, and transmission electrodes 81, the pattern electrode 83, the mounting common electrode 11a, and the mounting transmitting electrode 11c are arranged without overlapping in a plan view (see a region ⁇ surrounded by a dotted line in FIG. 1).
  • each hatched electrode electrically connected to the first ground electrode 9 has a common electrode 71, 82, a transmission electrode 81, a pattern filled with a transmission signal in a plan view.
  • the electrode 83, the mounting common electrode 11a, the mounting transmission electrode 11c, and the reception electrode 72 are disposed.
  • a via hole is formed in a ceramic green sheet formed in a predetermined shape with a laser or the like, and a via conductor for interlayer connection is formed by filling the inside with a conductive paste or by performing via fill plating.
  • Electrode patterns such as the two wiring electrodes 7 and 8, the first and second ground electrodes 9 and 10 and the mounting electrode 11 are printed with a conductive paste, and the dielectric layers 51 to 53 constituting the mounting substrate 5 are printed.
  • a ceramic green sheet for forming the is prepared. Each ceramic green sheet has via conductors, first and second wiring electrodes 7 and 8, first and second ground electrodes 9, so that a large number of mounting substrates 5 can be formed at one time.
  • a plurality of electrode patterns such as 10 and mounting electrodes 11 are provided.
  • the dielectric layers 51 to 53 are laminated to form a laminated body. And the groove
  • the reception filter element 2 and the reception filter element 3 are mounted on the mounting surface of the assembly of the mounting substrates 5, and the reception filter element 2 and the reception filter element 3 are
  • the mounting surface of the assembly of the mounted mounting substrates 5 is filled with mold resin, and this is heated and cured, whereby the mold layer 6 is provided on each mounting substrate 5 to form an assembly of the duplexer 1. Is done.
  • the aggregate of the duplexers 1 is individually divided, and the duplexer 1 is completed.
  • the transmission signal output from the transmission signal line Tx of the mother board to the transmission terminal 31 of the transmission filter element 3 via the LPF 4 and the transmission electrode 81 is input to the transmission filter. Then, a predetermined filtering process is performed, the signal is output from the common terminal 32 to the mounting substrate 5 side, and is output to the antenna line ANT of the mother substrate via the common electrode 82. Further, the reception signal input from the antenna line ANT of the mother board to the common terminal 21 of the reception filter element 2 via the common electrode 71 is input to the reception filter and subjected to a predetermined filtering process. Is output to the mounting substrate 5 side and is output to the reception signal line Rx of the mother substrate via the reception electrode 72 and the mounting reception electrode 11b.
  • the duplexer 1 is not limited to the above-described manufacturing method, and may be formed by a known general manufacturing method.
  • the mounting substrate 5 is a printed circuit board, LTCC using resin, ceramic, polymer material, or the like.
  • the substrate 5 can be formed of an alumina substrate, a glass substrate, a composite material substrate, a multilayer substrate, etc., and the mounting substrate 5 may be formed by selecting an optimal material according to the purpose of use of the duplexer 1. .
  • the mounting substrate 5 on which the reception filter element 2 and the transmission filter element 3 having different pass bands are mounted has a signal transmission first for the reception filter element 2 and the transmission filter element 3.
  • first wiring electrodes 7 and 8 and first and second ground electrodes 9 and 10 for grounding are provided, respectively.
  • the first ground electrode 9 connected to the ground terminal 23 of the reception filter element 2 and the second wiring electrode 8 connected to the transmission terminal 31 and the common terminal 32 of the transmission filter element 3 are in plan view. Since they are arranged without overlapping, the generation of parasitic capacitance between the first ground electrode 9 and the second wiring electrode 8 is suppressed, and the first ground electrode 9 and the second wiring electrode 8 are Electromagnetic coupling can be prevented.
  • the transmission filter element 3 is provided with a transmission terminal 31 connected to the input side of the transmission filter and a common terminal 32 connected to the output side as signal terminals.
  • the second wiring electrode 8 has a transmission electrode 81 connected to the transmission terminal 31 and a common electrode 82 connected to the common terminal 32, and the transmission electrode 81 and the common electrode 82 provide power for communication.
  • the first ground electrode 9, the transmission electrode 81, and the common electrode 82 are arranged so as not to overlap each other in plan view, so that the first ground electrode 9 is transmitted. 9 is prevented from being generated between the transmission electrode 81 and the common electrode 82, and the first ground electrode 9, the transmission electrode 81, and the common electrode 82 are prevented from being electromagnetically coupled. be able to.
  • a transmission signal input to the transmission filter of the transmission filter element 3 is provided. Filter processing by various filter circuits can be performed.
  • the pattern electrode 83 forming the filter circuit is arranged so as not to overlap the first ground electrode 9 in plan view, a parasitic capacitance is generated between the first ground electrode 9 and the pattern electrode 83. Therefore, the first ground electrode 9 and the pattern electrode 83 can be prevented from being electromagnetically coupled.
  • the first ground electrode 9 is disposed between the transmission electrode 81 and the common electrodes 71 and 82 and the reception electrode 72 in plan view, the first ground electrode 9 that is grounded transmits the first ground electrode 9. Since the transmission signal for communication having a large output transmitted through the electrode 31 and the common electrodes 71 and 82 is prevented from leaking to the reception electrode 72, further isolation characteristics between the reception filter element 2 and the transmission filter element 3 are obtained. Can be improved.
  • the reception filter element 2 is provided with a plurality of ground terminals 23, and has a large area of the first area having a flat pattern shape that is arranged so as to overlap each ground terminal 23 of the reception filter element 2 in plan view. Since each ground terminal 23 of the reception filter element 2 is grounded by the ground electrode 9, the grounding state of the reception filter element 2 can be improved, so that the reception filter element 2 and the transmission filter element 3 are connected to each other. Isolation characteristics can be improved.
  • some of the mounting electrodes 11 e connected to the first ground electrode 9 are larger than the other mounting electrodes 11. Since it has an area, for example, a part of the mounting electrode 11e having a large area is arranged between a plurality of other mounting electrodes 11 connected to the first and second wiring electrodes 7 and 8. Thus, electrical interference between the plurality of other mounting electrodes 11 can be suppressed.
  • first ground electrode 9 and a part of the mounting electrode 11e having a large area are electrically connected by a plurality of via conductors, so that the parasitic inductance generated in the plurality of via conductors can be reduced.
  • the first ground electrode 9 can be grounded in an ideal state.
  • FIG. 5 is a plan view showing an example of the electrode shape of the mounting substrate in the second embodiment of the present invention
  • FIGS. 5A to 5C show the electrode shapes in the respective dielectric layers of the mounting substrate.
  • FIG. 6 is a plan view showing a modification of the electrode shape of the mounting substrate.
  • this embodiment is different from the first embodiment described above in that the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the second ground electrode 10 disposed substantially above the center of the dielectric layer 51 is divided into two parts and disposed on the upper side.
  • the ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10, and the unconnected terminal of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10 arranged on the lower side.
  • the second ground electrode 10 is disposed in the lower left portion of the dielectric layer 51 with an electrode pattern formed so as to be long in the vertical direction.
  • a ground terminal 33 is connected.
  • the mounting electrodes 11 arranged on the back surface of the dielectric layer 53 are arranged point-symmetrically with the center of gravity of the duplexer 1 as the rotation center in plan view. Yes.
  • each mounting electrode 11 is arranged point-symmetrically with the center of gravity of the duplexer 11 as the center of rotation. Therefore, when the duplexer 1 is mounted on the module substrate of the circuit module, the duplexer 1 is prevented from tilting. Therefore, mountability such as mounting accuracy and mounting strength when the duplexer 1 is mounted on the module substrate of the circuit module can be improved.
  • each mounting electrode 11 formed on the back surface of the dielectric layer 53 may be formed identically. If it does in this way, when mounting the splitter 1, the design of the mask for solder printing used when printing a solder paste can be made easy. Further, when the duplexer 1 is mounted on the module substrate of the circuit module, the stress applied to the mounting surface between the duplexer 1 and the module substrate due to impact caused by dropping or expansion / contraction of the substrate accompanying heating and cooling, It can be uniformly dispersed in each mounting electrode 11.
  • a notch 11 g may be provided in a part of the mounting electrodes 11 formed on the back surface of the dielectric layer 53, or a recognition mark 11 h may be provided on the back surface of the dielectric layer 53.
  • the mounting electrodes 11 are formed in the same shape and the same size on the back surface of the duplexer 1 (dielectric layer 53), and the mounting electrodes 11 are point-symmetric. Even if it is arranged, it is possible to recognize the vertical direction in plan view of the duplexer 1 by recognizing the notch 11g or the recognition mark 11h, so each mounting electrode formed on the back surface of the duplexer 1 11 electrode characteristics can be recognized without error.
  • FIG. 7 is a plan view showing an example of the electrode shape of the mounting substrate according to the third embodiment of the present invention.
  • FIGS. 7A to 7C show the electrode shapes in the respective dielectric layers of the mounting substrate.
  • This embodiment is different from the second embodiment described above in that, as shown in FIG. 7, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since other configurations are the same as those in the first and second embodiments described above, description of the configuration is omitted by giving the same reference numerals.
  • 11d and 11e and the mounting common electrode 11a disposed on the lower side are formed to be larger than the areas of the other mounting electrodes 11.
  • the mounting ground electrodes 11d and 11e which are disposed substantially above the center of the dielectric layer 51, in a large area, the mounting ground electrodes 11d and 11e and the dielectric layer 52 are disposed. Since the first and second ground electrodes 9 and 10 can be electrically connected by a plurality of via electrodes, the same effects as those of the first embodiment described above can be obtained.
  • the common electrodes 71 and 82 of the dielectric layer 51 and the mounting of the dielectric layer 53 are mounted. As shown in FIG. 7B, the common electrode 11a can be electrically connected by the common electrodes 71 and 82 of the dielectric layer 52 formed by via conductors. Therefore, the influence of electromagnetic noise can be reduced by electrically connecting the common electrodes 71 and 82 of the dielectric layer 51 and the mounting common electrode 11a of the dielectric layer 53 through the shortest path. .
  • FIG. 8 is a plan view showing an example of the electrode shape of the mounting substrate in the fourth embodiment of the present invention
  • FIGS. 8A to 8C show the electrode shapes in the respective dielectric layers of the mounting substrate.
  • This embodiment is different from the first embodiment described above in that, as shown in FIG. 8, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • common electrodes 71 and 82 are disposed at substantially the center of the dielectric layer 51, and the common terminal 21 of the reception filter element 2 and the transmission filter element 3 are common.
  • the terminal 32 is connected to the positions A1 and A2 of the common electrodes 71 and 82, respectively.
  • the mounting common electrode 11a is disposed at substantially the center of the dielectric layer 53 in correspondence with the positions of the common electrodes 71 and 82 of the dielectric layer 51.
  • the common electrodes 71 and 82 of the body layer 51 and the mounting common electrode 11 of the dielectric layer 53 include the common electrodes 71 and 82 disposed substantially at the center of the dielectric layer 52 as shown in FIG. Electrically connected.
  • FIG. 9 is a plan view showing an example of the electrode shape of the mounting substrate according to the fifth embodiment of the present invention.
  • FIGS. 9A to 9C show the electrode shapes in the respective dielectric layers of the mounting substrate.
  • This embodiment differs from the first embodiment described above in that, as shown in FIG. 9, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the second ground electrode 10 disposed substantially above the center of the dielectric layer 51 is divided into two parts and is disposed on the upper side.
  • the ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10, and the unconnected terminal of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10 arranged on the lower side.
  • the ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10 disposed on the left side of the approximate center of the dielectric layer 51.
  • two second ground electrodes 10 are arranged vertically above the approximate center of the dielectric layer 52. Then, the second ground electrode 10 disposed on the upper side of the two second ground electrodes 10 disposed substantially above the center of the dielectric layer 51 by the upper second ground electrode 10. Are electrically connected to the mounting ground electrode 11e disposed substantially above the center of the dielectric layer 53. In addition, the second ground electrode 10 disposed on the lower side of the two second ground electrodes 10 disposed substantially above the center of the dielectric layer 51 by the second ground electrode 10 on the lower side. The electrode 10 is electrically connected to the mounting unconnected electrode 11f disposed substantially at the center of the dielectric layer 53.
  • the first ground electrode 9 and the second ground electrode 10 are arranged in an electrically insulated state. Therefore, even if signals transmitted through the first and second wiring electrodes 7 and 8 leak to the first and second ground electrodes 9 and 10, respectively, the first and second ground electrodes 9 and 10 are electrically connected. Since the first and second ground electrodes 9 and 10 are prevented from being transmitted to the other ground electrodes, the first and second ground electrodes 9 and 10 are prevented from being transmitted to each other. The isolation characteristics between the filter elements 2 and 3 can be further improved.
  • the ground terminal 33 and the unconnected terminal of the transmission filter element 3 are electrically insulated from each other, and the mounting ground electrode 11e and the mounting ground electrode provided on the back surface of the dielectric layer 53, respectively. It is electrically connected to the unconnected electrode 11f. Therefore, the common terminals 21 and 32, the reception terminal 22, the transmission terminal 31, the ground terminal 23 of the reception filter element 2, and the ground terminal 33 of the transmission filter element 3 are electrically insulated from each other. Since the respective electrodes 11 are electrically connected to the mounting electrodes 11 provided on the back surface of the dielectric layer 53, respectively, electrical mutual interference between the terminals can be reduced. The isolation characteristics between the filter elements 2 and 3 can be further improved.
  • the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention.
  • the first filter element of the present invention is formed by the reception filter element 2
  • the second filter element of the present invention is formed by the transmission filter element 3
  • the first and second filters The elements may be formed by the transmission filter element 3 and the reception filter element 2, respectively.
  • the present invention can be widely applied to a duplexer including a first filter element and a second filter element having different pass bands.

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Transceivers (AREA)

Abstract

La présente invention a trait à une technologie qui permet d'obtenir des caractéristiques d'isolation améliorées entre un premier et un second élément filtrant prévus sur un démultiplexeur. Une première électrode de masse (9) qui est connectée à une borne de mise à la terre (23) d'un élément filtrant de réception (2), et une seconde électrode de câblage (8) qui est connectée à un élément de transmission (31) et à une borne commune (32) d'un élément filtrant de transmission (3), sont agencées sans se chevaucher en vue en plan et, par conséquent, il est possible de supprimer toute occurrence de capacité parasite entre la première électrode de masse (9) et la seconde électrode de câblage (8) ; il est possible d'empêcher toute combinaison magnétique de la première électrode de masse (9) et de la seconde électrode de câblage (8) ; et il est possible d'empêcher qu'un signal de transmission transmis au moyen de la seconde électrode de câblage (8) ne soit transmis par l'intermédiaire de la première électrode de masse (9) vers une première électrode de câblage (7). Ceci permet d'améliorer les caractéristiques d'isolation entre l'élément filtrant de réception (2) et l'élément filtrant de transmission (3) qui sont prévus sur le démultiplexeur (1).
PCT/JP2012/004401 2011-07-20 2012-07-06 Démultiplexeur WO2013011649A1 (fr)

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JP2011158536 2011-07-20
JP2011-158536 2011-07-20

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JP2014154942A (ja) * 2013-02-05 2014-08-25 Taiyo Yuden Co Ltd 高周波モジュール
WO2015016203A1 (fr) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexeur
JP2016096439A (ja) * 2014-11-13 2016-05-26 太陽誘電株式会社 弾性波デバイス、送受信デバイスおよび移動体通信機
JP2019205065A (ja) * 2018-05-23 2019-11-28 株式会社村田製作所 マルチプレクサおよび通信装置
JP2022002260A (ja) * 2020-06-22 2022-01-06 株式会社村田製作所 表面実装型受動部品

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JP2014154942A (ja) * 2013-02-05 2014-08-25 Taiyo Yuden Co Ltd 高周波モジュール
WO2015016203A1 (fr) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexeur
JP5862842B2 (ja) * 2013-08-02 2016-02-16 株式会社村田製作所 分波装置
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JP2022002260A (ja) * 2020-06-22 2022-01-06 株式会社村田製作所 表面実装型受動部品

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