WO2013011649A1 - Demultiplexer - Google Patents

Demultiplexer Download PDF

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Publication number
WO2013011649A1
WO2013011649A1 PCT/JP2012/004401 JP2012004401W WO2013011649A1 WO 2013011649 A1 WO2013011649 A1 WO 2013011649A1 JP 2012004401 W JP2012004401 W JP 2012004401W WO 2013011649 A1 WO2013011649 A1 WO 2013011649A1
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WO
WIPO (PCT)
Prior art keywords
electrode
filter element
ground
transmission
connected
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PCT/JP2012/004401
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French (fr)
Japanese (ja)
Inventor
竹村 忠治
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株式会社村田製作所
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Priority to JP2011158536 priority Critical
Priority to JP2011-158536 priority
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013011649A1 publication Critical patent/WO2013011649A1/en

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    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/70Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
    • H03H9/72Networks using surface acoustic waves
    • H03H9/725Duplexers
    • HELECTRICITY
    • H03BASIC ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02Details
    • H03H9/05Holders; Supports
    • H03H9/0538Constructional combinations of supports or holders with electromechanical or other electronic elements
    • H03H9/0566Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers
    • H03H9/0576Constructional combinations of supports or holders with electromechanical or other electronic elements for duplexers including surface acoustic wave [SAW] devices

Abstract

Provided is a technology enabling improved isolation characteristics between a first and a second filter element provided to a demultiplexer. A first ground electrode (9) connected to a grounding terminal (23) of a reception filter element (2), and a second wiring electrode (8) connected to a transmission element (31) and common terminal (32) of a transmission filter element (3), are arranged without overlapping in plan view, and thus the occurrence of parasitic capacitance between the first ground electrode (9) and the second wiring electrode (8) is suppressed; magnetic combination of the first ground electrode (9) and second wiring electrode (8) can be prevented; and a transmission signal transmitted through the second wiring electrode (8) can be prevented from be transmitted via the first ground electrode (9) to a first wiring electrode (7). This makes it possible to improve isolation characteristics between the reception filter element (2) and the transmission filter element (3) provided to the demultiplexer (1).

Description

Duplexer

The present invention relates to a duplexer including a first filter element and a second filter element having different pass bands.

In recent years, mobile communication terminals such as mobile phones and personal digital assistants that support communication based on multiple communication standards such as the GSM (Global System for Mobile Communications) standard and the CDMA (Code Division Multiple Access) standard are rapidly spreading. In these communication portable terminals, signals in different frequency bands are transmitted and received using a common antenna. Therefore, there is an increasing demand for further enhancement in performance and size of the duplexer that demultiplexes transmission signals and reception signals having different frequencies.

For example, the conventional branching circuit 500 shown in FIG. 10 described in Patent Document 1 includes a low-frequency filter 501 and a high-frequency filter 502. The low-frequency filter 501 is formed by a transmission line Lf1 connected to the common terminal 503, a series resonance circuit including a transmission line Lf2 connected between the low-frequency terminal 504 and the ground, and a capacitor Cf1. Has been. The high frequency filter 502 includes a capacitor Cf2 connected to the common terminal 503, a capacitor Cf3 connected between the capacitor Cf2 and the high frequency terminal 505, and a connection point between the capacitors Cf2 and Cf3 and the ground. It is formed by a direct resonance circuit composed of a connected transmission line Lf3 and a capacitor Cf4.

The transmission lines Lf1 to Lf3 and the capacitors Cf1 to Cf4 forming the low frequency filter 501 and the high frequency filter 502 are built in the laminated substrate as electrode patterns, but the duplexer 500 is further downsized. Therefore, the following problems may occur when the electrode patterns are arranged close to each other and incorporated in the multilayer substrate. That is, the circuit pattern (transmission line Lf3, capacitors Cf2 to Cf4) forming the circuit element (transmission line Lf3, capacitors Cf2 to Cf4) forming the high frequency filter 502 is configured. If the electrode patterns to be arranged are opposed to each other with the dielectric layer of the laminated substrate interposed therebetween, parasitic capacitance may be generated between the two electrode patterns, and the two electrode patterns may be coupled electromagnetically.

When parasitic capacitance is generated between both electrode patterns forming the low-frequency filter 501 and the high-frequency filter 502, and both electrode patterns are electromagnetically coupled, signal leakage occurs between the filters 501 and 502. The isolation characteristic between 501 and 502 deteriorates. Therefore, in the conventional duplexer 500 shown in FIG. 10, the electrode pattern constituting the transmission line Lf1 forming the low frequency filter 501 and the electrode pattern constituting the capacitor Cf2 forming the high frequency filter 501 are electromagnetic It arrange | positions so that it may not overlap substantially in the lamination direction of a laminated substrate so that it may not couple | bond together.

In this way, since the electrode patterns that form both filters 501 and 502 are arranged so as not to overlap in the stacking direction of the stacked substrate, the generation of parasitic capacitance between the two electrode patterns is suppressed. It is possible to prevent the two electrode patterns from being electromagnetically coupled, to reduce the size of the duplexer 500, and to improve the isolation characteristics between the filters 501 and 502.

Further, as shown in the cross-sectional view of the conventional duplexer 600 in FIG. 11, a transmission filter element 601 and a reception filter element 602 having different pass bands are mounted on a mounting substrate 603, and the transmission filter element 601 and the reception filter element 602 are mounted. A duplexer 600 formed by being protected by a resin mold layer 604 is also known. In the duplexer 600, the wiring electrode 606 connected to the transmission terminal 605 that is the input side of the transmission filter element 601, the wiring electrode 608 that is connected to the common terminal 607 that is the output side, and the output side of the reception filter element 602. A wiring electrode 610 connected to the receiving terminal 609, a ground electrode 612 connected to the ground terminal 611 of the receiving filter element 602, and the like are built in the mounting substrate 603.

In the duplexer 600, as described above, parasitic capacitance is generated between the wiring electrodes 606, 608, 610, and the wiring electrodes 606, 608, 610 are electromagnetically coupled, thereby transmitting the filter element 601. In order to prevent the isolation characteristics between the reception filter elements 602 from deteriorating, the wiring electrodes 606, 608, and 610 for signal transmission are arranged so as not to overlap in the stacking direction of the stacked substrate 603. In addition, in the cross-sectional view of the duplexer 600 shown in FIG. 11, a part of the configuration such as the wiring electrode is omitted for easy explanation.

Japanese Patent Laying-Open No. 2005-210607 (paragraphs 0010, 0017 to 0022, FIG. 1, 5, abstract, etc.)

By the way, in the conventional duplexers 500 and 600, in order to improve the isolation characteristics described above, a grounding ground electrode having a large-area flat pattern shape is provided on the multilayer substrate or the mounting substrate 603. ing. However, by providing a ground electrode for grounding having a large-area flat pattern shape in a laminated substrate or a mounting substrate, the following problems may occur.

That is, for example, as shown in FIG. 11, the ground electrode 612 having a flat pattern shape with a large area is arranged on the mounting substrate 603 so as to overlap the signal transmission wiring electrodes 608 and 610 in plan view. . Therefore, as shown in a region surrounded by a dotted line in FIG. 11, parasitic capacitance is generated between the wiring electrode 608 and the ground electrode 612 facing each other with the dielectric layer of the mounting substrate 603 interposed therebetween, and the wiring electrode 608 is formed. When the ground electrode 612 is electromagnetically coupled, a signal transmitted by the wiring electrode 608 may leak to the ground electrode 612.

At this time, in particular, when the duplexer 600 is used in a high frequency band of several GHz, the ground electrode 612 is ideal due to a parasitic inductance generated in the via conductor 612a connected to the ground electrode 612 and the like. There is a possibility that it is not grounded. In this case, a signal leaking from the wiring electrode 608 to the ground electrode 612 is transmitted to the wiring electrode 610 connected to the reception terminal 609 of the reception filter element 602 via the ground electrode 612, whereby the transmission filter element 601 and the reception filter 601 are received. There is a possibility that the isolation characteristics between the filter elements 602 may be deteriorated, and improvement of the technique has been demanded.

The present invention has been made in view of the above-described problems, and an object thereof is to provide a technique capable of improving the isolation characteristics between the first and second filter elements included in the duplexer. .

In order to achieve the above-described object, a duplexer according to the present invention includes a first filter element and a second filter element having different pass bands, and a mounting substrate on which the first and second filter elements are mounted. And first and second wiring electrodes for signal transmission and first and second ground electrodes for grounding provided respectively for the first and second filter elements on the mounting substrate, The first ground electrode connected to the ground terminal of the first filter element and the second wiring electrode connected to the signal terminal of the second filter element do not overlap in a plan view. It is characterized by being arranged (Claim 1).

Further, the first ground electrode and the second ground electrode connected to the ground terminal of the second filter element are disposed in an electrically insulated state ( Claim 2). With this structure, signals leaking to the first and second ground electrodes are prevented from being transmitted to the other ground electrode, so that the isolation between the first and second filter elements is achieved. The characteristics can be further improved.

The second filter element includes a transmission filter for a transmission signal, and the second filter element includes a transmission terminal connected to the input side of the transmission filter and a common terminal connected to the output side. Is provided as the signal terminal of the second filter element, and the second wiring electrode is a transmission electrode connected to the transmission terminal and a common electrode connected to the common terminal of the second filter element (Claim 3). With such a structure, generation of parasitic capacitance between the first ground electrode and the transmission electrode and the common electrode of the second wiring electrode is suppressed, and the first ground electrode and the second ground electrode are suppressed. It is possible to prevent the transmission electrode and the common electrode of the wiring electrode from being electromagnetically coupled.

Further, the second wiring electrode further includes a pattern electrode that forms a filter circuit connected to the transmission terminal (claim 4). By adopting such a structure, it is possible to perform filter processing by various filter circuits on the transmission signal input to the transmission filter of the second filter element.

The first wiring electrode is connected to a signal terminal of the first filter element, the first filter element includes a reception signal reception filter, and the first filter element includes: A common terminal connected to the input side of the reception filter and a reception terminal connected to the output side are provided as the signal terminals of the first filter element, and the first wiring electrode is the first wiring electrode A common electrode connected to a common terminal of the filter element and a reception electrode connected to the reception terminal, wherein the common electrode of the first wiring electrode and the common electrode of the second wiring electrode are electrically And the first ground electrode is disposed between the transmission electrode and the common electrode of each of the first and second wiring electrodes and the reception electrode in plan view. With features And that (claim 5). With this structure, the first ground electrode leaks a transmission signal for communication with a large output that transmits the common electrode of each of the transmission electrode and the first and second wiring electrodes to the reception electrode. Therefore, the isolation characteristic between the first and second filter elements can be further improved.

The first filter element is provided with a plurality of ground terminals, and the first ground electrode is a flat plate disposed so as to overlap the ground terminals of the first filter element in plan view. It has the pattern shape of (6). By adopting such a structure, the grounding state of the first filter element can be improved, so that the isolation characteristics between the first and second filter elements can be improved.

The mounting board further includes a plurality of mounting electrodes provided on the back surface of the mounting substrate, and some of the mounting electrodes connected to the first ground electrode are larger than the other mounting electrodes. The first ground electrode and the part of the mounting electrodes have an area and are electrically connected by a plurality of via conductors (Claim 7). For example, by disposing a part of the mounting electrode having a large area between the plurality of other mounting electrodes connected to the first and second wiring electrodes, the electric power between the plurality of other mounting electrodes can be reduced. Interference can be suppressed.

According to the present invention, the first ground electrode connected to the ground terminal of the first filter element and the second wiring electrode connected to the signal terminal of the second filter element overlap in plan view. Therefore, the generation of parasitic capacitance between the first ground electrode and the second wiring electrode is suppressed, and the first ground electrode and the second wiring electrode are electromagnetically coupled. Can be prevented. Therefore, the signal transmitted through the second wiring electrode is prevented from leaking to the first ground electrode, and the signal transmitted through the second wiring electrode is transmitted to the first wiring electrode via the first ground electrode. Since transmission can be prevented, the isolation characteristics between the first and second filter elements provided in the duplexer can be improved.

It is a figure which shows 1st Embodiment of the splitter of this invention. It is a block diagram which shows the internal structure of the splitter of FIG. It is a top view which shows an example of the electrode shape of the board | substrate for mounting. It is a figure which shows the state which overlapped in the planar view the electrode shape in each dielectric material layer of the mounting board | substrate shown in FIG. It is a top view which shows an example of the electrode shape of the board | substrate for mounting in 2nd Embodiment of this invention. It is a top view which shows the modification of the electrode shape of the board | substrate for mounting. It is a top view which shows an example of the electrode shape of the board | substrate for mounting in 3rd Embodiment of this invention. It is a top view which shows an example of the electrode shape of the board | substrate for mounting in 4th Embodiment of this invention. It is a top view which shows an example of the electrode shape of the board | substrate for mounting in 5th Embodiment of this invention. It is a figure which shows an example of the conventional branching circuit. It is sectional drawing which shows an example of the conventional splitter.

<First Embodiment>
A first embodiment of a duplexer according to the present invention will be described with reference to FIGS. FIG. 1 is a diagram showing a first embodiment of a duplexer according to the present invention. FIG. 2 is a block diagram showing the internal configuration of the duplexer of FIG. FIG. 3 is a plan view showing an example of the electrode shape of the mounting substrate. FIGS. 3A to 3C show the electrode shapes of the dielectric layers of the mounting substrate, respectively. FIG. 4 is a view showing a state in which the electrode shapes in the respective dielectric layers of the mounting substrate shown in FIG.

(Demultiplexer)
The duplexer 1 is used to separate a transmission signal and a reception signal having different frequencies, and a circuit such as a high-frequency antenna switch module mounted on a mother board or the like included in a communication portable terminal such as a mobile phone or a portable information terminal. Implemented in the module. Then, by mounting the circuit module on which the duplexer 1 is mounted on a mother board or the like, various signal lines such as an antenna line ANT, a ground line GND, a reception signal line Rx, and a transmission signal line Tx provided on the mother board or the like. The power supply line and the duplexer 1 are connected, and transmission / reception signals are input / output between the mother board and the duplexer 1.

As shown in FIGS. 1 and 2, the duplexer 1 includes a reception filter element 2 (corresponding to a “first filter element” of the present invention) and a transmission filter element 3 (corresponding to the present invention) having different high-frequency signal passbands. "Corresponding to a" second filter "), a low-pass filter (LPF) 4 (corresponding to the" filter circuit "of the present invention) connected to the transmission terminal 31 of the transmission filter element 3, the reception filter element 2 and the transmission filter element 3 and a mold resin layer 6 that molds and protects the mounting surface of the mounting substrate 5 on which the reception filter element 2 and the transmission filter element 3 are mounted.

The reception filter element 2 and the transmission filter element 3 include a reception filter for reception signals and a transmission filter for transmission signals, respectively. The reception filter element 2 and the transmission filter element 3 are each formed by a SAW (surface acoustic wave) filter element. In this embodiment, the reception filter element 2 has a balanced output type reception filter. .

The reception filter element 2 is provided with a common terminal 21 (antenna terminal) connected to the input side of the reception filter and a reception terminal 22 connected to the output side as signal terminals, and the ground terminal 23 is a ground terminal. It is provided as. The transmission filter element 3 is provided with a transmission terminal 31 connected to the input side of the transmission filter and a common terminal 32 (antenna terminal) connected to the output side as a signal terminal, and a ground terminal 33 is a ground terminal. It is provided as.

In this embodiment, the reception filter element 2 and the transmission filter element 3 included in the duplexer 1 are formed by SAW filter elements. However, in addition to the SAW filter elements, a plurality of resonators and coils are connected. Thus, the reception filter and the transmission filter may be formed, and if the transmission signal and the reception signal having different frequencies can be reliably demultiplexed, the reception filter element 2 and the transmission filter element 3 may be a dielectric filter, Any device such as a BAW filter element may be used.

The LPF 4 is connected to the transmission terminal 31 of the transmission filter element 3 and filters the transmission signal input from the transmission signal line Tx. That is, the output of the transmission signal input to the transmission filter element 3 via the transmission signal line Tx is amplified by a power amplifier for communication, and second-order or higher harmonic components included in the transmission signal are also amplified by the power amplifier. It is amplified by. Accordingly, the LPF 4 attenuates second-order or higher harmonic components included in the transmission signal amplified by the power amplifier.

In this embodiment, the mounting substrate 5 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers 51 to 53 formed of ceramic green sheets.

That is, the ceramic green sheets forming the respective dielectric layers 51 to 53 are obtained by forming a sheet in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed by a molding machine. It is formed so that it can be fired at a low temperature of about 1000 ° C. at a so-called low temperature. Then, via holes are formed in the ceramic green sheet cut into a predetermined shape by laser processing or the like, and the formed via holes are filled with a conductive paste containing Ag, Cu, etc. Via conductors are formed, and various electrode patterns are formed by printing with a conductor paste to form the dielectric layers 51 to 53.

In addition, via conductors and electrode patterns are appropriately formed in each of the dielectric layers 51 to 53, so that a signal transmission second layer provided for the reception filter element 2 and the transmission filter element 3 respectively on the mounting substrate 5 is provided. The first and second wiring electrodes 7 and 8 and the first and second ground electrodes 9 and 10 are built in, and a plurality of mounting electrodes 11 are formed on the back surface of the mounting substrate 5.

That is, electrode patterns and via conductors are appropriately provided in the dielectric layers 51 to 53, and the first and second wiring electrodes 7, 8, the first and second ground electrodes 9, 10 and the mounting electrode 11 are provided. By being formed, the reception filter element 2 and the transmission filter element 3 mounted on the mounting substrate 5 and the mounting electrode 11 are electrically connected to each other. At this time, as will be described later, circuit elements such as capacitors and coils are formed by the electrode patterns and via conductors formed in the respective dielectric layers 51 to 53, and LPF 4 and the like are formed by the formed circuit elements such as capacitors and coils. A filter circuit, a matching circuit, or the like may be formed.

The first wiring electrode 7 for signal transmission of the reception filter element 2 has a common electrode 71 connected to the common terminal 21 of the reception filter element 2 and a reception electrode 72 connected to the reception terminal 22. The second wiring electrode 8 for signal transmission of the transmission filter element 3 is connected to the transmission electrode 81 connected to the transmission terminal 31 of the transmission filter element 3, the common electrode 82 connected to the common terminal 32, and the transmission terminal 31. The pattern electrode 83 for forming the LPF 4 is provided.

In this embodiment, a coil is formed by the pattern electrode 83, and the LPF 4 is formed by a capacitor (not shown) built in the transmission filter element 3 and a coil formed by the pattern electrode 83. In this embodiment, the common electrode 71 of the first wiring electrode 7 and the common electrode 82 of the second wiring electrode 7 formed on the dielectric layer 51 are electrically formed by being formed with the same electrode pattern. (See FIG. 3A).

The reception filter element 2 and the transmission filter element 3 are provided with a plurality of ground terminals 23 and 33, respectively. The ground terminals 23 and 33 are respectively connected to the first and second ground electrodes 9 and 10, respectively. Grounded.

The mounting electrode 11 includes a mounting common electrode 11a, a mounting receiving electrode 11b, a mounting transmitting electrode 11c, mounting ground electrodes 11d and 11e, and a mounting unconnected electrode 11f (see FIG. 3 (c)).

The mounting common electrode 11a is connected to the common terminals 21 and 32 of the reception filter element 2 and the transmission filter element 3 via the common electrodes 71 and 82, respectively. The mounting receiving electrode 11 b is connected to the receiving terminal 22 of the receiving filter element 2 via the receiving electrode 72. The mounting transmission electrode 11 c is connected to the transmission terminal 31 of the transmission filter element 3 via the transmission electrode 81 and the pattern electrode 83.

The mounting ground electrode 11d is connected to the ground terminal 23 of the reception filter element 2 via the first ground electrode 9, and the mounting ground electrode 11e is connected to the ground terminal 33 of the transmission filter element 3 and the second ground. It is connected via the electrode 10. Further, the mounting unconnected electrode 11f is provided on the back surface of the mounting substrate 5 in order to improve mounting strength when the duplexer 1 is mounted on the module substrate of the circuit module.

In this embodiment, the pattern electrode 84 that connects the second ground electrode 10 to which the ground terminal 33 of the transmission filter element 3 is connected and the mounting ground electrode 11 e is the second wiring electrode 8. It is provided on the dielectric layer 52 (see FIG. 3B). A coil is formed by forming a coil with the pattern electrode 84, and an attenuation pole that improves the attenuation characteristic of the transmission filter of the transmission filter element 3 is formed by the resonator configured with the pattern electrode 84.

(Electrode shape of mounting board)
Next, referring to FIG. 3 and FIG. 4, first and second wiring electrodes 7 and 8, first and second ground electrodes 9 provided on the dielectric layers 51 to 53 of the mounting substrate 5, respectively. , 10 and an example of the electrode shape of the mounting electrode 11 will be specifically described.

Of the electrodes described above, the electrodes formed by the same electrode pattern formed in each of the dielectric layers 51 to 53 are a plurality of electrodes corresponding to the respective electrodes formed by the same electrode pattern. Reference numerals are assigned to the same electrode pattern. Further, in FIG. 3, only the first and second wiring electrodes 7 and 8, the first and second ground electrodes 9 and 10 and the mounting electrode 11 and main via conductors are shown for easy explanation. The other electrodes and via conductors are not shown. Further, only the arrangement position of the via conductor is indicated by a circle.

Further, in the dielectric layer 53 shown in FIG. 3C, the mounting electrode 11 is actually provided on the back surface of the dielectric layer 53, but in FIG. 3C, it is provided on the dielectric layer 53. The mounting positions of the mounting electrodes 11 in plan view are indicated by solid lines. Note that FIGS. 5 to 8 used in the following description are also illustrated in the same manner as in FIG.

As shown in FIG. 3A, the first dielectric layer 51, which is the mounting surface of the mounting substrate 5, is connected to the common terminal 21 when the reception filter element 2 is mounted. A common electrode 71, a receiving electrode 72 to which the receiving terminal 22 is connected, and a first ground electrode 9 to which the ground terminal 23 is connected are formed.

The first ground electrode 9 has a flat pattern shape formed by cutting out the center portion of the substantially convex base portion, and the convex portion on the right side of the dielectric layer 51 in FIG. Are arranged so as to overlap each ground terminal 23 of the reception filter element 2 in plan view. The plurality of ground terminals 23 of the reception filter element 2 are connected to the position G1 of the first ground electrode 9, respectively.

The common electrode 71 has a crank-shaped pattern shape, and is disposed substantially below the center of the dielectric layer 51 of FIG. 3A. In a plan view, the crank-shaped piece portion is a first ground electrode. It is arrange | positioned in 9 notch parts. The common terminal 21 of the reception filter element 2 is connected to the position A1 of the common electrode 71. The receiving electrode 72 has a rectangular shape with a tongue-shaped portion, and two receiving electrodes 72 are arranged on the right side of the dielectric layer 51 in FIG. It is arrange | positioned at the upper and lower sides of the convex part, respectively. The two reception terminals 22 of the reception filter element 2 are connected to the position R1 of the reception electrode 72, respectively.

As shown in FIG. 3A, when the transmission filter element 3 is mounted on the dielectric layer 51, the transmission electrode 81 to which the transmission terminal 31 is connected and the common electrode to which the common terminal 32 is connected. A second ground electrode 10 to which 82 and the ground terminal 33 are connected is formed.

Three second ground electrodes 10 are disposed on the dielectric layer 51 in FIG. 3A, and one second ground electrode 10 is disposed on the upper side of the approximate center of the dielectric layer 51 in FIG. A ground electrode 10 is disposed, and two second ground electrodes 10 are disposed vertically on the left side of the dielectric layer 51. The plurality of ground terminals 33 of the transmission filter element 3 are connected to the position G2 of the second ground electrode 10, respectively. Further, an unconnected terminal (not shown) of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10.

The transmission electrode 81 has a shape in which a rectangular line-shaped extending portion is provided, and is disposed in the upper left portion of the dielectric layer 51 in FIG. 3A. The transmission terminal 31 of the transmission filter element 3 is , Connected to the position T2 of the transmission electrode 81. The common electrode 81 is formed by the same electrode pattern as the common electrode 71, and the common terminal 32 of the transmission filter element 3 is connected to the position A <b> 2 of the common electrode 81.

As shown in FIG. 3B, the dielectric layer 52 disposed below the dielectric layer 51 has the same electrode pattern having a substantially L-shaped flat pattern arranged on the right side. First and second ground electrodes 9 and 10 are formed. The first and second ground electrodes 9 and 10 of the dielectric layer 52 are arranged so as to substantially overlap with the first and second ground electrodes 9 and 10 to which the dielectric layer 51 is hatched. ing. The first and second ground electrodes 9, 10 of the dielectric layer 52 and the first and second ground electrodes 9, 10 to which the dielectric layer 51 is hatched are electrically connected by via conductors. ing. In this way, the first and second ground electrodes 9 and 10 disposed on the dielectric layers 51 and 52 are formed as large as possible to be connected to the first and second ground electrodes 9 and 10. The ground state of the ground terminal 23 of the second filter element 2 can be made favorable.

Further, two rod-shaped receiving electrodes 72 are arranged vertically on the right side of the dielectric layer 52, and the two receiving electrodes 72 and via conductors arranged on the right side of the dielectric layer 51, respectively. Are electrically connected. Further, common electrodes 71 and 82 are formed by the same rod-shaped electrode pattern disposed substantially below the center of the dielectric layer 52, and the common electrodes 71 and 82 of the dielectric layer 51 and via conductors are used. Electrically connected. As shown in FIG. 3B, in the dielectric layer 52, the common electrodes 71 and 82 and the first and second ground electrodes 9 and 10 are arranged as far apart as possible, so that the dielectric layer The transmission signal transmitted through the 52 common electrodes 71 and 82 is prevented from leaking to the first and second ground electrodes 9 and 10 of the dielectric layer 52.

In addition, a spiral pattern electrode 83 is disposed in the upper left portion of the dielectric layer 52 and is electrically connected to the transmission electrode 81 of the dielectric layer 51 by a via conductor. In addition, a substantially U-shaped pattern electrode 84 is disposed in the lower left portion of the dielectric layer 52, and is electrically connected to the second ground electrode 10 disposed in the lower left portion of the dielectric layer 51 and via conductors. Connected. Further, a rod-shaped second ground electrode 10 is disposed on the left side of the dielectric layer 52, and the ground electrode 10 is disposed on the left side of the dielectric layer 51 and is not connected to the transmission filter element 3. The second ground electrode 10 connected to the terminal is electrically connected to the via conductor.

As shown in FIG. 3 (c), a plurality of mounting ground electrodes 11d and 11e are disposed on the back surface of the dielectric layer 53 disposed below the dielectric layer 52. Among the plurality of mounting ground electrodes 11d and 11e, some of the mounting ground electrodes 11d and 11e that are disposed near the upper and lower right portions of the center of the dielectric layer 53 and are hatched are dielectric The first and second ground electrodes 9 and 10 to which the layer 52 is hatched are electrically connected by via conductors.

Of the mounting ground electrodes 11d and 11e of the dielectric layer 53 electrically connected to the first and second ground electrodes 9 and 10 to which the dielectric layer 52 is hatched by via conductors, the center The mounting ground electrodes 11d and 11e provided on the upper side have a larger area than the other mounting electrodes 11, and the first and second dielectric layers 52 are hatched by a plurality of via conductors. The two ground electrodes 9 and 10 are electrically connected. If comprised in this way, the grounding state of the 1st, 2nd ground electrodes 9 and 10 provided in the dielectrics 51 and 52 connected to the said mounting electrodes 11d and 11e can be made favorable. .

Note that the mounting ground electrode 11e provided in the lower left portion of the dielectric layer 53 is electrically connected to the pattern electrode 84 of the dielectric layer 52 by a via conductor.

In addition, a mounting common electrode 11a is disposed substantially below the center of the dielectric layer 53, and is electrically connected to the common electrodes 71 and 82 of the dielectric layer 52 by via conductors. In addition, two mounting receiving electrodes 11b are arranged one above the other in the upper right portion of the dielectric layer 53, and the two receiving electrodes 72 and via conductors provided in the upper right portion of the dielectric layer 52, respectively. Are electrically connected.

Further, a mounting transmission electrode 11c is disposed on the upper left portion of the dielectric layer 53, and is electrically connected to the pattern electrode 83 of the dielectric layer 52 by a via conductor. Further, the mounting unconnected electrode 11f is disposed on the left side of the approximate center of the dielectric layer 53, and is formed by the second ground electrode 10 and the via conductor disposed on the left side of the approximate center of the dielectric layer 52. Electrically connected.

Of the first and second ground electrodes 9 and 10 and the mounting electrodes 11e and 11d shown in FIGS. 3A to 3C, each hatched electrode is a first ground. It is electrically connected to the electrode 9. In addition, the transmission electrode 81, the pattern electrode 83, and the mounting transmission electrode 11c filled with dots transmit the transmission signal before being subjected to the filtering process by the transmission filter, and the common electrodes 71 and 82 filled with dots and In the mounting common electrode 11a, the transmission signal after being subjected to the filter processing by the transmission filter is transmitted.

Further, as shown in FIG. 4, each electrode electrically connected to the first ground electrode 9 and hatched, common electrodes 71 and 82 filled with a point where a transmission signal is transmitted, and transmission electrodes 81, the pattern electrode 83, the mounting common electrode 11a, and the mounting transmitting electrode 11c are arranged without overlapping in a plan view (see a region α surrounded by a dotted line in FIG. 1).

In addition, each hatched electrode electrically connected to the first ground electrode 9 has a common electrode 71, 82, a transmission electrode 81, a pattern filled with a transmission signal in a plan view. The electrode 83, the mounting common electrode 11a, the mounting transmission electrode 11c, and the reception electrode 72 are disposed.

(Production method)
Next, an outline of an example of a method for manufacturing the duplexer 1 of FIG. 1 will be described.

First, a via hole is formed in a ceramic green sheet formed in a predetermined shape with a laser or the like, and a via conductor for interlayer connection is formed by filling the inside with a conductive paste or by performing via fill plating. Electrode patterns such as the two wiring electrodes 7 and 8, the first and second ground electrodes 9 and 10 and the mounting electrode 11 are printed with a conductive paste, and the dielectric layers 51 to 53 constituting the mounting substrate 5 are printed. A ceramic green sheet for forming the is prepared. Each ceramic green sheet has via conductors, first and second wiring electrodes 7 and 8, first and second ground electrodes 9, so that a large number of mounting substrates 5 can be formed at one time. A plurality of electrode patterns such as 10 and mounting electrodes 11 are provided.

Next, the dielectric layers 51 to 53 are laminated to form a laminated body. And the groove | channel for dividing | segmenting into each mounting board | substrate 5 after baking is formed so that the area | region of each mounting board | substrate 5 may be enclosed. Subsequently, the assembly of the mounting substrate 5 is formed by firing the laminated body at a low temperature.

Next, before being divided into individual mounting substrates 5, the reception filter element 2 and the reception filter element 3 are mounted on the mounting surface of the assembly of the mounting substrates 5, and the reception filter element 2 and the reception filter element 3 are The mounting surface of the assembly of the mounted mounting substrates 5 is filled with mold resin, and this is heated and cured, whereby the mold layer 6 is provided on each mounting substrate 5 to form an assembly of the duplexer 1. Is done. Then, the aggregate of the duplexers 1 is individually divided, and the duplexer 1 is completed.

In the duplexer 1 formed in this way, the transmission signal output from the transmission signal line Tx of the mother board to the transmission terminal 31 of the transmission filter element 3 via the LPF 4 and the transmission electrode 81 is input to the transmission filter. Then, a predetermined filtering process is performed, the signal is output from the common terminal 32 to the mounting substrate 5 side, and is output to the antenna line ANT of the mother substrate via the common electrode 82. Further, the reception signal input from the antenna line ANT of the mother board to the common terminal 21 of the reception filter element 2 via the common electrode 71 is input to the reception filter and subjected to a predetermined filtering process. Is output to the mounting substrate 5 side and is output to the reception signal line Rx of the mother substrate via the reception electrode 72 and the mounting reception electrode 11b.

The duplexer 1 is not limited to the above-described manufacturing method, and may be formed by a known general manufacturing method. The mounting substrate 5 is a printed circuit board, LTCC using resin, ceramic, polymer material, or the like. The substrate 5 can be formed of an alumina substrate, a glass substrate, a composite material substrate, a multilayer substrate, etc., and the mounting substrate 5 may be formed by selecting an optimal material according to the purpose of use of the duplexer 1. .

As described above, in this embodiment, the mounting substrate 5 on which the reception filter element 2 and the transmission filter element 3 having different pass bands are mounted has a signal transmission first for the reception filter element 2 and the transmission filter element 3. 1, first wiring electrodes 7 and 8 and first and second ground electrodes 9 and 10 for grounding are provided, respectively. The first ground electrode 9 connected to the ground terminal 23 of the reception filter element 2 and the second wiring electrode 8 connected to the transmission terminal 31 and the common terminal 32 of the transmission filter element 3 are in plan view. Since they are arranged without overlapping, the generation of parasitic capacitance between the first ground electrode 9 and the second wiring electrode 8 is suppressed, and the first ground electrode 9 and the second wiring electrode 8 are Electromagnetic coupling can be prevented.

Therefore, since the generation of parasitic capacitance between the first ground electrode 9 and the second wiring electrode 8 is suppressed, a transmission signal transmitted through the second wiring electrode 8 is transmitted to the first ground electrode 9. Leakage can be prevented and transmission signals transmitted through the second wiring electrode 8 can be prevented from being transmitted to the first wiring electrode 7 via the first ground electrode 9. The isolation characteristic between the reception filter element 2 and the transmission filter element 3 included in 1 can be improved.

That is, the transmission filter element 3 is provided with a transmission terminal 31 connected to the input side of the transmission filter and a common terminal 32 connected to the output side as signal terminals. The second wiring electrode 8 has a transmission electrode 81 connected to the transmission terminal 31 and a common electrode 82 connected to the common terminal 32, and the transmission electrode 81 and the common electrode 82 provide power for communication. The first ground electrode 9, the transmission electrode 81, and the common electrode 82 are arranged so as not to overlap each other in plan view, so that the first ground electrode 9 is transmitted. 9 is prevented from being generated between the transmission electrode 81 and the common electrode 82, and the first ground electrode 9, the transmission electrode 81, and the common electrode 82 are prevented from being electromagnetically coupled. be able to.

Therefore, since the generation of parasitic capacitance between the first ground electrode 9 and the transmission electrode 81 and the common electrode 82 is suppressed, a transmission signal for communication having a large output that transmits the transmission electrode 81 and the common electrode 82. However, since leakage to the first ground electrode 9 is prevented and transmission signals can be prevented from being transmitted to the first wiring electrode 7 through the first ground electrode 9, it is very practical. Is.

Further, by providing a pattern electrode 83 that forms a filter circuit connected to the transmission terminal 81 of the transmission filter element 3 as the second wiring electrode 8, a transmission signal input to the transmission filter of the transmission filter element 3 is provided. Filter processing by various filter circuits can be performed.

Further, since the pattern electrode 83 forming the filter circuit is arranged so as not to overlap the first ground electrode 9 in plan view, a parasitic capacitance is generated between the first ground electrode 9 and the pattern electrode 83. Therefore, the first ground electrode 9 and the pattern electrode 83 can be prevented from being electromagnetically coupled.

Therefore, since the generation of parasitic capacitance between the first ground electrode 9 and the pattern electrode 83 is suppressed, a transmission signal for communication having a large output that transmits the pattern electrode 83 is transmitted to the first ground electrode 9. It is possible to prevent the transmission signal from being transmitted to the first wiring electrode 7 through the first ground electrode 9.

Further, since the first ground electrode 9 is disposed between the transmission electrode 81 and the common electrodes 71 and 82 and the reception electrode 72 in plan view, the first ground electrode 9 that is grounded transmits the first ground electrode 9. Since the transmission signal for communication having a large output transmitted through the electrode 31 and the common electrodes 71 and 82 is prevented from leaking to the reception electrode 72, further isolation characteristics between the reception filter element 2 and the transmission filter element 3 are obtained. Can be improved.

The reception filter element 2 is provided with a plurality of ground terminals 23, and has a large area of the first area having a flat pattern shape that is arranged so as to overlap each ground terminal 23 of the reception filter element 2 in plan view. Since each ground terminal 23 of the reception filter element 2 is grounded by the ground electrode 9, the grounding state of the reception filter element 2 can be improved, so that the reception filter element 2 and the transmission filter element 3 are connected to each other. Isolation characteristics can be improved.

Among the plurality of mounting electrodes 11 provided on the back surface of the mounting substrate 5, some of the mounting electrodes 11 e connected to the first ground electrode 9 are larger than the other mounting electrodes 11. Since it has an area, for example, a part of the mounting electrode 11e having a large area is arranged between a plurality of other mounting electrodes 11 connected to the first and second wiring electrodes 7 and 8. Thus, electrical interference between the plurality of other mounting electrodes 11 can be suppressed.

Further, the first ground electrode 9 and a part of the mounting electrode 11e having a large area are electrically connected by a plurality of via conductors, so that the parasitic inductance generated in the plurality of via conductors can be reduced. The first ground electrode 9 can be grounded in an ideal state.

<Second Embodiment>
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a plan view showing an example of the electrode shape of the mounting substrate in the second embodiment of the present invention, and FIGS. 5A to 5C show the electrode shapes in the respective dielectric layers of the mounting substrate. FIG. 6 is a plan view showing a modification of the electrode shape of the mounting substrate.

As shown in FIG. 5, this embodiment is different from the first embodiment described above in that the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.

In this embodiment, as shown in FIG. 5 (a), the second ground electrode 10 disposed substantially above the center of the dielectric layer 51 is divided into two parts and disposed on the upper side. The ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10, and the unconnected terminal of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10 arranged on the lower side. . In addition, the second ground electrode 10 is disposed in the lower left portion of the dielectric layer 51 with an electrode pattern formed so as to be long in the vertical direction. A ground terminal 33 is connected.

Further, as shown in FIG. 5C, the mounting electrodes 11 arranged on the back surface of the dielectric layer 53 are arranged point-symmetrically with the center of gravity of the duplexer 1 as the rotation center in plan view. Yes. With this configuration, each mounting electrode 11 is arranged point-symmetrically with the center of gravity of the duplexer 11 as the center of rotation. Therefore, when the duplexer 1 is mounted on the module substrate of the circuit module, the duplexer 1 is prevented from tilting. Therefore, mountability such as mounting accuracy and mounting strength when the duplexer 1 is mounted on the module substrate of the circuit module can be improved.

Further, as shown in the modification of the electrode shape of the mounting substrate in FIG. 6, the size and shape of each mounting electrode 11 formed on the back surface of the dielectric layer 53 may be formed identically. If it does in this way, when mounting the splitter 1, the design of the mask for solder printing used when printing a solder paste can be made easy. Further, when the duplexer 1 is mounted on the module substrate of the circuit module, the stress applied to the mounting surface between the duplexer 1 and the module substrate due to impact caused by dropping or expansion / contraction of the substrate accompanying heating and cooling, It can be uniformly dispersed in each mounting electrode 11.

Further, at this time, as shown in FIG. 6, a notch 11 g may be provided in a part of the mounting electrodes 11 formed on the back surface of the dielectric layer 53, or a recognition mark 11 h may be provided on the back surface of the dielectric layer 53. . With this configuration, the mounting electrodes 11 are formed in the same shape and the same size on the back surface of the duplexer 1 (dielectric layer 53), and the mounting electrodes 11 are point-symmetric. Even if it is arranged, it is possible to recognize the vertical direction in plan view of the duplexer 1 by recognizing the notch 11g or the recognition mark 11h, so each mounting electrode formed on the back surface of the duplexer 1 11 electrode characteristics can be recognized without error.

<Third Embodiment>
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 7 is a plan view showing an example of the electrode shape of the mounting substrate according to the third embodiment of the present invention. FIGS. 7A to 7C show the electrode shapes in the respective dielectric layers of the mounting substrate.

This embodiment is different from the second embodiment described above in that, as shown in FIG. 7, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since other configurations are the same as those in the first and second embodiments described above, description of the configuration is omitted by giving the same reference numerals.

In this embodiment, as shown in FIG. 7 (c), among the mounting electrodes formed on the back surface of the dielectric layer 53, the mounting ground electrode disposed substantially above the center of the dielectric layer 51. 11d and 11e and the mounting common electrode 11a disposed on the lower side are formed to be larger than the areas of the other mounting electrodes 11.

Therefore, by forming the mounting ground electrodes 11d and 11e, which are disposed substantially above the center of the dielectric layer 51, in a large area, the mounting ground electrodes 11d and 11e and the dielectric layer 52 are disposed. Since the first and second ground electrodes 9 and 10 can be electrically connected by a plurality of via electrodes, the same effects as those of the first embodiment described above can be obtained.

Further, by increasing the area of the mounting common electrode 11 a disposed substantially below the center of the dielectric layer 51, the common electrodes 71 and 82 of the dielectric layer 51 and the mounting of the dielectric layer 53 are mounted. As shown in FIG. 7B, the common electrode 11a can be electrically connected by the common electrodes 71 and 82 of the dielectric layer 52 formed by via conductors. Therefore, the influence of electromagnetic noise can be reduced by electrically connecting the common electrodes 71 and 82 of the dielectric layer 51 and the mounting common electrode 11a of the dielectric layer 53 through the shortest path. .

<Fourth embodiment>
Next, a fourth embodiment of the present invention will be described with reference to FIG. FIG. 8 is a plan view showing an example of the electrode shape of the mounting substrate in the fourth embodiment of the present invention, and FIGS. 8A to 8C show the electrode shapes in the respective dielectric layers of the mounting substrate.

This embodiment is different from the first embodiment described above in that, as shown in FIG. 8, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.

In this embodiment, as shown in FIG. 8A, common electrodes 71 and 82 are disposed at substantially the center of the dielectric layer 51, and the common terminal 21 of the reception filter element 2 and the transmission filter element 3 are common. The terminal 32 is connected to the positions A1 and A2 of the common electrodes 71 and 82, respectively. Further, as shown in FIG. 8C, the mounting common electrode 11a is disposed at substantially the center of the dielectric layer 53 in correspondence with the positions of the common electrodes 71 and 82 of the dielectric layer 51. The common electrodes 71 and 82 of the body layer 51 and the mounting common electrode 11 of the dielectric layer 53 include the common electrodes 71 and 82 disposed substantially at the center of the dielectric layer 52 as shown in FIG. Electrically connected.

Also in this embodiment, the same effects as those of the first embodiment described above can be obtained.

<Fifth Embodiment>
Next, a fifth embodiment of the present invention will be described with reference to FIG. FIG. 9 is a plan view showing an example of the electrode shape of the mounting substrate according to the fifth embodiment of the present invention. FIGS. 9A to 9C show the electrode shapes in the respective dielectric layers of the mounting substrate.

This embodiment differs from the first embodiment described above in that, as shown in FIG. 9, the shape of each electrode provided on each dielectric layer 51 to 53 of the mounting substrate and a part of the arrangement position are different. Since the other configuration is the same as that of the first embodiment, description of the configuration is omitted by giving the same reference numerals.

In this embodiment, as shown in FIG. 9A, the second ground electrode 10 disposed substantially above the center of the dielectric layer 51 is divided into two parts and is disposed on the upper side. The ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10, and the unconnected terminal of the transmission filter element 3 is connected to the position NC2 of the second ground electrode 10 arranged on the lower side. . Further, the ground terminal 33 of the transmission filter element 3 is connected to the position G2 of the second ground electrode 10 disposed on the left side of the approximate center of the dielectric layer 51.

Further, as shown in FIG. 9B, two second ground electrodes 10 are arranged vertically above the approximate center of the dielectric layer 52. Then, the second ground electrode 10 disposed on the upper side of the two second ground electrodes 10 disposed substantially above the center of the dielectric layer 51 by the upper second ground electrode 10. Are electrically connected to the mounting ground electrode 11e disposed substantially above the center of the dielectric layer 53. In addition, the second ground electrode 10 disposed on the lower side of the two second ground electrodes 10 disposed substantially above the center of the dielectric layer 51 by the second ground electrode 10 on the lower side. The electrode 10 is electrically connected to the mounting unconnected electrode 11f disposed substantially at the center of the dielectric layer 53.

As described above, in this embodiment, unlike the above-described embodiment, the first ground electrode 9 and the second ground electrode 10 are arranged in an electrically insulated state. Therefore, even if signals transmitted through the first and second wiring electrodes 7 and 8 leak to the first and second ground electrodes 9 and 10, respectively, the first and second ground electrodes 9 and 10 are electrically connected. Since the first and second ground electrodes 9 and 10 are prevented from being transmitted to the other ground electrodes, the first and second ground electrodes 9 and 10 are prevented from being transmitted to each other. The isolation characteristics between the filter elements 2 and 3 can be further improved.

In this embodiment, the ground terminal 33 and the unconnected terminal of the transmission filter element 3 are electrically insulated from each other, and the mounting ground electrode 11e and the mounting ground electrode provided on the back surface of the dielectric layer 53, respectively. It is electrically connected to the unconnected electrode 11f. Therefore, the common terminals 21 and 32, the reception terminal 22, the transmission terminal 31, the ground terminal 23 of the reception filter element 2, and the ground terminal 33 of the transmission filter element 3 are electrically insulated from each other. Since the respective electrodes 11 are electrically connected to the mounting electrodes 11 provided on the back surface of the dielectric layer 53, respectively, electrical mutual interference between the terminals can be reduced. The isolation characteristics between the filter elements 2 and 3 can be further improved.

Note that the present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the first filter element of the present invention is formed by the reception filter element 2, and the second filter element of the present invention is formed by the transmission filter element 3, but the first and second filters The elements may be formed by the transmission filter element 3 and the reception filter element 2, respectively.

The present invention can be widely applied to a duplexer including a first filter element and a second filter element having different pass bands.

1 demultiplexer 2 reception filter element (first filter element)
21 Common terminal 22 Reception terminal 23 Ground terminal 3 Transmission filter element (second filter element)
31 Transmission terminal 32 Common terminal 33 Ground terminal 4 Low-pass filter (filter circuit)
5 mounting substrate 7 first wiring electrode 71 common electrode 72 reception electrode 8 second wiring electrode 81 transmission electrode 82 common electrode 83 pattern electrode 9 first ground electrode 10 second ground electrode 11 mounting electrode

Claims (7)

  1. A first filter element and a second filter element having different passbands;
    A mounting substrate on which the first and second filter elements are mounted;
    The mounting board includes first and second wiring electrodes for signal transmission and first and second ground electrodes for grounding, which are provided for the first and second filter elements, respectively.
    The first ground electrode connected to the ground terminal of the first filter element and the second wiring electrode connected to the signal terminal of the second filter element do not overlap in a plan view. A duplexer characterized by being arranged.
  2. 2. The first ground electrode and the second ground electrode connected to a ground terminal of the second filter element are disposed in an electrically insulated state. The duplexer described in 1.
  3. The second filter element includes a transmission filter for a transmission signal;
    In the second filter element, a transmission terminal connected to the input side of the transmission filter and a common terminal connected to the output side are provided as the signal terminals of the second filter element,
    The component according to claim 1, wherein the second wiring electrode includes a transmission electrode connected to the transmission terminal and a common electrode connected to the common terminal of the second filter element. Waver.
  4. The duplexer according to claim 3, wherein the second wiring electrode further includes a pattern electrode forming a filter circuit connected to the transmission terminal.
  5. The first wiring electrode is connected to a signal terminal of the first filter element;
    The first filter element includes a reception filter for a reception signal;
    In the first filter element, a common terminal connected to the input side of the reception filter and a reception terminal connected to the output side are provided as the signal terminals of the first filter element,
    The first wiring electrode has a common electrode connected to a common terminal of the first filter element and a receiving electrode connected to the receiving terminal,
    The common electrode of the first wiring electrode and the common electrode of the second wiring electrode are electrically connected;
    The first ground electrode is arranged between the transmission electrode and the common electrode of each of the first and second wiring electrodes and the reception electrode in plan view. The duplexer according to 3 or 4.
  6. The first filter element is provided with a plurality of ground terminals,
    The first ground electrode has a flat pattern shape arranged so as to overlap the ground terminals of the first filter element in plan view. The duplexer described.
  7. A plurality of mounting electrodes provided on the back surface of the mounting substrate;
    Some of the mounting electrodes connected to the first ground electrode have a larger area than the other mounting electrodes,
    7. The duplexer according to claim 1, wherein the first ground electrode and the part of the mounting electrodes are electrically connected by a plurality of via conductors.
PCT/JP2012/004401 2011-07-20 2012-07-06 Demultiplexer WO2013011649A1 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154942A (en) * 2013-02-05 2014-08-25 Taiyo Yuden Co Ltd High frequency module
WO2015016203A1 (en) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexer
JP2016096439A (en) * 2014-11-13 2016-05-26 太陽誘電株式会社 Acoustic wave device, transmission/reception device and mobile communication equipment

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303931A (en) * 2005-04-21 2006-11-02 Fujitsu Ltd Filter and wave divider
WO2008146525A1 (en) * 2007-05-28 2008-12-04 Murata Manufacturing Co., Ltd. Duplexer and elastic wave device
JP2009225198A (en) * 2008-03-17 2009-10-01 Tdk Corp Surface acoustic wave device
JP2009296508A (en) * 2008-06-09 2009-12-17 Fujitsu Ltd Branching filter
JP2011139316A (en) * 2009-12-28 2011-07-14 Kyocera Corp Elastic wave device, and method of manufacturing the same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303931A (en) * 2005-04-21 2006-11-02 Fujitsu Ltd Filter and wave divider
WO2008146525A1 (en) * 2007-05-28 2008-12-04 Murata Manufacturing Co., Ltd. Duplexer and elastic wave device
JP2009225198A (en) * 2008-03-17 2009-10-01 Tdk Corp Surface acoustic wave device
JP2009296508A (en) * 2008-06-09 2009-12-17 Fujitsu Ltd Branching filter
JP2011139316A (en) * 2009-12-28 2011-07-14 Kyocera Corp Elastic wave device, and method of manufacturing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014154942A (en) * 2013-02-05 2014-08-25 Taiyo Yuden Co Ltd High frequency module
WO2015016203A1 (en) * 2013-08-02 2015-02-05 株式会社村田製作所 Duplexer
JP5862842B2 (en) * 2013-08-02 2016-02-16 株式会社村田製作所 Demultiplexer
CN105409121A (en) * 2013-08-02 2016-03-16 株式会社村田制作所 Duplexer
US9680446B2 (en) 2013-08-02 2017-06-13 Murata Manufacturing Co., Ltd. Demultiplexing apparatus with heat transfer via electrodes
JP2016096439A (en) * 2014-11-13 2016-05-26 太陽誘電株式会社 Acoustic wave device, transmission/reception device and mobile communication equipment

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