WO2014013831A1 - Module, et procédé de fabrication de module - Google Patents

Module, et procédé de fabrication de module Download PDF

Info

Publication number
WO2014013831A1
WO2014013831A1 PCT/JP2013/066788 JP2013066788W WO2014013831A1 WO 2014013831 A1 WO2014013831 A1 WO 2014013831A1 JP 2013066788 W JP2013066788 W JP 2013066788W WO 2014013831 A1 WO2014013831 A1 WO 2014013831A1
Authority
WO
WIPO (PCT)
Prior art keywords
module
resin layer
electronic component
substrate
mounting surface
Prior art date
Application number
PCT/JP2013/066788
Other languages
English (en)
Japanese (ja)
Inventor
秀司 大和
宏通 北嶋
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2014013831A1 publication Critical patent/WO2014013831A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves

Definitions

  • the present invention relates to a module in which an electronic component mounted on a mounting surface of a module substrate is sealed with a resin, and a method for manufacturing the module.
  • a module substrate 501 As shown in a conventional module 500 of FIG. 5, this type of module is a module substrate 501, various electronic components 502 mounted on the mounting surface of the module substrate 501, and a wiring substrate that covers the electronic component 502. And a resin layer 503 provided on the mounting surface 501.
  • the module substrate 501 is formed by laminating a plurality of insulating layers formed of a resin material or a ceramic material.
  • the module substrate 501 includes a pattern electrode formed of a metal material such as Au, Ag, Cu, Pt, or Pd.
  • a wiring electrode 504 made of a via conductor is provided.
  • the resin layer 503 is formed of a thermosetting resin material such as phenol resin or epoxy resin, or a photocurable resin material such as photocurable epoxy resin, polyimide resin, or acrylic resin on the mounting surface of the module substrate 501. It is filled and formed. In this way, the electronic component 502 mounted on the mounting surface of the module substrate 501 is covered with the resin layer 503, so that the electronic component 502 is protected by the resin layer 503.
  • the module 500 is used by being mounted on another board such as a mother board included in various apparatuses, for example, but the resin on the mounting surface of the module board 501 by mounting the electronic component 502 is filled with resin.
  • an adsorption surface for adsorbing and holding the module 500 by the conveyance device having an adsorption mechanism for conveying the module 500 onto another substrate such as a mother substrate is formed by the upper surface of the resin layer 503. Improved handling.
  • JP 2010-80901 A paragraphs 0056, 0057, FIG. 3, etc.
  • an adsorption surface for adsorbing and holding the module 500 by the conveying device that conveys the module 500 onto another substrate such as a mother substrate is formed by the upper surface of the resin layer 503, and the resin layer 503 is the module layer 503. It was a hindrance to the 500 height reduction. Further, in order to prevent the characteristics of the electronic component 502 included in the module 500 from fluctuating or deteriorating due to heat generation, it is desirable to take measures against heat dissipation in the module 500. However, a reduction in the height of the module 500 is required. Therefore, a heat dissipation measure that does not increase the thickness of the module 500 is desired.
  • the present invention has been made in view of the above problems, and has as its first object to provide a technique capable of reducing the height of a module without impairing handling properties, and suppresses an increase in the thickness of the module.
  • a second object is to provide a technique capable of improving the heat dissipation performance.
  • the module of the present invention includes a module substrate, an electronic component mounted on the mounting surface of the module substrate, and the mounting surface so as to cover a side surface of the electronic component. And an upper surface of each of the electronic component and the resin layer forms the same surface.
  • the module manufacturing method of the present invention includes a step of mounting an electronic component on the mounting surface of the module substrate, and a step of forming a resin layer by filling the mounting surface with resin so as to cover the side surface of the electronic component. And a step of grinding or polishing the resin layer and the electronic component such that the upper surfaces of the electronic component and the resin layer form the same surface.
  • the same surface is formed by the upper surface of each of the electronic component mounted on the mounting surface of the module substrate and the resin layer provided on the mounting surface so as to cover the side surface of the electronic component. . Therefore, even though the thickness of the resin layer is suppressed by the thickness of the electronic component, the module is transported by the transport device by holding the same surface formed by the upper surfaces of the electronic component and the resin layer by suction. Therefore, it is possible to reduce the height of the module without impairing handling properties.
  • the module of the present invention is characterized in that a metal film is formed on at least a part of the upper surfaces of the electronic component and the resin layer.
  • the module manufacturing method of the present invention is further characterized by further comprising a step of forming a metal film on at least a part of the upper surfaces of the electronic component and the resin layer.
  • the electronic component provided on the mounting surface of the module substrate and the metal film formed on at least a part of the upper surface of the resin layer function as a heat sink, so screen printing, vapor deposition, sputtering, etc.
  • the resin layer may be provided on the periphery of the electronic component with a conductor wall disposed so that one principal surface thereof faces the side surface of the electronic component connected to the metal film.
  • a conductor via connected to the metal film may be provided around the electronic component.
  • the heat generated in the electronic component is dissipated from the metal film on the top surface of the resin layer through the conductor walls and conductor vias provided around the electronic component of the resin layer, so the heat dissipation of the module Can be further improved.
  • the metal film is provided so as to cover an upper surface of the electronic component, and a conductor for electrically connecting the metal film and a wiring electrode formed on the module substrate is provided on the resin layer. It may be done.
  • the metal film provided to cover the upper surface of the electronic component is electrically connected to the wiring electrode formed on the module substrate via the conductor provided on the resin layer. Since it functions as a shield electrode, the shield performance of the module can be improved. Further, if a conductor wall or a conductor via connected to a metal film electrically connected to the wiring electrode formed on the module substrate via a conductor is provided around the electronic component of the resin layer, the module substrate When other electronic components are mounted on the mounting surface, electrical interference between the electronic components can be suppressed.
  • the electronic component includes an element substrate formed of a piezoelectric body, an insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate, and the element substrate stacked on the insulating layer.
  • a cover layer forming a space surrounded by the insulating layer, and a SAW filter element formed by providing a comb electrode in the predetermined region, the cover layer facing the mounting surface
  • the upper surface formed by the other main surface of the element substrate may be exposed from the resin layer and mounted on the mounting surface.
  • the cover layer is arranged in a laminated manner on the insulating layer disposed so as to surround a predetermined region of one main surface of the element substrate formed by the piezoelectric substrate, so that the gap between the element substrate and the cover layer is achieved.
  • An electronic component having a SAW filter element formed by providing a comb electrode in a predetermined region of the element substrate in a space formed by being surrounded by an insulating layer is provided with a cover layer facing the mounting surface. The upper surface formed by the other main surface of the substrate is exposed from the resin layer and mounted on the mounting surface of the module substrate.
  • an electronic component having a SAW filter element is not a structure in which a SAW filter element is provided on a package substrate formed of a resin material or a ceramic material as in the prior art, but a comb-tooth electrode is provided directly on a piezoelectric substrate. Since the device substrate formed in this way is formed into a wafer level-chip size package (WL-CSP) structure that is cut out, the module formed by mounting electronic components on the module substrate is further reduced in height and size Can be achieved.
  • WL-CSP wafer level-chip size package
  • the electronic component is mounted on the mounting surface of the module substrate, and the mounting surface and the cover layer are formed by filling the resin between the mounting surface and the cover layer of the electronic component to form a resin layer.
  • the strength of the cover layer of the electronic component can be improved.
  • the metal film is provided on the other main surface of the element substrate (piezoelectric element), heat generated by applying electric power to the comb electrodes provided in a predetermined region of the one main surface of the element substrate is generated. Since the heat is efficiently dissipated through the metal film, it is possible to prevent the generated heat from damaging the SAW filter element or changing or deteriorating the characteristics of the SAW filter element. Therefore, the power dissipation of the electronic component can be improved by improving the heat dissipation of the module.
  • the same surface is formed by the upper surface of each of the electronic component mounted on the mounting surface of the module substrate and the resin layer provided on the mounting surface so as to cover the side surface of the electronic component.
  • the module can be transported by the transport device by sucking and holding the same surface formed by the upper surfaces of the electronic component and the resin layer, The module can be reduced in height without impairing handling properties.
  • FIG. 1 is a diagram showing a first embodiment of a module including the electronic component of the present invention.
  • FIG. 2 is a block diagram showing an electrical configuration of the module of FIG.
  • 3 and 4 showing the second and third embodiments described later are also illustrated in the same manner as in FIG. 1, and thus the description thereof is omitted below.
  • a module 1 shown in FIGS. 1 and 2 is mounted on a mother board provided in a communication portable terminal such as a mobile phone or a portable information terminal.
  • the module 1 includes a transmission filter element 14 and a reception filter element 15.
  • a duplexer 10 duplexer: equivalent to the “electronic component” of the present invention
  • a module substrate 2 a matching circuit 3
  • a ground electrode 4 and various electronic components such as a switch IC, a filter, a resistor, a capacitor, and a coil.
  • a resin layer 7 and a metal film 8 are provided and formed as a high-frequency antenna switch module.
  • the module 1 is mounted on the mother board, the module 1 is connected to various signal lines and power lines such as the antenna line ANT, the ground line GND, the transmission signal line Tx, and the reception signal line Rx provided in the mother board.
  • various signal lines and power lines such as the antenna line ANT, the ground line GND, the transmission signal line Tx, and the reception signal line Rx provided in the mother board.
  • transmission / reception signals are input / output between the mother board and the module 1.
  • the module substrate 2 is integrally formed as a ceramic laminate by laminating and firing a plurality of dielectric layers formed of ceramic green sheets. That is, the ceramic green sheet forming each dielectric layer is a sheet in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed into a sheet by a molding machine. So that it can be fired at a low temperature. Then, via holes are formed on the ceramic green sheet cut into a predetermined shape by laser processing, etc., and the formed via holes are filled with a conductive paste containing Ag, Cu, etc. Via conductors are formed, various electrode patterns are formed by printing with a conductive paste, and each dielectric layer is formed.
  • via conductors and electrode patterns are appropriately formed in each dielectric layer, so that wiring for connecting the duplexer 10 mounted on the module substrate 2 and electronic components such as the chip coil 3a to the module substrate 2 A pattern 5, a ground electrode 4, a mounting electrode 6 and the like are formed. That is, the electrode pattern and the via conductor are appropriately provided in each dielectric layer to form the ground electrode 4, the wiring pattern 5, the mounting electrode 6, and the like, so that the duplexer 10 mounted on the module substrate 2 and Electronic components such as the chip coil 3a and the mounting electrode 6 are electrically connected to each other.
  • a circuit element such as a capacitor or a coil is formed by the electrode pattern and via conductor formed in each dielectric layer, or a filter circuit or a matching circuit 3 is formed by the formed circuit element such as a capacitor or coil. May be.
  • the matching circuit 3 is formed by a chip coil 3a which is a chip component mounted on the mounting surface 2a of the module substrate 2, and is provided on the output side of the transmission filter element 14 and the input side of the reception filter element 15. It is connected via the common terminal 17 c of the duplexer 10.
  • the ground electrode 4 is disposed below the duplexer 10, provided on the mounting surface 2 a of the module substrate 2, and electrically connected to the ground line GND.
  • the ground electrode 4 is connected to the ground terminal electrode of the duplexer 10 by a connection electrode such as a solder ball (not shown).
  • the resin layer 7 is provided on the mounting surface 2 a so as to cover the side surface of the duplexer 10, and the same surface is formed by the upper surfaces of the duplexer 10 and the resin layer 7.
  • the height from the mounting surface 2a of the duplexer 10 is the highest, and the other electronic components are mounted on the mounting surface 2a.
  • a device whose height is lower than the height of the duplexer 10 is mounted on the mounting surface 2a.
  • the metal film 8 is formed of a metal such as Au (gold), Ag (silver), or Cu (copper) on the top surfaces of the duplexer 10 and the resin layer 7 by a method such as screen printing, vapor deposition, or sputtering. .
  • the duplexer 10 has a wafer level-chip size package (WL-CSP) structure, an element substrate 11, an insulating layer 12, a cover layer 13, and a transmission filter element 14 and a reception that have different high-frequency signal pass bands. And a filter element 15.
  • WL-CSP wafer level-chip size package
  • the element substrate 11 is formed of a piezoelectric body such as lithium niobate, lithium tantalate, or quartz. Further, comb electrodes 14a and 15a (IDT electrodes) formed of Al, Cu, or the like are provided in a predetermined region of one main surface 11a of the element substrate 11 to constitute a SAW (surface acoustic wave) filter element.
  • the transmission filter element 14 and the reception filter element 15 are formed by the SAW filter elements constituted by the comb electrodes 14a and 15a, respectively.
  • the duplexer 10 includes a transmission terminal 17 a connected to the input side of the transmission filter element 14, a reception terminal 17 b connected to the output side of the reception filter element 15, and the output side and reception of the transmission filter element 14.
  • a common terminal 17c (antenna terminal) connected to the input side of the filter element 15 and a ground terminal 17d are provided.
  • the reception filter element 15 has a balanced output type reception filter.
  • a terminal electrode 14b connected to the comb electrode 14a forming the transmission filter element 14 and a terminal connected to the comb electrode 15a forming the reception filter element 15 are provided on one main surface 11a of the element substrate 11.
  • An electrode 15b is provided on one main surface 11a of the element substrate 11.
  • the insulating layer 12 is disposed so as to surround a predetermined region in which the comb electrodes 14a and 15a on one main surface 11a of the element substrate 11 are provided.
  • the insulating layer 12 is formed by forming a resin layer on one main surface 11a of the element substrate 11 provided with the comb electrodes 14a and 15a and the terminal electrodes 14b and 15b by using a photosensitive epoxy resin or polyimide resin. Later, through a photolithography process, the resin layer is removed from the predetermined region where the comb electrodes 14a and 15a are provided and the region of the terminal electrodes 14b and 15b.
  • the cover layer 13 is laminated on the insulating layer 12 to form a space surrounded by the insulating layer 12 between the cover layer 13 and the element substrate 11, and the comb electrodes 14a and 15a (transmission filter elements) are formed in the formed space. 14 and the reception filter element 15) are arranged.
  • the cover layer 13 may be formed by, for example, filling a connection hole of a resin layer that is laminated on the insulating layer 12 with a photosensitive epoxy resin or polyimide resin through a photolithography process with a paste of Cu or Al or via-filling.
  • the electrodes 14c and 15c connected to the terminal electrodes 14b and 15b are formed by plating.
  • the duplexer 10 is formed by forming mounting solder balls 14d and 15d on the electrodes 14c and 15c that are connected to the connection terminals 14b and 15b and exposed from the cover layer 13, respectively.
  • the transmission filter element 14 and the reception filter element 15 included in the duplexer 10 are formed by SAW filter elements.
  • the element substrate 11 from, for example, a Si substrate
  • the transmission filter element is formed.
  • 14 and the reception filter element 15 may be formed of BAW filter elements.
  • the cover layer 13 faces the mounting surface 2 a of the module substrate 2, and the upper surface formed by the other main surface of the element substrate 11 is exposed from the resin layer 7 and mounted on the mounting surface 2 a. ing.
  • via holes are formed on a ceramic green sheet formed in a predetermined shape with a laser or the like, and a conductor paste is filled inside or via fill plating is performed to form a via conductor (wiring pattern 5) for interlayer connection.
  • Electrode patterns such as the mounting electrode 2a, the ground electrode 4, the land-like wiring pattern 5 and the mounting electrode 6 on the mounting surface 2a are printed with a conductive paste to form each dielectric layer constituting the module substrate 2.
  • a ceramic green sheet is prepared. Each ceramic green sheet is provided with a plurality of via conductors and electrode patterns so that a large number of module substrates 2 can be formed at a time.
  • each dielectric layer is laminated to form a laminate.
  • substrate 2 after baking is formed so that the area
  • the assembly of the module substrates 2 is formed by firing the laminate at a low temperature.
  • various electronic components such as the duplexer 10 and the chip coil 3 a are mounted on the mounting surface 2 a of the assembly of the module substrates 2.
  • the mounting surface 2 a of the assembly of the module substrates 2 is filled with resin so as to cover the side surfaces of the duplexer 10, and the resin layer 7 is provided on each module substrate 2 by heat curing.
  • an assembly of modules 1 is formed.
  • the resin layer 7 and the element substrate 11 of the duplexer 10 are ground or polished so that the respective top surfaces of the duplexer 10 and the resin layer 7 form the same surface. Then, after the metal film 8 is formed on the surfaces formed by the top surfaces of the duplexer 10 and the resin layer 7, the assembly of the modules 1 is divided individually, and the module 1 is completed.
  • the transmission signal output from the transmission signal line Tx of the mother board to the transmission terminal 17a of the duplexer 10 via the mounting electrode 6 and the wiring pattern 5 is transmitted to the transmission filter element 14.
  • the A reception signal input from the antenna line ANT of the mother board to the common terminal 17c of the duplexer 10 via the mounting electrode 6 and the wiring pattern 5 (matching circuit 3) is input to the reception filter element 15.
  • Predetermined filtering is performed, the signal is output from the reception terminal 17 b to the module substrate 2, and is output to the reception signal line Rx of the mother substrate via the wiring pattern 5 and the mounting electrode 6.
  • the module substrate 2 provided with the wiring pattern 5 and the module 1 including the duplexer 10 having the WL-CSP structure are not limited to the above-described manufacturing method, and may be formed by a known general manufacturing method.
  • the module substrate 2 can be formed of a printed circuit board, LTCC, alumina substrate, glass substrate, composite material substrate, single layer substrate, multilayer substrate, etc. using resin, ceramic, polymer material, etc. What is necessary is just to form the module board
  • each of the duplexer 10 mounted on the mounting surface 2a of the module substrate 2 and the resin layer 7 provided on the mounting surface 2a so as to cover the side surface of the duplexer 10 are provided.
  • the same surface is formed by the upper surface of each. Therefore, although the thickness of the resin layer 7 is suppressed to the thickness of the duplexer 10, the same surface formed by the upper surfaces of the duplexer 10 and the resin layer 7 is held by suction, etc. Since the module 1 can be transported by a transport device (not shown) having the above, the module 1 can be reduced in height without impairing handling properties.
  • the demultiplexing is performed by a method such as screen printing, vapor deposition, or sputtering.
  • a method such as screen printing, vapor deposition, or sputtering.
  • the cover layer 13 is laminated and disposed on the insulating layer 12 disposed so as to surround a predetermined region of the one main surface 11a of the element substrate 11 formed of the piezoelectric substrate, whereby the element substrate 11, the cover layer 13, A duplexer 10 having a SAW filter element formed by providing comb electrodes 14a and 15a in a predetermined region of the element substrate 11 in a space formed by being surrounded by an insulating layer 12 between The layer 13 faces the mounting surface 2 a, and the upper surface formed by the other main surface of the element substrate 11 is exposed from the resin layer 7 and mounted on the mounting surface 2 a of the module substrate 2.
  • the duplexer 10 including the SAW filter element is not a structure in which the SAW filter element is provided on the package substrate formed of a resin material or a ceramic material as in the conventional case, but the comb-tooth electrode 14a directly on the piezoelectric substrate. , 15a is formed in a wafer level-chip size package (WL-CSP) structure in which the element substrate 11 is cut out, and thus the duplexer 10 is mounted on the module substrate 2 and formed.
  • the module 1 can be further reduced in height and size.
  • the resin layer 7 is also formed by filling the resin between the mounting surface 2a and the cover layer 13 of the duplexer 10. Therefore, the mounting strength of the duplexer 10 can be improved by the resin filled between the mounting surface 2a and the cover layer 13, and the strength of the cover layer 13 of the duplexer 10 can be improved.
  • the metal film 8 is provided on the other main surface of the element substrate 11 formed of the piezoelectric element, power is supplied to the comb electrodes 14a and 15a provided in a predetermined region of the one main surface 11a of the element substrate 11. Since the heat generated by the application is efficiently dissipated through the metal film 8, the generated heat may damage the SAW filter element, or the characteristics of the SAW filter element may fluctuate or deteriorate. Can be prevented. Therefore, the heat resistance of the duplexer 10 can be improved by improving the heat dissipation of the module 1.
  • the adsorption by the adsorption mechanism of the transport device is obstructed.
  • a minute unevenness is formed on the upper surface of the module 1 to such an extent that it does not occur.
  • the metal film 8 is formed on the upper surface of the module 1 having minute irregularities, the minute irregularities are formed on the upper surface of the metal film 8, so that the heat dissipation efficiency by the metal film 8 functioning as a heat sink is improved. be able to.
  • the chip coil 3a is mounted on the mounting surface 2a of the module substrate 2 in order to form the matching circuit 3 connected to the transmission filter element 14 and the reception filter element 15, but the transmission filter element 14 or a chip component such as a chip capacitor is mounted on the mounting surface 2a together with the chip coil 3a or in place of the chip coil 3a according to the configuration of the circuit connected to the reception filter element 15 or 14. Also good.
  • FIG. 3 is a diagram showing a second embodiment of the module of the present invention.
  • This embodiment is different from the first embodiment described above in that, as shown in FIG. 3, one main surface facing the side surface of the duplexer 10 is in contact with the periphery of the duplexer 10 of the resin layer 7.
  • the conductive wall 8 a (corresponding to the “conductor” of the present invention) is provided connected to the metal film 8.
  • the metal film 8 provided so as to cover the upper surface of the duplexer 10 (the other main surface of the element substrate 11) and the wiring pattern 5 provided on the module substrate 2, it is connected to the ground line GND.
  • the wiring pattern 5 is electrically connected by the conductor wall 8a.
  • the side surface of the resin layer 7 is also covered with the metal film 8. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the metal film 8 provided so as to cover the upper surface of the duplexer 10 is electrically connected to the wiring pattern 5 formed on the module substrate 2 via the conductor wall 8 a provided on the resin layer 7. As a result, it is grounded and functions as a shield electrode, so that the shielding property of the module 1 can be improved.
  • the conductor wall 8a that is electrically connected to the wiring pattern 5 of the module substrate 2 and is grounded is provided around the duplexer 10, the conductor wall 8a is mounted on the mounting surface 2a of the module substrate 2. The electrical interference between the electronic component (chip coil 3a and the like) and the duplexer 10 can be suppressed.
  • the heat dissipation efficiency of the module 1 can be further improved.
  • the conductor wall 8a is disposed in contact with the side surface of the duplexer 10 in order to improve the thermal conductivity. However, a gap is provided between the conductor wall 8a and the duplexer 10. In this state, the conductor wall 8 a may be disposed around the duplexer 10 of the resin layer 7.
  • FIG. 4 is a diagram showing a third embodiment of the module of the present invention.
  • this embodiment is different from the second embodiment described above in that a via conductor 8b connected to the metal film 8 around the duplexer 10 of the resin layer 7 (the “conductor” of the present invention). Is equivalent).
  • the metal film 8 provided so as to cover the upper surface of the duplexer 10 (the other main surface of the element substrate 11) and the wiring pattern 5 provided on the module substrate 2, it is connected to the ground line GND.
  • the wiring pattern 5 is electrically connected by the via conductor 8b. Since other configurations are the same as those in the first embodiment, description of the configuration is omitted by giving the same reference numerals.
  • the duplexer 10 is described as an example of the electronic component of the present invention.
  • the electronic component may be a semiconductor element such as a BAW filter, a power amplifier, or a switch IC. It may be anything.
  • the metal film 8 only needs to be provided on at least a part of the upper surface of the module 1.
  • the module in which one duplexer is mounted on the module substrate has been described as an example.
  • a module is formed by mounting two or more duplexers on the module substrate.
  • a switch IC may be mounted on the module substrate, and a duplexer to be used may be selected and switched by the switch IC from a plurality of duplexers mounted on the module substrate.
  • the transmission filter element 14 and the reception filter element 15 are arranged in the same space, but two spaces surrounded by the insulating layer 12 are formed between the element substrate 11 and the cover layer 13.
  • the transmission filter element 14 and the reception filter element 15 may be arranged in each space.
  • the transmission filter element 14 and the reception filter element 15 are separated from each other in structure, so that, for example, heat generated when power is applied to the transmission filter element 14 is generated by the reception filter element 15. The influence on the characteristics can be suppressed.
  • the transmission filter element and the reception filter element can be configured as individual electronic components and mounted on the mounting surface 2a of the module substrate 2 to achieve the same effect.
  • the duplexer 10 formed as WL-CSP integrally including the transmission filter element 14 and the reception filter element 15 has been described as an example, but a plurality of element substrates, cover layers, and A duplexer may be formed by an insulating layer.
  • Two WL-CSP elements each having a reception filter element arranged in a space surrounded by an insulating layer formed between the element substrate and the cover layer are prepared, and these two elements are connected to the module substrate 2.
  • a duplexer may be configured by mounting on the board.
  • the present invention can be widely applied to modules in which electronic components mounted on a mounting surface of a module substrate are sealed with resin.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

L'invention fournit une technique permettant de réduire la hauteur d'un module sans amoindrir ses propriétés de manipulation. Une face unique est formée par les faces supérieures d'un séparateur d'ondes (10) monté sur une face de montage (2a) d'un substrat de module (2), et d'une couche de résine (7) agencée sur la face de montage (2a) de manière à recouvrir une face latérale du séparateur d'ondes (10). Ainsi, indépendamment de la restriction de l'épaisseur de la couche de résine (7) par le séparateur d'ondes (10), le module (1) peut être transféré par un dispositif de transfert (non illustré) qui notamment maintient par succion la face unique formée par les faces supérieures du séparateur d'ondes (10) et de la couche de résine (7), et qui possède un mécanisme de succion, et il est possible de réduire la hauteur du module (1) sans amoindrir ses propriétés de manipulation.
PCT/JP2013/066788 2012-07-19 2013-06-19 Module, et procédé de fabrication de module WO2014013831A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012160779 2012-07-19
JP2012-160779 2012-07-19

Publications (1)

Publication Number Publication Date
WO2014013831A1 true WO2014013831A1 (fr) 2014-01-23

Family

ID=49948666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2013/066788 WO2014013831A1 (fr) 2012-07-19 2013-06-19 Module, et procédé de fabrication de module

Country Status (1)

Country Link
WO (1) WO2014013831A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017199969A (ja) * 2016-04-25 2017-11-02 株式会社村田製作所 回路モジュール
WO2022034823A1 (fr) * 2020-08-12 2022-02-17 株式会社村田製作所 Module haute fréquence et dispositif de communication
WO2022044526A1 (fr) * 2020-08-31 2022-03-03 株式会社村田製作所 Module haute fréquence et dispositif de communication
WO2022181073A1 (fr) * 2021-02-26 2022-09-01 株式会社村田製作所 Module à ondes acoustiques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332654A (ja) * 2000-03-17 2001-11-30 Matsushita Electric Ind Co Ltd 電気素子内蔵モジュール及びその製造方法
JP2004129088A (ja) * 2002-10-04 2004-04-22 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2007157891A (ja) * 2005-12-02 2007-06-21 Murata Mfg Co Ltd 回路モジュールおよびその製造方法
WO2007114224A1 (fr) * 2006-03-29 2007-10-11 Kyocera Corporation Module de circuit, appareil de communication sans fil et procede de fabrication de module de circuit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332654A (ja) * 2000-03-17 2001-11-30 Matsushita Electric Ind Co Ltd 電気素子内蔵モジュール及びその製造方法
JP2004129088A (ja) * 2002-10-04 2004-04-22 Toyo Commun Equip Co Ltd 表面実装型ｓａｗデバイス、及びその製造方法
JP2007157891A (ja) * 2005-12-02 2007-06-21 Murata Mfg Co Ltd 回路モジュールおよびその製造方法
WO2007114224A1 (fr) * 2006-03-29 2007-10-11 Kyocera Corporation Module de circuit, appareil de communication sans fil et procede de fabrication de module de circuit

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017199969A (ja) * 2016-04-25 2017-11-02 株式会社村田製作所 回路モジュール
US10861900B2 (en) 2016-04-25 2020-12-08 Murata Manufacturing Co., Ltd. Circuit module
WO2022034823A1 (fr) * 2020-08-12 2022-02-17 株式会社村田製作所 Module haute fréquence et dispositif de communication
WO2022044526A1 (fr) * 2020-08-31 2022-03-03 株式会社村田製作所 Module haute fréquence et dispositif de communication
WO2022181073A1 (fr) * 2021-02-26 2022-09-01 株式会社村田製作所 Module à ondes acoustiques

Similar Documents

Publication Publication Date Title
JP5510613B2 (ja) 回路モジュール
KR102436686B1 (ko) 내장형 rf 필터 패키지 구조 및 그 제조 방법
US9743519B2 (en) High-frequency component and high-frequency module including the same
US10305444B2 (en) Electronic component module
KR101622452B1 (ko) 모듈 기판 및 모듈
WO2014017228A1 (fr) Module
US11825603B2 (en) High-frequency module
JP5807675B2 (ja) 回路モジュール
JP6282410B2 (ja) モジュール
JP5621920B2 (ja) 回路モジュール
US20140016293A1 (en) High frequency module having surface acoustic wave device and method for manufacturing the same
US9461621B2 (en) Duplexer and module including the same
WO2014013831A1 (fr) Module, et procédé de fabrication de module
JP4527570B2 (ja) 高周波モジュ−ル及びそれを搭載した無線通信装置
JP5618003B2 (ja) 回路モジュール
US20130307636A1 (en) Composite electronic component
JP5107281B2 (ja) 電子部品、デュープレクサ、通信モジュール、通信装置、および電子部品の製造方法
JP2006211144A (ja) 高周波モジュール及び無線通信機器
US9379685B2 (en) Built-in-circuit substrate and composite module
JP6032229B2 (ja) 積層型セラミック電子部品
JP2004282175A (ja) ダイプレクサ内蔵配線基板
KR20040044572A (ko) 칩 스케일 패키지 제조방법

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13820240

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13820240

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP