WO2013008494A1 - Dispositif de filtre d'ondes élastiques - Google Patents

Dispositif de filtre d'ondes élastiques Download PDF

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Publication number
WO2013008494A1
WO2013008494A1 PCT/JP2012/058815 JP2012058815W WO2013008494A1 WO 2013008494 A1 WO2013008494 A1 WO 2013008494A1 JP 2012058815 W JP2012058815 W JP 2012058815W WO 2013008494 A1 WO2013008494 A1 WO 2013008494A1
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WO
WIPO (PCT)
Prior art keywords
electrode
wave filter
piezoelectric substrate
output
input
Prior art date
Application number
PCT/JP2012/058815
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English (en)
Japanese (ja)
Inventor
隆礼 乗地
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2013523844A priority Critical patent/JP5648745B2/ja
Priority to CN201280028978.8A priority patent/CN103609020B/zh
Publication of WO2013008494A1 publication Critical patent/WO2013008494A1/fr

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/0023—Balance-unbalance or balance-balance networks
    • H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
    • H03H9/0047—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks
    • H03H9/0052—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded
    • H03H9/0057—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
    • H03H9/1092—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a cover cap mounted on an element forming part of the surface acoustic wave [SAW] device on the side of the IDT's

Definitions

  • Patent Document 1 As a method of reducing the parasitic capacitance formed between the wirings, for example, as described in Patent Document 1, a method of forming an insulating layer having a dielectric constant lower than that of the piezoelectric substrate under the wiring is conceivable.
  • an insulating layer is interposed between the ground wiring and the output-side signal wiring.
  • the main object of the present invention is to provide an elastic wave filter device having excellent attenuation characteristics outside the passband.
  • An elastic wave filter device is an elastic wave filter device including an input terminal, an output terminal, and an elastic wave filter unit.
  • the elastic wave filter unit is connected between the input terminal and the output terminal.
  • the acoustic wave filter device includes a piezoelectric substrate, an input pad electrode, an output pad electrode, a filter electrode section, an input signal wiring, an output signal wiring, and a ground wiring.
  • the input pad electrode is disposed on the piezoelectric substrate.
  • the input pad electrode constitutes an input terminal.
  • the output pad electrode is disposed on the piezoelectric substrate.
  • the output pad electrode constitutes an output terminal.
  • the filter electrode portion is disposed on the piezoelectric substrate.
  • the filter electrode part constitutes an elastic wave filter part.
  • the input signal wiring is arranged on the piezoelectric substrate.
  • the input signal wiring connects the filter electrode portion and the input pad electrode.
  • the output signal wiring is arranged on the piezoelectric substrate.
  • the output signal wiring connects the filter electrode portion and the output pad electrode.
  • the ground wiring is arranged on the piezoelectric substrate.
  • the ground wiring is connected to the ground potential.
  • the input signal wiring has an adjacent portion adjacent to the output signal wiring. The distance between the adjacent portion and the ground wiring is shorter than the distance between the adjacent portion and the output signal wiring.
  • the ground wiring is arranged so as to overlap the adjacent portion, and the elastic wave filter device according to the present invention insulates the ground wiring from the adjacent portion.
  • An insulating layer is arranged so as to overlap the adjacent portion, and the elastic wave filter device according to the present invention insulates the ground wiring from the adjacent portion.
  • the filter electrode unit has a plurality of IDT electrodes arranged along the elastic wave propagation direction.
  • the elastic wave filter unit is a filter unit having a balanced-unbalanced conversion function.
  • the output pad electrode includes two parallel output pad electrodes.
  • the input pad electrode includes first and second input pad electrodes.
  • the output pad electrode includes first and second output pad electrodes.
  • the filter electrode portion includes a first filter electrode portion connected between the first input pad electrode and the first output pad electrode, and a gap between the second input pad electrode and the second output pad electrode. And a connected second filter electrode part.
  • the piezoelectric substrate has a rectangular shape. The first and second input pad electrodes are arranged along one side of the two opposite sides of the piezoelectric substrate, while the first and second output pad electrodes are on the other side. It is arranged along the side.
  • an elastic wave filter device having excellent attenuation characteristics outside the passband can be provided.
  • FIG. 1 is a schematic cross-sectional view of an acoustic wave filter device according to an embodiment of the present invention.
  • FIG. 2 is a schematic plan view of an acoustic wave filter chip according to an embodiment of the present invention.
  • FIG. 3 is a schematic plan view of an acoustic wave filter chip in a comparative example.
  • FIG. 4 is a graph showing insertion loss when a signal is applied from the first input pad electrode 31a to the balanced output pad electrode 32a1.
  • FIG. 5 is a graph showing insertion loss when a signal is applied from the first input pad electrode 31a to the balanced output pad electrode 32a2.
  • FIG. 6 is a graph showing insertion loss when balanced output pad electrodes 32a1 and 32a2 are balancedly connected.
  • FIG. 1 is a schematic cross-sectional view of an acoustic wave filter device according to this embodiment.
  • the elastic wave filter device 1 shown in FIG. 1 includes a reception filter unit corresponding to a communication system of GSM (registered trademark) 850 (used band: 869 to 894 MHz), GSM (registered trademark) 900 (used band: 925 to 960 MHz).
  • a total of four reception filter units 21 to 24 corresponding to the reception filter units are provided.
  • the acoustic wave filter device 1 may be a surface acoustic wave filter device using a surface acoustic wave or a boundary acoustic wave filter device using a boundary acoustic wave.
  • the elastic wave filter device 1 includes a wiring board 10 and an elastic wave filter chip 11.
  • the acoustic wave filter chip 11 is flip-chip mounted on the mounting surface 10 a of the wiring substrate 10.
  • the elastic wave filter chip 11 is connected to an electrode 13 disposed on the back surface 10 b of the wiring substrate 10.
  • the acoustic wave filter chip 11 is sealed with a resin sealing material 12 provided on the wiring substrate 10.
  • the elastic wave filter device 1 has a CSP (chip size package) structure.
  • the wiring board 10 is made of alumina will be described.
  • the constituent material of the wiring board is not particularly limited in the present invention.
  • the wiring board 10 can be made of, for example, an appropriate ceramic material or resin material.
  • the acoustic wave filter chip 11 includes a piezoelectric substrate 20.
  • the piezoelectric substrate 20 has a rectangular shape.
  • the piezoelectric substrate 20 can be composed of, for example, a LiTaO 3 substrate, a LiNbO 3 substrate, a quartz substrate, or the like. In the present embodiment, a case where the piezoelectric substrate 20 is composed of a LiTaO 3 substrate will be described.
  • a first filter electrode portion 21a On the surface 20a of the piezoelectric substrate 20 on the wiring substrate 10 side, a first filter electrode portion 21a, a second filter electrode portion 22a, a third filter electrode portion 23a, and a fourth filter electrode portion 24a. And are arranged.
  • the first filter electrode portion 21 a constitutes the first elastic wave filter portion 21.
  • the second filter electrode part 22 a constitutes a second elastic wave filter part 22.
  • the third filter electrode part 23 a constitutes a third elastic wave filter part 23.
  • the fourth filter electrode part 24 a constitutes a fourth elastic wave filter part 24.
  • the first filter electrode portion 21 a is disposed on the surface 20 a of the piezoelectric substrate 20, and the first input pad electrode 31 a constituting the first input terminal 31 and the surface 20 a of the piezoelectric substrate 20.
  • the first output pad electrode 32 a constituting the first output terminal 32 is connected to the first output pad electrode 32 a.
  • the first output pad electrode 32 a includes two balanced output pad electrodes 32 a 1 and 32 a 2 disposed on the surface 20 a of the piezoelectric substrate 20.
  • the first input pad electrode 31 a and the first filter electrode portion 21 a are connected by an input signal wiring 41 disposed on the surface 20 a of the piezoelectric substrate 20.
  • the balanced output pad electrode 32a1 and the first filter electrode portion 21a are connected by an output signal wiring 51a disposed on the surface 20a of the piezoelectric substrate 20.
  • the balanced output pad electrode 32a2 and the first filter electrode portion 21a are connected by an output signal wiring 51b disposed on the surface 20a of the piezoelectric substrate 20.
  • the second filter electrode portion 22a is disposed on the surface 20a of the piezoelectric substrate 20, and includes a second input pad electrode 33a constituting the second input terminal 33, and balanced output pad electrodes 32a1 and 32a2. Connected between.
  • the second input pad electrode 33a and the second filter electrode portion 22a are connected by an input signal wiring 42 arranged on the surface 20a of the piezoelectric substrate 20.
  • the balanced output pad electrode 32a1 and the second filter electrode portion 22a are connected by an output signal wiring 51a.
  • the balanced output pad electrode 32a2 and the second filter electrode portion 22a are connected by an output signal wiring 51b.
  • the third filter electrode portion 23 a is arranged on the second input pad electrode 33 a and the second output pad electrode 34 a that is arranged on the surface 20 a of the piezoelectric substrate 20 and constitutes the second output terminal 34. Connected between.
  • the second output pad electrode 34 a includes two balanced output pad electrodes 34 a 1 and 34 a 2 disposed on the surface 20 a of the piezoelectric substrate 20.
  • the second input pad electrode 33a and the third filter electrode portion 23a are connected by an input signal wiring 43 arranged on the surface 20a of the piezoelectric substrate 20.
  • the balanced output pad electrode 34a1 and the third filter electrode portion 23a are connected by an output signal wiring 52a disposed on the surface 20a of the piezoelectric substrate 20.
  • the balanced output pad electrode 34a2 and the third filter electrode portion 23a are connected by an output signal wiring 52b disposed on the surface 20a of the piezoelectric substrate 20.
  • the fourth filter electrode portion 24a is connected between the first input pad electrode 31a and the balanced output pad electrodes 34a1 and 34a2.
  • the first input pad electrode 31 a and the fourth filter electrode portion 24 a are connected by an input signal wiring 44 disposed on the surface 20 a of the piezoelectric substrate 20.
  • the balanced output pad electrode 34a1 and the fourth filter electrode portion 24a are connected by an output signal wiring 52a.
  • the balanced output pad electrode 34a2 and the fourth filter electrode portion 24a are connected by an output signal wiring 52b.
  • the first filter electrode portion 21a and the fourth filter electrode portion 24a are commonly connected to the first input pad electrode 31a.
  • a second filter electrode portion 22a and a third filter electrode portion 23a are commonly connected to the second input pad electrode 33a.
  • a first filter electrode part 21a and a second filter electrode part 22a are commonly connected to the balanced output pad electrodes 32a1 and 32a2.
  • a third filter electrode portion 23a and a fourth filter electrode portion 24a are commonly connected to the balanced output pad electrodes 34a1 and 34a2.
  • the first and second input pad electrodes 31a and 33a are arranged along one side edge 20A of the two opposite edges 20A and 20B of the piezoelectric substrate 20.
  • the balanced output pad electrodes 32a1 and 32a2 constituting the first output pad electrode 32a and the balanced output pad electrodes 34a1 and 34a2 constituting the second output pad electrode 34a are the end 20B of the piezoelectric substrate 20. Are arranged along.
  • Each of the first to fourth filter electrode portions 21a to 24a is a longitudinally coupled resonator type acoustic wave filter portion including a plurality of IDT electrodes 25 arranged along the elastic wave propagation direction.
  • Each of the first to fourth elastic wave filter units 21 to 24 is a balance type filter unit having a balance-unbalance conversion function. An unbalanced signal is input from the input terminals 31 and 33, and a balanced signal is output from the balanced output pad electrodes 32a1, 32a2, 34a1, and 34a2.
  • Each of the plurality of IDT electrodes 25 constituting the first to fourth filter electrode portions 21a to 24a is constituted by a pair of comb-like electrodes that are interleaved with each other.
  • One of the pair of comb electrodes is connected to the ground potential.
  • one comb-like electrode of the IDT electrode included in the first and second filter electrode portions 21a and 22a is connected to the ground electrode 51 connected to the ground potential.
  • one comb-like electrode of the IDT electrode included in the third and fourth filter electrode portions 23a and 24a is connected to the ground electrode 52 connected to the ground potential.
  • a ground wiring 61 connected to the ground electrode 51 and a ground wiring 62 connected to the ground electrode 52 are arranged.
  • the electrodes included in the acoustic wave filter chip 11, such as wiring, pad electrodes, and IDT electrodes, are, for example, metals selected from the group consisting of Al, Pt, Au, Ag, Cu, Ni, Ti, Cr, and Pd, Or it can also form with the alloy containing 1 or more types of metals chosen from the group which consists of Al, Pt, Au, Ag, Cu, Ni, Ti, Cr, and Pd.
  • the electrode may be comprised by the laminated body of the some conductive layer which consists of said metal and an alloy. In this embodiment, an example in which the electrode is made of an Al—Cu alloy will be described.
  • the input signal wiring 41 has an adjacent portion 41a adjacent to the output signal wiring 51a.
  • the input signal wiring 41 is provided such that the distance between the adjacent portion 41a and the ground wiring 61 is shorter than the distance between the adjacent portion 41a and the output signal wiring 51a.
  • the ground wiring 61 is arranged so that at least a part thereof overlaps the adjacent portion 41 a and the thickness direction of the wiring board 10.
  • An insulating layer 71 is disposed between the portion overlapping the adjacent portion 41a of the ground wiring 61 and the adjacent portion 41a. The insulating layer 71 insulates the portion overlapping the adjacent portion 41a of the ground wiring 61 from the adjacent portion 41a.
  • the input signal wiring 43 has an adjacent portion 43a adjacent to the output signal wiring 52b.
  • the input signal wiring 43 is provided such that the distance between the adjacent portion 43a and the ground wiring 62 is shorter than the distance between the adjacent portion 43a and the output signal wiring 52b.
  • the ground wiring 62 is arranged so that at least a part thereof overlaps the adjacent portion 43 a and the thickness direction of the wiring board 10.
  • An insulating layer 72 is disposed between the portion overlapping the adjacent portion 43a of the ground wiring 62 and the adjacent portion 43a. The insulating layer 72 insulates the portion overlapping the adjacent portion 43 a of the ground wiring 62 from the adjacent portion 43 a.
  • the insulating layers 71 and 72 can be made of a material having a high relative dielectric constant such as polyimide, epoxy resin, acrylic resin, or ceramic material.
  • the insulating layers 71 and 72 are preferably made of a material having a relative dielectric constant of 2 to 6.
  • a case where the insulating layers 71 and 72 are made of polyimide having a relative dielectric constant of about 3.5 and a relative dielectric constant smaller than that of the piezoelectric substrate 20 having a relative dielectric constant of 20 or more will be described.
  • the distance between the adjacent portions 41a and 43a and the ground wirings 61 and 62 is shorter than the distance between the adjacent portions 41a and 43a and the output signal wirings 51a and 52b. For this reason, an excellent attenuation characteristic outside the passband can be realized. This is thought to be due to the following reasons. That is, since the distance between the adjacent portions 41a and 43a and the ground wirings 61 and 62 is shorter than the distance between the adjacent portions 41a and 43a and the output signal wires 51a and 52b, the adjacent portions 41a and 43a and the output signal are output.
  • the parasitic capacitance formed between the adjacent portions 41a and 43a and the ground wirings 61 and 62 is larger than the parasitic capacitance formed between the wirings 51a and 52b. For this reason, the output signal wiring is not passed from the input signal wirings 41 and 43 through the acoustic wave filter units 21 to 24 via the parasitic capacitance formed between the adjacent parts 41a and 43a and the output signal wirings 51a and 52b. Signals are suppressed from flowing through 51a and 52b, and flow to the ground potential via the ground lines 61 and 62. As a result, it is considered that excellent attenuation characteristics outside the passband can be realized.
  • a surface acoustic wave filter device having a configuration substantially similar to that of the acoustic wave filter device 1 according to the above embodiment was manufactured.
  • the members having the structure are referred to by the same reference numerals.
  • FIG. 4 shows insertion loss when a signal is applied from the first input pad electrode 31a to the balanced output pad electrode 32a1.
  • FIG. 5 shows insertion loss when a signal is applied from the first input pad electrode 31a to the balanced output pad electrode 32a2.
  • FIG. 6 shows insertion loss when balanced connection is made between the balanced output pad electrodes 32a1 and 32a2. 4 to 6, the graphs indicated by dotted lines represent examples, and the graphs indicated by solid lines represent comparative examples.
  • the embodiment having the ground wiring 61 is greatly improved in attenuation characteristics outside the passband on the balanced output pad electrode 32a1 side than the comparative example.
  • the attenuation characteristics outside the passband are the same in the example and the comparative example.
  • the balance is improved between the balanced output pad electrode 32a1 side and the balanced output pad electrode 32a2 side, as shown in FIG. 6, in the differential output, the embodiment is larger than the comparative example and out of the passband. The damping characteristics have been improved.
  • the ground lines 61, 43a and the ground wirings 61, 62 are made shorter than the distances between the adjacent parts 41a, 43a and the output signal lines 51a, 52b. It can be seen that by providing 62, an excellent attenuation characteristic outside the passband can be realized.
  • a plurality of filter electrode portions are formed on one piezoelectric substrate 20, and input pad electrodes 31a and 33a and output pad electrodes 32a and 33a are formed on two opposite sides 20A and 20B of the piezoelectric substrate 20. Are arranged in such a manner that signal wirings having different potentials are close to each other. For this reason, the effect of improving the attenuation characteristics outside the pass band becomes more remarkable.
  • the ground wirings 61 and 62 can be formed in the same formation process as other wirings, and the insulating layers 71 and 72 can also be formed in the same formation process as other three-dimensional wiring insulating layers. Therefore, since it is not necessary to add a new process, an increase in manufacturing cost of the acoustic wave filter device can be suppressed.
  • the size of the parasitic capacitance generated between the adjacent portions 41a and 43a and the ground wirings 61 and 62 depends on the opposing area between the adjacent portions 41a and 43a and the ground wirings 61 and 62 and the thickness of the insulating layers 71 and 72. It can be adjusted by changing.
  • Balanced output pad electrode 33 ... second input terminal 33a ... second input pad electrode 34 ... second output terminal 34a ... second output pad electrode 34a1, 43a2 ... balanced output pad electrode 4 ⁇ 44 ... input signal lines 41a, 43a ... adjacent portions 51, 52 ... ground electrode 51a, 51b, 52a, 52b ... Output signal lines 61, 62 ... ground wire 71, 72 ... insulating layer

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)

Abstract

La présente invention concerne un dispositif de filtre d'ondes élastiques qui présente d'excellentes caractéristiques d'atténuation en dehors de la bande passante. Le dispositif de filtre d'ondes élastiques (1) est équipé de sections d'électrode de filtre (21a-24a) qui sont placées sur un substrat piézoélectrique (20) et qui constituent des sections de filtre d'ondes élastiques (21-24). Des lignes de signal d'entrée (41, 43) ont des sections limitrophes (41a, 43a) qui sont contiguës aux lignes de signal de sortie (51a, 52b). La distance entre chaque section limitrophe (41a, 43a) et une ligne de terre (61, 62) correspondante qui est connectée au potentiel de terre est plus courte que la distance entre la section limitrophe (41a, 43a) et la ligne de signal de sortie (51a, 52b) correspondante.
PCT/JP2012/058815 2011-07-11 2012-04-02 Dispositif de filtre d'ondes élastiques WO2013008494A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013523844A JP5648745B2 (ja) 2011-07-11 2012-04-02 弾性波フィルタ装置
CN201280028978.8A CN103609020B (zh) 2011-07-11 2012-04-02 弹性波滤波器装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011152980 2011-07-11
JP2011-152980 2011-07-11

Publications (1)

Publication Number Publication Date
WO2013008494A1 true WO2013008494A1 (fr) 2013-01-17

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JP (1) JP5648745B2 (fr)
CN (1) CN103609020B (fr)
WO (1) WO2013008494A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016063738A1 (fr) * 2014-10-20 2016-04-28 株式会社村田製作所 Dispositif à ondes élastiques et son procédé de fabrication
DE112016003390B4 (de) * 2015-07-28 2024-06-20 Murata Manufacturing Co., Ltd. Vorrichtung für elastische Wellen

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004282707A (ja) * 2003-02-24 2004-10-07 Murata Mfg Co Ltd 弾性表面波フィルタ、通信機
WO2006009021A1 (fr) * 2004-07-23 2006-01-26 Murata Manufacturing Co., Ltd. Dispositif à ondes de surface élastiques
WO2007083432A1 (fr) * 2006-01-18 2007-07-26 Murata Manufacturing Co., Ltd. Dispositif a ondes acoustiques de surface et dispositif a ondes acoustiques limites
JP2007259023A (ja) * 2006-03-23 2007-10-04 Matsushita Electric Ind Co Ltd 弾性表面波フィルタ及びそれを用いた通信機器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004282707A (ja) * 2003-02-24 2004-10-07 Murata Mfg Co Ltd 弾性表面波フィルタ、通信機
WO2006009021A1 (fr) * 2004-07-23 2006-01-26 Murata Manufacturing Co., Ltd. Dispositif à ondes de surface élastiques
WO2007083432A1 (fr) * 2006-01-18 2007-07-26 Murata Manufacturing Co., Ltd. Dispositif a ondes acoustiques de surface et dispositif a ondes acoustiques limites
JP2007259023A (ja) * 2006-03-23 2007-10-04 Matsushita Electric Ind Co Ltd 弾性表面波フィルタ及びそれを用いた通信機器

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Publication number Publication date
JP5648745B2 (ja) 2015-01-07
CN103609020B (zh) 2015-10-14
JPWO2013008494A1 (ja) 2015-02-23
CN103609020A (zh) 2014-02-26

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