WO2013007815A1 - Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp - Google Patents

Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp Download PDF

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Publication number
WO2013007815A1
WO2013007815A1 PCT/EP2012/063780 EP2012063780W WO2013007815A1 WO 2013007815 A1 WO2013007815 A1 WO 2013007815A1 EP 2012063780 W EP2012063780 W EP 2012063780W WO 2013007815 A1 WO2013007815 A1 WO 2013007815A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
emitting diode
abovementioned
lamp
bulb
Prior art date
Application number
PCT/EP2012/063780
Other languages
English (en)
French (fr)
Inventor
Takahiro Akuta
Hiromi MURAMATSU
Keizo OISHI
Takashi Osawa
Junichi Okuyama
Tatsuya Suzuki
Original Assignee
Osram Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Ag filed Critical Osram Ag
Publication of WO2013007815A1 publication Critical patent/WO2013007815A1/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90Methods of manufacture
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/08Lighting devices intended for fixed installation with a standard
    • F21S8/085Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/086Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device attached sideways of the standard, e.g. for roads and highways
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00Lighting devices intended for fixed installation
    • F21S8/08Lighting devices intended for fixed installation with a standard
    • F21S8/085Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light
    • F21S8/088Lighting devices intended for fixed installation with a standard of high-built type, e.g. street light with lighting device mounted on top of the standard, e.g. for pedestrian zones
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/506Cooling arrangements characterised by the adaptation for cooling of specific components of globes, bowls or cover glasses
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21WINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
    • F21W2131/00Use or application of lighting devices or systems not provided for in codes F21W2102/00-F21W2121/00
    • F21W2131/10Outdoor lighting
    • F21W2131/103Outdoor lighting of streets or roads
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/30Light sources with three-dimensionally disposed light-generating elements on the outer surface of cylindrical surfaces, e.g. rod-shaped supports having a circular or a polygonal cross section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/40Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/49105Connecting at different heights
    • H01L2224/49107Connecting at different heights on the semiconductor or solid-state body
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8581Means for heat extraction or cooling characterised by their material

Definitions

  • Patent literature article 1 Japanese Patent Kokai 2009- 4130
  • the width w of one side surface of the abo ⁇ vementioned support member is fixed at a prescribed width
  • the distance Ak from the center of one side surface of the abovementioned support member to the inner surface of the bulb is fixed at a prescribed distance
  • n is a value whereby the abovementioned light- emitting diode unit can be arranged inside a cylindrical bulb having the abovementioned prescribed bulb diameter, and is a value which is determined based on the abovementioned prescribed bulb diameter, prescribed width and prescribed distance .
  • the street light according to the present invention is characterized in that it is provided with a light-emitting di ⁇ ode lamp having an E-type cap,
  • FIG. 45 Perspective view of the glass bulb 21 in embodiment 7.
  • lamps filled with a perfluorocarbon liquid have a higher color temperature than those which are not filled (filled only with nitrogen) , and the lamp color is shifted in the blue direction and appears brighter. Also, because the color temperature of the lamp is raised it is possible to use a light-emitting diode 11 that has a lower color temperature. By this means it is possible to reduce the amount of yellow YAG phosphor used, this being a cause of deterioration in the most typical type of pseudo-white light-emitting diode 11 comprising a blue light-emitting diode 11 to which yellow YAG phosphor is applied.
  • Width of one surface of the light-emitting diode unit 10 b Distance from the center of the glass bulb 21 to the light-emitting diode 11
  • the inner surface of the glass cover is in close proximity of 5mm or less with light-emitting diodes 11 mounted on the side surfaces of the prismatic or cylindrical support member 13 of the light-emitting diode unit 10 it is possible for heat to be dissipated efficiently from the side surfaces of the light-emitting diode unit 10, and it is possible to provide a light-emitting diode lamp 20 having a longer operating life.
  • the support member 13 is made of metal, heat generated by the light-emitting diodes 11 can be effi- ciently absorbed and dissipated.
  • Figure 35 is a conceptual diagram showing comparative example 1 of the silicone injection method.
  • Figure 39 is an illustration of the support member 13 of the light-emitting diode unit 10, in an unfolded state.
  • Figure 39 The difference between Figure 39 and Figure 7 lies in the existence of U-shaped incisions 218 and semicircular incisions 219.
  • the incisions 218 and 219 have the advantage of facilitating folding when folding the support member and the advantage of facilitating positioning during folding.
  • the incisions 218 and 219 are U-shaped and semicircular, but they may also be triangular, rectangular, circular or trapezoidal .
  • Figure 40 is a drawing illustrating the flare tube 22.
  • the flare tube 22 is glass.
  • Two lead wires 17 penetrate through the flare tube 22.
  • An axial support strut 15 is embedded at the center of one end of the flare tube 22.
  • An exhaust tube 221 extends from the center of the other end of the flare tube 22 toward the axial support strut 15. The exhaust tube 221 penetrates the middle of the flare tube 22, but it is bent obliguely ahead of the axial support strut forming an exhaust port 222.
  • the light-emitting diode unit 10 is inserted into a test tube-shaped glass bulb 21, the outer circumference of the flare tube 22 and the inner circumference of the glass bulb 21 are fused together, and the glass bulb 21 is sealed. This completes the assembly process S20.
  • the diameter of the dispenser injection needle depends on the diameter of the exhaust tube 221 being used.
  • a thicker dispenser injection needle is advantageous in terms of sili ⁇ cone injection, but because the gap to the tip tube is narrowed, it becomes impossible to exhaust the air.
  • the range of outer diameter of the dispenser injection needle is be- tween a minimum outer diameter of ⁇ 0.5mm (minimum inner diameter of ⁇ 0.2mm) and a maximum outer diameter of ⁇ 4.5mm (minimum outer diameter of ⁇ 4.0mm), based on the relationship with the abovementioned exhaust tube 221.
  • an injection needle having an outer diameter that is smaller than the inner diameter of the exhaust tube 221 is inserted into the exhaust tube 221 and the thermally conductive medium is injected in- to the glass bulb through the injection needle, and injection of the thermally conductive medium by means of the injection needle and exhaustion by means of the exhaust tube 221 are performed simultaneously.
  • the silicone 290 which is injected may be colorless and transparent, or it may be a colored silicone, or it may be a hybrid silicone comprising silicone and another substance such as an epoxy. Also, in order to increase heat dissipation characteristics further, heat dissipating silicone into which metal particles have been mixed, having excellent heat dissipation characteristics, may be used.
  • the length LI of the outer bulb 211 is greater than the length L2 of the inner bulb 212.
  • Figure 53 is a dimensioned drawing of the light-emitting diode lamp 20 of embodiment 7.
  • the difference compared with Figure 14 lies in the addition of the following dimensions which relate to the outer bulb 211 and the inner bulb 212.
  • the method of manufacturing a light-emitting lamp of embodiment 7 is characterized in that it is provided with a process Sll in which a glass bulb 21 having a double tube section is manufactured,
  • the light-emitting diode unit 10 is manufactured by following the processes explained in embodiments 1 to 5.
  • the pyramid 18 is not prepared.
  • the metal base plate 299 is also not used.
  • DC circuit and has two output terminals which output to two cables a constant direct current of approximately 20V- 700mA or 40V-350mA or 80V-200mA, from the 100V or 200V alternating-current commercial power supply.
  • an existing HID lamp street light can be modified to a light-emitting diode lamp street light with the minimum of work, and by reusing existing equipment.
  • components of the existing street light are reused as far as possible, and conversion to an energy-efficient LED lamp is possible.
  • a glass bulb 21 envelops a portion of a support member 13 of a light-emitting diode unit 10, and another portion of the support member 13 is exposed to the atmosphere. There is an opening in the top portion of the glass bulb 21, and the other portion of the support member 13 of the light-emitting diode unit 10 is exposed and protrudes through the opening.
  • the section in which light-emitting diodes 11 exist is en- veloped by the glass bulb 21. Only the support member 13 is exposed and protrudes.
  • the support member 13 is a metal such as aluminum, and heat dissipation characteristics are im- proved by the end portion of the support member coming into direct contact with the atmosphere.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
PCT/EP2012/063780 2011-07-14 2012-07-13 Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp WO2013007815A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011155744 2011-07-14
JP2011-155744 2011-07-14
JP2011-244426 2011-11-08
JP2011244426 2011-11-08

Publications (1)

Publication Number Publication Date
WO2013007815A1 true WO2013007815A1 (en) 2013-01-17

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PCT/EP2012/063780 WO2013007815A1 (en) 2011-07-14 2012-07-13 Light-emitting diode lamp, lighting fixture, method of manufacturing light-emitting lamp, method of manufacturing light-emitting diode lamp, street light, and method of exchanging lamp

Country Status (2)

Country Link
JP (5) JP6161872B2 (enrdf_load_stackoverflow)
WO (1) WO2013007815A1 (enrdf_load_stackoverflow)

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WO2014180689A1 (en) * 2013-05-08 2014-11-13 Koninklijke Philips N.V. Lighting device
WO2016154156A1 (en) * 2015-03-20 2016-09-29 Eye Lighting International Of North Amercia, Inc. Glass jacketed led lamp
WO2017182094A1 (en) * 2016-04-22 2017-10-26 Osram Opto Semiconductors Gmbh Led module and method for producing an led module
EP3205395A4 (en) * 2014-10-09 2018-04-11 Toray Industries, Inc. Photoirradiation device, photoreaction method using same, and method for producing lactam
WO2018096027A1 (en) * 2016-11-25 2018-05-31 Philips Lighting Holding B.V. Ssl lamp for replacing gas discharge lamp
US9995437B2 (en) 2014-01-29 2018-06-12 Philips Lighting Holding B.V. LED bulb
US10161575B2 (en) 2015-04-30 2018-12-25 Philips Lighting Holding B.V. Solid state lighting device and luminaire
RU196996U1 (ru) * 2019-10-16 2020-03-24 Юрий Борисович Соколов Светодиодная лампа
WO2022028022A1 (zh) * 2020-08-04 2022-02-10 东莞市瑞拓科技有限公司 一种新型 led 立体光源

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GB2485421B (en) 2010-11-15 2016-05-25 Mars Inc Dough products exhibiting reduced oil migration
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JP6234119B2 (ja) * 2013-09-03 2017-11-22 三菱電機株式会社 照明ランプ及び照明装置
JP6288993B2 (ja) * 2013-09-03 2018-03-07 三菱電機株式会社 照明ランプ及び照明装置
JP2016115649A (ja) * 2014-12-18 2016-06-23 岩崎電気株式会社 Ledランプ
JP6897602B2 (ja) * 2018-02-27 2021-06-30 豊田合成株式会社 流体殺菌装置
CN109956517A (zh) * 2017-12-14 2019-07-02 丰田合成株式会社 紫外光照射杀菌装置和流体杀菌装置
JP7035499B2 (ja) * 2017-12-14 2022-03-15 豊田合成株式会社 紫外光照射殺菌装置
KR20220034456A (ko) * 2020-09-11 2022-03-18 주식회사 싸이큐어 표면 및 공간 led 살균 조명장치
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RU196996U1 (ru) * 2019-10-16 2020-03-24 Юрий Борисович Соколов Светодиодная лампа
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JP2015135825A (ja) 2015-07-27
JP6391769B2 (ja) 2018-09-19
JP2017168454A (ja) 2017-09-21
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JP5968482B2 (ja) 2016-08-10
JP6161872B2 (ja) 2017-07-12
JP2015135824A (ja) 2015-07-27

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