WO2013004137A1 - Module de source lumineuse et dispositif d'éclairage - Google Patents

Module de source lumineuse et dispositif d'éclairage Download PDF

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Publication number
WO2013004137A1
WO2013004137A1 PCT/CN2012/077624 CN2012077624W WO2013004137A1 WO 2013004137 A1 WO2013004137 A1 WO 2013004137A1 CN 2012077624 W CN2012077624 W CN 2012077624W WO 2013004137 A1 WO2013004137 A1 WO 2013004137A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
light source
source module
insulating layer
circuit layer
Prior art date
Application number
PCT/CN2012/077624
Other languages
English (en)
Chinese (zh)
Inventor
林明吉
吕畹铃
Original Assignee
方与圆电子(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 方与圆电子(深圳)有限公司 filed Critical 方与圆电子(深圳)有限公司
Publication of WO2013004137A1 publication Critical patent/WO2013004137A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Abstract

L'invention concerne un module de source lumineuse et un dispositif d'éclairage. Le module de source lumineuse comprend un substrat (100), une couche d'isolation (200) et une couche de circuit (300). La couche de circuit (300), la couche d'isolation (200) et le substrat (100) sont empilés. La couche d'isolation (200) est disposée entre le substrat (100) et la couche de circuit (300). Le dispositif d'éclairage comprend un boîtier et le module de source lumineuse est disposé dans le boîtier. Dans le module de source lumineuse et le dispositif d'éclairage, la couche de circuit (300), la couche d'isolation (200) et le substrat (100) sont empilés ; la couche de circuit (300), la couche d'isolation (200) et le substrat (100) peuvent tous être formés par estampage à l'aide d'un outil d'estampage, si bien que la qualité de surface est élevée, la précision dimensionnelle est élevée, l'efficacité de la production est élevée, le processus d'assemblage est simple et le coût de production est bas, ce qui améliore l'efficacité d'émission lumineuse et l'effet d'éclairage du produit.
PCT/CN2012/077624 2011-07-01 2012-06-27 Module de source lumineuse et dispositif d'éclairage WO2013004137A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN2011202311416U CN202217702U (zh) 2011-07-01 2011-07-01 一种光源模组及照明装置
CN201120231141.6 2011-07-01

Publications (1)

Publication Number Publication Date
WO2013004137A1 true WO2013004137A1 (fr) 2013-01-10

Family

ID=46016939

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2012/077624 WO2013004137A1 (fr) 2011-07-01 2012-06-27 Module de source lumineuse et dispositif d'éclairage

Country Status (2)

Country Link
CN (1) CN202217702U (fr)
WO (1) WO2013004137A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202217702U (zh) * 2011-07-01 2012-05-09 方与圆电子(深圳)有限公司 一种光源模组及照明装置

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1466782A (zh) * 2001-08-28 2004-01-07 ���µ繤��ʽ���� 使用led的发光装置
JP2004087796A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd Ｌｅｄチップ取付部材の製造方法及びそのｌｅｄチップ取付部材を用いたｌｅｄ実装基板
CN2657204Y (zh) * 2003-04-29 2004-11-17 洪千惠 一种带发光二极体的电路板
US20090189165A1 (en) * 2008-01-29 2009-07-30 Kingbright Electronic Co., Ltd. Light-emitting diode light source
JP2010021420A (ja) * 2008-07-11 2010-01-28 Denka Agsp Kk 発光素子搭載用基板、発光素子パネル、発光素子パッケージおよび発光素子搭載用基板の製造方法
CN101819967A (zh) * 2009-02-27 2010-09-01 夏普株式会社 Led模块以及led光源装置
CN101939851A (zh) * 2007-08-31 2011-01-05 三洋电机株式会社 发光组件以及其制造方法
CN101978513A (zh) * 2008-03-26 2011-02-16 岛根县 半导体发光组件及其制造方法
CN202217702U (zh) * 2011-07-01 2012-05-09 方与圆电子(深圳)有限公司 一种光源模组及照明装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1466782A (zh) * 2001-08-28 2004-01-07 ���µ繤��ʽ���� 使用led的发光装置
JP2004087796A (ja) * 2002-08-27 2004-03-18 Matsushita Electric Works Ltd Ｌｅｄチップ取付部材の製造方法及びそのｌｅｄチップ取付部材を用いたｌｅｄ実装基板
CN2657204Y (zh) * 2003-04-29 2004-11-17 洪千惠 一种带发光二极体的电路板
CN101939851A (zh) * 2007-08-31 2011-01-05 三洋电机株式会社 发光组件以及其制造方法
US20090189165A1 (en) * 2008-01-29 2009-07-30 Kingbright Electronic Co., Ltd. Light-emitting diode light source
CN101978513A (zh) * 2008-03-26 2011-02-16 岛根县 半导体发光组件及其制造方法
JP2010021420A (ja) * 2008-07-11 2010-01-28 Denka Agsp Kk 発光素子搭載用基板、発光素子パネル、発光素子パッケージおよび発光素子搭載用基板の製造方法
CN101819967A (zh) * 2009-02-27 2010-09-01 夏普株式会社 Led模块以及led光源装置
CN202217702U (zh) * 2011-07-01 2012-05-09 方与圆电子(深圳)有限公司 一种光源模组及照明装置

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