WO2013004137A1

WO2013004137A1 - Light source module and lighting device

Info

Publication number: WO2013004137A1
Application number: PCT/CN2012/077624
Authority: WO
Inventors: 林明吉; 吕畹铃
Original assignee: 方与圆电子(深圳)有限公司
Priority date: 2011-07-01
Filing date: 2012-06-27
Publication date: 2013-01-10
Also published as: CN202217702U

Abstract

A light source module and a lighting device. The light source module comprises a substrate (100), an insulation layer (200), and a circuit layer (300). The circuit layer (300), the insulation layer (200), and the substrate (100) are stacked. The insulation layer (200) is disposed between the substrate (100) and the circuit layer (300). The lighting device comprises a casing, and the light source module is disposed in the casing. In the light source module and the lighting device, the circuit layer (300), the insulation layer (200), and the substrate (100) are stacked, the circuit layer (300), the insulation layer (200), and the substrate (100) can all be formed through stamping of a stamping die, so the surface smoothness is high, the dimensional accuracy is high, the production efficiency is high, the assembling process is simple, and the production cost is low, thereby improving the light-emitting efficiency and lighting effect of the product.

Description

Light source module and lighting device

Technical field

The invention belongs to the technical field of light source module structures, and in particular relates to a light source module and a lighting device.

Background technique

The current light source module includes a substrate and a circuit board, the substrate is used for fixing the LED, the substrate and the circuit board are separately disposed, and the LED on the circuit board and the substrate By wire connection, the product volume is large, the assembly process is complicated, the production efficiency is low, and the production cost is high.

technical problem

The object of the present invention is to overcome the above deficiencies of the prior art and to provide The utility model relates to a light source module and a lighting device, which has the advantages of small product volume, simple assembly process, high production efficiency and low production cost.

Technical solution

The present invention is implemented as follows: a light source module includes a substrate, an insulating layer, and a circuit layer. The circuit layer, the insulating layer, and the substrate are stacked one on another, and the insulating layer is disposed between the substrate and the circuit layer.

Specifically, the insulating layer is fixedly disposed on the upper surface of the substrate, and the insulating layer is provided with a hole avoiding hole.

Specifically, the circuit layer includes a positive electrode portion and a negative electrode portion, and the positive electrode portion and the negative electrode portion are fixedly disposed on the insulating layer.

Specifically, a recess for placing the light-emitting member is disposed on the substrate; a protrusion is protruded from an edge of the recess.

Specifically, the substrate is a metal stamping, and the mounting hole and the positioning notch are formed on the substrate; the substrate is strip-shaped or circular or polygonal.

Specifically, the light source module further includes an LED chip, the LED chip is disposed on the substrate and is provided with 24 pieces, The 24 LED chips are arranged in three groups. Each group of LED chips includes 8 LED chips connected in series, and three groups of LED chips are connected in parallel.

Specifically, the substrate includes three sub-boards, which are sequentially adjacent by a connecting portion, and each of the sub-boards is provided with a group of LEDs. Chip.

Specifically, eight LED chips in each set of LED chips are uniformly arranged in a line shape on the sub-board.

Specifically, the circuit layer is provided with the LED a chip-connected contact; the substrate is provided with at least two pieces; the substrate is strip-shaped or circular or polygonal.

The invention also provides a lighting device comprising a casing, wherein the casing is provided with the above-mentioned light source module.

Beneficial effect

Provided by the present invention The light source module and the illumination device are provided by stacking the circuit layer, the insulating layer and the substrate up and down, and the circuit layer and the insulating layer can be stamped and formed by the stamping die, and have high surface smoothness, high dimensional precision, high production efficiency, and production cost. Low advantages, small product size, simple assembly process, high production efficiency, low production cost, improved luminous efficiency of the product, and improved lighting effect.

DRAWINGS

1 is a perspective view showing the assembly of a light source module according to an embodiment of the present invention;

Figure 2 is a partial enlarged view of A in Figure 1;

3 is a schematic cross-sectional view of a light source module according to an embodiment of the present invention;

4 is a perspective view of a substrate of a light source module according to an embodiment of the present invention;

5 is a perspective view of an insulating layer of a light source module according to an embodiment of the present invention;

FIG. 6 is a perspective view of a circuit layer of a light source module according to an embodiment of the present invention.

7 is a top plan view of a light source module including a plurality of substrates according to an embodiment of the present invention;

8 is a top plan view of a light source module including a substrate according to an embodiment of the present invention;

FIG. 9 is a left side view of a light source module according to an embodiment of the present invention.

Embodiments of the invention

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in FIG. 1 and FIG. 2, FIG. 1 to FIG. 3 provided by the embodiment of the present invention. As shown in the embodiment of the present invention, a light source module includes a substrate 100, an insulating layer 200, a circuit layer 300, the circuit layer 300, an insulating layer 200, and a substrate 100. The insulating layer 200 is disposed between the substrate 100 and the wiring layer 300. Substrate 100 , insulating layer 200 , circuit layer 300 It can be stamped and formed by stamping die. In specific applications, it can be produced by high-speed punching, which has the advantages of high production efficiency and low production cost. When assembling, it is only necessary to fix the insulating layer 200 to the substrate 100. Then, the circuit layer 300 is fixed on the insulating layer 200, and by providing the insulating layer 200, the short circuit of the circuit layer 300 can be avoided. Insulation layer 200 It may be made of a suitable material such as plastic or resin, or may be coated on the surface of the substrate 100 by a coating such as an insulating varnish. The substrate 100 may be made of a material such as metal aluminum, and the circuit layer 300 It can be stamped from a material such as copper sheet, and is within the scope of protection of the present invention. Through such a design, the process is greatly simplified, and the insulating layer 200 and the wiring layer 300 can be accurately positioned on the substrate by means of tooling fixtures, etc., respectively. On the 100, the product assembly precision is high and the quality is reliable. Moreover, the stamped substrate 100 The utility model has the advantages of high surface quality and high dimensional precision, which effectively improves the light extraction efficiency of the product, and because the stamping is adopted, the end surface of the substrate 100 is flat, so as to facilitate installation and positioning, and the heat dissipation performance can be improved.

Specifically, as shown in FIG. 1 and FIG. 5, the insulating layer 200 is fixedly disposed on the upper surface of the substrate 100, and the light emitting member is as The LED or the like is also fixed on the upper surface of the substrate 100, and the insulating layer 200 is provided with a hole avoiding hole 201 to facilitate the layout of the LED.

Specifically, as shown in FIGS. 1, 2, and 6, the wiring layer 300 includes a positive electrode portion 310 and a negative electrode portion 320. The positive electrode portion 310 and the negative electrode portion 320 are fixedly disposed on the insulating layer 200 to guide the two leads of the LED to the positive electrode portion 310 and the negative electrode portion 320, respectively. The structure is reasonable and reliable and easy to assemble.

Specifically, as shown in FIG. 1, FIG. 5 and FIG. 6, the outer shape of the circuit layer 300 is not larger than the insulating layer 200. The shape is designed to ensure the insulation effect, and the circuit layer 300 is prevented from coming into contact with the substrate 100, and the product has good reliability.

Preferably, as shown in Figures 1, 3 and 6, the circuit layer 300 It is formed by copper sheet stamping and has excellent electrical conductivity. The thickness of the copper sheet is between 0.1 and 0.3 mm. In this embodiment, a copper sheet having a thickness of 0.15 mm is selected as the wiring layer 300. . It should be understood that the use of other conductive materials and other thicknesses of the wiring layer 300 are also within the scope of the present invention.

Specifically, as shown in FIG. 1, FIG. 3 and FIG. 4, the substrate 100 is provided with a recess 101 for placing the light-emitting member. The light-emitting member can be an LED or the like, and the recess 101 is used for accommodating the LED And fluorescent glue, sealant and so on. There is no need to manually use a resin to circle a resin and cure the resin, eliminating the need for a resin step, saving time for the resin to cure, without having to put in a heating setting for curing the resin, greatly reducing labor costs and investment in production equipment. And save time, improve production efficiency and reduce production costs.

More specifically, as shown in FIG. 1 to FIG. 4, the edge of the recess 101 is convexly provided with a boss 102. In this embodiment, the boss 102 is circular. With such a design, on the one hand, the capacity of the pocket 101 is increased to accommodate more fluorescent glue and sealant, and on the other hand, the upper surface of the boss 102 can be brought close to the wiring layer 300, so that The LED pins are more easily connected to the circuit layer 300, which avoids the formation of a chamfer between the LED pins and the circuit layer 300, which leads to pin breakage and the like, thereby improving the yield of the product.

Moreover, due to the good heat dissipation performance of the product, the temperature change in the cavity 101 is small, and the airtightness is better. The photobleaking after luminescence heating can be reduced, reducing light consumption and energy consumption.

Specifically, as shown in FIG. 1, FIG. 3 and FIG. 4, the substrate 100 For metal stamping parts, on the one hand, the production efficiency, surface quality and dimensional accuracy are improved, and on the other hand, the structural strength and heat dissipation effect are improved. The substrate 100 is provided with a mounting through hole 103 and a positioning notch portion 104. In order to install the light source module in the lighting device.

Preferably, as shown in FIG. 1, FIG. 3 and FIG. 4, the substrate 100 Appropriate shapes such as strips or circles or polygons or ellipses or shapes, depending on the actual situation, are within the scope of protection of the present invention.

Specifically, as shown in FIG. 7, the light source module includes a plurality of substrates 100. As shown in FIG. 7 to FIG. 9, the light source module further includes The LED chip 400 and the LED chip 400 are disposed on the substrate 100 and are provided with 24 pieces, and 24 LED chips are arranged in three groups of three groups, each group of LED chips. The 400 includes eight LED chips 400 connected in series, and three sets of LED chips 400 are connected in parallel. By using 24 LED chips 400 and the 24 The LED chip 400 is divided into three sets of parallel chip sets, and each chip set is set to 8 LED chips in series. To make the light distribution of the product reasonable, it is beneficial to improve the light efficiency of the product, to achieve better luminous effect, and reduce the application cost.

Specifically, as shown in FIGS. 7 to 9, the substrate 100 For the metal stamping parts, the shape and size suitable for the package can be obtained by one press forming, on the one hand, the production efficiency, the surface quality and the dimensional precision are improved, and on the other hand, the structural strength and the heat dissipation effect are improved. Substrate 100 A mounting through hole 104 and a positioning notch 103 are provided in the upper opening to facilitate positioning of the light source module in the lighting device.

More specifically, as shown in FIGS. 7 and 8, the substrate 100 includes three sub-boards 110 and three sub-boards 110. It can be formed by one stamping from the same metal sheet. Three daughter boards 110 By sequentially connecting the connecting portions, the light source module of the connected structure has a relatively accurate positional relationship, a lower loss between the processes, a high product yield rate, and no need to load and remove the carrier. The packaging efficiency is greatly improved. Each daughter board A set of LED chips 400 is disposed on the 110, that is, each of the sub-boards 110 is provided with eight LED chips 400 connected in series, and eight of each group of LED chips 400 The LED chip 400 is linearly arranged on the sub-board 110. Of course, the substrate 100 can also be provided with a complete unit, which is also within the scope of the present invention.

Specifically, as shown in FIGS. 7 to 9, the circuit layer 300 is provided with contacts 310 connected to the LED chip 400. In order to facilitate the installation of the light source module. The circuit layer 300 is provided with a circuit pattern, the contact 310 is connected to the circuit pattern, and the pins of the LED chip 400 are connected to the circuit pattern by wires.

Preferably, as shown in FIG. 7, the substrate 100 is provided with at least two pieces, and a plurality of substrates 100 are obtained by one stamping, which is high in production efficiency. As shown As shown in Fig. 7, the substrate 100 is four units or a plurality of units, and the production process is the same, so the efficiency is increased by four times to many times.

Specifically, the substrate 100 Appropriate shapes such as strips or circles or polygons or ellipses or shapes, depending on the actual situation, are within the scope of protection of the present invention. In this embodiment, the substrate 100 has an elongated shape and can be used as a lamp tube or the like.

The embodiment of the invention further provides a lighting device, comprising a housing, wherein the light source module is arranged in the housing.

Specifically, the light source module in the lighting device includes 24 LED chips 400, and the 24 LEDs Set to three sets of chipsets in parallel, each chip set is set to 8 LED chips in series 400 To make the light distribution of the product reasonable, it is beneficial to improve the light efficiency of the product, to achieve better luminous effect, and reduce the application cost.

Of course, it can be understood that the light source module can also be designed as two sets of parallel or other suitable sets of chipsets in parallel, each group of chips can include 6 or 4 Or other suitable number of LED chips 400 in series. For example, two sets of parallel chipsets are used, and each set of chips adopts 4 or 6 or 10 LED chips. Or, use three sets of chipsets in parallel, each group of chips using 4 or 6 or 10 or 12 or 14 LED chips 400 Or, use four sets of chipsets in parallel, each group of chips using 4 or 6 or 10 LED chips 400, etc., the specific number can be set according to actual needs.

It should be noted that the light source module provided by the embodiment of the present invention can be applied not only to the lighting device but also to the backlight module of the electronic product.

The above is only the preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included in the protection of the present invention. Within the scope.

Claims

A light source module includes a substrate, an insulating layer, and a circuit layer. The circuit layer, the insulating layer and the substrate are stacked one on another, and the insulating layer is disposed between the substrate and the circuit layer.
Claims 1 The light source module is characterized in that the insulating layer is fixedly disposed on the upper surface of the substrate, and the insulating layer is provided with a hollow hole.
Claims 1 In the light source module, the circuit layer includes a positive electrode portion and a negative electrode portion, and the positive electrode portion and the negative electrode portion are fixedly disposed on the insulating layer.
Claims 1 The light source module is characterized in that: the substrate is provided with a recess for placing the light-emitting member; and the edge of the recess is convexly provided with a boss.
Claims 1 The light source module is characterized in that the substrate is a metal stamping, and the mounting hole and the positioning notch are formed on the substrate; the substrate is strip-shaped or circular or polygonal.
The light source module of claim 1 , wherein the light source module further comprises an LED chip, wherein the LED chip is disposed on the substrate and is provided with 24 pieces, the 24 LED chips are arranged in three groups, each group of LED chips includes 8 LED chips connected in series, three groups of LEDs The chips are connected in parallel.
The light source module according to claim 6, wherein the substrate comprises three sub-boards, the three sub-boards are sequentially adjacent by a connecting portion, and each of the sub-boards is provided with a set LED chip.
The light source module according to claim 7, wherein eight LEDs in each group of LED chips The chips are evenly arranged in a line on the daughter board.
The light source module according to claim 6, wherein the circuit layer is provided with the LED a chip-connected contact; the substrate is provided with at least two pieces; the substrate is strip-shaped or circular or polygonal.
A lighting device comprising a housing, wherein the housing is provided with claims 1 to 9 The light source module according to any one of the preceding claims.