WO2013000426A1

WO2013000426A1 - Wafer clamping device using the stretched threads and springs

Info

Publication number: WO2013000426A1
Application number: PCT/CN2012/077786
Authority: WO
Inventors: 朱煜; 杨开明; 李鑫; 汪劲松; 胡金春; 张鸣; 徐登峰; 穆海华; 尹文生; 余东东; 崔乐卿
Original assignee: 清华大学
Priority date: 2011-06-28
Filing date: 2012-06-28
Publication date: 2013-01-03
Also published as: CN102709222A

Abstract

A wafer clamping device using the stretched threads and springs is provided, which includes a pallet, four bottom supporting assemblies, two side supporting assemblies and one thread retractable clamping assembly. The thread retractable clamping assembly includes a motor, the threads, two mobile clamps, two baffles and two spring components. Under the actions of the motor and spring components, threads and spring components stretch the mobile clamps to be open or closed, and the stretcher strain of springs brings pressure to the wafer edge, and so that the wafer is fixed between the two side supporting assemblies and the two mobile clamps. By altering the position of the supporting assemblies and adjusting the restricting device, it is possible to achieve to transmit the wafers having different diameter sizes, and to solve the problem in existing transmission structure that only the wafers having same size can be transmitted. The tension of the spring components can be changed by adjusting the baffles, and the functions of holding and buffer are achieved by utilizing the flexibility of spring components, thereby during the wafers are clamped, it is avoid the damage of wafers caused by the impact of the clamping force.

Description

Wafer clamping device using wire rope tension stretching

Technical field

The present invention relates to a wafer holding device that utilizes wire rope tension stretching, and is mainly applied to the field of semiconductor wafer transfer technology.

Background technique

In the semiconductor manufacturing process, such as wafer cleaning, polishing, etc., there is a large amount of wafer transfer between the cassette-cartridge and the cassette-chamber, thus designing a safe and effective wafer transfer device. It is one of the hot spots in the semiconductor industry research.

The wafer transfer apparatus of the patent US 2006/0192400 A1 is shown in FIG. Four raised supports 126 are secured to the tray 124. The bottom surface of the wafer is in contact with the upper surface of the 126 and is supported by 126. The movable clamp 138 is coupled to the cylinder 130 via a connecting rod 136. The cylinder push lever 136 linearly moves back and forth by executing an external control unit command. The clip 138 is linearly moved back and forth in synchronization with the push rod 136. When the cylinder push lever 136 is moved forward, the wafer W is sandwiched between the tray front end projection 128 and the moving clip front end projection 140 to fix the wafer.

The wafer transfer device of US 7,186, 297B2 is shown in FIG. Four protruding members 10 are fixed on the tray 1. During the transfer, the bottom surface of the wafer W is in contact with the upper surface of the 10, and is supported by the four convex supporting members 10. When the external control unit is commanded, the cylinder push rod 2 is straight forward and backward. Moving, the rod 2 is connected to the clip 8, and the movement of the rod 2 causes the clip 8 to move synchronously. When the rod 2 moves forward, the front end 8a of the clip 8 comes into contact with the edge of the wafer W, and the wafer W is sandwiched between the 8a and the raised member 6 to fix the wafer.

The above method can be applied to wafer transfer in semiconductor manufacturing, but there are some shortcomings.

1 The clip 128, the protruding member 140, and the protruding member 6 are cylindrical. When the wafer is fixed, only the horizontal degree of freedom of the wafer is limited, and the vertical direction of freedom is not limited, so the wafer can only be transported in the horizontal plane;

2 clip 138, push rod 2 is a rigid member, during the process of clamping the wafer, the deviation of the moving distance of the push rod will cause damage to the wafer;

3 The position of the raised supports 126 and 10 on the tray is fixed, so that only a certain range of wafers can be transported, which is limited by the diameter of the wafer.

In view of the above deficiencies, it is necessary to design a wafer transfer apparatus which can be applied to semiconductor manufacturing and can be safely transported in any direction without being limited by the wafer diameter. Summary of the invention

The present invention contemplates a wafer holding device that utilizes wire rope stretching to provide a wafer holding device that is not limited by the diameter of the wafer.

The technical scheme of the present invention is as follows: A wafer holding device that utilizes a wire spring stretching, the device comprising a fixed clamping device 100 and a wire telescoping clamping device 200. The fixed clamping device comprises a tray 101, two side support members 102, four raised supports 103 and eight circular holes 104. The tray 101 has a Y shape, and the four boss supports 103 are fixed in the circular holes 104 and symmetrically distributed on both sides of the tray 101. The side support members 102 are symmetrically disposed at the end positions of the tray 101.

The convex support member 103 has a cylindrical shape, and the upper portion of the cylinder is rounded, and the eight circular holes 104 are symmetrically arranged on both sides of the tray 101. The convex support member 103 is fixed in the circular hole 104 and is fixed by screwing or bonding. the way. The side support member 102 is cylindrical. When the wafer is held, the outer surface of the side support member 102 is in contact with the outer surface of the wafer for the purpose of holding the wafer.

The cord telescoping clamping device 200 includes a motor 201, a cord 202, a moving clip 203, two spring elements 204, and a plurality of shutter members 205. The moving clip includes a clip arm 203a, a clip fixing screw 203b, and a clip connector 203c. Two moving clips 203 are symmetrically arranged on both sides of the tray 101, the moving clip 203 is cylindrically contacted with the wafer, the bottom of the cylinder is rounded, and the outer surface of the cylinder of the moving clip 203 is in contact with the outer edge of the wafer to fix the wafer. The purpose of 900.

Two baffle members 205 are symmetrically secured to the tray 101. The baffle member 205 includes two beams 2051, four screws 2052, and two baffles 2053. The beam 2051 is fixed to the tray 101, and each of the beams 2051 has two threaded holes 2051a and a first circular hole 2051b. The threaded holes 2051a are symmetrically arranged on both sides of the beam 2051 in the Y-axis direction. Four screws 2052 are respectively installed in four threaded holes 2051a, two baffles 2053 are respectively installed in the two first circular holes 2051b, and the baffle 2053 is movable in the X-axis direction, and the baffle rod 2053a passes through the first A round hole that moves along the X axis.

The motor 201 is fixed to the base 001, and the moving clip 203 is fixed to the tray 101. The cord 202 is fixedly coupled to the clip connector 203c on the moving clip 203. One end of the two spring members 204 is fixedly coupled to the clip connector 203 of the clip, and the other end is coupled to the two shutters 2053, respectively. After the position of the baffle 2053 is fixed, the length of the spring element 204 is adjusted by adjusting the four screws 2052.

After the position of the baffle of the device of the present invention is fixed, the length of the spring element can be adjusted by adjusting the four screws, so that the clamping force when the wafer is held can be changed according to the working condition. The fixed position of the moving clip and the shutter member on the tray can be changed, thereby making the wafer holding device of the present invention suitable for wafers of different diameters. The use of the spring element makes the wafer grip flexible, and acts as a buffer for the wafer, thereby avoiding wafer damage caused by the impact of the clamping force during the wafer clamping process. DRAWINGS

Figure 1 is a plan view of the patented wafer transfer apparatus;

Figure 2 is a front elevational view of the tray structure of the apparatus of the present invention;

Figure 3 is a front elevational view of the convex support of the device of the present invention;

4 is a schematic view of a device for transporting large diameter dimensions of the device of the present invention;

Figure 5 is a schematic view showing the transmission of a small-diameter wafer by the apparatus of the present invention;

Figure 6 is a plan view of the device cord extension device of the present invention;

Figure 7 is an enlarged plan view of the device cord extension device of the present invention; Figure 8 is a front elevational view of the device cord retractor of the present invention;

Figure 9 is a side view of the connecting beam of the device of the present invention;

Figure 10 is a top plan view of the state of the apparatus of the present invention before picking up the wafer;

Figure 11 is a front elevational view showing the state of the apparatus of the present invention before picking up a wafer;

Figure 12 is a front elevational view of the state of the apparatus of the present invention after taking a wafer;

Figure 13 is a schematic view showing the position adjustment of the device of the present invention;

Figure 14 is a schematic view showing the position adjustment of the device of the present invention;

Figure 15 is a schematic view showing the position adjustment of the wire rope stretching device of the device of the present invention;

Figure 16 shows an existing wafer transfer device;

Figure 17 shows an existing wafer transfer device.

In the picture

001-base

100-fixed clamping device, 200-rope telescopic clamping device

101-tray, 102-side support element, 103-raised support, 104-round

201-motor, 202-rope, 203-moving clip, 204-spring element

203a-clip arm, 203b-clip fixing screw, 203c clip connector

2051-beam, 2052-screw, 2053-baffle

2051a-threaded hole, 2051b-first round hole

2053a-baffle bar

The embodiments of the present invention are further described in detail below with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a plan view of a wafer chucking apparatus 100 of the present invention. The wafer holding device includes a fixed holding device 100 and a wire telescopic holding device 200. Figure 2 and Figure 3 are front views of the fixed holding device 100.

The fixed holding device 100 includes a tray 101, two side support members 102, four raised supports 103, and eight circular holes 104. The tray 101 has a Y shape, and four projection supports 103 are fixed in the circular holes 104 and symmetrically distributed on both sides of the tray 101. The side support members 102 are symmetrically disposed at the end positions of the tray 101.

As shown in Fig. 3, the raised support member 103 is cylindrical and the upper portion of the cylinder is rounded to avoid scratching the wafer 900 when it is in contact with the wafer 900. The four raised support upper surfaces 103a are in the same plane. When the wafer is taken, the wafer bottom surface 900a is in contact with the raised support upper surface 103a, and the wafer 900 is supported by the four raised supports 103.

Eight circular holes 104 are symmetrically arranged on both sides of the tray 101, three circular holes 104 on each side. The boss support member 103 is fixed in the circular hole 104 and is fixed by screwing or bonding. When the raised supports 103 are disposed in the different circular holes 104, the distance between the raised supports 103 is varied, so that picking of the wafers 900 of different diameters can be achieved. Figure 4 is A schematic diagram of a larger diameter wafer 900 is picked up, and FIG. 5 is a schematic diagram of picking up a smaller diameter wafer 900. As shown in Figure 2, the side support members 102 are cylindrical. When the wafer 900 is held, the outer surface of the side support member 102 is in contact with the outer surface of the wafer 900 for the purpose of holding the wafer 900.

Figure 6 is a schematic view showing the structure of the wire rope stretching and holding device 200. The apparatus includes a motor 201, a cord 202, a moving clip 203, a spring element 204, and a baffle element 205.

Fig. 7 is a plan view of the moving clip 203, and Fig. 8 is a front view of the moving clip 203. The moving clip 203 includes a clip arm 203a, a clip fixing screw 203b, and a clip connector 203c. The two moving clips 203 are symmetrically disposed on both sides of the tray 101, so that the two points are brought into contact with the edge of the wafer 900, and the clamping force can be passed through the center position of the wafer 900. The moving clip 203 is cylindrical in contact with the wafer 900, and the bottom of the cylinder is rounded to avoid scratching the wafer 900. The outer cylindrical surface of the moving clip 203 is in contact with the outer edge of the wafer 900 for the purpose of fixing the wafer 900.

Two baffle members 205 are symmetrically secured to the tray 101. The baffle member 205 includes two beams 2051, four screws 2052, and two baffles 2053. Figure 9 is a side view of the beam 2051. The beam 2051 is fixed to the tray 101. Each beam 2051 has two threaded holes 2051a and a first circular hole 2051b. The threaded holes 2051a are symmetrically arranged on both sides of the beam 2051 in the Y-axis direction. Four screws 2052 are respectively mounted in the four threaded holes 2051a, and the two shutters 2053 are respectively mounted in the two first circular holes 2051b, and the shutter 2053 is movable in the X-axis direction. The baffle bar 2053a passes through the first circular hole 2051b and is movable along the X axis.

The motor 201 is fixed to the base 001, and the moving clip 203 is fixed to the tray 101. The cord 202 is fixedly coupled to the clip connector 203c on the moving clip 203. One end of the two spring members 204 is fixedly coupled to the clip connector 203c of the clip 203, and the other end is coupled to the two shutters 2053, respectively. When the wafer 900 is grasped, the motor 201 drives the wire 202 to move in the negative direction of the X-axis, and the wire 202 drives the moving clip 203 to be in an open state. Since the four screws 2052 are in contact with the baffle 2053, the baffle 2053 is restricted. The movement of the X in the negative direction, so that the spring element 204 is in the stretched state at this time. When the wafer 900 is placed on the tray 101, it is supported by the four raised supports 103. At this time, the motor 201 stops working, and the moving clip 203 is changed from the open state to the closed state by the tension of the spring member 204, and moves. The outer cylindrical outer surface of the clip 203 is in contact with the edge of the wafer 900. The spring element 204 is still stretched at this time, and the moving clip 203 under the force of the spring has a pressure on the wafer 900, so that the wafer 900 can be fixed. Between the moving clip 203 and the side support member 102. Fig. 9 is a view showing a state in which the moving clip is opened before the wafer 900 is held, and Fig. 10 is a closed state in which the moving clip is held when the moving clip holds the wafer 900.

As shown in FIG. 13 and FIG. 14, after the baffle 205 is fixed in position, the length of the spring element 204 can be adjusted by adjusting the four screws 2052, so that the clamping force when the wafer 900 is held can be changed according to the working conditions. .

As can be seen from the comparison of Fig. 15 and Fig. 1, the fixed position of the moving clip 203 and the shutter member 205 on the tray 101 can be changed, thereby making the wafer holding device of the present invention suitable for the wafer 900 of different diameters. Figure 15 is a schematic view showing the position of the moving clip 203 and the shutter member 205 when the wafer 900 of the smaller diameter is clamped. Figure 1 is a schematic view showing the position of the moving clip 203 and the shutter member 205 when the larger diameter cylindrical 900 is clamped.

Claims

1 is a wafer clamping device using a wire rope stretching, characterized in that: the device comprises a fixed clamping device (100) and a wire rope stretching device (200);

The fixed clamping device comprises a tray (101), two side support members (102), four convex support members (103) and eight circular holes (104); the tray (101) has a Y shape and four convex shapes. The support member (103) is fixed in the circular hole (104) and symmetrically distributed on both sides of the tray (101); the side support members (102) are symmetrically arranged at the end position of the tray (101); the convex support member (103) Cylindrical, and the upper part of the cylinder is rounded; eight round holes (104) are symmetrically arranged on both sides of the tray (101); the convex support (103) is fixed in the circular hole (104), threaded or glued The side support member (102) is cylindrical; when the wafer is held, the outer surface of the side support member (102) is in contact with the outer surface of the wafer for the purpose of holding the wafer;

The wire rope telescopic clamping device (200) comprises a motor (201), a wire rope (202), a moving clamp (203), two spring elements (204) and a plurality of baffle elements (205); the moving clip comprises a clip arm ( 203a), clip fixing screw (203b), clip connector (203c); two moving clips (203) are symmetrically arranged on both sides of the tray (101); the moving clip (203) is in contact with the wafer in a cylindrical shape, the bottom of the cylinder The rounded outer surface of the moving clip (203) is in contact with the outer edge of the wafer for the purpose of fixing the wafer (900);

Two baffle elements (205) are symmetrically fixed on the tray (101), and the baffle element (205) comprises two beams (2051), four screws (2052), two baffles (2053); beam (2051) Fixed on the tray (101), each beam (2051) has two threaded holes (2051a), a first circular hole (2051b); the threaded holes (2051a) are symmetrically arranged along the Y-axis direction in the beam (2051) Side; four screws (2052) are respectively installed in four threaded holes (2051a), two baffles (2053) are respectively installed in the two first circular holes (2051b), and the baffle (2053) can be along X Movement in the axial direction; the baffle rod (2053a) passes through the first circular hole and is movable along the X axis;

The motor (201) is fixed on the base (001), the moving clamp (203) is fixed on the tray (101); the wire (202) is fixedly connected to the clip connector (203c) on the moving clamp (203); One end of the spring element (204) is fixedly connected to the clip connector (203) of the clip, and the other end is connected to the two baffles (2053) respectively;

After the baffle (2053) is fixed in position, the length of the spring element (204) is adjusted by adjusting the four screws (2052).