CN102709222A - Wafer clamping device utilizing stretching of cord spring - Google Patents
Wafer clamping device utilizing stretching of cord spring Download PDFInfo
- Publication number
- CN102709222A CN102709222A CN201210192044XA CN201210192044A CN102709222A CN 102709222 A CN102709222 A CN 102709222A CN 201210192044X A CN201210192044X A CN 201210192044XA CN 201210192044 A CN201210192044 A CN 201210192044A CN 102709222 A CN102709222 A CN 102709222A
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- wafer
- clip
- pallet
- cotton rope
- fixed
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A wafer clamping device utilizing stretching of a cord spring comprises a tray, four bottom supporting assemblies, two side supporting assemblies and one cord stretching clamping assembly. The cord stretching clamping assembly comprises a motor, a cord, two movable clips, two baffle plate devices and two spring elements. Under the action of the motor and the spring elements, the movable clips are pulled by the cord and the spring elements to open and close, the stretching deformation of the spring acts on the edge of a wafer to produce pressure, so that the wafer is fixed between the two side supporting assemblies and the two movable clips. By changing the position of a protruded supporting member and adjusting a limiting device, the transmission of different wafers with different diameters can be realized, and the problem in the existing transmission structure that the size of the wafer to be transmitted is single can be solved. By adjusting the baffle plate device, the pull force of the spring elements can be changed, the flexibility of the spring elements is utilized to play a role in clamping and buffering, so that the damage of the wafer caused by the impact of the clamping force in the wafer clamping process can be avoided.
Description
Technical field
The present invention relates to a kind of wafer clamping device that utilizes the cotton rope springs, be mainly used in the semi-conductor silicon chip transmission technique field.
Background technology
In semiconductor fabrication, like the cleaning of wafer, polishing etc., between film magazine-film magazine, film magazine-chamber, there are a large amount of transmission that wafer is carried out, therefore designing a kind of device of wafer transfer safely and effectively is one of focus of semicon industry research.
The wafer transfer device of patent US2006/0192400A1 is shown in figure 14.Be fixed with four protruding supports 126 on the pallet 124, the wafer bottom surface contacts with 126 upper surfaces, and by 126 supports, removable clip 138 is connected with cylinder 130 through connecting rod 136.Through carrying out the instruction of external control unit, cylinder catch bar 136 carries out the front and back straight line and moves.Clip 138 synchronous front and back straight line under the effect of push rod 136 moves.When cylinder catch bar 136 moved forward, wafer W was sandwiched between pallet front end projection piece 128 and the mobile clip front end projection piece 140, and wafer is fixed.
Patent US7,186, the wafer transfer device of 297B2 is shown in figure 15.Be fixed with four projection pieces 10 on the pallet 1, wafer W bottom surface contacts with 10 upper surface in the transmission course, is supported by four protruding strutting pieces 10; When instructing through carrying out the external control unit; Cylinder catch bar 2 front and back straight lines move, and bar 2 is connected with clip 8, the mobile drive clip 8 same moved further of bar 2.When bar 2 moved forward, the front end 8a of clip 8 and the EDGE CONTACT of wafer W were sandwiched in wafer W between 8a and the projection piece 6, and wafer is fixed.
Above method can be applied in the transmission of wafer in the semiconductor manufacturing, but comes with some shortcomings.
1. clip 128, projection piece 140, projection piece 6 are cylindric, when fixing wafer, have only limited the wafer level direction degree of freedom, do not limit the vertical direction degree of freedom, therefore can only in horizontal plane, transmit wafer;
2. clip 138, push rod 2 are rigid member, and in clamping wafer process, the deviation of push rod displacement will cause the breakage of wafer;
Therefore 3. the fixed-site of protruding strutting piece 126 and 10 on pallet can only be transmitted the wafer of certain size scope, receives the restriction of diameter wafer size.
To above deficiency, be necessary to design the wafer transfer device that can be applied in the semiconductor manufacturing safe transmission in any direction and not receive the diameter wafer size restrictions.
Summary of the invention
The present invention has designed a kind of wafer clamping device that utilizes the cotton rope springs, and purpose is to provide the wafer clamping device that can not receive the diameter wafer size restrictions.
Technical scheme of the present invention is following:
A kind of wafer clamping device that utilizes the cotton rope springs, this device comprise fixed clamp device and the flexible clamping device of cotton rope; The fixed clamp device comprises pallet, two side support member, four protruding strutting pieces and eight circular holes; Pallet be shaped as Y shape, side support member is arranged symmetrically in the terminal position of pallet; Protruding strutting piece is cylindric; Eight circular holes are arranged symmetrically in the pallet both sides; Four protruding strutting pieces are installed in four circular holes wherein, and symmetric arrangement; The wafer bottom surface contacts with protruding strutting piece upper surface; Side support member is cylindrical.
The flexible clamping device of cotton rope comprises motor, cotton rope, moves clip, two spring elements and two baffle elements; Mobile clip comprises gripper-arm, clip hold-down screw, clip connector; Two gripper-arm are arranged symmetrically in the pallet both sides; It is cylindrical moving clip and wafer contact position.
Two baffle plate assembly symmetries are fixed on the pallet, and each baffle plate assembly comprises a crossbeam, two adjustment screw and a baffle plate; Crossbeam has two screwed holes and one first circular hole, and crossbeam is fixedly mounted on the pallet; Screwed hole is arranged symmetrically in the crossbeam two ends along Y direction; Two adjustment screw are installed in respectively in two screwed holes; Be fixed with damper rod on the baffle plate, damper rod passes first circular hole.
Motor is fixed on the pedestal, and mobile clip is fixed on the pallet; Cotton rope is fixedly connected with clip connector on the mobile clip; One end of two spring elements is fixedly connected with the clip connector, and the other end is connected with two baffle plates respectively; After baffle position is fixing, through adjusting the extended length of four adjustment screw adjustment spring elements.
Eight circular holes are arranged in the pallet both sides with respect to the X axial symmetry, and four circular holes in eight circular holes are distributed on the circumference; All the other four circular holes are distributed on another circumference.
After apparatus of the present invention baffle position is fixing, can adjust the extended length of spring element through adjusting four adjustment screw, the chucking power in the time of therefore can changing the clamping wafer according to working condition requirement.Can change and move clip and the fixed position of baffle element on pallet, and then can make wafer clamping device of the present invention be fit to the wafer of different-diameter size.Have flexibility when utilizing spring element to make the clamping wafer, play the effect of clamping buffering, avoided in the clamping wafer process because the wafer that the impact of chucking power causes damage.
Description of drawings
Fig. 1 is the vertical view of this patent wafer clamping device.
Fig. 2 is apparatus of the present invention support holder structure front view.
Fig. 3 is the protruding front views that support of apparatus of the present invention.
Fig. 4 is apparatus of the present invention transmission major diameter size wafer sketch map.
Fig. 5 is apparatus of the present invention transmission small-diameter sized wafer sketch map.
Fig. 6 is apparatus of the present invention cotton rope retractor device vertical view.
Fig. 7 is apparatus of the present invention cotton rope retractor device amplification plan view.
Fig. 8 is apparatus of the present invention cotton rope retractor device front view.
Fig. 9 is that apparatus of the present invention connect the crossbeam end view.
Figure 10 is that apparatus of the present invention are picked up the preceding state vertical view of wafer.
Figure 11 is apparatus of the present invention adjustment screw position adjustment sketch map.
Figure 12 is apparatus of the present invention adjustment screw position adjustment sketch map.
Figure 13 is apparatus of the present invention cotton rope retractor device position adjustment sketch map.
Figure 14 has the wafer transfer device now.
Figure 15 has the wafer transfer device now.
Among the figure:
The 001-pedestal;
100-fixed clamp device; The 200-cotton rope clamping device that stretches;
The 101-pallet; The 102-side support member; The protruding strutting piece of 103-; The 104-circular hole;
The 201-motor; The 202-cotton rope; 203-moves clip; The 204-spring element;
The 203a-gripper-arm; 203b-clip hold-down screw; 203c clip connector;
The 2051-crossbeam; The 2052-adjustment screw; The 2053-baffle plate;
The 2051a-screwed hole; 2051b-first circular hole;
The 2053a-damper rod;
The 900-wafer.
Embodiment
Below in conjunction with accompanying drawing embodiment of the present invention is described in further detail.
Fig. 1 is the vertical view of wafer clamping device of the present invention.The wafer clamping device comprises the flexible clamping device 200 of fixed clamp device 100 and cotton rope.Fig. 2, Fig. 3 are fixed clamp device 100 front views.
Fixed clamp device 100 comprises pallet 101, two side support member 102, four protruding strutting pieces 103 and eight circular holes 104.Pallet 101 be shaped as Y shape, four protruding strutting pieces 103 are fixed in the circular hole 104, and are symmetrically distributed in pallet 101 both sides.Wafer 900 bottom surfaces contact with protruding strutting piece 103 upper surfaces; Side support member 102 is arranged symmetrically in the terminal position of pallet 101.
As shown in Figure 3, protruding strutting piece 103 is cylindric, and cylinder top rounding, scratches wafer 900 when avoiding contacting with wafer 900.Four protruding strutting piece 103 upper surfaces are on same plane, and when getting wafer, wafer 900 bottom surfaces contact with protruding strutting piece 103 upper surfaces, by four protruding strutting piece 103 supporting wafer 900.
Eight circular holes 104 are arranged symmetrically in pallet 101 both sides, four circular holes 104 of every side.Protruding strutting piece 103 is fixed in the circular hole 104, adopts to be threaded or bonding fixed form.When protruding strutting piece 103 was arranged in the different circular holes 104, the distance between the protruding strutting piece 103 changed, and therefore can realize the supporting to different-diameter size wafer 900.Fig. 4 is for picking up than major diameter size wafer 900 sketch mapes, and Fig. 5 is for picking up than small-diameter sized wafer 900 sketch mapes.
As shown in Figure 2, side support member 102 is cylindrical.When clamping wafer 900, the outer surface of side support member 102 contacts with the outer surface of wafer 900, plays the purpose of clamping wafer 900.
Fig. 6 is flexible clamping device 200 structural representations of cotton rope.This device comprises motor 201, cotton rope 202, moves clip 203, spring element 204, baffle element 205.
Fig. 7 is for moving clip 203 vertical views, and Fig. 8 is for moving clip 203 front views.Move clip 203 and comprise gripper-arm 203a, clip hold-down screw 203b, clip connector 203c.Gripper-arm 203a is arranged symmetrically in pallet 101 both sides, utilizes and wafer 900 EDGE CONTACT like this at 2, can play the effect of chucking power through wafer 900 centers.Moving clip 203 is cylindrical with wafer 900 contact positions, and the cylindrical base rounding avoids scratching wafer 900.The cylindrical outer surface that moves clip 203 contacts with wafer 900 outward flanges, plays the fixedly purpose of wafer 900.
Two baffle element 205 symmetries are fixed on the pallet 101, and each baffle element 205 comprises a crossbeam 2051, two adjustment screw 2052 and baffle plates 2053.Fig. 9 is crossbeam 2051 end views, and crossbeam 2051 has two screwed hole 2051a and one first circular hole 2051b, and is installed on the pallet 101; Screwed hole 2051a is arranged symmetrically in crossbeam 2051 both sides along Y direction; Two adjustment screw 2052 are installed in respectively among two screwed hole 2051a, are fixed with damper rod 2053a on the baffle plate 2053, and damper rod passes the first circular hole 2051b, and baffle plate 2053 can be moved in the X-axis direction;
Like Figure 11, shown in Figure 12, after baffle plate 205 fixed-site, can adjust the extended length of spring element 204, the chucking power in the time of therefore can changing clamping wafer 900 according to working condition requirement through adjusting four adjustment screw 2052.
Contrast by Figure 13 and Fig. 1 can be found out, can change and move clip 203 and the fixed position of baffle element 205 on pallet 101, and then can make wafer clamping device of the present invention be fit to the wafer 900 of different-diameter size.Wherein Figure 13 moves clip 203 and baffle element 205 position views during than small-diameter sized wafer 900 for clamping, and Fig. 1 moves clip 203 and baffle element 205 position views during than major diameter size wafer 900 for clamping.
Claims (2)
1. wafer clamping device that utilizes the cotton rope springs is characterized in that: this device comprises fixed clamp device (100) and the flexible clamping device (200) of cotton rope;
The fixed clamp device comprises pallet (101), two side support member (102), four protruding strutting pieces (103) and eight circular holes (104); Pallet (101) be shaped as Y shape, side support member (102) is arranged symmetrically in the terminal position of pallet (101); Protruding strutting piece (103) is cylindric; Eight circular holes (104) are arranged symmetrically in pallet (101) both sides, and four protruding strutting pieces (103) are installed in four circular holes (104) wherein, and symmetric arrangement; Wafer (900) bottom surface contacts with protruding strutting piece (103) upper surface; Side support member (102) is cylindrical;
The cotton rope clamping device (200) that stretches comprises motor (201), cotton rope (202), moves clip (203), two spring elements (204) and two baffle elements (205); Mobile clip comprises gripper-arm (203a), clip hold-down screw (203b) and clip connector (203c); Two gripper-arm (203a) are arranged symmetrically in pallet (101) both sides; Moving clip (203) is cylindrical with the wafer contact position;
Two baffle plate assemblies (205) symmetry is fixed on the pallet (101), and each baffle plate assembly (205) comprises a crossbeam (2051), two adjustment screw (2052) and a baffle plate (2053); Crossbeam (2051) has two screwed holes (2051a) and one first circular hole (2051b), and crossbeam (2051) is fixedly mounted on the pallet (101); Screwed hole (2051a) is arranged symmetrically in crossbeam (2051) two ends along Y direction; Two adjustment screw (2052) are installed in respectively in two screwed holes (2051a); Be fixed with damper rod (2053a) on the baffle plate (2053), damper rod (2053a) passes first circular hole (2051b);
Motor (201) is fixed on the pedestal (001), moves clip (203) and is fixed on the pallet (101); Cotton rope (202) is fixedly connected with clip connector (203c) on the mobile clip (203); One end of two spring elements (204) is fixedly connected with clip connector (203), and the other end is connected with two baffle plates (2053) respectively.
2. a kind of wafer clamping device that utilizes the cotton rope springs as claimed in claim 1; It is characterized in that: described eight circular holes (104) are arranged in pallet (101) both sides with respect to the X axial symmetry, and four circular holes in eight circular holes (104) are distributed on the circumference; All the other four circular holes are distributed on another circumference.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210192044XA CN102709222A (en) | 2011-06-28 | 2012-06-11 | Wafer clamping device utilizing stretching of cord spring |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110176774 | 2011-06-28 | ||
| CN201110176774.6 | 2011-06-28 | ||
| CN201210192044XA CN102709222A (en) | 2011-06-28 | 2012-06-11 | Wafer clamping device utilizing stretching of cord spring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102709222A true CN102709222A (en) | 2012-10-03 |
Family
ID=46901885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210192044XA Pending CN102709222A (en) | 2011-06-28 | 2012-06-11 | Wafer clamping device utilizing stretching of cord spring |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102709222A (en) |
| WO (1) | WO2013000426A1 (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456672A (en) * | 2013-09-04 | 2013-12-18 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
| CN103730321A (en) * | 2013-12-24 | 2014-04-16 | 苏州市奥普斯等离子体科技有限公司 | Device for processing chip plasma surface |
| CN103745949A (en) * | 2013-12-24 | 2014-04-23 | 苏州市奥普斯等离子体科技有限公司 | Chip clamping device |
| CN104354963A (en) * | 2014-11-05 | 2015-02-18 | 东晶锐康晶体（成都）有限公司 | Square tray fixing device |
| CN104752287A (en) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray mounting/demounting manipulator |
| US9443819B2 (en) | 2014-02-13 | 2016-09-13 | Apple Inc. | Clamping mechanism for processing of a substrate within a substrate carrier |
| CN106241728A (en) * | 2015-06-15 | 2016-12-21 | 武汉理工大学 | A kind of Teflon device for the processing of micro-nano device wet method and process technique |
| CN110854043A (en) * | 2019-11-19 | 2020-02-28 | 上海华力集成电路制造有限公司 | Wafer loading finger of pre-vacuum lock chamber |
| TWI759160B (en) * | 2020-04-08 | 2022-03-21 | 德商謬泰克自動化技術有限公司 | Device and method for removing a framed wafer from a wafer tray |
| CN115424976A (en) * | 2022-11-07 | 2022-12-02 | 浙江果纳半导体技术有限公司 | Wafer clamping mechanism and wafer transmission equipment |
| WO2024045242A1 (en) * | 2022-09-02 | 2024-03-07 | 台湾积体电路制造股份有限公司 | Positioning device and wafer clamping system |
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- 2012-06-11 CN CN201210192044XA patent/CN102709222A/en active Pending
- 2012-06-28 WO PCT/CN2012/077786 patent/WO2013000426A1/en active Application Filing
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| US20020051704A1 (en) * | 1999-03-18 | 2002-05-02 | Applied Materials, Inc. | Pneumatically actuated flexure gripper for wafer handling robots |
| US20040048474A1 (en) * | 2000-12-15 | 2004-03-11 | Hiroshi Asano | Wafer holding |
| JP2006150538A (en) * | 2004-11-30 | 2006-06-15 | Rorze Corp | Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456672A (en) * | 2013-09-04 | 2013-12-18 | 沈阳拓荆科技有限公司 | Open type supporting board for pin |
| CN103456672B (en) * | 2013-09-04 | 2016-03-09 | 沈阳拓荆科技有限公司 | Open pin support plate |
| CN103730321A (en) * | 2013-12-24 | 2014-04-16 | 苏州市奥普斯等离子体科技有限公司 | Device for processing chip plasma surface |
| CN103745949A (en) * | 2013-12-24 | 2014-04-23 | 苏州市奥普斯等离子体科技有限公司 | Chip clamping device |
| CN104752287A (en) * | 2013-12-30 | 2015-07-01 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray mounting/demounting manipulator |
| US9443819B2 (en) | 2014-02-13 | 2016-09-13 | Apple Inc. | Clamping mechanism for processing of a substrate within a substrate carrier |
| CN104354963A (en) * | 2014-11-05 | 2015-02-18 | 东晶锐康晶体（成都）有限公司 | Square tray fixing device |
| CN106241728A (en) * | 2015-06-15 | 2016-12-21 | 武汉理工大学 | A kind of Teflon device for the processing of micro-nano device wet method and process technique |
| CN110854043A (en) * | 2019-11-19 | 2020-02-28 | 上海华力集成电路制造有限公司 | Wafer loading finger of pre-vacuum lock chamber |
| TWI759160B (en) * | 2020-04-08 | 2022-03-21 | 德商謬泰克自動化技術有限公司 | Device and method for removing a framed wafer from a wafer tray |
| US11443974B2 (en) | 2020-04-08 | 2022-09-13 | Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh | Device and method for removing a framed wafer from a wafer tray |
| WO2024045242A1 (en) * | 2022-09-02 | 2024-03-07 | 台湾积体电路制造股份有限公司 | Positioning device and wafer clamping system |
| CN115424976A (en) * | 2022-11-07 | 2022-12-02 | 浙江果纳半导体技术有限公司 | Wafer clamping mechanism and wafer transmission equipment |
| CN115424976B (en) * | 2022-11-07 | 2023-02-17 | 浙江果纳半导体技术有限公司 | Wafer clamping mechanism and wafer transmission equipment |
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| Publication number | Publication date |
|---|---|
| WO2013000426A1 (en) | 2013-01-03 |
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Application publication date: 20121003 |