CN110854043A - Wafer loading finger of pre-vacuum lock chamber - Google Patents
Wafer loading finger of pre-vacuum lock chamber Download PDFInfo
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- CN110854043A CN110854043A CN201911132866.7A CN201911132866A CN110854043A CN 110854043 A CN110854043 A CN 110854043A CN 201911132866 A CN201911132866 A CN 201911132866A CN 110854043 A CN110854043 A CN 110854043A
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- wafer
- lock chamber
- vacuum lock
- point contact
- wafer loading
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a wafer loading finger of a pre-vacuum lock chamber, and the main structure of the wafer loading finger is made of ceramic materials. A wafer point contact portion is provided at a front end portion of the main body structure. The top surface of the wafer point contact part protrudes above the top surface of the main body structure, so that the wafer and the wafer loading finger are in point contact, and the contact area of the wafer is reduced. The component material of the wafer point contact part is soft material with hardness smaller than that of the ceramic material so as to reduce the vibration of the wafer. The wafer point contact part is detachably arranged on the main body structure, so that the wafer point contact part is convenient to clean and replace. The invention can reduce or eliminate the number of particle defects generated by friction between fingers and wafers, improve the process stability and process window, prolong the maintenance period of the cavity and improve the normal operation time of equipment.
Description
Technical Field
The present invention relates to a semiconductor integrated circuit manufacturing apparatus, and more particularly, to a wafer loading finger (finger) of a pre-vacuum lock chamber.
Background
An AMEC DRIE machine provided by the middle micro semiconductor equipment (shanghai) limited company (AMEC) is a plasma etcher, a single device of the AMEC DRIE machine has 4 reaction chambers and 2 load lock chambers (loadlock chambers), and the design ensures higher productivity and is an important etcher machine in wafer (wafer) processing.
The pre-vacuum lock chamber is used for introducing the wafer from the atmospheric state, and then sealing and vacuumizing. Then, the wafer is conveyed into the reaction cavity to carry out the processing steps; conversely, after the wafer is processed in the reaction chamber, the wafer needs to be pulled back into the pre-vacuum lock chamber, and then the pre-vacuum lock chamber is vacuumized to transfer the wafer back to the wafer transfer box, such as a FOUP, in an atmospheric state. Therefore, the pre-vacuum lock chamber provides a transition from atmosphere to vacuum or from vacuum to atmosphere in the wafer transfer.
During wafer transfer, a wafer loading finger is used to place the wafer in the pre-vacuum lock chamber. FIG. 1 is a top view of a wafer loading finger of a conventional pre-vacuum lock chamber; the wafer loading finger of the conventional pre-vacuum lock chamber comprises a main body structure 101 made of a ceramic material, and a bearing area of a wafer is arranged between the front end part and the root part of the main body structure 101.
The wafer loading finger further comprises an installation part 102, the installation part 102 is made of ceramic materials, and the main body structure 101 is integrally formed on the installation part 102.
Two mounting holes 104 are formed in the mounting portion 102, and the mounting portion 102 is mounted in the pre-vacuum lock chamber through screws passing through the mounting holes 104.
And a plurality of wafer loading fingers are arranged in the same pre-vacuum lock chamber. The mounting holes 104 of the mounting portions 102 of each wafer loading finger are aligned and a spacer portion is provided between the mounting portions 102, and a screw hole is provided in the spacer portion and aligned with the mounting hole 104, and a screw is simultaneously passed through the mounting holes 104 and the screw hole of the spacer portion to fix each wafer loading finger in the pre-vacuum lock chamber. Typically, each of the wafer loading fingers is fixed to the bottom surface of the pre-vacuum lock chamber, i.e., each of the wafer loading fingers vertically overlaps the bottom surface of the pre-vacuum lock chamber.
In the prior art, the material of the wafer loading finger is usually ceramic, and the polished ceramic surface is directly contacted with the back surface of the wafer. As wafer processing moves to higher technology nodes, the control of defect particles (particles) by the etching process becomes more and more stringent, for example, the corresponding size of defect particles decreases from 0.16 microns to 0.06 microns. In the AMEC DRIE platform, as loadlock is a significant part of the transfer path connecting vacuum and atmosphere, finger is a component carrying wafer, and finger in the prior art is a ceramic structure directly contacting the wafer back, the structure has two disadvantages:
1. the wafer and ceramic are in direct contact and slight friction during transfer can cause particles that can cause surface defects on the wafer article.
2. Rubbing of the ceramic surface against the wafer blackens the contact surface, presents a particle hazard and is difficult to clean.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a wafer loading finger of a pre-vacuum lock chamber, which can reduce or eliminate the number of particle defects generated by friction between the finger and the wafer, improve the process stability and the process window, prolong the maintenance period of the chamber and improve the normal operation time (uptime) of equipment.
In order to solve the technical problem, the main structure of the wafer loading finger of the pre-vacuum lock chamber provided by the invention is made of ceramic materials.
A bearing area of the wafer is arranged between the front end part and the root part of the main body structure, and a wafer point contact part is arranged on the front end part of the main body structure.
The top surface of the wafer point contact part protrudes above the top surface of the main body structure, so that the wafer and the wafer loading finger are in point contact, and the contact area of the wafer is reduced.
The component material of the wafer point contact part is soft material with the hardness smaller than that of the ceramic material so as to reduce the vibration of the wafer.
The wafer point contact part is detachably arranged on the main body structure, so that the wafer point contact part is convenient to clean and replace.
In a further improvement, the main structure is rectangular or fan-shaped in top view.
In a further improvement, the wafer point contacts are captured in through holes formed in the front end of the body structure.
In a further refinement, the wafer point contacts are embedded in the through holes by interference fit.
In a further refinement, the through-hole comprises a cylindrical hole through the entire thickness of the body structure and a groove at the periphery of the cylindrical hole.
The groove is communicated with the cylindrical hole, the depth of the groove is smaller than that of the cylindrical hole, the position where the groove is communicated with the cylindrical hole is in a step structure, and the groove extends from the step structure to the outer side of the cylindrical hole.
The wafer point contact part is provided with a cylindrical part corresponding to the cylindrical hole and a strip part corresponding to the groove, and the cylindrical part is clamped in the cylindrical hole while the strip part is clamped in the corresponding groove.
In a further improvement, the cross-sectional configuration of the projecting portions of the wafer point contacts above the top surface of the body structure is trapezoidal.
In a further improvement, the diameter of the cylindrical part of the wafer point contact part is 3.1 plus or minus 0.1mm, the diameter of the top surface of the protruding part of the wafer point contact part is 2 plus or minus 0.1mm, the thickness of the main body structure is 2.6mm, the thickness of the wafer point contact part is 3 plus or minus 0.1mm, and the top angle of the trapezoid of the cross-sectional structure of the protruding part of the wafer point contact part is 165 degrees.
The wafer loading finger further comprises an installation part, the installation part is made of ceramic materials, and the main body structure is integrally formed on the installation part.
The further improvement is that the installation part is provided with two installation holes, and the installation part is installed in the pre-vacuum lock chamber through screws penetrating through the installation holes.
In a further improvement, a plurality of wafer loading fingers are mounted to the same pre-vacuum lock chamber.
In a further improvement, the mounting holes of the mounting portions of each wafer loading finger are aligned, a spacer portion is arranged between the mounting portions, a screw hole aligned with the mounting hole is also formed in the spacer portion, and a screw simultaneously penetrates through the mounting holes and the screw hole of the spacer portion to fix each wafer loading finger in the pre-vacuum lock chamber.
In a further refinement, each of the wafer loading fingers is secured to a bottom surface of the pre-vacuum lock chamber.
In a further improvement, the pre-vacuum lock chamber is a pre-vacuum lock chamber of a plasma etcher.
In a further improvement, one of the plasma etchers comprises two of the pre-vacuum lock chambers, and one of the pre-vacuum lock chambers comprises 4 of the wafer loading fingers.
In a further improvement, the wafer point contact part is made of Vespel resin.
Compared with the structure that the wafer and the finger are in large-area contact in the prior art, the wafer point contact part can reduce the contact area of the wafer and the finger, so that the number of particle defects generated by friction between the finger and the wafer is reduced or eliminated.
In addition, the material arrangement of the wafer point contact portion of the present invention can be independent of the material arrangement of the main body structure, so the material arrangement of the wafer point contact portion of the present invention can be a soft material such as Vespel resin which is softer than the ceramic material, and since the wafer point contact portion is in direct contact with the wafer and is softer, the wafer shock can be reduced, which can further reduce or eliminate the number of particle defects generated by the friction between the finger and the wafer.
In addition, compared with the prior art that the contact surface of the finger and the wafer is easy to blacken and particle defects are easy to generate and are not easy to clean, the wafer point contact part is detachably arranged on the main body structure, so the wafer point contact part can be conveniently taken down from the main body structure, the wafer point contact part can be conveniently cleaned or replaced, and the hidden trouble that the particle defects are formed at the contact position of the finger and the wafer can be eliminated.
In summary, the present invention can reduce or eliminate the number of particle defects caused by friction between the fingers and the wafer, improve process stability, increase process options and process recipe (recipe) windows, prolong chamber maintenance cycle and improve uptime of the device.
Drawings
The invention is described in further detail below with reference to the following figures and detailed description:
FIG. 1 is a top view of a wafer loading finger of a prior art pre-vacuum lock chamber;
FIG. 2 is a top view of a wafer loading finger of the pre-vacuum lock chamber in accordance with an embodiment of the present invention;
FIG. 3 is a cross-sectional view taken along line AA in FIG. 2;
FIG. 4 is a cross-sectional view taken along line BB in FIG. 2;
FIG. 5 is a schematic view of the wafer point contacts and vias of FIG. 4 in isolation;
fig. 6 is an enlarged view of a wafer point contact according to an embodiment of the present invention.
Detailed Description
FIG. 2 is a top view of a wafer loading finger of the pre-vacuum lock chamber according to an embodiment of the present invention; FIG. 3 is a cross-sectional view taken along line AA in FIG. 2; FIG. 4 is a cross-sectional view taken along line BB in FIG. 2; fig. 5 is a schematic view of fig. 4 with the corresponding wafer point contact 3 and via 2 separated; FIG. 6 is an enlarged view of a wafer point contact 3 according to an embodiment of the present invention; the main structure 1 of the wafer loading finger of the pre-vacuum lock chamber is made of ceramic materials.
A wafer bearing area is arranged between the front end part and the root part of the main body structure 1, and a wafer point contact part 3 is arranged on the front end part of the main body structure 1.
The top surface of the wafer point contact part 3 protrudes above the top surface of the main body structure 1, so that the wafer and the wafer loading finger are in point contact, and the contact area of the wafer is reduced.
The wafer point contact portion 3 is made of a soft material having a hardness smaller than that of the ceramic material, so as to reduce the wafer vibration. Preferably, the material of the wafer point contact 3 is Vespel resin. Vespel resin is a wholly aromatic polyimide resin. The Vespel resin is a high-performance resin, has good heat resistance and wear resistance, can be used under the condition of no lubrication without influencing other materials, and cannot cause any damage.
The wafer point contact part 3 is detachably arranged on the main body structure 1, so that the wafer point contact part 3 is convenient to clean and replace.
The main structure 1 is rectangular in top view. In other embodiments can also be: the main structure 1 is fan-shaped.
The wafer point contact 3 is engaged in a through hole 2 formed in the front end portion of the body structure 1.
The wafer point contact 3 is inserted into the through hole 2 by interference fit.
The through-hole 2 includes a cylindrical hole passing through the entire thickness of the body structure 1 and a groove 2a at the outer periphery of the cylindrical hole.
The groove 2a is communicated with the cylindrical hole, the depth of the groove 2a is smaller than that of the cylindrical hole, the groove 2a and the cylindrical hole are in a step structure at the communication position, and the groove 2a extends from the step structure to the outer side of the cylindrical hole. As shown in fig. 2, two grooves 2a are included, and the two grooves 2a are arranged on an extension line with the same diameter; in other embodiments, this can also be: with one or more than 2 of said grooves 2 a.
The wafer point contact 3 has a cylindrical portion corresponding to the cylindrical hole and a bar portion 3b corresponding to the groove 2a, the cylindrical portion being caught in the cylindrical hole while the bar portion 3b is caught in the corresponding groove 2 a.
The cross-sectional structure of the protruding portion 3a of the wafer point contact 3 protruding above the top surface of the body structure 1 is trapezoidal.
The diameter of the cylindrical portion of the wafer point contact 3 is 3.1 ± 0.1mm, the diameter of the top surface of the projecting portion 3a of the wafer point contact 3 is 2 ± 0.1mm, the thickness of the body structure 1 is 2.6mm, the thickness of the wafer point contact 3 is 3 ± 0.1mm, and the apex angle α of the trapezoid of the cross-sectional structure of the projecting portion 3a of the wafer point contact 3 is 165 degrees.
Wafer loading finger still includes installation department 3, installation department 3 comprises ceramic material, 1 integrated into one piece of major structure sets up on the installation department 3.
Be provided with two mounting holes 4 on the installation department 3, installation department 3 is through passing the screw of mounting hole 4 is installed in the lock chamber of forevacuum.
And a plurality of wafer loading fingers are arranged in the same pre-vacuum lock chamber. Mounting holes 4 of the mounting portions 3 of the wafer loading fingers are aligned, a spacing portion is arranged between the mounting portions 3, screw holes aligned with the mounting holes 4 are also formed in the spacing portion, and screws simultaneously penetrate through the mounting holes 4 and the screw holes of the spacing portion and fix the wafer loading fingers in the pre-vacuum lock chamber. Each wafer loading finger is secured to a bottom surface of the pre-vacuum lock chamber.
The pre-vacuum lock chamber is a pre-vacuum lock chamber of a plasma etcher, such as an AMEC DRIE machine. One plasma etcher comprises two pre-vacuum lock chambers, and one pre-vacuum lock chamber comprises 4 wafer loading fingers.
Compared with the structure that the wafer and the finger are in large-area contact in the prior art, the wafer point contact part 3 is added on the main body structure 1 of the wafer loading finger, the wafer point contact part 3 can reduce the contact area of the wafer and the finger, and therefore the number of particle defects generated by friction between the finger and the wafer is reduced or eliminated.
In addition, the material of the wafer point contact portion 3 according to the embodiment of the present invention can be provided independently of the material of the main body structure 1, so the material of the wafer point contact portion 3 according to the present invention can be provided as a soft material such as Vespel resin which is softer than the ceramic material, and since the wafer point contact portion 3 is in direct contact with the wafer and is softer, the wafer shock can be reduced, which can further reduce or eliminate the number of particle defects generated by the friction between the finger and the wafer.
In addition, compared with the prior art that the contact surface between the finger and the wafer is easy to blacken and particle defects are easy to generate and the cleaning is not easy, the wafer point contact part 3 of the embodiment of the invention is detachably arranged on the main body structure 1, so the wafer point contact part 3 can be conveniently taken down from the main body structure 1, the cleaning or the replacement of the wafer point contact part 3 can be conveniently carried out, and the hidden danger of particle defects at the contact position between the finger and the wafer can be eliminated.
In summary, embodiments of the present invention can reduce or eliminate the number of particle defects caused by friction between the fingers and the wafer, improve process stability, increase process options and process recipe (recipe) windows, prolong chamber maintenance periods, and improve uptime of the apparatus.
The present invention has been described in detail with reference to the specific embodiments, but these should not be construed as limitations of the present invention. Many variations and modifications may be made by one of ordinary skill in the art without departing from the principles of the present invention, which should also be considered as within the scope of the present invention.
Claims (15)
1. A wafer loading finger of a pre-vacuum lock chamber, characterized in that: the main structure of the wafer loading finger is made of ceramic material,
a bearing area of the wafer is arranged between the front end part and the root part of the main body structure, and a wafer point contact part is arranged on the front end part of the main body structure;
the top surface of the wafer point contact part protrudes above the top surface of the main body structure, so that the wafer and the wafer loading finger are in point contact, and the contact area of the wafer is reduced;
the component material of the wafer point contact part is a soft material with the hardness smaller than that of the ceramic material so as to reduce the vibration of the wafer;
the wafer point contact part is detachably arranged on the main body structure, so that the wafer point contact part is convenient to clean and replace.
2. The wafer loading finger of the pre-vacuum lock chamber of claim 1, wherein: the main structure is rectangular or fan-shaped in top view.
3. The wafer loading finger of the pre-vacuum lock chamber of claim 2, wherein: the wafer point contact is engaged in a through hole formed in a front end portion of the body structure.
4. The wafer loading finger of the pre-vacuum lock chamber of claim 3, wherein: the wafer point contact is embedded in the through hole by interference fit.
5. The wafer loading finger of the pre-vacuum lock chamber of claim 4, wherein: the through hole comprises a cylindrical hole passing through the whole thickness of the main body structure and a groove positioned at the periphery of the cylindrical hole;
the groove is communicated with the cylindrical hole, the depth of the groove is smaller than that of the cylindrical hole, the position where the groove is communicated with the cylindrical hole is in a step structure, and the groove extends to the outer side of the cylindrical hole from the step structure;
the wafer point contact part is provided with a cylindrical part corresponding to the cylindrical hole and a strip part corresponding to the groove, and the cylindrical part is clamped in the cylindrical hole while the strip part is clamped in the corresponding groove.
6. The wafer loading finger of the pre-vacuum lock chamber of claim 5, wherein: the cross-sectional structure of the protruding part of the wafer point contact part protruding above the top surface of the main body structure is trapezoidal.
7. The wafer loading finger of the pre-vacuum lock chamber of claim 6, wherein: the diameter of the cylindrical part of the wafer point contact part is 3.1 +/-0.1 mm, the diameter of the top surface of the protruding part of the wafer point contact part is 2 +/-0.1 mm, the thickness of the main body structure is 2.6mm, the thickness of the wafer point contact part is 3 +/-0.1 mm, and the trapezoidal vertex angle of the cross-sectional structure of the protruding part of the wafer point contact part is 165 degrees.
8. The wafer loading finger of the pre-vacuum lock chamber of claim 1, wherein: the wafer loading finger further comprises an installation part, the installation part is made of ceramic materials, and the main body structure is integrally formed and arranged on the installation part.
9. The wafer loading finger of the pre-vacuum lock chamber of claim 1, wherein: the mounting portion is provided with two mounting holes and is installed in the pre-vacuum lock cavity through screws penetrating through the mounting holes.
10. The wafer loading finger of the pre-vacuum lock chamber of claim 9, wherein: and a plurality of wafer loading fingers are arranged in the same pre-vacuum lock chamber.
11. The wafer loading finger of the pre-vacuum lock chamber of claim 10, wherein: mounting holes of the mounting portions of the wafer loading fingers are aligned, a spacing portion is arranged between the mounting portions, screw holes aligned with the mounting holes are also formed in the spacing portion, and screws simultaneously penetrate through the mounting holes and the screw holes of the spacing portion and fix the wafer loading fingers in the pre-vacuum lock chamber.
12. The wafer loading finger of the pre-vacuum lock chamber of claim 11, wherein: each wafer loading finger is secured to a bottom surface of the pre-vacuum lock chamber.
13. The wafer loading finger of the pre-vacuum lock chamber of claim 11, wherein: the pre-vacuum lock chamber is a pre-vacuum lock chamber of a plasma etcher.
14. The wafer loading finger of the pre-vacuum lock chamber of claim 13, wherein: one plasma etcher comprises two pre-vacuum lock chambers, and one pre-vacuum lock chamber comprises 4 wafer loading fingers.
15. The wafer loading finger of the pre-vacuum lock chamber of claim 1, wherein: the wafer point contact part is made of Vespel resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132866.7A CN110854043A (en) | 2019-11-19 | 2019-11-19 | Wafer loading finger of pre-vacuum lock chamber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911132866.7A CN110854043A (en) | 2019-11-19 | 2019-11-19 | Wafer loading finger of pre-vacuum lock chamber |
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| CN110854043A true CN110854043A (en) | 2020-02-28 |
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| CN201911132866.7A Pending CN110854043A (en) | 2019-11-19 | 2019-11-19 | Wafer loading finger of pre-vacuum lock chamber |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347315A (en) * | 2004-05-31 | 2005-12-15 | Sanyo Electric Co Ltd | Wafer transfer device and wafer transfer method |
| CN102709222A (en) * | 2011-06-28 | 2012-10-03 | 清华大学 | Wafer clamping device utilizing stretching of cord spring |
| US20170040205A1 (en) * | 2015-08-05 | 2017-02-09 | Lam Research Corporation | High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer |
| CN208923074U (en) * | 2018-10-26 | 2019-05-31 | 长鑫存储技术有限公司 | Transmit arm |
-
2019
- 2019-11-19 CN CN201911132866.7A patent/CN110854043A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005347315A (en) * | 2004-05-31 | 2005-12-15 | Sanyo Electric Co Ltd | Wafer transfer device and wafer transfer method |
| CN102709222A (en) * | 2011-06-28 | 2012-10-03 | 清华大学 | Wafer clamping device utilizing stretching of cord spring |
| US20170040205A1 (en) * | 2015-08-05 | 2017-02-09 | Lam Research Corporation | High-hardness-material-powder infused elastomer for high friction and compliance for silicon wafer transfer |
| CN208923074U (en) * | 2018-10-26 | 2019-05-31 | 长鑫存储技术有限公司 | Transmit arm |
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Application publication date: 20200228 |