WO2024045242A1

WO2024045242A1 - Positioning device and wafer clamping system

Info

Publication number: WO2024045242A1
Application number: PCT/CN2022/120671
Authority: WO
Inventors: 高佳; 陆峰; 殷凯
Original assignee: 台湾积体电路制造股份有限公司; 台积电(中国)有限公司
Priority date: 2022-09-02
Filing date: 2022-09-22
Publication date: 2024-03-07
Also published as: CN217903092U

Abstract

The application relates to a positioning device and a wafer clamping system. The positioning device is used in the wafer clamping system, and comprises a supporting mechanism and a positioning mechanism, wherein the positioning mechanism comprises a body portion and a limiting portion; the body portion is arranged on the supporting mechanism, and the limiting portion is connected to the body portion and protrudes relative to the body portion; the limiting portion and the body portion enclose an accommodating cavity, and at least part of a surface of the accommodating cavity is an arc-shaped surface; and the positioning device has a first state in which the body portion is movably connected to the supporting mechanism and can move relative to the supporting mechanism, and a second state in which the body portion and the supporting mechanism are locked. By means of the positioning device provided by the application, the mounting accuracy of the clamping mechanism for clamping a wafer can be improved, and the product yield can also be improved.

Description

Positioning device and wafer clamping system

Cross-references to related applications

This application claims priority to Chinese patent application 202222333507.1 titled "Positioning Device and Wafer Clamping System" filed on September 2, 2022. The entire content of this application is incorporated herein by reference.

Technical field

The present application relates to the technical field of semiconductor transportation equipment, and in particular to a positioning device and a wafer clamping system.

Background technique

Wafer is the core component for the production of semiconductor integrated circuits. Circuits and electronic components can be processed on the wafer. The above-mentioned manufacturing process requires multiple processes, among which transferring the wafer between various process chambers is an essential process.

During the process of transferring the wafer, component wear may occur, and components such as the clamping mechanism need to be replaced. The replaced clamping mechanism may be offset, causing the wafer to be unable to be accurately positioned on the wafer clamping system, resulting in The wafer is skewed during the transfer process, causing wafer damage and other phenomena, which will reduce the product yield.

Contents of the invention

This application provides a positioning device and a wafer clamping system, aiming to improve the installation accuracy of the clamping mechanism for clamping the wafer and improve product yield.

In order to achieve the above object, in the first aspect, the present application provides a positioning device, which is used in a wafer clamping system. The positioning device includes a support mechanism and a positioning mechanism; the positioning mechanism includes a body part and a limiting part. , the body part is arranged on the support mechanism, the limiting part is connected to the body part and protrudes relative to the body part, the limiting part and the body part are enclosed to form an accommodation cavity, at least part of the surface of the accommodation cavity is an arc surface, wherein , the positioning device includes a first state and a second state. In the first state, the body part and the support mechanism are movably connected, and the body part can move relative to the support mechanism; in the second state, the body part and the support mechanism are locked.

In some embodiments, the surface of the body part close to the limiting part is an arc-shaped surface, and the arc-shaped surface protrudes toward the direction of the limiting part.

In some embodiments, the body part and the limiting part are connected in a smooth transition.

In some embodiments, the body portion includes two ends opposite to each other, and a limiting portion is provided at one of the two ends.

In some embodiments, a projection of the body portion along a thickness direction of the support mechanism partially overlaps with the support mechanism.

In some embodiments, the projection of the limiting portion along the thickness direction of the supporting mechanism is staggered from the supporting mechanism.

In some embodiments, the support mechanism includes a support body and an extension part; the extension part is connected to the support body and protrudes from the support body, the extension part has an arc-shaped structure, and a body part is provided on the extension part.

In some embodiments, the extension part includes a plurality of sub-parts connected to the support body, the plurality of sub-parts are spaced apart along the circumference of the extension part, and each sub-part is provided with a body part.

In some embodiments, the support body includes a main body part and a weight-reducing part; the main body part is connected to the extension part; the weight-reducing part is connected to the main body part, and the mass of the weight-reducing part is smaller than the mass of the main body part.

In a second aspect, this application proposes a wafer clamping system. The wafer clamping system includes a base, a clamping mechanism and a positioning device. The positioning device is as in any embodiment of the first aspect of this application. The positioning device; the clamping mechanism is detachably connected to the base and is used to clamp the wafer; the positioning device includes a support mechanism detachably connected to the base and a positioning mechanism with a body part, wherein the positioning device is In the first state, the body part and the support mechanism are movably connected, and the body part can move relative to the support mechanism to adjust the relative position of the body part and the clamping mechanism; in the second state, the body part and the support mechanism are locked.

According to the positioning device of the embodiment of the present application, the positioning device includes a support mechanism. When the clamping mechanism needs to be replaced, it can be locked by the support mechanism and the base of the wafer clamping system to improve the stability of the replacement process; the positioning device also includes a positioning device. mechanism. The positioning mechanism includes a body part and a limiting part. The body part and the limiting part are enclosed to form an accommodation cavity. The accommodation cavity can be used to accommodate the clamping mechanism of the wafer clamping system, which is beneficial to the positioning mechanism for clamping. The precise positioning of the installation position of the mechanism, and at least part of the surface of the accommodation cavity is an arc surface, which can match the contours of the accommodation cavity and the clamping mechanism, which is conducive to further improving the accuracy of the installation position positioning; through the body part relative to the support The movement of the mechanism can adjust the relative position of the body part and the clamping mechanism of the wafer clamping system, thereby determining the installation position of the clamping mechanism; the limit part is connected to the body part and protrudes relative to the body part, and the protruding limit part The part can further limit the position of the clamping mechanism and position the installation position of the clamping mechanism more accurately, thereby improving the clamping accuracy of the wafer and reducing the risk of damage to the wafer during clamping and transfer, thereby enabling Improve product yield. Moreover, the positioning device of the present application is practical and convenient, and can significantly improve production efficiency.

Description of drawings

The present application can be better understood from the following description of specific embodiments of the present application with reference to the accompanying drawings, wherein other features, objects and advantages of the present application will become apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings. It will become more apparent that identical or similar reference numbers indicate identical or similar features.

Figure 1 is a schematic structural diagram of a wafer clamping system provided by some embodiments of the present application;

Figure 2 is an enlarged schematic diagram of the wafer clamping system shown in Figure 1 at position I;

Figure 3 is a schematic structural diagram of a wafer clamping system provided by other embodiments of the present application;

Figure 4 is a schematic structural diagram of a positioning device provided by some embodiments of the present application;

Figure 5 is a schematic structural diagram of a positioning device provided by other embodiments of the present application.

The drawings are not necessarily drawn to actual scale.

Each figure in the figure is marked with:

X, thickness direction; W, wafer;

1. Wafer clamping system; 10. Positioning device; 11. Support mechanism; 111. Support body; 1111. Main body part; 1112. Weight reduction part; 112. Extension part; 1121. Sub-part; 113. Second fixing part ; 12. Positioning mechanism; 121. Body part; 1211. First arc surface; 122. Limiting part; 123. Accommodation cavity; 124. Third fixing piece; 125. Installation hole; 20. Clamping mechanism; 21. Clamp Holding surface; 22. First fixing member; 30. Base.

Detailed ways

The embodiments of the present application will be described in further detail below with reference to the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to illustrate the principles of the present application, but cannot be used to limit the scope of the present application, that is, the present application is not limited to the described embodiments.

In the description of this application, it should be noted that, unless otherwise stated, "plurality" means more than two; the terms "upper", "lower", "left", "right", "inside", " The orientation or positional relationship indicated such as "outside" is only for the convenience of describing the present application and simplifying the description. It does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present application. Application restrictions. Furthermore, the terms "first," "second," etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. "Vertical" is not vertical in the strict sense, but within the allowable error range. "Parallel" is not parallel in the strict sense, but within the allowable error range.

The directional words appearing in the following description are the directions shown in the figures and do not limit the specific structure of the present application. In the description of this application, it should also be noted that, unless otherwise clearly stated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense. For example, it can be a fixed connection or a removable connection. Detachable connection, or integral connection; it can be directly connected or indirectly connected through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in this application may be understood based on specific circumstances.

During the production process, the wafer needs to enter the transfer chamber from the atmospheric environment and then enter the reaction chamber, and may need to be transferred between different reaction chambers, and transferred from the reaction chamber to the transfer chamber after completing the process production. Each transfer step requires the cooperation of a wafer clamping system. The wafer is placed on the wafer clamping system, the wafer is clamped by the wafer clamping system, and the wafer is transferred to the next process.

In order to improve the clamping accuracy of the wafer clamping system, this application starts from the structural improvement of the wafer clamping system. During the wafer clamping process, auxiliary devices such as positioning devices are provided. The positioning device controls the wafer clamping system. The positioning of the clamping mechanism can make the installation position of the replaced clamping mechanism more accurate, thereby improving the clamping accuracy of the transmission system. Next, this application will be described in detail.

This application proposes a wafer clamping system 1. As shown in FIGS. 1 to 3 , the wafer clamping system 1 is used to clamp wafers. The wafer clamping system 1 includes a base 30 , a clamping mechanism 20 and a positioning device 10 . W shown in Figure 1 represents a wafer.

The base 30 serves as an installation base, and can be used to connect with other components, such as the robotic arm of the wafer clamping system 1. The robotic arm can drive the base 30 to move up and down or left and right, thereby realizing the wafer W in different directions. transmission on. The base 30 can be made of various materials, such as aluminum, aluminum alloy, etc.

The clamping mechanism 20 is detachably connected to the base 30. The clamping mechanism 20 is used to clamp the wafer. Optionally, the clamping mechanism 20 has a clamping surface 21 in contact with the wafer, and the clamping surface 21 is in contact with the wafer. The outer contour of the wafer matches. The wafer is generally a disc-shaped structure, and its outer contour can be the outer peripheral contour of the wafer; accordingly, the clamping surface 21 can be a circular arc surface or similar to an arc surface, and can cooperate with the outer periphery of the wafer. To fix the wafer. Since the clamping mechanism 20 is in contact with the wafer during use, it will inevitably suffer from wear and tear, such as grooves appearing in the clamping mechanism 20; wear of the clamping mechanism 20 will affect the clamping accuracy of the wafer. , in this case, the clamping mechanism 20 needs to be replaced. Since the clamping mechanism 20 is detachably connected to the base 30 , the clamping mechanism 20 that needs to be replaced can be removed from the base 30 , and then a new clamping mechanism 20 can be installed on the base 30 .

The clamping mechanism 20 is disposed on the base 30 and can be installed on the base 30 through the first fixing member 22 . For example, the first fixing member 22 may be a pin or a bolt. When the clamping mechanism 20 needs to be replaced, the first fixing part 22 can be loosened so that the clamping mechanism 20 can be detached from the base 30; then the new clamping mechanism 20 is fixed to the base 30 through the first fixing part 22. superior.

In some embodiments, the clamping mechanism 20 may include multiple mounting parts. Correspondingly, the base 30 may include a mating part disposed opposite to the multiple mounting parts. Correspondingly, the first fixing part 22 may be provided in plurality. Each first fixing part 22 can be disposed in the mounting part and the matching part respectively to fasten the clamping mechanism 20 and the base 30 . For example, the mounting portion may be in the form of a through hole or a groove. The fitting part may also be in the form of a through hole or a groove.

In some embodiments, a portion of the contour of the clamping mechanism 20 matches a portion of the contour of the base 30 . The above structural arrangement can make the projection of the clamping mechanism 20 in the axial direction of the wafer located within the projection of the base 30 in the axial direction of the wafer, so that the clamping mechanism 20 can occupy less space and can reduce the cost. Interference of the clamping mechanism 20 with other components.

The clamping mechanism 20 is used to clamp the wafer. One or more clamping mechanisms 20 may be provided, and one clamping mechanism 20 may be provided around the periphery of the wafer; when multiple clamping mechanisms 20 are provided, the plurality of clamping mechanisms 20 may be provided one after another along the circumferential direction of the wafer. The clamping surfaces 21 of the multiple clamping mechanisms 20 are arranged around the outer periphery of the wafer; multiple clamping mechanisms 20 can be provided to flexibly replace the clamping mechanisms 20 . Furthermore, multiple clamping mechanisms 20 can be arranged at intervals, and there is basically no interference between adjacent clamping mechanisms 20 , thereby making the replacement of the clamping mechanisms 20 more flexible. By way of example, the number of clamping mechanisms 20 may be set to three, four, five, or six, and so on.

In some embodiments, at least part of the clamping surface 21 of each clamping mechanism 20 is inclined toward the axis of the wafer. The inclined clamping surface 21 can guide the wafer when moving to the clamping mechanism 20 . A part of the clamping surface 21 can be tilted toward the axis of the wafer to guide the movement of the wafer; another part of the clamping surface 21 can be perpendicular to the axis of the wafer, and the other part of the clamping surface 21 is consistent with a part of the clamping surface. 21 are arranged continuously, and the wafer can stay on another part of the clamping surface 21 after being guided by one part of the clamping surface 21 , that is, the other part of the clamping surface 21 can carry the wafer. Of course, the entire clamping surface 21 can be tilted toward the axis of the wafer; the clamping surface 21 includes a first edge and a second edge opposite to each other along the axis of the wafer, and the first edges of the plurality of clamping surfaces 21 are located The diameter of the circumferential outline is larger than the diameter of the wafer, so that the wafer can move from the first edge to the second edge. The diameter of the circumferential outline where the second edges of the plurality of clamping surfaces 21 are located is less than or equal to the diameter of the wafer, so that The wafer is enabled to rest on the second edge or between the first edge and the second edge.

The positioning device 10 can position the clamping mechanism 20. For example, when the clamping mechanism 20 needs to be replaced, the positioning device 10 can be installed on the base 30 so that the positioning device 10 can position the clamping mechanism 20 that needs to be replaced. , that is, mark the installation position of the clamping mechanism 20, then remove the clamping mechanism 20 that needs to be replaced from the base 30, and install the new clamping mechanism 20 on the base 30. In view of the positioning device 10 clamping The installation position of the clamping mechanism 20 is marked, which can improve the installation accuracy of the clamping mechanism 20 and ensure the clamping accuracy of the wafer.

Next, the specific structure of the positioning device 10 will be described. This application also proposes a positioning device 10. As shown in FIGS. 1 to 5 , the positioning device 10 can be used in a wafer clamping system 1 . The positioning device 10 includes a support mechanism 11 and a positioning mechanism 12 .

The support mechanism 11 is detachably connected to the base 30. When the clamping mechanism 20 needs to be replaced, the support mechanism 11 is installed on the base 30. After the clamping mechanism 20 is replaced, the support mechanism 11 can be removed from the base 30. dismantling. For example, the support mechanism 11 is disposed on the base 30 , and it can be disposed on the base 30 through the second fixing member 113 . For example, the second fixing member 113 may be a pin or a bolt. When the clamping mechanism 20 needs to be replaced, the support mechanism 11 and the base 30 can be fastened through the second fixing member 113 so that the positioning device 10 can stably and accurately mark the position of the clamping mechanism 20; after replacing the clamping mechanism 20, Finally, the second fixing member 113 can be loosened so that the supporting mechanism 11 can be detached from the base 30 .

The support mechanism 11 can provide an installation foundation for the positioning mechanism 12 . The support mechanism 11 can be made of a variety of materials, such as aluminum, aluminum alloy or stainless steel. Aluminum alloy is lighter and suitable for lightweight design of the system. Stainless steel has high strength, relatively good mechanical properties, and excellent resistance. Deformation ability and excellent corrosion resistance.

The positioning mechanism 12 can be disposed opposite to the clamping mechanism 20, and the positioning mechanism 12 can be disposed between the support mechanism 11 and the clamping mechanism 20, so that the positioning mechanism 12 can be used to specifically mark the installation position of the clamping mechanism 20; for example, The positioning mechanism 12 includes a body part 121 and a limiting part 122. The body part 121 is provided on the support mechanism 11. The limiting part 122 is connected to the body part 121 and protrudes relative to the body part 121. The space between the limiting part 122 and the body part 121 An accommodating cavity 123 is formed between them, and at least part of the surface of the accommodating cavity 123 is an arc surface. The accommodation cavity 123 can be used to accommodate the clamping mechanism 20 so that the positioning mechanism 12 and the clamping mechanism 20 can be positioned oppositely. Since the wafer is usually a disc-shaped structure, in order to match the structure of the wafer, the clamping mechanism 20 can be set in an arc-shaped structure, and the accommodating cavity 123 is used to cooperate with the clamping mechanism 20, so at least part of the surface of the accommodating cavity 123 can be By providing an arc surface, the positioning mechanism 12 can better match the contour of the clamping mechanism 20 , thereby improving the accuracy of marking the installation position of the clamping mechanism 20 by the positioning mechanism 12 . Since the limiting part 122 protrudes from the body part 121, it can limit the position of the clamping mechanism 20 and position the installation position of the clamping mechanism 20, further improving the positioning of the installation position of the clamping mechanism 20. Accuracy.

The relative position between the body part 121 and the support mechanism 11 can be adjusted. After adjusting the position of the body part 121, the positioning mechanism 12 and the clamping mechanism 20 can be arranged relatively, so that the positioning mechanism 12 can position the clamping mechanism 20. . And after the positioning mechanism 12 is adjusted in place (the positioning mechanism 12 and the clamping mechanism 20 can be arranged relative to each other so that the positioning mechanism 12 can accurately position the installation position of the clamping mechanism 20), the body part 121 is fixed to the support mechanism 11.

Specifically, the positioning device 10 includes a first state and a second state. In the first state, the body part 121 and the support mechanism 11 are movably connected, the body part 121 can move relative to the support mechanism 11, and the movement of the body part 121 will drive the limiter. The position portions 122 move together, so that the overall position of the positioning mechanism 12 can be adjusted to change the relative positional relationship between the positioning mechanism 12 and the clamping mechanism 20 . It should be noted that when the position of the positioning mechanism 12 is adjusted to satisfy that the positioning mechanism 12 and the clamping mechanism 20 are relatively arranged, the positioning mechanism 12 needs to be fixed, that is, the body part 121 of the positioning mechanism 12 and the support mechanism 11 are locked. This state is Second state. Since the positioning mechanism 12 and the clamping mechanism 20 satisfy the relative arrangement relationship, fixing the positioning mechanism 12 is equivalent to determining the installation position of the clamping mechanism 20 . At this time, the clamping mechanism 20 that needs to be replaced can be removed from the base 30 Remove the base 30 , and then install the new clamping mechanism 20 on the base 30 so that the new clamping mechanism 20 and the positioning mechanism 12 are relatively disposed.

The positioning device 10 of the embodiment of the present application includes a support mechanism 11. When the clamping mechanism 20 needs to be replaced, it can be locked by the support mechanism 11 and the base 30 of the wafer clamping system 1, thereby improving the stability of the replacement process. ; The positioning device 10 also includes a positioning mechanism 12. The positioning mechanism 12 includes a body part 121 and a limiting part 122. The body part 121 and the limiting part 122 are enclosed to form an accommodating cavity 123. The accommodating cavity 123 can be used to accommodate wafers. The clamping mechanism 20 of the clamping system 1 is conducive to the precise positioning of the installation position of the clamping mechanism 20 by the positioning mechanism 12, and at least part of the surface of the accommodation cavity 123 is an arc surface, which can make the accommodation cavity 123 and the clamping mechanism 20 Matching the contours of the wafer clamping system 1 helps to further improve the accuracy of the installation position; by moving the body part 121 relative to the support mechanism 11, the relative position of the body part 121 and the clamping mechanism 20 of the wafer clamping system 1 can be adjusted, thereby determining The installation position of the clamping mechanism 20; the limiting part 122 is connected to the body part 121 and protrudes relative to the body part 121. The protruding limiting part 122 can further limit the clamping mechanism 20 and position the clamp more accurately. The installation position of the holding mechanism 20 can be improved to improve the clamping accuracy of the wafer, reduce the risk of damage to the wafer during clamping and transportation, and thereby improve the product yield. Moreover, the positioning device 10 of the present application is practical and convenient, and can significantly improve production efficiency.

In this application, the positioning mechanism 12 is connected to the supporting mechanism 11 , and the two can be connected through the third fixing member 124 . Illustratively, the third fixing member 124 is a pin, a bolt, or the like. When the position of the positioning mechanism 12 needs to be adjusted, the third fixing member 124 can be loosened so that the positioning mechanism 12 and the support mechanism 11 are movablely connected, and the positioning mechanism 12 can adjust its position relative to the support mechanism 11 .

In order to cooperate with the adjustment process of the positioning mechanism 12 , the support mechanism 11 may be provided with a mounting hole 125 . One end of the third fixing member 124 is disposed in the mounting hole 125 of the support mechanism 11 , and the other end is disposed in the body portion 121 of the positioning mechanism 12 . The mounting hole 125 can be configured as a long strip hole or an arc-shaped hole with a certain length, and the third fixing member 124 can move in the mounting hole 125 to drive the positioning mechanism 12 to move. Of course, the mounting hole 125 can be a through hole with a diameter that matches the third fixing member 124. The through holes can be provided in multiple numbers. When adjusting the position of the positioning mechanism 12, the third fixing member 124 can be disposed in different through holes. hole, thereby adjusting the position of the positioning mechanism 12.

Since the wafer is usually a disc-shaped structure, in order to match the structure of the wafer, the overall structure of the clamping mechanism 20 can also be set to an arc-shaped structure or a structure similar to an arc-shaped structure. In order to match the structure of the clamping mechanism 20 , the body portion 121 can be an arc-shaped structure that protrudes toward the direction of the clamping mechanism 20 .

In some embodiments, the surface of the body portion 121 close to the limiting portion 122 is an arc-shaped surface, and the arc-shaped surface protrudes toward the direction of the limiting portion 122 . 1211 shown in FIG. 4 represents the arc surface of the body part 121 , and the arc surface of the body part 121 is defined as the first arc surface 1211 here.

The first arc surface 1211 can match the contour of the clamping mechanism 20 . By matching the first arc surface 1211 with the contour of the clamping mechanism 20 , the positioning mechanism 12 can maintain a relative position with the clamping mechanism 20 , thereby enabling the locked positioning mechanism 12 to accurately position the clamping mechanism 20 for installation. position, so that the installation position of the replaced clamping mechanism 20 is more accurate. In this application, the first arc surface 1211 matches the contour of the clamping mechanism 20, which may mean that the first arc surface 1211 is in direct contact or indirect contact with the contour of the clamping mechanism 20. The indirect contact may refer to an indirect connection through an intermediate component. .

As some examples, the body part 121 may be in direct contact with the clamping mechanism 20 , that is, the arc surface of the body part 121 is in contact with the outer surface of the clamping mechanism 20 . In this case, it can be understood that the outer surface of the clamping mechanism 20 is in contact with the first arc surface 1211 .

As other examples, the body part 121 may be embedded in the clamping mechanism 20 , and the arc surface of the body part 121 is in contact with the inner surface of the clamping mechanism 20 . For example, the clamping mechanism 20 may have a structure with a clamping groove, and the body part 121 is embedded in the clamping groove. Specifically, the clamping mechanism 20 may include a clamping body and a clamping groove. The clamping groove is recessed relative to the clamping body in a direction away from the supporting mechanism 11 . The clamping groove has a bottom surface facing the supporting mechanism 11 . It can be understood that The inner surface of the clamping mechanism 20 includes a bottom surface. The body part 121 is embedded in the clamping groove, and the first arc surface 1211 is in contact with the bottom surface. By the way that the first arc surface 1211 contacts the bottom surface, the position of the bottom surface can be positioned by positioning the first arc surface 1211, and thus the position of the clamping mechanism 20 can be positioned by positioning the positioning mechanism 12.

As some further examples, the clamping mechanism 20 can also be embedded in the positioning mechanism 12 . In this structural form, the positioning mechanism 12 may have a positioning groove, and the clamping mechanism 20 is disposed in the positioning groove.

In some embodiments, the body part 121 and the limiting part 122 are connected in a smooth transition. The connection between the body part 121 and the limiting part 122 is relatively gentle, which is reflected as a smooth transition connection. The problem of stress concentration is not easy to occur at the connection, and can Improve the structural stability of the positioning mechanism 12 itself. Of course, the main body part 121 and the limiting part 122 may be connected at right angles, acute angles or obtuse angles.

In some embodiments, the body part 121 may include two ends opposite to each other, and a limiting part 122 is provided at one of the two ends. For example, when the body part 121 is an arc-shaped structure, it may extend along the circumferential direction, and the two ends may be considered as two ends opposite to each other along the circumferential direction. A limiting portion 122 is provided at one of the two ends to facilitate the movement of the clamping mechanism 20 from the other end of the body portion 121 to one end of the body portion 121 until the clamping mechanism 20 and the body portion 121 cooperate with each other, and in When moving into the accommodation cavity 123 and causing the positioning mechanism 12 and the clamping mechanism 20 to be relatively arranged, the limiting portion 122 can play a limiting role on the clamping mechanism 20 and accurately position the clamping mechanism 20 .

In some embodiments, the projection of the body portion 121 along the thickness direction X of the support mechanism 11 partially overlaps with the support mechanism 11 . The projection along the thickness direction X of the support mechanism 11 can be considered as the projection direction is parallel to the thickness direction X of the support mechanism 11 , and its projection surface is perpendicular to the thickness direction X. The projection of the body part 121 along the thickness direction Reduce interference with other components.

In some embodiments, the projection of the limiting portion 122 along the thickness direction It has an interference effect on the clamping mechanism 20, thereby ensuring the accuracy of installation of the clamping mechanism 20.

In some embodiments, the support mechanism 11 includes a support body 111 and an extension part 112. The extension part 112 is connected to the support body 111 and protrudes from the support body 111. The extension part 112 has an arc-shaped structure, and a body part is provided on the extension part 112. 121. Setting the extension part 112 into an arc-shaped structure is more conducive to the mutual cooperation between the extension part 112 and the body part 121 and improves the positioning effect of the clamping mechanism 20 .

In some embodiments, the extension part 112 includes a plurality of sub-parts 1121 connected to the support body 111. The plurality of sub-parts 1121 are spaced apart along the circumference of the extension part 112, and each sub-part 1121 is provided with a body part 121. The extension part 112 includes a plurality of sub-parts 1121 arranged at intervals. On the one hand, it can reduce the overall weight of the support mechanism 11, reduce its pressure on the base 30, and ensure the structural stability of the wafer clamping system 1; on the other hand, multiple The sub-parts 1121 are arranged at intervals along the circumferential direction of the extension part 112. Each sub-part 1121 is provided with a main body part 121. The corresponding main part 121 of each sub-part 1121 can position the clamping mechanism 20, thereby enabling the clamping mechanism 20 to be positioned. Different clamping mechanisms 20 respectively play a positioning role.

Since the base 30 can be made of soft material, in order to ensure that the base 30 can provide good support to the support mechanism 11, in other words, the support mechanism 11 will not cause excessive pressure on the base 30, in some embodiments, The support body 111 includes a main body 1111 and a weight-reducing part 1112. The mass of the weight-reducing part 1112 is smaller than the mass of the main body 1111. The weight-reducing part 1112 can reduce the overall weight of the support mechanism 11, thereby reducing the impact of the support mechanism 11 on the base 30. pressure to improve the overall structural stability of the wafer clamping system 1. Specifically, the weight reduction part 1112 may be made of a material different from the material of the main body part 1111, and the density of the weight reduction part 1112 is relatively small, so that the mass of the weight reduction part 1112 is smaller than the mass of the main body part 1111. In this case, the weight reduction part 1112 The portion 1112 and the main body portion 1111 can be continuously arranged, and the support main body 111 is embodied in a continuous solid structure. Alternatively, the weight-reducing part 1112 may be a recessed structure relative to the main part 1111, and may be made of the same or different materials as the main part 1111. Alternatively, the weight reduction part 1112 may be a weight reduction hole penetrating the support body 111 along the thickness direction X of the support mechanism 11 .

Furthermore, multiple weight-reducing parts 1112 can be provided, and the multiple weight-reducing parts 1112 are spaced apart, which can reduce the risk of excessive pressure on the base 30 on the basis of ensuring the structural stability of the support mechanism 11 itself. This ensures the overall structural stability of the wafer clamping system 1 .

Although the application has been described with reference to preferred embodiments, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the application, in particular provided that no structural conflicts exist , the technical features mentioned in each embodiment can be combined in any way. The application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

A positioning device for a wafer clamping system, the positioning device includes:

supporting structures; and

A positioning mechanism includes a body part and a limiting part. The body part is provided on the support mechanism. The limiting part is connected to the body part and protrudes relative to the body part. The limiting part An accommodating cavity is formed between the accommodating cavity and the main body part, and at least part of the surface of the accommodating cavity is an arc-shaped surface.

Wherein, the positioning device includes a first state and a second state. In the first state, the body part and the support mechanism are movably connected, and the body part can move relative to the support mechanism; In the second state, the main body part and the supporting mechanism are locked.
The positioning device according to claim 1, wherein a surface of the body part close to the limiting part is an arc surface, and the arc surface protrudes toward the direction of the limiting part.
The positioning device according to claim 1, wherein the body part and the limiting part are connected in a smooth transition.
The positioning device according to claim 1, wherein the body part includes two ends opposite to each other, and one of the two ends is provided with the limiting part.
The positioning device according to claim 1, wherein a projection of the body portion along a thickness direction of the support mechanism partially overlaps the support mechanism.
The positioning device according to claim 5, wherein the projection of the limiting portion along the thickness direction of the supporting mechanism is staggered from the supporting mechanism.
The positioning device according to claim 1, wherein the support mechanism includes:

supporting body;

An extension part is connected to the support body and protrudes from the support body. The extension part has an arc-shaped structure, and the body part is provided on the extension part.
The positioning device according to claim 7, wherein the extension part includes a plurality of sub-parts connected to the support body, the plurality of sub-parts are arranged at intervals along the circumferential direction of the extension part, and each of the sub-parts is The main body part is provided on each part.
The positioning device according to claim 7, wherein the support body includes:

a main body portion connected to the extension portion; and

The weight reduction part is connected to the main body part, and the mass of the weight reduction part is smaller than the mass of the main body part.
A wafer clamping system including:

base;

A clamping mechanism, which is detachably connected to the base and used to clamp the wafer;

The positioning device according to any one of claims 1 to 9, said positioning device comprising a support mechanism detachably connected to the base and a positioning mechanism having a body part,

Wherein, in the first state of the positioning device, the body part and the support mechanism are movably connected, and the body part can move relative to the support mechanism to adjust the relationship between the body part and the clamping mechanism. Relative position; in the second state, the body part and the support mechanism are locked.