CN113725143A - Wafer clamping piece, wafer clamping mechanism and wafer processing equipment - Google Patents

Wafer clamping piece, wafer clamping mechanism and wafer processing equipment Download PDF

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Publication number
CN113725143A
CN113725143A CN202010448754.9A CN202010448754A CN113725143A CN 113725143 A CN113725143 A CN 113725143A CN 202010448754 A CN202010448754 A CN 202010448754A CN 113725143 A CN113725143 A CN 113725143A
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CN
China
Prior art keywords
wafer
arm
driving
extension
clamping
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Pending
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CN202010448754.9A
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Chinese (zh)
Inventor
金浩天
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Shanghai Z&h Electronic Co ltd
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Shanghai Z&h Electronic Co ltd
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Priority to CN202010448754.9A priority Critical patent/CN113725143A/en
Publication of CN113725143A publication Critical patent/CN113725143A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Abstract

The invention discloses a wafer clamping piece, a wafer clamping mechanism and wafer processing equipment, wherein the wafer clamping piece comprises a mounting seat; the clamping arm comprises a base and two first extension arms, the two first extension arms are respectively arranged on the base, and the base is arranged on the mounting seat; at least two second extension arms respectively mounted on the clamping arms; the second extension arm is provided with a third extension arm; wherein the height of the third extension arm is less than the height of the second extension arm, which is less than the height of the clamping arm; at least two second extension arms and the centre gripping arm enclose and form a first centre gripping space, and at least two third extension arms and at least two second extension arms enclose and form a second centre gripping space. Which can be adapted to wafers of two sizes.

Description

Wafer clamping piece, wafer clamping mechanism and wafer processing equipment
Technical Field
The invention relates to the field of wafer processing, in particular to a wafer clamping piece, a wafer clamping mechanism and wafer processing equipment.
Background
The wafer refers to a substrate (also called a substrate) for manufacturing a semiconductor transistor or an integrated circuit, and is called a wafer because it is a crystalline material and its shape is circular.
The basic wafer processing step is that the wafer is cleaned properly and then sent into a thermal furnace, a silicon dioxide layer with a thickness of about several hundred is formed on the surface of the wafer in an oxygen-containing environment in a heating oxidation mode, then a silicon nitride layer with a thickness of about 1000A to 2000A is deposited (Deposition) on the silicon dioxide which is just grown in a chemical vapor Deposition mode, then the whole wafer is subjected to a photolithography process, a layer of photoresist is coated on the wafer, and then the pattern on the photomask is transferred to the photoresist. Then, an etching technique is used to remove the portion of the silicon nitride layer that is not protected by the photoresist, and the portion of the desired circuit pattern is left. Then, using phosphorus as ion source to implant phosphorus atom into the whole wafer, and then removing the photoresist.
It is understood that during the processing of the wafer, the wafer is held by the wafer holding arm and moved between the processing units for performing the cleaning, depositing the silicon dioxide layer, depositing the silicon nitride layer, forming the photoresist layer, and the like.
It should be noted that, in the conventional wafer processing equipment, the clamping arm of the wafer processing equipment can only clamp a wafer of one size, and when wafers of other sizes need to be processed, the wafer clamping arm of the corresponding size needs to be replaced, so that the replacement process is complicated and the efficiency is low. On the other hand, most of the traditional wafer processing equipment can not replace the clamping arm, namely, only one size of wafer can be processed, and therefore the universality is low and the use efficiency is low.
It should be noted that the chuck arm of the conventional wafer processing apparatus is generally of a single layer structure, and only one wafer can be processed at a time, which is not only inefficient, but also may cause contamination of the chuck arm during different processes, thereby possibly causing contamination of the wafer.
In view of the foregoing, there is a need for improvements in conventional wafer processing equipment.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a wafer clamping member, a wafer clamping mechanism and a wafer processing apparatus, wherein the wafer clamping member is suitable for wafers of at least two sizes, and can improve the use efficiency of the apparatus and facilitate the processing of the wafers.
In order to achieve the above object, the present invention provides a wafer clamp, comprising:
a mounting base;
the clamping arm comprises a base and two first extension arms, the two first extension arms are respectively arranged on the base, and the base is arranged on the mounting seat;
at least two second extension arms respectively mounted on the clamping arms; and
the number of the second extension arms is the same as that of the third extension arms, and each second extension arm is provided with one third extension arm;
wherein the height of the third extension arm is less than the height of the second extension arm, which is less than the height of the clamping arm; at least two second extension arms and the clamping arms surround to form a first clamping space which is suitable for installing a wafer with a first size; at least two third extension arms and at least two second extension arms surround to form a second clamping space suitable for mounting a wafer with a second size.
In some preferred embodiments of the present invention, the number of the second extension arms is two, and two of the second extension arms are respectively installed at two of the first extension arms.
In some preferred embodiments of the present invention, the number of the second extension arms is three, two of the three second extension arms are respectively installed at the two first extension arms, one of the three second extension arms is installed at the base, and the three second extension arms and the clamping arm surround to form the first clamping space.
In some preferred embodiments of the present invention, three of the second extension arms are uniformly spaced apart from each other by a predetermined distance.
In some preferred embodiments of the invention, the third extension arm has a width less than the width of the second extension arm.
In some preferred embodiments of the present invention, the width of the end of the third extension arm remote from the second extension arm is less than the width of the end of the third extension arm mounted to the second extension arm.
In some preferred embodiments of the present invention, the third extension arm is integrally formed with the second extension arm.
According to another aspect of the present invention, the present invention further provides a wafer chucking mechanism, comprising:
a first wafer clamping assembly comprising said wafer clamping member and a first actuator arm, one end of said first actuator arm being mounted to said wafer clamping member of said first wafer clamping assembly;
a second wafer clamping assembly comprising said wafer clamping member and a second actuator arm, one end of said second actuator arm being mounted to said wafer clamping member of said second wafer clamping assembly; and
a driving assembly including a first driving member and a second driving member, wherein the other end of the first driving arm is mounted to the first driving member, the other end of the second driving arm is mounted to the second driving member, and the wafer clamping members of the first wafer clamping assembly and the wafer clamping members of the second wafer clamping assembly are stacked at a predetermined distance from each other; the first driving part can drive the first driving arm to move, and the second driving part can drive the second driving arm to move.
In some preferred embodiments of the present invention, the wafer holding mechanism further comprises:
a third wafer clamping assembly comprising the wafer clamping member and a third driving arm, wherein one end of the third driving arm is mounted on the wafer clamping member of the third wafer clamping assembly;
the driving assembly further includes a third driving member, the other end of the third driving arm is mounted on the third driving member, the wafer clamping member of the third wafer clamping assembly and the wafer clamping member of the second wafer clamping assembly are stacked at a certain distance, the wafer clamping member of the second wafer clamping assembly is located between the wafer clamping member of the first wafer clamping assembly and the wafer clamping member of the third wafer clamping assembly, and the third driving member can drive the third driving arm to move.
In some preferred embodiments of the present invention, the first driving member, the second driving member and the third driving member are respectively located below the wafer clamping member of the third wafer clamping assembly, and the first driving arm and the second driving arm are respectively located at both sides of the wafer clamping member of the second wafer clamping assembly.
In some preferred embodiments of the present invention, the first driving arm is mounted to one end of the first driving member and has a first driving groove, and a portion of a first driving belt of the first driving member is mounted to the first driving groove; the second driving arm is arranged at one end of the second driving piece and is provided with a second driving groove, and a part of a second driving belt of the second driving piece is arranged in the second driving groove; the third driving arm is mounted at one end of the third driving member and has a third driving groove, and a part of a third driving belt of the third driving member is mounted in the third driving groove.
According to another aspect of the present invention, there is further provided a wafer processing apparatus comprising
The wafer clamping mechanism is arranged; and
the wafer clamping mechanism is arranged on the equipment main body.
The scheme of the invention comprises at least one of the following beneficial effects:
1. a first clamping space is formed between the at least two second extension arms and the clamping arms in a surrounding mode, wafers with the first size can be installed, and a second clamping space is formed between the at least two third extension arms and the at least two second extension arms in a surrounding mode, and wafers with the second size can be installed.
2. The width of third extension arm is less than the width of second extension arm to the width of second extension arm is less than the width of first extension arm, thereby can reduce the area with wafer contact, improves the effect of wafer processing.
Drawings
The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which preferred embodiments of the invention are shown.
FIG. 1 is a schematic view of the overall structure of a wafer holder according to a preferred embodiment of the present invention;
fig. 2 is a schematic top view of a wafer holder according to a variation of the above preferred embodiment of the present invention;
FIG. 3 is a schematic top view of the wafer holder according to the above preferred embodiment of the present invention;
FIG. 4 is a schematic view of the overall structure of a wafer holder according to a preferred embodiment of the present invention;
FIG. 5 is a rear view of the wafer holder according to the above preferred embodiment of the present invention;
FIG. 6 is a perspective view of a wafer clamping mechanism in accordance with a preferred embodiment of the present invention;
fig. 7 is a perspective view of the wafer clamping mechanism according to the above preferred embodiment of the present invention.
The reference numbers illustrate:
1 wafer holder, 11 mount, 12 holder arm, 13 second extension arm, 14 third extension arm, 120 first holding space, 121 base, 122 first extension arm, 130 second holding space, 131 first mounting end, 132 second mounting end, 1220 wafer pick-and-place opening;
21 a first wafer clamping assembly, 22 a second wafer clamping assembly, 23 a drive assembly, 24 a third wafer clamping assembly, 211 a first drive arm, 221 a second drive arm, 241 a third drive arm, 2111 a first mounting end, 2112 a first drive end, 2110 a first drive slot, 2211 a second mounting end, 2212 a second drive end, 2210 a second drive slot, 2411 a third mounting end, 2412 a third drive end, 2410 a third drive slot.
Detailed Description
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following description will be made with reference to the accompanying drawings. It is obvious that the drawings in the following description are only some examples of the invention, and that for a person skilled in the art, other drawings and embodiments can be derived from them without inventive effort.
For the sake of simplicity, the drawings only schematically show the parts relevant to the present invention, and they do not represent the actual structure as a product.
Example 1
Referring to the drawings 1 to 3 of the specification, a wafer holder 1 according to the present invention is illustrated, the wafer holder 1 being adapted to hold a wafer during processing of the wafer. The wafer clamping piece 1 provided by the invention can be suitable for processing the wafers with at least two sizes, so that the processing of the wafers with at least two sizes can be suitable under the condition of not changing the structure of processing equipment, and the efficiency of processing the wafers is improved.
Specifically, the wafer holder 1 includes a mounting seat 11, a holding arm 12, at least two second extension arms 13, and at least two third extension arms 14, and the holding arm 12 further includes a base 121 and two first extension arms 122.
The two first extension arms 122 are respectively mounted on the base 121, and the base 121 is mounted on the mounting seat 11. At least two of the second extension arms 13 are respectively mounted to the holding arms 12. The number of the third extension arms 14 is the same as that of the third extension arms 13, and one third extension arm 14 is respectively installed on each second extension arm 13. The third extension arm 14 has a height lower than that of the second extension arm 13, the second extension arm 13 has a height lower than that of the holding arm 12, and at least two of the second extension arms 13 and the holding arm 12 surround to form a first holding space 120 suitable for mounting the wafer of the first size; at least two of the third extension arms 14 and at least two of the second extension arms 13 surround to form a second clamping space 130 suitable for mounting the wafer of a second size.
With reference to fig. 2 of the description, in a first variant embodiment of the invention, the number of second extension arms 13 and third extension arms 14 is two. In the preferred embodiment, the two second extension arms 13 are respectively installed on the two first extension arms 122 of the holding arm 12, and the positions of the two second extension arms 13 are respectively symmetrical with respect to the center of the first holding space 120. The two second extension arms 13 and the holding arms 12 form the first holding space 120, and the two third extension arms 14 and the two second extension arms 13 form the second holding space 130.
Referring to fig. 3 of the specification, in the preferred embodiment, the number of the second extension arms 13 and the third extension arms 14 is three. In the preferred embodiment, two of the three second extension arms 13 are respectively mounted to the two first extension arms 122 of the holding arm 12, and the other one of the three second extension arms 13 is mounted to the base 121 of the holding arm 12. Preferably, three of the second extension arms 13 are symmetrical with respect to the center of the first holding space 120, respectively. The three second extension arms 13 and the holding arms 12 surround to form the first holding space 120, and the three third extension arms 14 and the three second extension arms 13 surround to form the second holding space 130.
It is noted that the second dimension is smaller than the first dimension. Preferably, the first dimension is 8 inches and the second dimension is 6 inches, i.e., the wafer holder 1 is capable of accommodating 6 inches and 8 inches of the wafer. Optionally, the first dimension is 6 inches and the second dimension is 4 inches, i.e., the wafer holder 1 can accommodate both 4 inches and 6 inches of the wafer. It is understood that the specific values of the first dimension and the second dimension can be set based on the specific dimension of the wafer to be processed, and the specific values of the first dimension and the second dimension should not be construed as limiting the invention.
It will be appreciated that, since the height of the second extension arm 13 is lower than the height of the holding arm 12, there is a certain height difference between the upper surface of the second extension arm 13 and the upper surface of the holding arm 12, and the second extension arm 13 and the holding arm 12 form a first step structure. The wafer of the first size is adapted to be mounted to the first step structure while the wafer of the first size is mounted. The wafer of the first size is suitable for being placed in the second extension arm 13 with the lower height in the first step structure, the second extension arm 13 provides support for the wafer of the first size, and the clamping arm 12 limits the position of the periphery of the wafer of the first size to prevent the wafer of the first size from sliding to the periphery.
Likewise, since the height of the third extension arm 14 is lower than that of the second extension arm 13, there is a certain height difference between the upper surface of the third extension arm 13 and the upper surface of the second extension arm 13, and the third extension arm 14 and the second extension arm 13 form a second step structure. The wafer of the second size is adapted to be mounted to the second step structure while the wafer of the second size is mounted. The wafer of the second size is suitable for being placed in the third extension arm 14 with a high intersection bottom in the second step structure, the fourth extension arm 14 provides support for the wafer of the second size, and the second extension arm 13 limits the position around the wafer of the second size to prevent the wafer of the second size from sliding around.
Preferably, in some preferred embodiments of the present invention, the base 121 of the clamp arm 12 is integrally formed with the mounting seat 11. Alternatively, the base 121 of the clamp arm 12 can be mounted to the mounting seat 11 by other methods, and the specific manner of mounting the base 121 to the mounting seat 11 should not be construed as limiting the invention.
Preferably, the third extension arm 14 is integrally formed with the second extension arm 13. Alternatively, the third extension arm 14 can also be mounted to the second extension arm 13 by other means, and the specific manner in which the third extension arm 14 is mounted to the second extension arm 13 should not be construed as limiting the invention.
Preferably, the second extension arm 13 is detachably mounted to the holding arm 12, such as by being screwed to the holding arm 12. Alternatively, the second extension arm 14 can also be integrally formed with the holding arm 12 or otherwise mounted to the holding arm 12, and the specific manner in which the second extension arm 13 is mounted to the holding arm 12 should not be construed as limiting the invention.
Referring to the description of fig. 2 and 3, the second extension arm 13 has a first mounting end 131 and a second mounting end 132, the first mounting end 131 of the second extension arm 13 is mounted to the holding arm 12, and the second mounting end 132 is mounted to the third extension arm 14. Preferably, the first mounting end 131 of the second extension arm 13 is overlapped with the clamping arm 12 and is mounted to the clamping arm 12 by means of screw fixation.
Specifically, the height of the first mounting end 131 of the second extension arm 13 is higher than the height of the second mounting end 132, the first mounting end 131 can be mounted on the upper surface of the base 121 or the first extension arm 122 of the holding arm 12, and the height of the upper surface of the second mounting end 132 of the second extension arm 13 is lower than the height of the upper surface of the base 121 or the first extension arm 122 of the holding arm 12, so as to form the first holding space 120 around the base 121 or the first extension arm 122 of the holding arm 12. Optionally, the first mounting end 131 of the second extension arm 13 can also be mounted to a lower surface of the base 121 or the first extension arm 122 of the clamp arm 12. It is to be understood that the position and manner of mounting the first mounting end 131 to the clamping arm 122 should not be construed as limiting the present invention as long as the height of the upper surface of the second mounting end 132 of the second extension arm 13 can be made lower than the height of the base 121 or the first extension arm 122 of the clamping arm 12.
Referring to the specification, fig. 2 and fig. 3, when the number of the second extension arms 13 is three, the width of the third extension arm 14 is smaller than the width of the second extension arm 13, so as to reduce the contact area between the third extension arm 14 and the wafer of the second size, and improve the processing effect of the wafer. It will be appreciated that reducing the width of the third extension arm 14 also reduces the overall weight of the wafer sandwich 1, facilitating the processing of the wafer.
Preferably, the width of the third extension arm 14 is gradually reduced from the end mounted to the second extension arm 13 to the end far away from the second extension arm 13, so that the width of the third extension arm 14 is reduced while the structural strength of the third extension arm 14 is maintained.
Further, a gap is formed between two ends of the first extension arms 122 away from the base 121 to form a wafer access opening 1220, so that the wafer can be conveniently mounted in the first holding space 120 or the second holding space 130.
Example two
Referring to fig. 4 to 7 of the specification, according to another aspect of the present invention, the present invention further provides a wafer clamping mechanism, comprising a first wafer clamping assembly 21, a second wafer clamping assembly 22 and a driving assembly 23, wherein the first wafer clamping assembly 21 comprises the wafer clamping member 1 of the above embodiment and a first driving arm 211, and the first driving arm 211 is mounted on the mounting seat 11 of the first wafer clamping member; the second wafer clamping assembly 22 comprises the wafer clamping member 1 of the above embodiment and a second driving arm 221, wherein the second driving arm 221 is mounted on the mounting seat 11 of the second wafer clamping member; the driving assembly 23 includes a first driving member and a second driving member, the first driving arm 211 of the first wafer clamping assembly 21 is mounted on the first driving member (not shown), and the first driving member can drive the first driving arm 211 to move along a predetermined direction; the second driving arm 221 is mounted on a second driving member (not shown), and the second driving arm 221 can be driven by the second driving member to move along a predetermined direction.
It should be noted that, when the first driving arm 211 is mounted on the first driving member and the second driving arm 221 is mounted on the second driving member, the first wafer chuck and the second wafer chuck are stacked with a certain distance therebetween.
Referring to fig. 4 of the specification, the wafer clamping mechanism further includes a third wafer clamping assembly 24, and the third wafer clamping assembly 24 includes the wafer clamping member 1 according to the above embodiment and a third driving arm 241, and one end of the third driving arm 241 is mounted on the third wafer clamping member.
The driving assembly 23 further includes a third driving member (not shown), and the third driving arm 241 of the third wafer clamping assembly 24 is mounted on the third driving member, and the third driving member can drive the third driving arm 241 of the third wafer clamping assembly 24 to move.
It should be noted that, for the convenience of the following description, the wafer holder 1 of the first wafer holding assembly 21 is defined as a first wafer holder, the wafer holder 1 of the second wafer holding assembly 22 is defined as a second wafer holder, and the wafer holder 1 of the third wafer holding assembly 24 is defined as a third wafer holder.
When the third driving arm 241 of the third wafer clamping assembly 24 is mounted to the third driving member, the third wafer clamping member and the second wafer clamping member are stacked with a predetermined distance therebetween, and the second wafer clamping member is located between the first wafer clamping member and the third wafer clamping member. Preferably, the first wafer holder, the second wafer holder, and the third wafer holder are parallel to each other.
Referring to fig. 5 of the specification, the first driving arm 211 includes a first mounting end 2111 and a first driving end 2112, the first mounting end 2111 of the first driving arm 211 is mounted to the first wafer holder, and the second driving end 2112 is mounted to the first driving member.
The second drive arm 221 further comprises a second mounting end 2211 and a second driving end 2212, the second mounting end 2211 of the second drive arm 221 is mounted to the second wafer holder, and the second driving end 2212 is mounted to the second driver.
The third driving arm 241 further includes a third mounting end 2411 and a third driving end 2412, the third mounting end 2411 of the third driving arm 241 is mounted to the third wafer holder, and the third driving end 2412 is mounted to the third driving member.
Referring to fig. 5 to 7 of the specification, the first driving member, the second driving member and the third driving member of the driving assembly 23 are respectively located below the third wafer holder, the first driving arm 211 and the second driving arm 221 are respectively located at left and right sides of the second wafer holder, and the third driving arm 241 extends downward from the third wafer holder 1.
Further, the first driving end 2112 of the first driving arm 211 further has a first driving groove 2110, the second driving end 2212 of the second driving arm 221 further has a second driving groove 2210, and the third driving end 2412 of the third driving arm 241 further has a third driving groove 2410.
The first driving piece further comprises a first driving motor and a first driving belt, the first driving belt is mounted on the first driving motor, and the first driving motor can drive the first driving belt to rotate along a preset direction; the second driving piece further comprises a second driving motor and a second driving belt, the second driving belt is mounted on the second driving motor, and the second driving motor can drive the second driving belt to rotate along a preset direction; the third driving piece further comprises a third driving motor and a third driving belt, the third driving belt is installed on the third driving motor, and the third driving motor can drive the third driving belt to rotate along a preset direction.
Specifically, the first driving belt of the first driving member is installed in the first driving groove 2110, and the first driving belt can drive the first driving arm 211 to move along a preset path; the second driving belt of the second driving member is mounted in the second driving groove 2210, and the second driving belt can drive the second driving arm 221 to move along a preset path; the third driving belt is installed in the third driving groove 2410, and the third driving belt can drive the third driving arm 241 to move along a preset path.
The driving assembly 23 further includes a driving housing, the driving housing forms an accommodating space, and the first driving member, the second driving member and the third driving member are respectively installed in the accommodating space of the driving housing.
The driving housing further includes an upper cover plate, the upper cover plate has a first channel, a second channel and a third channel, the first driving end 2112 of the first driving arm 211 passes through the first channel, the second driving end 2212 of the second driving arm 221 passes through the second channel, the third driving end 2412 of the third driving arm 241 passes through the third channel, the first driving arm 211 can be driven by the first driving belt to move along the length extension direction of the first channel, the second driving arm 221 can be driven by the second driving belt to move along the length extension direction of the second channel, and the third driving arm 241 can be driven by the third driving belt to move along the length extension direction of the third channel.
EXAMPLE III
According to another aspect of the present invention, the present invention further provides a wafer processing apparatus, which includes an apparatus main body and a wafer clamping mechanism according to the above embodiment, and the wafer clamping mechanism is mounted on the apparatus main body, so that the wafer processing apparatus provided by the present invention can meet the processing requirements of wafers of two sizes, and does not need to replace the apparatus components, thereby improving the wafer processing efficiency.
It should be noted that the above embodiments can be freely combined as necessary. The foregoing is only a preferred embodiment of the present invention, and it should be noted that it is obvious to those skilled in the art that various modifications and improvements can be made without departing from the principle of the present invention, and these modifications and improvements should also be considered as the protection scope of the present invention.

Claims (12)

1. A wafer holder, comprising:
a mounting base;
the clamping arm comprises a base and two first extension arms, the two first extension arms are respectively arranged on the base, and the base is arranged on the mounting seat;
at least two second extension arms respectively mounted on the clamping arms; and
the number of the second extension arms is the same as that of the third extension arms, and each second extension arm is provided with one third extension arm;
wherein the height of the third extension arm is less than the height of the second extension arm, which is less than the height of the clamping arm; at least two second extension arms and the clamping arms surround to form a first clamping space which is suitable for installing a wafer with a first size; at least two third extension arms and at least two second extension arms surround to form a second clamping space suitable for mounting a wafer with a second size.
2. The wafer holder as claimed in claim 1, wherein the number of the second extension arms is two, and two of the second extension arms are respectively mounted to two of the first extension arms.
3. The wafer holder of claim 1, wherein the number of the second extension arms is three, two of the three second extension arms are respectively mounted to the two first extension arms, one of the three second extension arms is mounted to the base, and the three second extension arms and the holding arm surround to form the first holding space.
4. The wafer holder of claim 3, wherein the three second extension arms are uniformly spaced apart from each other by a predetermined distance.
5. The wafer holder as claimed in any one of claims 1 to 4, wherein the third extension arm has a width less than a width of the second extension arm.
6. The wafer holder of claim 5, wherein the width of the end of the third extension arm distal from the second extension arm is less than the width of the end of the third extension arm mounted to the second extension arm.
7. The wafer holder of claim 5, wherein the third extension arm is integrally formed with the second extension arm.
8. A wafer clamping mechanism, comprising:
a first wafer clamping assembly comprising the wafer clamp of any one of claims 1-7 and a first actuating arm, one end of said first actuating arm being mounted to said wafer clamp of said first wafer clamping assembly;
a second wafer clamping assembly comprising the wafer clamp of any one of claims 1-7 and a second drive arm, one end of the second drive arm being mounted to the wafer clamp of the second wafer clamping assembly; and
a driving assembly including a first driving member and a second driving member, wherein the other end of the first driving arm is mounted to the first driving member, the other end of the second driving arm is mounted to the second driving member, and the wafer clamping members of the first wafer clamping assembly and the wafer clamping members of the second wafer clamping assembly are stacked at a predetermined distance from each other; the first driving part can drive the first driving arm to move, and the second driving part can drive the second driving arm to move.
9. The wafer clamping mechanism of claim 8 further comprising:
a third wafer clamping assembly comprising the wafer clamp of any of claims 1-7 and a third drive arm mounted at one end to the wafer clamp of the third wafer clamping assembly;
the driving assembly further includes a third driving member, the other end of the third driving arm is mounted on the third driving member, the wafer clamping member of the third wafer clamping assembly and the wafer clamping member of the second wafer clamping assembly are stacked at a certain distance, the wafer clamping member of the second wafer clamping assembly is located between the wafer clamping member of the first wafer clamping assembly and the wafer clamping member of the third wafer clamping assembly, and the third driving member can drive the third driving arm to move.
10. The wafer clamping mechanism of claim 9 wherein the first, second and third actuating members are each positioned below the wafer clamp of the third wafer clamping assembly, and the first and second drive arms are each positioned on opposite sides of the wafer clamp of the second wafer clamping assembly.
11. The wafer chuck mechanism of claim 10, wherein the first driving arm has a first driving groove at an end thereof mounted to the first driving member, and a portion of a first driving belt of the first driving member is mounted to the first driving groove; the second driving arm is arranged at one end of the second driving piece and is provided with a second driving groove, and a part of a second driving belt of the second driving piece is arranged in the second driving groove; the third driving arm is mounted at one end of the third driving member and has a third driving groove, and a part of a third driving belt of the third driving member is mounted in the third driving groove.
12. A wafer processing apparatus, comprising
A wafer holding mechanism as recited in any one of claims 8-11; and
the wafer clamping mechanism is arranged on the equipment main body.
CN202010448754.9A 2020-05-25 2020-05-25 Wafer clamping piece, wafer clamping mechanism and wafer processing equipment Pending CN113725143A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010448754.9A CN113725143A (en) 2020-05-25 2020-05-25 Wafer clamping piece, wafer clamping mechanism and wafer processing equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010448754.9A CN113725143A (en) 2020-05-25 2020-05-25 Wafer clamping piece, wafer clamping mechanism and wafer processing equipment

Publications (1)

Publication Number Publication Date
CN113725143A true CN113725143A (en) 2021-11-30

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Application Number Title Priority Date Filing Date
CN202010448754.9A Pending CN113725143A (en) 2020-05-25 2020-05-25 Wafer clamping piece, wafer clamping mechanism and wafer processing equipment

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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024045242A1 (en) * 2022-09-02 2024-03-07 台湾积体电路制造股份有限公司 Positioning device and wafer clamping system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024045242A1 (en) * 2022-09-02 2024-03-07 台湾积体电路制造股份有限公司 Positioning device and wafer clamping system

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