JP3909981B2 - Wafer size conversion holder and wafer holding method using the same - Google Patents

Description

[0001]
[Industrial application fields]
The present invention can securely hold wafers of different sizes, such as silicon, without modifying the transfer system, wafer mounting table, wafer processing disk, etc. for mounting in the apparatus. , Semiconductor manufacturing apparatus, wafer size conversion holder for ion implantation apparatus, and wafer holding method using the same, capable of performing ion implantation processing from single wafer processing to batch processing of multiple processing one by one It is.
[0002]
[Prior art]
Conventionally, in semiconductor manufacturing equipment and ion implantation equipment, in order to mount wafers of different diameters, a method of exchanging the entire wafer mounting table, a wafer chuck with a different diameter, a wafer size conversion holder with a complicated configuration, There was something used. In the method of exchanging the entire wafer mounting table, it takes a lot of time and effort to replace the wafer mounting table, and the front and rear wafer transfer systems have to be changed greatly. On the other hand, the chuck with different diameter adjustment and the complicated wafer size conversion are required. In the case of using a holder, there were many practical problems in terms of adjustment, handling, weight and size.
[0003]
In the single wafer type wafer processing apparatus, when processing a wafer having a smaller diameter than the wafer size supported by the wafer mounting table of the apparatus, it can be converted and used in the same manner as the predetermined wafer size. Wafer adapters are being considered.
[0004]
For example, as described in Japanese Patent Laid-Open No. 3-102849, it has an outer diameter corresponding to a wafer having a predetermined diameter, and has an engraved portion so that a small diameter wafer can be held inside thereof, and a pseudo orientation There is a structure corresponding to a small aperture by providing a flat. This method has an advantage that a wafer with a small diameter can be used in an apparatus for a large diameter wafer in the single wafer processing. However, in an ion implantation apparatus that performs batch processing, a size conversion holder on which a wafer is placed is placed on a wafer placement table on a disk that rotates at a high speed. In such a structure, centrifugal force and inertial force work. The holding of the wafer in the direction is not reliable, and in some cases, there are problems such as dropping or chipping of the wafer.
[0005]
Alternatively, it has a thickness substantially equal to the thickness of the wafer and has a recess having a shape substantially equal to that of the wafer, and has a through-hole for vacuum suction to the holding portion of the wafer and holds it by vacuum suction. A type of adapter is described in JP-A-6-129131. This wafer adapter is useful as a reinforcing jig during a wafer processing process for a wafer having low strength. Further, such an adapter is effective when it is processed by a single wafer and can be adsorbed in a vacuum. However, in an ion implantation apparatus that performs batch processing, it is difficult to carry out the ion implantation processing because it is difficult to adsorb by vacuum using such a wafer adapter.
[0006]
Japanese Patent Laid-Open No. 59-74645 discloses a wafer holder for a small-diameter wafer that can be handled in the same manner as a large-diameter wafer. This wafer holder is composed of an annular engagement groove and a disk. In this structure, it is possible to ensure the holding of the wafer by the protruding edge or the like rising in the vertical direction and reduce the possibility of the wafer jumping out of the wafer holder, but the structure is not capable of fixing the wafer. In addition, when used in an ion implanter for performing the batch processing, when the wafer is not securely held and the disk body serving as the wafer mounting table rotates at a high speed, the wafer may be displaced on the disk body, Popping out from the body may occur, causing problems such as cracking and chipping of the wafer.
[0007]
That is, in a batch type ion implantation apparatus of a fully automatic process, it is necessary to place a wafer size comparison holder on which a wafer is placed on a disk, and the disk rotates or swings at high speed. Even if an adapter that can be used only in a single-wafer type that does not require a motion operation is used, it is practically difficult to perform ion implantation.
[0008]
Furthermore, conventional ion implantation apparatuses with a 200 mm wafer specification cannot easily perform normal ion implantation processing on wafers other than 200 mm wafers. If it is necessary to inject another wafer size, it is necessary to change many configurations such as the transfer system and disk according to the size of the wafer, and there are many reliable and precise adjustments each time. Needed time.
[0009]
[Problems to be solved by the invention]
Therefore, when ion implantation is performed by a fully automatic process using the same ion implantation apparatus for wafers of different sizes, for example, 200, 150, and 125 mm, a wafer mounting table, a wafer multistage storage cassette, a transport system, and handling Parts that are determined by the wafer diameter, such as robots and elevator mechanisms, must be replaced, and many parts related to these replacements must be prepared, and many of these parts are in the vacuum vessel. Therefore, it takes a long time for the replacement, and it takes a long time to start up the apparatus after the replacement. In addition, reliable and precise adjustment is required each time, and a lot of time is consumed. The present invention is a wafer size conversion for enabling wafers of different sizes to be implanted with the same semiconductor manufacturing apparatus and ion implantation apparatus without exchanging components such as a wafer mounting table, a transfer system, and a handling robot. It is an object to provide a holder and a wafer holding method using the holder.
[0010]
Another object of the present invention is to improve the accuracy and reliability of placing wafers of different sizes in a semiconductor manufacturing apparatus and an ion implantation apparatus.
[0011]
[Means for Solving the Problems]
The present invention is characterized by the following wafer size conversion holder and a wafer support method in an ion implantation apparatus using the same. Ion implantation apparatus having a movable wafer mounting table for holding a wafer such as silicon Wafer size conversion holder In this case, a base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and the wafer is mounted on the top surface of the base body. To touch the flat part of In the surface direction on the upper surface of the wafer base body accompanying the movement operation of the wafer mounting table In one direction and in a direction perpendicular to this one direction Restriction member that restricts movement, and movement in the direction away from the upper surface of the base of the outer periphery of the wafer And movement in one direction A stopper member for restricting and locking, and a surface direction on the upper surface of the base of the outer peripheral portion of the wafer One-way A configuration in which an operation-type clamp member that restricts and locks movement and movement in a direction away from the upper surface of the base body is provided on the upper surface of the base body When The wafer is placed on the upper surface of the base body by the limiting member, stopper member, and clamp member. Impossible to move back and forth, left and right and up and down It was configured to be fixed.
[0012]
The limiting member and the clamp member are arranged so as to sandwich the line passing through the center of the wafer surface, and the clamp member and the stopper member are arranged so as to sandwich the line passing through the center of the wafer surface. The base body has an outer peripheral shape substantially similar to that of the wafer. The stopper member is provided with a restricting portion that restricts and locks the movement in the surface direction on the upper surface of the base body at the outer peripheral portion of the wafer. The restricting members are arranged on both sides of the upper surface of the wafer base so that there are at least two places across a line passing through the center of the wafer surface. The wafer mounting table is a batch type that holds a plurality of wafers on the same circumference and performs operations.
[0013]
The stopper member or the clamp member is provided at a position corresponding to the orientation flat portion of the wafer. The clamp member is configured to perform limit locking by an elastic biasing force. The elastic biasing member is configured to have a spring or a spring in the structure. At least one of the stopper member and the clamp member is configured to restrict and lock movement in a direction away from the upper surface of the base by a limiting locking body having a tapered portion. At least one of the stopper member or the clamp member is configured to restrict and lock movement in a direction away from the upper surface of the base by a locking body or a cover body that protrudes small toward the wafer side.
[0014]
The elastic biasing member was provided on the upper surface of the base body. The exposed portion of the ion implantation on the upper surface of the base body is coated or coated with a material having the same components as the wafer. The clamp member having an elastic urging force is configured to be movable to a limit locking position and a limit release position, and is configured to be fixable at at least one position. The stopper member or the clamp member is configured to cover the edge portion of the ion-implanted surface on the outer periphery of the wafer along the outer periphery, and also serves as a limiting member.
[0015]
Of the restricting member, the stopper member, and the clamp member, at least the restricting member or the stopper member is formed integrally with or separately from the base. An orientation flat part or notch part was provided in the base body. The stopper member or the clamp member provided at a position corresponding to the orientation flat part of the wafer is provided at a position corresponding to at least the orientation flat part or the notch part of the base body, or provided at a position opposite to 180 degrees. The center of the wafer and the center of the base body are provided at the same center position.
[0016]
Also, an ion implantation apparatus having a movable wafer mounting table for holding a wafer such as silicon Wafer holding method And a base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and the wafer is mounted on the upper surface of the base body. To touch the flat part of In the surface direction on the upper surface of the wafer base body accompanying the movement operation of the wafer mounting table In one direction and in a direction perpendicular to this one direction A restricting member that restricts movement; With a locking body or cover body Movement in the direction away from the upper surface of the base at the outer periphery of the wafer And movement in one direction A stopper member for restricting and locking, With a locking body or cover body From the side opposite the stopper member Limits and locks the movement of the outer peripheral part of the wafer in the direction away from the upper surface of the base body and the movement of the wafer in one direction. A configuration in which a clamp auxiliary member having a force to hold the wafer by an elastic biasing member arranged together with the stopper auxiliary member is provided on the upper surface of the base body When And a limiting member and a stopper member , Stopper auxiliary members and Clamp auxiliary Depending on the member, the wafer is placed on the top of the base Impossible to move back and forth, left and right and up and down Fixed. The clamp auxiliary member is disposed in an intermediate portion of the stopper auxiliary member so as to freely advance and retract. The interval between the stopper member locking body or cover body and the stopper auxiliary member locking body or cover body is slightly smaller than the wafer width in the wafer insertion direction when the wafer is inserted, and the stopper member and the stopper auxiliary member wafer. Insert the wafer into the insertion part of the stopper, insert the wafer into the wafer insertion part of the stopper auxiliary member, and then insert it into the wafer insertion part of the stopper member on the opposite side. The wafer was locked with an auxiliary member. The limiting member is configured so as to be in contact with the end portion of the wafer at at least two points so as to be disposed at two positions facing each other with the stopper member interposed therebetween. A recess for inserting the wafer clamping means is arranged in the middle of the stopper member or in the vicinity thereof.
[0017]
[Effects of the Invention]
A wafer such as silicon is placed on the upper surface of the base body so that the movement is locked by the limiting member and the stopper member, and is further held and held by the support of the elastic body by the clamp member. Accordingly, the movement of the wafer placed on the upper surface of the base of the wafer accompanying the movement operation in the opposite direction to the moving direction of the wafer mounting table is restricted by the restricting member at the outer peripheral portion of the wafer. In addition, the stopper member restricts and locks the movement of the outer periphery of the wafer in the surface direction on the upper surface of the base and the movement in the direction away from the upper surface of the base body, and further the relative movement of the stopper member on the outer periphery of the wafer. The movement-type clamping member provided on the opposite side of the wafer restricts and locks the movement of the outer peripheral portion of the wafer in the surface direction on the upper surface of the base body and the movement in the direction away from the upper surface of the base body. The wafer and the base are transported in a combined state, are detachably mounted on a wafer mounting table such as a disk, and desired ion implantation is performed on the stationary or moving disk.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
With reference to FIG. 1 of the front view of this invention and hh sectional drawing 2, the application example to an ion implantation apparatus is demonstrated among the semiconductor manufacturing apparatuses using a wafer size conversion holder. A is a wafer size conversion holder having an outer peripheral shape substantially the same as that of the wafer 2, and is composed of a thin plate material having a positioning portion X such as an orientation flat, an outer peripheral V-shaped cutout, and a mark at a specific portion of the outer periphery. It is comprised from the base body 1 and other members. The base body 1 is a wafer mounting table of a batch type disk D1 as shown in FIG. 16 for holding a wafer such as silicon in the wafer processing chamber W of the ion implantation apparatus as shown in FIG. It is detachably provided on the processing side surface. The batch-type disk wafer mounting table disk D1 has a moving motion system in which a plurality of wafers 2 are mounted and a rotational motion D2 and a reciprocating motion D3 are performed on a plane substantially orthogonal to the ion beam IB. Is done. The rotational motion D2 and the reciprocating motion D3 are operated by a motor D4 and a driving body D5, respectively. In addition, the single wafer type wafer mounting table is constituted by an anti-fixed type that simply changes the supporting direction of a single wafer.
[0019]
On the upper surface of the base body 1 of the wafer size conversion holder A, the relative movement of the wafer 2 accompanying the movement operation in one direction and the opposite direction by the rotational movement D2 and the reciprocating movement D3 of the wafer mounting table is shown. A limiting member 3 that restricts at the outer periphery, and a stopper member 4 that restricts and locks the movement of the outer periphery of the wafer 2 in the surface direction on the upper surface of the base body 1 and the movement away from the upper surface of the base body 1. The clamp member 5 that restricts and locks the movement of the outer peripheral portion of the wafer 2 in the surface direction on the upper surface of the base body 1 and the movement in the direction away from the upper surface of the base body is provided. The clamp member 5 is provided on the opposite side of the stopper member 4 on the outer periphery of the wafer 2.
[0020]
The limiting member 3, the stopper member 4, and the clamp member so that the wafer 2 is placed on the same center O as the base 1 of the wafer size conversion holder A or at a position P slightly offset as shown in FIG. 5 are arranged. As shown in FIGS. 4A to 5A (cross section bb in FIG. 1), the movement of the stopper member 4 in the surface direction on the upper surface of the base body 1 of the outer peripheral portion of the wafer 2 is restricted by the restriction portion 401. The stopper member 4 that restricts and locks the movement in the direction away from the upper surface of the base body 1 by the taper portion 402 that is a protruding portion may have a shape along a circumferential shape, as shown in FIG. As shown, the shape may be a shape along the orientation flat X ′ of the wafer 2, and the limiting action is performed at that portion. Moreover, the shape shown in FIG.5 (b) may be sufficient as a restriction | limiting part and a protrusion part as 403 and 404, respectively.
[0021]
On the other hand, as shown in FIG. 1, one or more clamp members 5 are provided on the base body 1, and the movement of the outer peripheral portion of the wafer 2 in the surface direction on the upper surface of the base body 1 is shown in FIG. As shown, the restriction portion 405 restricts and locks, and the movement in the direction away from the upper surface of the base is restricted and locked by the taper portion 406 that is a protruding portion. The clamp member / restriction member that restricts and locks the movement in the direction away from the upper surface of the base body 1 is at least 2 in total at least one place on one side of the symmetry line with respect to any symmetry line on the upper surface of the base body. Provide more than one place.
[0022]
【Example】
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following examples.
[0023]
The base body 1 has an outer periphery having a shape similar to that of the wafer 2, that is, has a diameter (200 mm, 150 mm, 125 mm, etc.) similar to that of a wafer having a predetermined wafer size of the apparatus, and the thickness of the base material. In addition, in the range of at least about 2 to 10 mm around the base, it is manufactured to have a thickness equivalent to a predetermined wafer. Moreover, aluminum, graphite, other metals, etc. can be used for the material, and it is desirable that the material has electrical conductivity if possible. Further, the base body can be made of the same material or carbon-based material as that of a wafer such as Si or GaAs, if necessary, or can be coated or coated with the same material or carbon-based material.
[0024]
The restricting member 3 and the restricting portion 401 are initially rotated when the base body 1 is placed on the wafer mounting table and clamped in the same manner as the wafer, is set on a large diameter disk, and the large diameter disk is rotated at a high speed. At the time of acceleration and at the time of deceleration before the end of rotation, it is provided so as to serve as a guide for preventing the wafer from dropping off from the base body 1 due to inertial force. Of these, the restricting member 3 may extend over substantially the entire circumference of the wafer, or may be provided on the left and right or a part of the top and bottom. Further, it is desirable that the height of the restricting member 3 is larger than the thickness of the wafer from the wafer placement surface, if possible. However, if it is higher than necessary, a portion where the ion beam is not irradiated is formed in the implanted portion of the wafer, which is not desirable. The shape of the limiting member 3 is the same shape as the wafer to be placed and held, that is, an arc shape obtained by cutting a part of a circle, or a shape obtained by cutting a part of the shape, and the size is such that the wafer can be placed. That is, the size has a diameter slightly larger than the wafer diameter. The limiting action of the limiting member 3 is shown in FIG. 3 (cross section aa in FIG. 1). The limiting member 3 may have a rectangular cross section as shown in FIG.
[0025]
A stopper member 4 is provided in one direction portion of the limiting member 3, and the wafer 2 is positioned by the limiting member 3 and the stopper member 4. Further, in order to fix the wafer 2, the wafer 2 is pressed by the clamp member 5 from the side opposite to the stopper member 4 so as not to move. The clamp member 5 is given a force to hold the wafer by an elastic biasing member 6 (compression coil spring). Further, a cover 7 is provided so that the ion beam does not hit the elastic urging member (compression coil spring) 6 and the clamp member 5. As an example, the clamp member 5 may be composed of a support shaft 51, an elastic urging member 6, a lever 11, a pedestal 12, a spring support, and the like, as shown in FIG.
[0026]
The stopper member 4 is provided so that the wafer does not protrude from the wafer mounting surface on the upper surface of the base. Generally, it is provided in a direction in which centrifugal force due to disk rotation acts. As shown in FIG. 4 which is a bb cross section of FIG. 1, the stopper member has a protruding portion 4 ′ (for example, a protrusion 4 ′ toward the wafer side as a locking member above the upper surface of the placed wafer. The taper / stepped portion) is provided so as to suppress the jumping out of the wafer. The stopper member may be a pseudo orientation flat having the same shape as the orientation flat portion X ′ of the wafer in order to position the wafer. Further, the stopper member can follow the shape of the wafer when the wafer has a notch shape or a square shape. Further, a spring or a clamp is provided on the clamp member side so that a force is applied to the stopper member side. In addition, it is desirable that at least the outer periphery of the size conversion holder has the same standard wafer thickness as the size of the wafer mounting table.
[0027]
The clamp member 5 is provided in a direction opposite to the stopper member 4. The clamp member 5 is positioned in a direction in which force is applied to the stopper member 4 and is basically formed of an elastic biasing member. The number may be one or more. In the case of a plurality, it is desirable that the force of the plurality of clamp members is equally applied to the stopper member 4. Further, the clamp member 5 has a protruding portion (for example, a taper 402 and a stepped portion 404) toward the wafer side as a locking member above the upper surface of the wafer placed as shown in FIG. By providing, it is configured to suppress the jumping out of the wafer. The elastic biasing member 6 is often a spring or a clamp having a structure including a spring in the structure. The spring used as the elastic biasing member 6 is preferably a compression coil spring, a torsion coil spring, or a leaf spring.
[0028]
The limiting member and the clamp member are arranged so as to sandwich the line passing through the center of the wafer surface, and the clamp member and the stopper member are arranged so as to sandwich the line passing through the center of the wafer surface.
[0029]
The base body has an outer peripheral shape substantially similar to that of the wafer. The stopper member is provided with a restricting portion that restricts and locks the movement in the surface direction on the upper surface of the base body at the outer peripheral portion of the wafer. The restricting members are arranged on both sides of the upper surface of the wafer base so that there are at least two places across a line passing through the center of the wafer surface.
[0030]
The interval between the clamp member and the stopper member is slightly smaller than the wafer width in the wafer insertion direction when the wafer is inserted, and the wafer insertion portion of the stopper member is provided with the wafer insertion interval. After the wafer was inserted into the wafer, the wafer was brought into close contact with the base body within the restriction range of the restriction member, and the wafer was locked with the clamp member.
[0031]
The wafer mounting table is a batch type in which a plurality of wafers are held on the same circumference and work is performed. The stopper member or the clamp member was provided at a position corresponding to the orientation flat portion of the wafer. The clamp member is configured to perform the limit locking by an elastic biasing member. The elastic biasing member is configured to have a spring or a spring in the structure.
[0032]
At least one of the stopper member and the clamp member is configured to restrict and lock movement in a direction away from the upper surface of the base by a limiting locking body having a tapered portion. The elastic biasing member was provided on the upper surface of the base body. A material having the same component as that of the wafer may be coated on the processing target portion on the upper surface of the base body. The clamp member is configured to be movable to a limit locking position and a limit release position, and is configured to be fixable at at least one position. The clamp member is configured to cover the edge portion of the ion-implanted surface on the outer periphery of the wafer along the outer periphery, and the stopper member or the clamp member also serves as the limiting member. The stopper member or the clamp member is configured to cover the edge portion of the ion-implanted surface on the outer periphery of the wafer along the outer periphery, and also serves as a limiting member. Of the limiting member, the stopper member, and the clamp member, at least the limiting member or the stopper member was formed integrally or separately from the base. An orientation flat may be provided on the base body.
[0033]
The stopper member or clamp member provided at a position corresponding to the orientation flat portion of the wafer is provided at least at a position corresponding to the orientation flat portion of the base body or at a position opposite to 180 degrees.
The center of the wafer and the center of the base body may be provided at the same center position.
[0034]
As shown in FIG. 7, a recess V is provided on the base 1 over a part of the outer periphery of the wafer, and the lower surface of the mounted wafer is removed from the outer periphery with a removal tool such as a driver or tweezers. You may comprise so that a wafer can be removed upward.
[0035]
The material of the constituent member of the size conversion holder can reinforce the wafer, such as aluminum, ceramics, graphite, and the like, so that the amount of contamination on the silicon wafer does not matter. FIG. 2 shows a cross-sectional view of a state in which a wafer is placed on a wafer size conversion holder. The height of the limiting member 3 from the wafer mounting surface 10 is substantially larger than the thickness of the wafer. In the state where the wafer 2 is placed, the surface of the limiting member 3 is present at a position higher than the surface of the wafer 2.
[0036]
The second embodiment shown in FIG. 7 will be described below. A base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and a wafer is detachably provided on the upper surface of the base body so that the wafer mounting table moves on the upper surface of the wafer base body. A restricting member that restricts movement in the surface direction at the surface, a stopper member that restricts and locks movement of the outer periphery of the wafer in a direction away from the upper surface of the base body, and a locking body from the opposite side of the stopper member or A clamp auxiliary member having a force for pressing the wafer by an elastic biasing member arranged together with the stopper auxiliary member having the cover body is provided on the upper surface of the base body, and the restriction member, the stopper member, and the clamp member are used. The wafer was fixed on the upper surface of the base body. The clamp auxiliary member is disposed in an intermediate portion of the stopper auxiliary member so as to freely advance and retract. The interval between the stopper member locking body or cover body and the stopper auxiliary member locking body or cover body is slightly smaller than the wafer width in the wafer insertion direction when the wafer is inserted, and the stopper member and the stopper auxiliary member wafer. Insert the wafer into the insertion section of the stopper, insert the wafer into the wafer insertion section of the stopper auxiliary member, and then insert it into the wafer insertion section of the stopper member on the opposite side. The wafer was locked with an auxiliary member. The restricting members were arranged at two locations opposite to each other with the stopper member as a structure in contact with the wafer edge at at least two points. A recess for inserting the wafer clamping means is arranged in the middle of the stopper member or in the vicinity thereof.
[0037]
As shown in FIG. 7, it is also possible to fix the wafer by an elastic biasing member such as a leaf spring or a clamp auxiliary member 52 which is an elastic material. In FIG. 7, the limiting member 31 is disposed so as to face the stopper member 41 with an arc shape obtained by cutting a part of a circle or a shape obtained by cutting a part of the shape. Further, in order to fix the wafer 2, the wafer 2 is pressed from the opposite side of the stopper member 41 by the clamp auxiliary member 52 arranged together with the stopper auxiliary member 11 so as not to move. The clamp auxiliary member 52 is given a force to hold the wafer by the elastic biasing member 8 (plate-shaped or bar-shaped spring). Further, the stopper member 41, the stopper auxiliary member 11, and the clamp auxiliary member 52 are provided with a locking body or cover body 7 to restrict and lock the movement of the outer peripheral portion of the wafer in the direction away from the upper surface of the base body and the ion beam. May not be hit. The clamping auxiliary member 52 locked on both sides of the elastic urging member 8 by the locking bodies 9 and 9 may be formed of an elastic material integrally with the elastic urging member 8 (plate-like or bar-like spring), You may provide the hollow 12 in the base body 1 part of the movable range of an elastic biasing member. FIG. 8 is a side view of FIG. Reference numeral 10 denotes a wafer mounting surface. FIG. 9 is a cross-sectional view of the clamp auxiliary member 52 in the embodiment having a dd cross section in FIG. 7, and is slidably fitted and held between the stopper auxiliary members 11. FIG. 10 shows another example of the second embodiment of FIG. 11 is a cross-sectional view taken along the line gg in FIG. 12 is a cross-sectional view of the clamp auxiliary member 52 taken along line ee in FIG. FIG. 13 is an explanatory diagram in the middle of the wafer mounting operation, and FIG. 14 is an explanatory diagram showing the wafer mounting. That is, the interval between the stopper auxiliary member 11 and the stopper member 41 is slightly smaller than the wafer width in the wafer insertion direction when the wafer is inserted, and the wafer insertion portion of the stopper member is provided with a wafer insertion interval. After inserting the wafer into the wafer insertion section, the wafer is brought into close contact with the base body within the restriction range of the restriction member, and fitted into the stopper auxiliary member 11, and then the wafer is locked with the clamp auxiliary member. To do.
[0038]
In any case, the number, shape, and type of springs are not limited, and the number can be determined within the necessary range. When a silicon wafer having a wafer size of 150 mm and a thickness of 625 μm is held by a wafer size conversion holder for a 200 mm apparatus and held on a disk and implanted using a batch type ion implantation apparatus compatible with the 200 mm wafer, a 200 mm wafer is conventionally used. With the corresponding batch type ion implantation apparatus, a 150 mm wafer could not be implanted. However, by using the wafer size conversion holder of the present invention, a wafer after ion implantation treatment without any problem can be obtained. It was. As a result, it has become possible to inject a wafer having a size different from the specification of the apparatus without performing a modification of the apparatus.
[0039]
【The invention's effect】
As described above, by using the wafer size conversion holder according to the present invention, a wafer having a size smaller than a predetermined size in a batch type ion implantation apparatus as well as a single wafer processing is conventionally used. Compared to the above, accurate positioning and reliable support of the wafer on the upper surface of the base body can be performed with a minimum number of members, and reliable implantation can be performed.
[0040]
In addition, since there is no need to modify the equipment, the vacuum chamber is not opened during the setup process for wafer size conversion, which shortens the time to start implantation and increases the number of particles in the end station. Can be prevented. Furthermore, since parts for remodeling are not necessary, the cost is reduced accordingly.
[0041]
The disk, which is a wafer mounting table, can be automatically mounted even when the number of held disks is large, even in batch systems where multiple wafers are held on the same circumference and ion implantation is performed, and the disks themselves do not need to be remanufactured. It becomes.
[Brief description of the drawings]
FIG. 1 is a configuration diagram (front view) of a wafer size conversion holder in an embodiment of the present invention.
FIG. 2 is a configuration diagram (hh sectional view) of a wafer size conversion holder in an embodiment of the present invention.
FIG. 3 is a cross-sectional view of the limiting member 3 in the embodiment that is a cross-section along the line aa in FIG.
FIG. 4 is a cross-sectional view of the stopper member 4 in the embodiment which is a bb cross section of FIG. 1;
FIG. 5 is another cross-sectional view of the stopper member 4 in the embodiment which is a bb cross section of FIG. 1;
6 is another cross-sectional view of the stopper member 4 in the embodiment which is a cross-sectional view taken along the line cc of FIG. 1. FIG.
FIG. 7 is a configuration diagram of a wafer size conversion holder (push spring system) in the second embodiment.
FIG. 8 is a side view of FIG. 7;
9 is a cross-sectional view of the clamp auxiliary member 52 in the embodiment which is a dd cross section in FIG. 7; FIG.
FIG. 10 shows another example of the second embodiment of FIG.
11 is a cross-sectional view taken along the line gg in FIG.
12 is a cross-sectional view of the clamp auxiliary member 52 taken along line ee in FIG.
FIG. 13 is an explanatory diagram in the middle of wafer mounting work.
FIG. 14 is an explanatory diagram showing wafer loading.
FIG. 15 is a configuration diagram of a wafer processing chamber W of the ion implantation apparatus.
FIG. 16 is a configuration diagram of a wafer mounting table such as a batch type disk D1 for holding a wafer such as silicon.
[Explanation of symbols]
1 Base body
2 wafers
3 Restriction member
4 Stopper member
5 Clamp member
6 Elastic biasing member
7 Cover
8 Pressing spring
9 Wafer mounting part
D1 disc

Claims (23)

In a wafer size conversion holder of an ion implantation apparatus having a movable wafer mounting table for holding a substrate wafer such as silicon,
A base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and a wafer is detachably provided so as to be in contact with a flat portion of the upper surface of the base body,
A limiting member that restricts movement in one direction of the surface of the wafer on the upper surface of the base body and movement in a direction perpendicular to the one direction in accordance with the movement operation of the wafer mounting table;
A stopper member that restricts and locks the movement of the outer periphery of the wafer in a direction away from the upper surface of the base body and the movement in one direction of the surface direction ;
An operation-type clamping member that restricts and locks movement in one direction in the surface direction on the upper surface of the base body of the outer peripheral portion of the wafer and movement in a direction away from the upper surface of the base body; It is configured to be provided on the top,
Wafer size Conversion holder over, characterized in that the wafer by the restriction member and the stopper member and the clamping member is immovably fixed to the front and rear, right and left and vertically to the base member upper surface. Together with the the restriction member and the clamping member configured to be disposed across the line passing through the surface center of the wafer, the with the clamp member and the strike Tsu path over member disposed across the line passing through the surface center of the wafer wafer size Conversion holder over according to claim 1, characterized by being configured to be. The base body, the wafer is substantially similar to the outer peripheral shape as the claims 1 wafer size-conversion holder over description. Wherein the restriction member is on the base member upper surface of the wafer, the wafer size Conversion holder over according to claim 1, wherein arranged on both sides so as to be at least 2 or more sites across the line passing through the surface center of the wafer. The wafer mounting table holds a plurality on the same circumference of the wafer, the wafer size Conversion holder over according to claim 1, wherein the batch type to perform operations. The stopper member or the clamping member, the wafer size Conversion holder over according to claim 1, wherein provided at positions corresponding to the orientation flat of the wafer. The clamping member wafer size-conversion holder over according to claim 1, wherein the structure is configured to perform the restriction locking by elastic urging member. 7. wafer size-conversion holder over according the elastic biasing member configured to have a spring in the spring or structure. 2. The wafer size conversion holder according to claim 1, wherein at least one of the stopper member or the clamp member is configured to restrict and lock movement in a direction away from the upper surface of the base by a limiting locking body having a tapered portion. -. The wafer according to claim 1, wherein at least one of the stopper member or the clamp member is configured to restrict and lock movement in a direction away from the upper surface of the base by a locking body or a cover body that protrudes small toward the wafer side. size-conversion holder over. Wafer size Conversion holder over the elastic biasing member according to claim 7, wherein provided on the upper surface of the base body. Wafer size Conversion holder over according to claim 1, wherein the coated processing or coating process the materials of component similar to the wafer in the exposure portion of the ion implantation of the upper surface of the base body. Clamping member having a resilient biasing member, along with configured movable in limited locking position and limit the open position, at least, the wafer size Conversion holder over according to claim 7, wherein the fixable configured in one position . Wherein the restriction member, the stopper member, the clamping of the member, at least the restriction member or wafer size-conversion holder over according to claim 1, wherein the stopper member is the base and integrally molded. Wafer size Conversion holder over of claim 6 wherein providing the orientation flat or notch in the base body. The stopper member or clamp member provided at a position corresponding to the orientation flat portion of the wafer is provided at a position corresponding to at least the orientation flat portion or the notch portion of the base body, or provided at a position opposite to 180 degrees. 15 wafer size-conversion holder over description. In a method of holding a wafer of an ion implantation apparatus having a movable wafer mounting table for holding a wafer such as silicon,
A base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and a wafer is detachably provided so as to be in contact with the flat surface of the upper surface of the base body, so that the wafer mounting table can be moved. And a restricting member for restricting movement of the wafer in one direction on the upper surface of the base body and in a direction perpendicular to the one direction, and a locking body or a cover body, and a base of the outer peripheral portion of the wafer. A stopper member that restricts and locks the movement away from the upper surface of the base body and the movement in one direction of the surface , and the outer periphery of the wafer from the opposite side of the stopper member having a locking body or cover body A clamp auxiliary member having a force to hold the wafer with an elastic biasing member arranged together with a stopper auxiliary member that restricts and locks the movement in the direction away from the upper surface of the base body and the movement in one direction of the surface direction , Top surface of base A configuration is provided to,
Method of holding the wafer using the the restriction member and the stopper member, the wafer size-conversion holder over which immovably fixed to the front and rear, right and left and up and down direction of the wafer to the base member upper surface by the stopper support member and the clamp support member. 18. The wafer size conversion holder and a wafer holding method using the same according to claim 17, wherein the clamp auxiliary member is disposed in an intermediate portion of the stopper auxiliary member so as to be freely advanced and retracted. The interval between the stopper body or cover body of the stopper member and the stopper body or cover body of the stopper auxiliary member is slightly smaller than the wafer width in the wafer insertion direction, and the insertion of the stopper member and the stopper auxiliary member into the wafer is performed. A wafer insertion interval is provided in the part, and when inserting the wafer, after inserting the wafer into the wafer insertion part of the stopper auxiliary member, it is fitted into the wafer insertion part of the opposite stopper member, and the wafer is brought into contact with the restriction member is allowed, method of holding the wafer with a wafer size-conversion holder over of claim 17, wherein the locked wafer with clamp support member. The limiting member, holding method of a wafer using a wafer size-conversion holder over of claim 19 opposed to 2 points arranged across the stopper member as structures that contact the wafer edge with at least two or more points . Intermediate portion or holding method of a wafer using a wafer size-conversion holder over of claim 19, wherein placing the recess to insert the wafer clamping means in the vicinity of the stopper member. In a method of holding a wafer of an ion implantation apparatus having a movable wafer mounting table for holding a substrate wafer such as silicon,
A base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and a wafer is detachably provided so as to be in contact with the flat surface of the upper surface of the base body, so that the wafer mounting table can be moved. And a restricting member for restricting movement of the wafer in one direction on the upper surface of the base body and in a direction perpendicular to the one direction, and movement in a direction away from the upper surface of the base body of the outer periphery of the wafer In addition, a stopper member that restricts and locks movement in one direction in the surface direction, and movement in one direction in the surface direction on the upper surface of the base body at the outer peripheral portion of the wafer and movement in a direction away from the upper surface of the base body are restricted. An operation-type clamping member to be locked is provided on the upper surface of the base body,
A wafer holding method using a wafer size conversion holder, wherein a wafer is fixed to the upper surface of the base body so as to be immovable in the front-rear, left-right, and up-down directions by the limiting member, the stopper member, and the clamp member. Has a movable wafer mounting table for holding wafers such as silicon In wafer size conversion holder of ion implantation equipment
A base body having a substantially circular outer peripheral shape is detachably provided on the wafer mounting table, and a wafer is detachably provided so as to be in contact with the upper surface plane portion of the base body,
A limiting member that restricts movement in one direction of the surface of the wafer on the top surface of the base body and movement in a direction perpendicular to the one direction in accordance with the movement operation of the wafer mounting table;
A stopper member that restricts and locks the movement of the outer periphery of the wafer in a direction away from the upper surface of the base body and the movement in one direction of the surface direction;
Stopper auxiliary that has a locking body or a cover body and restricts the movement of the outer peripheral portion of the wafer in the direction away from the upper surface of the base body and the movement in one direction of the surface from the side opposite to the stopper member A clamp auxiliary member having a force for pressing the wafer with an elastic biasing member arranged together with the member is provided on the upper surface of the base body,
A wafer size conversion holder in which a wafer is fixed to the upper surface of the base body so as to be immovable back and forth, right and left and up and down by the limiting member, the stopper member, the stopper auxiliary member and the clamp auxiliary member.

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