CN103745949B - Chip clamping device - Google Patents
Chip clamping device Download PDFInfo
- Publication number
- CN103745949B CN103745949B CN201310718327.8A CN201310718327A CN103745949B CN 103745949 B CN103745949 B CN 103745949B CN 201310718327 A CN201310718327 A CN 201310718327A CN 103745949 B CN103745949 B CN 103745949B
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- CN
- China
- Prior art keywords
- chip
- spring
- thimble
- clamping device
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The invention relates to a chip clamping device comprising a top plate, a center, a retainer ring, a first spring, and a steel wire. One end of the top plate is provided with a chute. The center is in an L shape; one end of the center is arranged in the chute of the top plate; and the other end of the center is connected with the retainer ring. One end of the first spring is connected with the retainer ring; and the other end is connected with the steel wire. The provided device has the simple structure. Because the spring is arranged at the device, the certain buffer function is realized during the force driving process; and due to the contact with the chip by one end of the center, the chip can be clamped effectively, thereby preventing the chip from fragmentation during the clamping process.
Description
Technical field
The invention belongs to field of material surface treatment, particularly belong to chip surface plasma clean field.
Background technology
Develop towards small-sized, ultra-thin direction with chip, the process to chip will bring certain difficulty.Due to chip
Too small excessively thin, lead to the frangible of chip and easily blown away or the movement of chip leads to the intractability of chip is carried
High.
Therefore, need a kind of clamping device that precisely can effectively clamp chip badly.
Content of the invention
In order to solve the above-mentioned problems in the prior art, provide a kind of chip clamping device.
The technical solution adopted in the present invention is：A kind of chip clamping device, including top flat, thimble, back-up ring, the first spring
And steel wire, one end of above-mentioned top flat is provided with chute；Above-mentioned thimble is L-shaped, and one end of above-mentioned thimble is located at the chute of above-mentioned top flat
In, the other end of above-mentioned thimble connects back-up ring；One end of above-mentioned first spring connects above-mentioned back-up ring, and the other end connects above-mentioned steel
Silk.
Preferably, above-mentioned thimble is provided with one end of described back-up ring and is additionally provided with second spring, and above-mentioned thimble is arranged in above-mentioned
Two springs connect above-mentioned back-up ring.
Preferably, said chip clamping device is symmetrically arranged on two relative edges of chip.
Preferably, said chip clamping device is symmetrically arranged on chip four edges.
Preferably, it is additionally provided with protective case, above-mentioned protective case is respectively arranged on above-mentioned steel wire, the first spring, second spring, gear
The outer ring of circle, thimble and top flat.
Preferably, it is additionally provided with cylinder, above-mentioned cylinder connects the end of above-mentioned steel wire, for promoting or pulling above-mentioned steel
Silk.
Beneficial effect using the technical program is：A kind of chip clamping device, including top flat, thimble, back-up ring, the first bullet
Spring and steel wire, one end of top flat is provided with chute；Thimble is L-shaped, one end of thimble in the chute of top flat, the other end of thimble
Connect back-up ring；One end of first spring connects described back-up ring, and the other end connects steel wire.This apparatus structure is simple, and due to this dress
Install spring, power has been played certain cushioning effect during transmission, then by the end thereof contacts chip of thimble, can have
Effect clamping chip, prevents chip fragmentation during clamping.
Brief description
In order that present disclosure is easier to be clearly understood, below according to specific embodiment and combine accompanying drawing, right
The present invention is described in further detail, wherein：
Fig. 1 is the cross-sectional view of the embodiment of the present invention 1；
Fig. 2 is that the chip clamping device of the embodiment of the present invention 1 is symmetrically arranged at two relative edges of chip upper cross-section structure signal
Figure；
Fig. 3 is the cross-sectional view of the embodiment of the present invention 2；
In figure, 1. cylinder 2. protective case 3. steel wire 4. first spring, 5. back-up ring, 6. second spring, 7. thimble 8. core
Piece 9. chute 10. top flat.
Specific embodiment
Describe the specific embodiment of the present invention below in conjunction with the accompanying drawings in detail.
Embodiment 1
As shown in Figure 1-2, a kind of chip clamping device, including top flat 10, thimble 7, back-up ring 5, the first spring 4 and steel wire 3,
One end of top flat 10 is provided with chute 9；Thimble 7 is L-shaped, and one end of the shorter edge of L-type thimble, in the chute 9 of top flat 10, is pushed up
The other end of pin 7 is fixedly connected back-up ring 5；One end of first spring 4 connects back-up ring 5, and the other end connects steel wire 3.The present embodiment is excellent
Choosing is additionally provided with the second back-up ring, and the one end being provided with back-up ring 5 in thimble 7 is additionally provided with second spring 6, and thimble 7 is arranged in second spring 6 even
Connect back-up ring 5.
The operation principle of this clamping device is described below：In clamping process, it is respectively equipped with two on the relative both sides of chip
Individual chip clamping device, promotes steel wire 3 in fixing protective case 2 internal slide, according to the gearing of motive force, compresses first
Spring 4, the first spring 4 contacts back-up ring 5, and then promotes second spring 6, and second spring 6 drives one end fortune to chip 8 for the thimble
Dynamic, because thimble 7 is L-shaped, and the end of the shorter edge of thimble 7 is arranged in the chute 9 of top flat 10, when thimble travels forward
Because the effect of power will drive top flat to move to chip 8, thus touching chip, in the presence of spring pressure, withstand chip
8.
In de- clip process, steel wire 3 is pulled to slide to the one end away from chip 8 in fixing protective case 2, therefore steel wire
3 slowly weaken first for the active force of the first spring 4, and the first spring 4 recovers deformation, thus second spring 6 also recovers deformation,
Second spring 6 reversely pulls thimble 7 so that it is retreated after recovering deformation.Because the end of L-type thimble 7 is arranged on the chute of top flat 10
In 9, top flat 10 is departed from contact with chip 8 by the gearing due to power, so that chip 8 takes off folder.
Embodiment 2,
Remaining is same as Example 1, and difference is, is connected to clamping device, chip in four faces of chip
Four faces are symmetrical arranged clamping device, can make uniform force during chip clamping, can prevent from damaging during clamping
Chip.
Embodiment 3
As shown in figure 3, remaining is same as Example 2, difference is, the end of steel wire 3 be additionally provided with for pulling or
Promote the cylinder 1 of steel wire motion, be capable of automating the clamping to chip or de- folder acts on.
The invention has the beneficial effects as follows：A kind of chip clamping device, including top flat, thimble, back-up ring, the first spring and steel
Silk, one end of top flat is provided with chute；Thimble is L-shaped, and in the chute of top flat, the other end of thimble connects gear for one end of thimble
Circle；One end of first spring connects described back-up ring, and the other end connects steel wire.This apparatus structure is simple, and because this device is provided with
Spring, power is played certain cushioning effect during transmission, then by the end thereof contacts chip of thimble, can effectively clamp
Chip, prevents chip fragmentation during clamping.
Above-described is only the preferred embodiment of the present invention it is noted that for those of ordinary skill in the art
For, without departing from the concept of the premise of the invention, some deformation can also be made and improve, these broadly fall into the present invention
Protection domain.
Claims (5)
1. a kind of chip clamping device is it is characterised in that include top flat, thimble, back-up ring, the first spring and steel wire, described top flat
One end be provided with chute；Described thimble is L-shaped, one end of described thimble in the chute of described top flat, described thimble another
One end is fixedly connected back-up ring；One end of described first spring connects described back-up ring, and the other end connects described steel wire；It is additionally provided with protection
Set, described protective case is respectively arranged on described steel wire, the first spring, second spring, the outer ring of back-up ring, thimble and top flat.
2. chip clamping device according to claim 1 is it is characterised in that described chip clamping device is symmetrically arranged at chip
Article two, on relative edge.
3. chip clamping device according to claim 1 is it is characterised in that described chip clamping device is symmetrically arranged at chip
On four edges.
4. chip clamping device according to claim 1 is it is characterised in that described thimble is provided with one end of described back-up ring also
It is provided with second spring, described thimble is arranged in described second spring and connects described back-up ring.
5. it is characterised in that being additionally provided with cylinder, described cylinder connects described chip clamping device according to claim 1
The end of steel wire, for promoting or pulling described steel wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310718327.8A CN103745949B (en) | 2013-12-24 | 2013-12-24 | Chip clamping device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310718327.8A CN103745949B (en) | 2013-12-24 | 2013-12-24 | Chip clamping device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103745949A CN103745949A (en) | 2014-04-23 |
| CN103745949B true CN103745949B (en) | 2017-02-15 |
Family
ID=50502959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310718327.8A Active CN103745949B (en) | 2013-12-24 | 2013-12-24 | Chip clamping device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103745949B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006057051A1 (en) * | 2004-11-29 | 2006-06-01 | Fujitsu Limited | Auction apparatus and auction program |
| CN201222493Y (en) * | 2008-06-06 | 2009-04-15 | 无锡中微高科电子有限公司 | Multipurpose clamper for bonding machine workstation |
| CN101552223A (en) * | 2009-01-20 | 2009-10-07 | 三星电子（苏州）半导体有限公司 | Special fixture for manufacturing process of semiconductor module and sliding block component thereof |
| CN102709222A (en) * | 2011-06-28 | 2012-10-03 | 清华大学 | Wafer clamping device utilizing stretching of cord spring |
| CN102751228B (en) * | 2011-06-28 | 2014-11-26 | 清华大学 | Wafer clamping device by utilizing spring pinch cock |
| CN202434479U (en) * | 2012-01-09 | 2012-09-12 | 中国科学院苏州纳米技术与纳米仿生研究所 | In situ plasma cleaning and wafer bonding equipment |
-
2013
- 2013-12-24 CN CN201310718327.8A patent/CN103745949B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN103745949A (en) | 2014-04-23 |
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| C14 | Grant of patent or utility model | ||
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