CN204375708U - Chip multistep top tool - Google Patents
Chip multistep top tool Download PDFInfo
- Publication number
- CN204375708U CN204375708U CN201420854601.4U CN201420854601U CN204375708U CN 204375708 U CN204375708 U CN 204375708U CN 201420854601 U CN201420854601 U CN 201420854601U CN 204375708 U CN204375708 U CN 204375708U
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- CN
- China
- Prior art keywords
- chip
- compress spring
- stem casing
- upper sliding
- sliding sleeve
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Abstract
The utility model relates to a kind of chip multistep top tool, it is characterized in that it comprises the pedestal (1) connected successively from bottom to top, guide post (2) and push rod (3), described guide post (2) is provided with inner cover (4), described inner cover (4) is equipped with low sleeve (5) and upper sliding sleeve (6) successively, push rod (3) periphery is arranged with the first top stem casing (8) and the second top stem casing (9) from inside to outside successively, the first Compress Spring (10) is provided with between outer cover (7) on described low sleeve (5) and upper sliding sleeve (6), the second Compress Spring (11) is provided with between described pedestal (1) and low sleeve (5).The utility model changes three steps or two step jack-up into by a step jack-up of thimble, and with compensator or trimmer pressure, simultaneously the boss structure inlayed inside and outside changing into of thimble structure, increases lifting surface area, prevents chip from causing hidden splitting and defective chip when peeling off.
Description
technical field
The utility model relates to a kind of chip multistep top tool, is particularly useful for the stripping off device realizing jack-up for thinner chip.Belong to technical field of semiconductor encapsulation.
Background technology
In Die Bonder and Flip Chip Bonder equipment, have use chip peeling apparatus, it successfully can realize chip from the separation the blue film of wafer dish, thus provides independently chip raw material for other operations.Radio-frequency (RF) identification (radiofrequency identification) label Inlay sealed in unit is made up of substrate conveyor module (comprising charging and rewinding), some rubber moulding block, attachment module, hot pressing module and detection module.Wherein, mount stripping off device in module and achieve chip from the stripping wafer (Wafer) dish.Type of action when stripping off device is peeled off by chip is divided into jack-up to peel off and vacuum stripping.The stripping of thimble jack-up adopts more chip to peel off mode in current RFID sealed in unit.The stress deformation of the size of the contact forces of thimble and Wafer dish and the chip under contact force effect, whether whether directly determining can be chipping in stripping process chips, can successfully peel off most important to chip.In particular, along with the reduction of chip thickness and the raising of package speed, the chip stripping process under thimble effect is one of main inducing of chip cracks, directly affects the qualification rate of product.Current loader generally uses single thimble or many thimbles tool, by chip from jack-up blue film (tunica albuginea), chip is departed from.Concentrate because thimble tool is stressed, when the chip of operation thickness lower than 80um, extremely easily cause that chip is hidden to be split, make chip failure.
Utility model content
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of chip multistep top tool, can reduce when ultra-thin chip is peeled off and cause hidden splitting to make chip failure.
The purpose of this utility model is achieved in that a kind of chip multistep top tool, it comprises the pedestal connected successively from bottom to top, guide post and push rod, described guide post is provided with inner cover, described inner cover is equipped with low sleeve and upper sliding sleeve successively, the periphery of described upper sliding sleeve is provided with outer cover, push rod periphery above described upper sliding sleeve is arranged with the first top stem casing be connected with inner cover and the second top stem casing be connected with outer cover from inside to outside successively, the first Compress Spring is provided with between outer cover on described low sleeve and upper sliding sleeve, the second Compress Spring is provided with between described pedestal and low sleeve.
The coefficient of elasticity of described first Compress Spring is less than the coefficient of elasticity of the second Compress Spring.
The outer surface of described first top stem casing and the second top stem casing is provided with boss structure, and boss structure is inside and outside nested form.
Compared with prior art, the beneficial effect that the utility model has is:
The utility model changes three steps or two step jack-up into by a step jack-up of thimble, and with compensator or trimmer pressure, simultaneously the boss structure inlayed inside and outside changing into of thimble structure, increases lifting surface area, prevents chip from causing hidden splitting and defective chip when peeling off.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Wherein:
Pedestal 1
Guide post 2
Push rod 3
Inner cover 4
Low sleeve 5
Upper sliding sleeve 6
Outer cover 7
First top stem casing 8
Second top stem casing 9
First Compress Spring 10
Second Compress Spring 11.
Embodiment
See Fig. 1, the utility model relates to a kind of chip multistep top tool, comprise the pedestal 1 connected successively from bottom to top, guide post 2 and push rod 3, described guide post 2 is provided with inner cover 4, described inner cover 4 is equipped with low sleeve 5 and upper sliding sleeve 6 successively, the periphery of described upper sliding sleeve 6 is provided with outer cover 7, push rod 3 periphery above described upper sliding sleeve 6 is arranged with the first top stem casing 8 and the second top stem casing 9 from inside to outside successively, boss structure is at the upper surface of described first top stem casing 8 and the second top stem casing 9, boss structure is inside and outside nested form, can according to die size change of shape, described first top stem casing 8 is fixed by nut with inner cover 4, described second top stem casing 9 is fixed by nut with outer cover 7, the first Compress Spring 10 is provided with between outer cover 7 on described low sleeve 5 and upper sliding sleeve 6, and low sleeve 5 and upper sliding sleeve 6 leave certain glade plane space when initial condition, the second Compress Spring 11 is provided with between described pedestal 1 and low sleeve 5, and both also leave certain glade plane space when initial condition, the coefficient of elasticity of described first Compress Spring 10 is less than the coefficient of elasticity of the second Compress Spring 11, when Machine basement jack-up, whole tool is lifted and completes a jack-up action to thimble cap is spacing, then when pedestal is again by jack-up, first Compress Spring is compressed, until the gap between low sleeve 5 and upper sliding sleeve 6 completes elimination namely complete the action of secondary jack-up, in this jack-up course of action, because the first top stem casing 8 fixes with inner cover 4, and low sleeve 5 can drive act on inner cover 4, thus drive act on the first top stem casing 8, equally, jack-up due to pedestal can drive the upper act of guide post 2 and push rod 3, and what therefore on secondary, in act process, main top lifting worked is push rod 3 and the first top stem casing 8, finally when pedestal continues jack-up, the second Compress Spring 11 is compressed, until the gap between pedestal 1 and low sleeve 5 is eliminated completely, complete upper movement primarily of push rod 3 in this process and do.
Claims (3)
1. a chip multistep top tool, it is characterized in that it comprises the pedestal (1) connected successively from bottom to top, guide post (2) and push rod (3), described guide post (2) is provided with inner cover (4), described inner cover (4) is equipped with low sleeve (5) and upper sliding sleeve (6) successively, the periphery of described upper sliding sleeve (6) is provided with outer cover (7), the first top stem casing (8) be connected with inner cover (4) and the second top stem casing (9) be connected with outer cover (7) is arranged with from inside to outside successively in push rod (3) periphery of described upper sliding sleeve (6) top, the first Compress Spring (10) is provided with between outer cover (7) on described low sleeve (5) and upper sliding sleeve (6), the second Compress Spring (11) is provided with between described pedestal (1) and low sleeve (5).
2. a kind of chip multistep top according to claim 1 tool, is characterized in that the coefficient of elasticity of described first Compress Spring (10) is less than the coefficient of elasticity of the second Compress Spring (11).
3. a kind of chip multistep top according to claim 1 and 2 tool, it is characterized in that being boss structure at the upper surface of described first top stem casing (8) and the second top stem casing (9), boss structure is inside and outside nested form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420854601.4U CN204375708U (en) | 2014-12-30 | 2014-12-30 | Chip multistep top tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420854601.4U CN204375708U (en) | 2014-12-30 | 2014-12-30 | Chip multistep top tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204375708U true CN204375708U (en) | 2015-06-03 |
Family
ID=53331904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420854601.4U Active CN204375708U (en) | 2014-12-30 | 2014-12-30 | Chip multistep top tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204375708U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
-
2014
- 2014-12-30 CN CN201420854601.4U patent/CN204375708U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107369642A (en) * | 2017-06-08 | 2017-11-21 | 太极半导体（苏州）有限公司 | A kind of suction method for being avoided that ultra-thin chip fragmentation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |