CN216957989U

CN216957989U - Separation mechanism for separating chip and film

Info

Publication number: CN216957989U
Application number: CN202220698192.8U
Authority: CN
Inventors: 白生祥
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2022-03-28
Filing date: 2022-03-28
Publication date: 2022-07-12
Anticipated expiration: 2032-03-28

Abstract

The application discloses a separating mechanism for separating chip and membrane, including the vacuum adsorption piece that has the cavity, the upper end of vacuum adsorption piece has the convex part, has the hole of peeling off that a plurality of intervals set up on the convex part, peels off hole and cavity intercommunication, and the convex part is used for supporting the membrane that the up end was stained with the chip, and when the cavity produced the negative pressure, the membrane that corresponds with the hole of peeling off took place curved deformation and embedding and peels off the hole, realizes peeling off of membrane and chip. The separation mechanism of this application does not use the thimble, realizes the separation of chip and membrane by the hole of peeling off on the convex part. For ejector lift-off peeling: the ejector pin and the lifting element are saved, and the production cost of the chip mounting process is effectively reduced; the risk of damaging the surface caused by the thimble impacting the bottom of the chip is reduced; because no thimble is needed, the efficiency of lifting debugging can be improved when the machine is changed to replace products.

Description

Separation mechanism for separating chip and film

Technical Field

The utility model relates to the technical field of semiconductor packaging, in particular to a separating mechanism for separating a chip and a film.

Background

At present, a chip mounter in a packaging factory adopts a thimble jacking and peeling mode in a chip and blue film separation mode, as shown in fig. 1, the thimble jacking and peeling mode is a schematic diagram, and the working principle is as follows: the chip 1 to be operated is moved to a position right above the thimble 4, the thimble cap 3 generates negative pressure, the blue film 2 under the chip 1 is adsorbed through the pore 31, then the lifting element controls the thimble 4 to lift up to be propped against the blue film 2 under the chip 1, so that the chip 1 continuously rises, the chip 1 is separated from the blue film 2 under the chip 1, and when the thimble 4 rises to a certain height, the chip 1 and the blue film 2 are completely peeled off. The existing stripping mechanism has the following problems:

1. the risk that the chip is broken easily due to the fact that the ejector pin impacts the bottom of the chip;

2. when the machine is changed to replace the product model, a great deal of time is needed to adjust the ideal positions among the chip, the thimble and the thimble cap, otherwise, a series of problems such as thimble breakage or chip mounting inclination are easily caused.

SUMMERY OF THE UTILITY MODEL

The present invention addresses the above-described problems and overcomes at least one disadvantage by providing a separation mechanism for separating a chip and a membrane.

The technical scheme adopted by the utility model is as follows:

the utility model provides a separating mechanism for separating chip and membrane, is including the vacuum adsorption spare that has the cavity, the upper end of vacuum adsorption spare has the convex part, the stripping hole that has a plurality of intervals to set up on the convex part, stripping hole with the cavity intercommunication, the convex part is used for supporting the up end and glues the membrane that has the chip, and when the cavity produced the negative pressure, the membrane that corresponds with stripping hole takes place curved deformation and imbeds and peels off the hole, realizes peeling off of membrane and chip.

The separation mechanism of this application does not use the thimble, realizes the separation of chip and membrane by the hole of peeling off on the convex part. For lift-off stripping of the thimble: the thimble and the lifting element are saved, and the production cost of the chip mounting process is effectively reduced; the risk of a damaged surface caused by the fact that the ejector pin impacts the bottom of the chip is reduced; because no thimble is needed, the debugging efficiency can be improved when the machine is changed to replace products.

In one embodiment of the present invention, the upper end surface of the protrusion has a protrusion structure, and the protrusion structure is disposed around the periphery of the peeling hole.

The protruding structure is arranged, so that the contact area between the peripheral edge of the stripping hole and the convex part can be reduced, and the film can be conveniently deformed in a better curved shape.

In one embodiment of the present invention, the protruding structure on the periphery of the peeling hole is in line contact with the film.

In one embodiment of the present invention, the protruding structure on the periphery of the peeling hole is in surface contact with the film.

In one embodiment of the present invention, the cross-sectional area of the protruding structure decreases as the protruding structure is closer to the upper portion.

In one embodiment of the present invention, the vacuum absorbing member is further provided with a connector communicated with the cavity, and the connector is used for connecting a vacuum device.

In one embodiment of the present invention, the vacuum device is a vacuum pump.

The utility model has the beneficial effects that: the separation mechanism of this application does not use the thimble, realizes the separation of chip and membrane by the hole of peeling off on the convex part. For lift-off stripping of the thimble: the thimble and the lifting element are saved, and the production cost of the chip mounting process is effectively reduced; the risk of a damaged surface caused by the fact that the ejector pin impacts the bottom of the chip is reduced; because no thimble is needed, the debugging efficiency can be improved when the machine is changed to replace products.

Drawings

FIG. 1 is a schematic diagram of a conventional ejector pin lift-off;

FIG. 2 is a schematic view of a separating mechanism for separating a chip and a membrane;

fig. 3 is a schematic view of the blue film of fig. 2 after it has been deformed in a curved shape and inserted into the peeling hole.

The figures are numbered:

1. a chip; 2. a blue film; 3. a thimble cap; 31. fine pores; 4. a thimble; 5. a vacuum adsorption member; 51. a cavity; 52. a convex portion; 521. stripping holes; 522. a raised structure; 53. a connecting head.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings.

As shown in fig. 2 and 3, a separation mechanism for separating a chip and a film comprises a vacuum adsorption member 5 with a cavity 51, wherein the upper end of the vacuum adsorption member 5 is provided with a convex part 52, the convex part 52 is provided with a plurality of stripping holes 521 arranged at intervals, the stripping holes 521 are communicated with the cavity 51, the convex part 52 is used for supporting a blue film 2 with a chip 1 adhered to the upper end surface, and when the cavity 51 generates negative pressure, the blue film 2 corresponding to the stripping holes 521 is deformed in a curved shape and is embedded into the stripping holes 521, so that the blue film 2 is stripped from the chip 1.

The separation mechanism of the present embodiment does not use a thimble, and the separation of the chip 1 and the blue film 2 is performed by the peeling holes 521 on the convex portions 52. For lift-off stripping of the thimble: the thimble and the lifting element are saved, and the production cost of the chip mounting process is effectively reduced; the risk of surface damage caused by the fact that the ejector pin impacts the bottom of the chip 1 is reduced; because no thimble is needed, the debugging efficiency can be improved when the machine is changed to replace products.

As shown in fig. 2 and 3, in the present embodiment, the upper end surface of the protrusion 52 has a protrusion 522, and the protrusion 522 is disposed around the periphery of the peeling hole 521. The provision of the protruding structure 522 can reduce the contact area between the peripheral edge of the peeling hole 521 and the projection 52, thereby facilitating the more curved deformation of the blue film 2.

In the embodiment, the area of the cross section of the protruding structure 522 on the upper side is smaller, and the protruding structure 522 at the periphery of the peeling hole 521 is in line contact with the blue film 2. When the cavity 51 generates negative pressure, the line contact mode can ensure the sealing effect of the blue film 2 and the convex part 52, and can better enable the blue film 2 to generate curved deformation. In other embodiments, the protrusion 522 at the periphery of the peeling hole 521 may also be in surface contact with the blue film 2.

As shown in fig. 2 and 3, the vacuum absorbing member 5 is further provided with a connector 53 communicating with the cavity 51, and the connector 53 is used for connecting a vacuum device (i.e., a negative pressure source). In this embodiment, the vacuum apparatus is a vacuum pump.

The above description is only for the preferred embodiment of the present invention and is not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings can be directly or indirectly applied to other related technical fields and are included in the scope of the present invention.

Claims

1. The utility model provides a separating mechanism for separating chip and membrane, its characterized in that, is including the vacuum adsorption spare that has the cavity, the upper end of vacuum adsorption spare has the convex part, the stripping hole that has a plurality of intervals to set up on the convex part, stripping hole with the cavity intercommunication, the convex part is used for supporting the membrane that the up end was stained with the chip, and when the cavity produced negative pressure, the membrane that corresponds with stripping hole takes place curved deformation and imbeds stripping hole, realizes the peeling off of membrane and chip.

2. The separation mechanism for separating a chip and a film according to claim 1, wherein an upper end surface of the projection has a projection structure, and the projection structure is provided around a periphery of the peeling hole.

3. The separation mechanism for separating a chip and a film as claimed in claim 2, wherein the convex structure at the periphery of the peeling hole is in line contact with the film.

4. The separation mechanism for separating a chip and a membrane according to claim 2, wherein the convex structure on the periphery of the peeling hole is in surface contact with the membrane.

5. The separation mechanism for separating a chip and a membrane according to claim 3 or 4, wherein the cross-sectional area is smaller as the projection structure is located closer to the upper side.

6. The separation mechanism for separating a chip and a membrane as claimed in claim 1, wherein the vacuum absorbing member further has a connector connected to the cavity, the connector being adapted to connect to a vacuum device.

7. The separation mechanism for separating a chip and a membrane according to claim 6, wherein the vacuum means is a vacuum pump.