CN216957989U - Separation mechanism for separating chip and film - Google Patents

Abstract

The application discloses a separating mechanism for separating chip and membrane, including the vacuum adsorption piece that has the cavity, the upper end of vacuum adsorption piece has the convex part, has the hole of peeling off that a plurality of intervals set up on the convex part, peels off hole and cavity intercommunication, and the convex part is used for supporting the membrane that the up end was stained with the chip, and when the cavity produced the negative pressure, the membrane that corresponds with the hole of peeling off took place curved deformation and embedding and peels off the hole, realizes peeling off of membrane and chip. The separation mechanism of this application does not use the thimble, realizes the separation of chip and membrane by the hole of peeling off on the convex part. For ejector lift-off peeling: the ejector pin and the lifting element are saved, and the production cost of the chip mounting process is effectively reduced; the risk of damaging the surface caused by the thimble impacting the bottom of the chip is reduced; because no thimble is needed, the efficiency of lifting debugging can be improved when the machine is changed to replace products.

Description

Separation mechanism for separating chips and membranes

technical field

The utility model relates to the technical field of semiconductor packaging, in particular to a separation mechanism for separating chips and membranes.

Background technique

At present, the chip loader in the packaging factory uses the ejector pin lift-off method to separate the chip from the blue film. As shown in Figure 1, it is the schematic diagram of the ejector pin ejection and peeling. The working principle is: the chip 1 to be operated is moved to the ejector pin 4 positive In the upper position, the thimble cap 3 generates a negative pressure, and the blue film 2 under the chip 1 is adsorbed through the fine hole 31, and then the lifting element controls the thimble 4 to rise up, and pushes against the blue film 2 under the chip 1, so that the chip 1 continues to rise, The separation of the chip 1 and the blue film 2 below occurs. When the ejector pin 4 rises to a certain height, the complete peeling between the chip 1 and the blue film 2 is realized. The existing stripping mechanism has the following problems:

1. The impact of the ejector pin on the bottom of the chip is likely to cause the risk of chip rupture;

2. When changing the product model, it takes a lot of time to adjust the ideal position between the chip, the thimble and the thimble cap, otherwise it is easy to cause a series of problems such as breakage of the thimble or tilting of the chip.

Utility model content

Aiming at the above problems and overcoming at least one deficiency, the present invention proposes a separation mechanism for separating chips and membranes.

The technical scheme adopted by the utility model is as follows:

A separation mechanism for separating chips and membranes, comprising a vacuum suction part with a cavity, the upper end of the vacuum suction part has a convex part, the convex part has a plurality of peeling holes arranged at intervals, the peeling holes Connected with the cavity, the convex part is used to support the film with the chip on the upper end surface. When the cavity generates a negative pressure, the film corresponding to the peeling hole is deformed and embedded in the peeling hole to realize the peeling of the film and the chip. .

The separation mechanism of the present application does not use an ejector pin, and separates the chip and the film through the peeling hole on the convex portion. Compared with the ejector lift-off type, the ejector pins and lifting components are saved, and the production cost of the chip loading process is effectively reduced; the risk of damage to the surface caused by the ejector pins hitting the bottom of the chip is reduced; It can improve the efficiency of debugging when changing products.

In one embodiment of the present invention, the upper end surface of the protruding portion has a protruding structure, and the protruding structure is arranged around the periphery of the peeling hole.

The provision of the protruding structure can reduce the contact area between the periphery of the peeling hole and the protruding portion, which facilitates better curved deformation of the membrane.

In one embodiment of the present invention, the protruding structure on the periphery of the peeling hole is in line contact with the membrane.

In one embodiment of the present invention, the protruding structure on the periphery of the peeling hole is in surface contact with the membrane.

In one embodiment of the present invention, the higher the protruding structure is, the smaller the cross-sectional area is.

In one embodiment of the present invention, the vacuum suction member is further provided with a connecting head communicating with the cavity, and the connecting head is used for connecting the vacuum device.

In one embodiment of the present invention, the vacuum device is a vacuum pump.

The beneficial effect of the utility model is that the separation mechanism of the present application does not use an ejector pin, and the separation of the chip and the film is realized by the peeling hole on the convex portion. Compared with the ejector lift-off type, the ejector pins and lifting components are saved, and the production cost of the chip loading process is effectively reduced; the risk of damage to the surface caused by the ejector pins hitting the bottom of the chip is reduced; It can improve the efficiency of debugging when changing products.

Description of drawings

Fig. 1 is the schematic diagram of the existing thimble ejecting and peeling;

FIG. 2 is a schematic structural diagram of a separation mechanism for separating chips and membranes;

FIG. 3 is a schematic diagram of the blue membrane shown in FIG. 2 after bending deformation and embedding into the peeling hole.

The reference numbers in the figure are:

1, chip; 2, blue film; 3, thimble cap; 31, fine hole; 4, thimble; 5, vacuum suction part; 51, cavity; 52, convex part; 521, peeling hole; 522, convex structure; 53. Connector.

Detailed ways

The present utility model will be described in detail below with reference to the accompanying drawings.

As shown in Figures 2 and 3, a separation mechanism for separating chips and membranes includes a vacuum suction member 5 with a cavity 51, the upper end of the vacuum suction member 5 has a convex portion 52, and the convex portion 52 is provided with a plurality of intervals The peeling hole 521 is provided. The peeling hole 521 is communicated with the cavity 51. The convex part 52 is used to support the blue film 2 with the chip 1 on the upper end surface. When the cavity 51 generates negative pressure, the blue film 2 corresponding to the peeling hole 521 is generated. It is deformed in a curved shape and inserted into the peeling hole 521 to realize the peeling of the blue film 2 and the chip 1 .

The separation mechanism of this embodiment does not use an ejector pin, and the chip 1 and the blue film 2 are separated by the peeling hole 521 on the convex portion 52 . Compared with the ejector lift-off type, the ejector pins and lifting components are saved, and the production cost of the chip loading process is effectively reduced; the risk of damage to the surface caused by the ejector pins hitting the bottom of the chip 1 is reduced; The efficiency of debugging can be improved when the product is replaced by the machine.

As shown in FIGS. 2 and 3 , in this embodiment, the upper end surface of the protruding portion 52 has a protruding structure 522 , and the protruding structure 522 is arranged around the periphery of the peeling hole 521 . The provision of the protruding structure 522 can reduce the contact area between the periphery of the peeling hole 521 and the protruding portion 52 , so as to facilitate the better curved deformation of the blue film 2 .

In this embodiment, the higher the raised structure 522 is, the smaller the cross-sectional area, and the raised structure 522 around the peeling hole 521 is in line contact with the blue film 2 . When a negative pressure is generated in the cavity 51, the line contact method can ensure the sealing effect of the blue film 2 and the convex portion 52, and can better deform the blue film 2 in a curved shape. In other embodiments, the protruding structures 522 on the periphery of the peeling hole 521 may also be in surface contact with the blue film 2 .

As shown in FIGS. 2 and 3 , the vacuum suction member 5 is also provided with a connecting head 53 communicating with the cavity 51 , and the connecting head 53 is used to connect a vacuum device (ie, a negative pressure source). In this embodiment, the vacuum device is a vacuum pump.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of patent protection of the present invention. Any equivalent structural transformation made by using the contents of the description and accompanying drawings of the present invention is directly or indirectly applied to other related The technical field is similarly included in the protection scope of the present invention.

Claims (7)

1. The utility model provides a separating mechanism for separating chip and membrane, its characterized in that, is including the vacuum adsorption spare that has the cavity, the upper end of vacuum adsorption spare has the convex part, the stripping hole that has a plurality of intervals to set up on the convex part, stripping hole with the cavity intercommunication, the convex part is used for supporting the membrane that the up end was stained with the chip, and when the cavity produced negative pressure, the membrane that corresponds with stripping hole takes place curved deformation and imbeds stripping hole, realizes the peeling off of membrane and chip.

2. The separation mechanism for separating a chip and a film according to claim 1, wherein an upper end surface of the projection has a projection structure, and the projection structure is provided around a periphery of the peeling hole.

3. The separation mechanism for separating a chip and a film as claimed in claim 2, wherein the convex structure at the periphery of the peeling hole is in line contact with the film.

4. The separation mechanism for separating a chip and a membrane according to claim 2, wherein the convex structure on the periphery of the peeling hole is in surface contact with the membrane.

5. The separation mechanism for separating a chip and a membrane according to claim 3 or 4, wherein the cross-sectional area is smaller as the projection structure is located closer to the upper side.

6. The separation mechanism for separating a chip and a membrane as claimed in claim 1, wherein the vacuum absorbing member further has a connector connected to the cavity, the connector being adapted to connect to a vacuum device.

7. The separation mechanism for separating a chip and a membrane according to claim 6, wherein the vacuum means is a vacuum pump.

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