CN216597503U

CN216597503U - Dress lid tool that chip package used

Info

Publication number: CN216597503U
Application number: CN202122985997.9U
Authority: CN
Inventors: 候许科; 初晓东
Original assignee: Rizhao Dongxun Electronic Technology Co ltd
Current assignee: Rizhao Dongxun Electronic Technology Co ltd
Priority date: 2021-12-01
Filing date: 2021-12-01
Publication date: 2022-05-24
Anticipated expiration: 2031-12-01

Abstract

The utility model discloses a cover mounting jig for chip packaging, which comprises a bottom plate and a top plate, wherein a plurality of groups of positioning pins are arranged on the bottom plate, carrier pieces can be detachably placed between each group of positioning pins, a plurality of base placing holes for placing bases are formed in each carrier piece, a plurality of upper cover placing grooves of chips which correspond to the base placing holes one by one are formed in the lower surface of the top plate, a negative pressure channel is formed in the top plate, a negative pressure suction port communicated with the negative pressure channel is formed in each upper cover placing groove, a negative pressure connecting nozzle communicated with the negative pressure channel is formed in the top plate and is connected with a negative pressure system, a positioning structure is arranged between the top plate and the bottom plate, and a plurality of upper covers can be assembled at one time by the cover mounting jig, so that the cover mounting efficiency is improved.

Description

Dress lid tool that chip package used

Technical Field

The present disclosure relates to cover mounting apparatuses, and particularly to a cover mounting apparatus for chip packaging.

Background

At present, the chip is called as the packaged chip formed after packaging in a broad sense, the packaged chip mainly comprises a base, a chip body and an upper cover, the chip body is bonded on the base through glue and is bonded, then the upper cover is covered on the base and finally welded to form the packaged chip, and in the packaging process, the assembly between the upper cover and the base is difficult, the current main operation mode is that a carrier piece is adopted, the base is placed in a groove of the carrier piece, then the upper cover is manually placed on the base one by one, and then welding operation is carried out, the artificial participation degree of the whole process is higher, and the assembly efficiency of the upper cover is very low.

SUMMERY OF THE UTILITY MODEL

The technical problem to be solved by the utility model is as follows: the cover assembling jig for the chip packaging can assemble a plurality of upper covers at one time, so that the cover assembling efficiency is improved, and the problem of low chip packaging and transferring efficiency is solved.

In order to solve the technical problems, the technical scheme of the utility model is as follows: the cover mounting jig comprises a bottom plate and a top plate, wherein a plurality of groups of positioning pins are arranged on the bottom plate, carrier pieces can be detachably placed between each group of positioning pins, a plurality of base placing holes used for placing bases are formed in each carrier piece, an upper cover placing groove of a chip in one-to-one correspondence with the base placing holes is formed in the lower surface of the top plate, a negative pressure channel is formed in the top plate, a negative pressure suction port communicated with the negative pressure channel is formed in each upper cover placing groove, a negative pressure connecting nozzle communicated with the negative pressure channel is formed in the top plate, the negative pressure connecting nozzle is connected with a negative pressure system, and a positioning structure is arranged between the top plate and the bottom plate.

As a preferred scheme, the top plate comprises a top plate body, at least two upper positioning lugs are arranged around the top plate body, correspondingly, the bottom plate comprises a bottom plate body, at least two lower positioning lugs are arranged on the bottom plate body, and the positioning structure is arranged between the upper positioning lugs and the lower positioning lugs.

As a preferable scheme, the positioning structure includes a positioning hole disposed on each upper positioning lug, and a positioning column inserted into the positioning hole is disposed on the corresponding lower positioning lug.

As a preferable scheme, two sides of the middle part of the top plate body are provided with lifting operation ears which are convenient for lifting the top plate body.

As a preferred scheme, the carrier sheet is a metal carrier sheet, the base placing hole comprises a stepped hole matched with the chip base in shape, an auxiliary hole is arranged on the outer side of the stepped hole, and the auxiliary hole is communicated with the stepped hole.

Preferably, the carrier pieces are strip-shaped carrier pieces, and the base placing holes on each carrier piece are arranged in a straight line at equal intervals.

As a preferable scheme, positioning square holes corresponding to the base placing holes are arranged on the two sides of the base placing holes on the carrier sheet, and each group of positioning square holes corresponds to one base placing hole.

After the technical scheme is adopted, the utility model has the effects that: because the capping jig comprises a bottom plate and a top plate, a plurality of groups of positioning pins are arranged on the bottom plate, carrier pieces can be detachably placed between each group of positioning pins, a plurality of base placing holes for placing a base are arranged on each carrier piece, a plurality of upper cover placing grooves of the chips which are in one-to-one correspondence with the base placing holes are arranged on the lower surface of the top plate, a negative pressure channel is arranged on the top plate, a negative pressure suction port communicated with the negative pressure channel is arranged on each upper cover placing groove, a negative pressure connecting nozzle communicated with the negative pressure channel is arranged on the top plate, the negative pressure connecting nozzle is connected with a negative pressure system, and a positioning structure is arranged between the top plate and the bottom plate, the chip base is placed in the base placing hole in the actual use process, when the capping is needed, the upper cover is directly placed in the upper cover placing groove and is adsorbed by the negative pressure, then the top plate is turned over, and the top plate is buckled on the bottom plate through the positioning structure, the upper cover adsorbs through the effect of negative pressure and fixes on the roof this moment, then roof and bottom plate accurate alignment back, and the upper cover is placed on the chip base with regard to the one-to-one, then stops bleeding, and the chip upper cover can be because of the gravity of self and the roof separation this moment, after puting aside the roof, take out the carrier piece again and place on welding equipment's platform can, should adorn and cover the tool and can once only assemble a plurality of chip upper covers to the base on, the degree of accuracy is good, and efficiency is higher.

Because the roof includes the roof body again, be provided with two at least upper location ears around the roof body, corresponding, the bottom plate includes the bottom plate body, is provided with two at least lower location ears on the bottom plate body, and location structure sets up between upper location ear and the lower location ear, utilizes the setting of the convenient location structure that upper location ear and lower location ear can be better, avoids occuping the region of bottom plate body.

And because the two sides of the middle part of the top plate body are provided with the lifting operation ears which are convenient for lifting the top plate body, the top plate body can be conveniently operated by hands by utilizing the lifting operation ears, and the top plate body can be conveniently turned over.

And because the carrier piece is a metal carrier piece, the base placing hole comprises a stepped hole matched with the shape of the chip base, an auxiliary hole is arranged outside the stepped hole and communicated with the stepped hole, the chip base can be conveniently placed by using the stepped hole, pins of the chip base can conveniently penetrate through the stepped hole, and the auxiliary hole can be used for positioning the clamping base and the upper cover from the auxiliary hole by using a tool when the top plate is lifted, so that subsequent welding work is facilitated.

And because the outer side of the base placing hole on the carrier sheet is provided with the positioning square hole corresponding to the base placing hole, and the positioning square hole is in one-to-one correspondence with each base placing hole, the carrier sheet can be positioned better in the subsequent welding process.

Drawings

The utility model is further illustrated with reference to the following figures and examples.

FIG. 1 is a schematic structural view of a top plate according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a base plate according to an embodiment of the present invention;

FIG. 3 is a schematic view of a carrier plate mounted on a base plate according to an embodiment of the present invention;

FIG. 4 is a schematic view of a single carrier plate according to an embodiment of the present invention;

FIG. 5 is a schematic structural view of a base placement hole according to an embodiment of the present invention;

FIG. 6 is a cross-sectional view of a conventional packaged chip;

in the drawings: 1. a base plate; 2. a top plate; 3. positioning pins; 4. a carrier sheet; 5. a base placement hole; 51. a stepped hole; 52. an auxiliary hole; 6. an upper cover placing groove; 7. a negative pressure channel; 8. a negative pressure air suction port; 9. a negative pressure connecting nozzle; 10. an upper positioning lug; 11. a lower positioning ear; 12. positioning holes; 13. a positioning column; 14. lifting the operating lug; 15. positioning a square hole; 16. a chip body; 17. an upper cover; 18. a base.

Detailed Description

The present invention is described in further detail below with reference to specific examples.

As shown in fig. 1-6, a cover mounting jig for chip packaging includes a bottom plate 1 and a top plate 2, a plurality of sets of positioning pins 3 are provided on the bottom plate 1, carrier pieces 4 are detachably placed between each set of positioning pins 3, a plurality of base 18 placing holes 5 for placing the base 18 are provided on each carrier piece 4, upper cover 17 placing grooves 6 of a plurality of chips corresponding to the base 18 placing holes 5 one to one are provided on the lower surface of the top plate 2, a negative pressure channel 7 is provided on the top plate 2, a negative pressure suction port 8 communicated with the negative pressure channel 7 is provided on each upper cover 17 placing groove 6, a negative pressure connecting nozzle 9 communicated with the negative pressure channel 7 is provided on the top plate 2, the negative pressure connecting nozzle 9 is connected with a negative pressure system, and a positioning structure is provided between the top plate 2 and the bottom plate 1.

In this embodiment, the top plate 2 includes the 2 bodies of top plate, be provided with two at least last location ears 10 around the 2 bodies of top plate, it is corresponding, bottom plate 1 includes the 1 bodies of bottom plate, be provided with two at least lower location ears 11 on the 1 bodies of bottom plate, location structure sets up between last location ear 10 and lower location ear 11, location structure is including setting up the locating hole 12 on every last location ear 10, it is corresponding, be provided with the reference column 13 that inserts in the locating hole 12 on the lower location ear 11, the middle part both sides of the 2 bodies of top plate are provided with the operation ear 14 of lifting up that conveniently lifts up the 2 bodies of top plate.

In this embodiment, the carrier pieces 4 are metal carrier pieces 4, the placement holes 5 of the base 18 include stepped holes 41 adapted to the shape of the chip base 18, auxiliary holes 42 are provided outside the stepped holes 41, the auxiliary holes 42 are communicated with the stepped holes 41, the carrier pieces 4 are strip-shaped carrier pieces 4, the placement holes 5 of the base 18 on each carrier piece 4 are arranged at equal intervals in a straight line, and positioning square holes 15 corresponding to the placement holes 5 of the base 18 are provided outside the placement holes 5 of the base 18 on each carrier piece 4.

At present, it is recorded in the background art that the chip is broadly called as a packaged chip formed after packaging, the packaged chip mainly comprises a base 18, a chip body 16 and an upper cover 17, in the using process, the base 18 of the packaged chip is firstly placed in the base 18 placing hole 5 of the bottom plate 1, the upper cover 17 is directly placed in the upper cover 17 placing groove 6 of the top plate 2, a negative pressure system is started, the negative pressure air suction port 8 sucks the upper cover 17, the upper cover 17 is fixed on the top plate 2 in an absorption manner through the action of negative pressure, the top plate 2 can be turned over by lifting the operation lug 14, the top plate 2 is accurately aligned and buckled on the bottom plate 1 through the matching positioning action of the positioning hole 12 and the positioning column 13, at the moment, the upper covers 17 are correspondingly placed on the base 18 of the packaged chip one by one to one, then the negative pressure system is closed, the air suction is stopped, the chip upper cover 17 is separated from the top plate 2 under the action of self gravity, the top plate 2 is removed, and then the carrier plate 4 is taken out from the bottom plate 1 and placed on a platform of the welding equipment for subsequent operation.

The gas circuit system mentioned in the embodiment is the conventional technology at present, and the vacuum element, the gas circuit and the program control are disclosed in detail in the 3 rd SMC training teaching material of the modern practical pneumatic technology published by the mechanical industry publisher in 2008, 08, 01, which shows that the gas circuit structure in the embodiment is also the prior art, and clearly shows that the control of the motor and the travel switch are also described in detail in the book of Motor drive and speed regulation published by the chemical industry publisher in 2015, 07, 01, so that the connection of the circuit and the gas circuit is clear.

The above examples are only for describing the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention should fall within the protection scope defined by the claims of the present invention without departing from the design spirit of the present invention.

Claims

1. The utility model provides a dress lid tool that chip package used which characterized in that: the novel vacuum packaging device is characterized by comprising a bottom plate and a top plate, wherein a plurality of groups of positioning pins are arranged on the bottom plate, carrier pieces can be detachably placed between every group of positioning pins, a plurality of base placing holes used for placing bases are formed in every carrier piece, upper cover placing grooves of chips corresponding to the base placing holes in a one-to-one mode are formed in the lower surface of the top plate, negative pressure channels are formed in the top plate, negative pressure suction ports communicated with the negative pressure channels are formed in every upper cover placing groove, negative pressure connecting mouths communicated with the negative pressure channels are formed in the top plate and connected with a negative pressure system, and positioning structures are arranged between the top plate and the bottom plate.

2. The cap mounting jig for chip packaging according to claim 1, wherein: the roof includes the roof body, be provided with two at least last location ears around the roof body, it is corresponding, the bottom plate includes the bottom plate body, be provided with two at least location ears down on the bottom plate body, location structure sets up in last location ear and down between the location ear.

3. The cap mounting jig for chip packaging according to claim 2, wherein: the positioning structure comprises positioning holes arranged on each upper positioning lug, and positioning columns inserted into the positioning holes are arranged on the corresponding lower positioning lugs.

4. The cap mounting jig for chip packaging according to claim 3, wherein: the middle part both sides of roof body are provided with the convenience and lift up the operation ear that lifts up of roof body.

5. The cap mounting jig for chip packaging according to claim 4, wherein: the carrier piece is a metal carrier piece, the base placing hole comprises a stepped hole matched with the shape of the chip base, and an auxiliary hole is arranged on the outer side of the stepped hole and communicated with the stepped hole.

6. The cap mounting jig for chip packaging according to claim 5, wherein: the carrier pieces are strip-shaped carrier pieces, and the base placing holes on each carrier piece are arranged at equal intervals in a straight line.

7. The cap mounting jig for chip packaging according to claim 6, wherein: the two sides of the carrier piece, which are positioned in the base placing holes, are provided with positioning square holes corresponding to the base placing holes, and each group of positioning square holes corresponds to one base placing hole.