CN204289402U - Two soldering tip crystal solidifying apparatus - Google Patents
Two soldering tip crystal solidifying apparatus Download PDFInfo
- Publication number
- CN204289402U CN204289402U CN201420428448.9U CN201420428448U CN204289402U CN 204289402 U CN204289402 U CN 204289402U CN 201420428448 U CN201420428448 U CN 201420428448U CN 204289402 U CN204289402 U CN 204289402U
- Authority
- CN
- China
- Prior art keywords
- swing arm
- soldering tip
- wafer
- drive motor
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Die Bonding (AREA)
Abstract
The open a kind of two soldering tip crystal solidifying apparatus of the utility model, comprise the frame being provided with wafer disks, this frame is provided with the first soldering tip, this first soldering tip is connected with the first swing arm drive motor by the first swing arm, described frame is also provided with the second soldering tip, and this second soldering tip is connected with the second swing arm drive motor by the second swing arm.During work, under the first swing arm drive motor and the second swing arm drive motor drive, when moving to bonding position after making the first swing arm start to turn to brilliant dish position pickup wafer, second swing arm is rotated and is started to move to crystalline substance dish direction from bonding position, when making the first swing arm move to bonding position, second swing arm just moves to brilliant dish top and starts to pick up wafer, repeats to pick up bonding action.Because cycle when avoiding adopting single soldering tip, wafer being picked up rear location is longer, the efficiency that raising wafer is picked up and shift motion time, and then improve the efficiency of die bond.
Description
Technical field
The utility model relates to semiconductor die bond technical field, particularly a kind of crystal solidifying apparatus of two soldering tips.
Background technology
Wafer is accurately placed on the position of bonding, carries out postorder bonding operation after needing that when being used as the material of die bond is delivered to relevant position by feeding device by semiconductor crystal solidifying apparatus after being picked up by wafer by manipulator.
Existing crystal solidifying apparatus only has a soldering tip usually, at soldering tip from after wafer picked up by crystalline substance dish, needs to be moved to bonding position, owing to having certain distance between crystalline substance dish and bonding position, when soldering tip is moved, its stroke is longer, makes the efficiency of bonder not high.How to increase suitable cost, significantly put forward die bond efficiency becomes the technical problem being badly in need of solving simultaneously.
Utility model content
The technical problem that the utility model mainly solves is to provide a kind of two soldering tip crystal solidifying apparatus, cycle when this Multi-welding-arm device for die bonder can be avoided adopting single soldering tip, wafer being picked up rear location is longer, the efficiency that raising wafer is picked up and shift motion time, and then improve the efficiency of die bond.
In order to solve the problem, the utility model provides a kind of two soldering tip crystal solidifying apparatus, this pair of soldering tip crystal solidifying apparatus comprises the frame being provided with wafer disks, this frame is provided with the first soldering tip, this first soldering tip is connected with the first swing arm drive motor by the first swing arm, described frame is also provided with the second soldering tip, and this second soldering tip is connected with the second swing arm drive motor by the second swing arm.
Say further, described first swing arm and the second swing arm swing arranged in parallel.
Say further, the angle between the fulcrum of described first swing arm fulcrum and the second swing arm and brilliant disk center's point is 95 degree.
The two soldering tip crystal solidifying apparatus of the utility model, comprise the frame being provided with wafer disks, this frame is provided with the first soldering tip, this first soldering tip is connected with the first swing arm drive motor by the first swing arm, described frame is also provided with the second soldering tip, and this second soldering tip is connected with the second swing arm drive motor by the second swing arm.During work, under the first swing arm drive motor and the second swing arm drive motor drive, when moving to bonding position after making the first swing arm start to turn to brilliant dish position pickup wafer, second swing arm is rotated and is started to move to crystalline substance dish direction from bonding position, when making the first swing arm move to bonding position, second swing arm just moves to brilliant dish top and starts to pick up wafer, repeats to pick up bonding action.Because cycle when avoiding adopting single soldering tip, wafer being picked up rear location is longer, the efficiency that raising wafer is picked up and shift motion time, and then improve the efficiency of die bond.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, and the accompanying drawing in describing is embodiments more of the present utility model, to those skilled in the art, under the prerequisite not paying creative work, other accompanying drawings can also be obtained according to these accompanying drawings.
Fig. 1 is the two soldering tip crystal solidifying apparatus example structure schematic diagram of the utility model.
Below in conjunction with embodiment, and with reference to accompanying drawing, the realization of the utility model object, functional characteristics and advantage are described further.
Embodiment
In order to make the object of utility model, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
As shown in Figure 1, the utility model provides a kind of two soldering tip crystal solidifying apparatus embodiment.
This pair of soldering tip crystal solidifying apparatus comprises: the frame being provided with wafer disks, this frame is provided with the first soldering tip, this first soldering tip is connected with the first swing arm drive motor by the first swing arm, and described frame is also provided with the second soldering tip, and this second soldering tip is connected with the second swing arm drive motor by the second swing arm.
Specifically, described first swing arm and the second swing arm swing arranged in parallel.Angle between the fulcrum of described first swing arm fulcrum and the second swing arm and brilliant disk center's point is 95 degree.
During work, under the first swing arm drive motor and the second swing arm drive motor drive, when moving to bonding position after making the first swing arm start to turn to brilliant dish position pickup wafer, second swing arm is rotated and is started to move to crystalline substance dish direction from bonding position, when making the first swing arm move to bonding position, second swing arm just moves to brilliant dish top and starts to pick up wafer, repeats to pick up bonding action.Because cycle when avoiding adopting single soldering tip, wafer being picked up rear location is longer, the efficiency that raising wafer is picked up and shift motion time, and then improve the efficiency of die bond.
Above embodiment only in order to the technical solution of the utility model to be described, is not intended to limit; Although be described in detail the utility model with reference to previous embodiment, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or equivalent replacement is carried out to wherein portion of techniques feature, and these amendments or replacement, do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the utility model.
Claims (3)
1. pair soldering tip crystal solidifying apparatus, comprises the frame being provided with wafer disks, and this frame is provided with the first soldering tip, and this first soldering tip is connected with the first swing arm drive motor by the first swing arm, it is characterized in that:
Described frame is also provided with the second soldering tip, and this second soldering tip is connected with the second swing arm drive motor by the second swing arm.
2. according to claim 1 pair of soldering tip crystal solidifying apparatus, is characterized in that:
Described first swing arm and the second swing arm swing arranged in parallel.
3. according to claim 1 and 2 pair of soldering tip crystal solidifying apparatus, is characterized in that:
Angle between the fulcrum of described first swing arm fulcrum and the second swing arm and brilliant disk center's point is 95 degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420428448.9U CN204289402U (en) | 2014-07-31 | 2014-07-31 | Two soldering tip crystal solidifying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420428448.9U CN204289402U (en) | 2014-07-31 | 2014-07-31 | Two soldering tip crystal solidifying apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204289402U true CN204289402U (en) | 2015-04-22 |
Family
ID=52872536
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420428448.9U Expired - Fee Related CN204289402U (en) | 2014-07-31 | 2014-07-31 | Two soldering tip crystal solidifying apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204289402U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107061664A (en) * | 2016-12-19 | 2017-08-18 | 安徽天裕汽车零部件制造有限公司 | The device that a kind of single motor driving double-pendulum arms are rotated |
| CN108511364A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
-
2014
- 2014-07-31 CN CN201420428448.9U patent/CN204289402U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107061664A (en) * | 2016-12-19 | 2017-08-18 | 安徽天裕汽车零部件制造有限公司 | The device that a kind of single motor driving double-pendulum arms are rotated |
| CN108511364A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
| CN108511364B (en) * | 2017-02-28 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| US11081380B2 (en) | 2017-02-28 | 2021-08-03 | Shanghai Micro Electronics Equipment (Group) Co., Ltd | Chip bonding device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150422 Termination date: 20170731 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |