CN203536399U - COG (chip on glass) pick-up apparatus based on chip bonding process - Google Patents
COG (chip on glass) pick-up apparatus based on chip bonding process Download PDFInfo
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- CN203536399U CN203536399U CN201320644612.5U CN201320644612U CN203536399U CN 203536399 U CN203536399 U CN 203536399U CN 201320644612 U CN201320644612 U CN 201320644612U CN 203536399 U CN203536399 U CN 203536399U
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- suction nozzle
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Abstract
The utility model is suitable for the technical field of packaging for a COG (chip on glass) process, and discloses a COG pick-up apparatus based on the chip bonding process. The COG pick-up apparatus comprises two parallel suction nozzle supports and fixing rods fixed with the suction nozzle supports, wherein either end of each suction nozzle support is provided with at least one movable vacuum suction nozzle which is connected with a vacuum mechanism. During operation, the position of each vacuum suction nozzle can be adaptively adjusted for glass with different specifications so as to match the size of the glass. Compared with the prior art, the COG pick-up apparatus can prevent the added workload and extra debugging time of replacing pick-up apparatuses when glass with different specifications are to be picked up and shorten the debugging time of fitting the glass with different specifications, thereby improving production efficiency.
Description
Technical field
The present invention relates to chip laminating glass (Chip On Glass; COG) processing procedure is used encapsulation technology field, refers to especially a kind ofly for glass that chip is fitted, to pick up the mobile device of picking up.
Background technology
In traditional COG processing procedure process, the glass of chip need to being fitted moves to chip bonding position, facilitates subsequent handling operational processes.It is by vacuum slot, glass to be inhaled and picked up that existing chip laminating glass moves, then moves, and during for the glass of different specifications, conventionally needs to change the attracting device adapting with glass size size, increases the workloads such as debugging, affects operating efficiency.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind ofly picks up device based on chip bonding processing procedure chip laminating glass, this chip laminating glass is picked up device and can be avoided inhaling while picking up the glass of different size size, the workload of device increase and the time of debugging are picked up in replacing, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
In order to solve the problems of the technologies described above, the invention provides and a kind ofly based on chip bonding processing procedure chip laminating glass, pick up device, this chip laminating glass is picked up device and is comprised: two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, and this vacuum slot is connected with vacuum mechanism.
Say further, the both sides that described suction nozzle support is positioned at fixed lever are respectively equipped with holddown groove, and the cross section of this holddown groove is down convex shape.
Say further, described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.
Say further, described holddown groove is provided with position scale and indicates.
Say further, described vacuum slot comprises the body that is provided with bulge loop, on this body, be arranged with grip block, between this grip block and body, be provided with the elastomeric element that grip block is moved to body lower end, on described grip block, be provided with rotating depression bar, at the middle part of this depression bar, be provided with the straight-bar contacting with bulge loop.
Say further, at least one shoulder of described holddown groove, be provided with latch, the card article arranging on the lower surface of this latch and grip block coordinates.
Chip of the present invention laminating glass is picked up device, comprise two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, this vacuum slot is connected with vacuum mechanism.During work, for the glass of different specifications, by adaptation, regulate the position of each vacuum slot, make it to match with glass size.Compared with prior art, can avoid inhaling while picking up the glass of different size size, change the workload of device increase and the time of debugging picked up, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, and accompanying drawing in describing is some embodiments of the present invention, to those skilled in the art, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is that chip laminating glass of the present invention is picked up device example structure schematic diagram.
Fig. 2 is along A-A direction cross-sectional schematic in Fig. 1.
Fig. 3 is along vacuum slot center line cross-sectional schematic.
Below in conjunction with embodiment, and with reference to accompanying drawing, the realization of the object of the invention, functional characteristics and advantage are described further.
Embodiment
In order to make object, technical scheme and the advantage of invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of invention, rather than whole embodiment.Embodiment based in the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope of protection of the invention.
As shown in Figure 1, Figure 2 and Figure 3, the invention provides and a kind ofly based on chip bonding processing procedure chip laminating glass, pick up device embodiment.
This chip laminating glass is picked up device and is comprised: two suction nozzle supports 2 that be arranged in parallel and fix 2 fixed lever 1 with this suction nozzle support, the two ends of each suction nozzle support 2 are respectively equipped with movably at least one vacuum slot 3, and this vacuum slot 3 is connected with vacuum mechanism.
Specifically, the both sides that described suction nozzle support 2 is positioned at fixed lever 1 are respectively equipped with holddown groove 21, and the cross section of this holddown groove 21 is down convex shape.Described vacuum slot 3 comprises the body 30 that is provided with bulge loop 35, on this body 30, be arranged with grip block 31, between this grip block 31 and body 30, be provided with the elastomeric element 34 that grip block is moved to body lower end, as Compress Spring etc., on described grip block 31, be provided with rotating depression bar 32, at the middle part of this depression bar 32, be provided with the straight-bar contacting with bulge loop 35.By this contracting spring, coordinate with the limiting section 33 on grip block 31 and body 30, make grip block 31 be clamped to the relative fixed position of holddown groove 21, by suitable adjusting, can make spring 34 have sufficient spring energy that horizontal direction vacuum slot can not moved, the variation that can disregard occurs while picking up glass simultaneously in the vertical direction.At described holddown groove 21 at least one shoulder, be provided with latch 310, this latch 310 coordinates with the card article that the lower surface of grip block 31 arranges, and vacuum slot 3 is coordinated tightr with suction nozzle support 2, can not produce and be moved in the horizontal direction.Described holddown groove 21 is provided with position scale and indicates, and can facilitate user to make the position of each vacuum slot corresponding.In the time of need to moving, by depression bar, press downwards, grip block moved up, make and holddown groove between matching loose, to acting as to vacuum slot horizontal direction.And then can realize movement.
During work, for the glass of different specifications, by adaptation, regulate the position of each vacuum slot, make it to match with glass size.Compared with prior art, can avoid inhaling while picking up the glass of different size size, change the workload of device increase and the time of debugging picked up, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
As required, described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.During work, by position transducer, detect in real time the specification of glass, by control module, control driving mechanism and make the do adaptation of vacuum slot position move earthquake, realize automatically and regulating.
Above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, and these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (6)
1. based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Comprise two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, this vacuum slot is connected with vacuum mechanism.
2. according to claim 1ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
The both sides that described suction nozzle support is positioned at fixed lever are respectively equipped with holddown groove, and the cross section of this holddown groove is down convex shape.
3. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.
4. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described holddown groove is provided with position scale and indicates.
5. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described vacuum slot comprises the body that is bulge loop, on this body, be arranged with grip block, between this grip block and body, be provided with the elastomeric element that grip block is moved to body lower end, on described grip block, be provided with rotating depression bar, at the middle part of this depression bar, be provided with the straight-bar contacting with bulge loop.
6. according to claim 5ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
At at least one shoulder of described holddown groove, be provided with latch, the card article arranging on the lower surface of this latch and grip block coordinates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320644612.5U CN203536399U (en) | 2013-10-19 | 2013-10-19 | COG (chip on glass) pick-up apparatus based on chip bonding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320644612.5U CN203536399U (en) | 2013-10-19 | 2013-10-19 | COG (chip on glass) pick-up apparatus based on chip bonding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203536399U true CN203536399U (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320644612.5U Withdrawn - After Issue CN203536399U (en) | 2013-10-19 | 2013-10-19 | COG (chip on glass) pick-up apparatus based on chip bonding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203536399U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531517A (en) * | 2013-10-19 | 2014-01-22 | 深圳市鑫三力自动化设备有限公司 | Pickup device for chip on glass based on chip bonding manufacture procedure |
| CN110171711A (en) * | 2019-05-15 | 2019-08-27 | 安徽胜利精密制造科技有限公司 | A kind of spider sucker and its replacement tooling |
-
2013
- 2013-10-19 CN CN201320644612.5U patent/CN203536399U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103531517A (en) * | 2013-10-19 | 2014-01-22 | 深圳市鑫三力自动化设备有限公司 | Pickup device for chip on glass based on chip bonding manufacture procedure |
| CN103531517B (en) * | 2013-10-19 | 2017-04-05 | 深圳市鑫三力自动化设备有限公司 | Based on chip bonding processing procedure chip laminating glass picks up device |
| CN110171711A (en) * | 2019-05-15 | 2019-08-27 | 安徽胜利精密制造科技有限公司 | A kind of spider sucker and its replacement tooling |
| CN110171711B (en) * | 2019-05-15 | 2024-03-26 | 安徽胜利精密制造科技有限公司 | Spider hand sucking disc and change frock thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140409 Effective date of abandoning: 20170405 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20140409 Effective date of abandoning: 20170405 |