CN108598035A - A kind of chip positioning disengaging seat - Google Patents
A kind of chip positioning disengaging seat Download PDFInfo
- Publication number
- CN108598035A CN108598035A CN201810611103.XA CN201810611103A CN108598035A CN 108598035 A CN108598035 A CN 108598035A CN 201810611103 A CN201810611103 A CN 201810611103A CN 108598035 A CN108598035 A CN 108598035A
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- Prior art keywords
- chip
- locating piece
- positioning
- locating
- cylinder
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
Abstract
The invention discloses a kind of chip positionings to be detached from seat, including fixed plate, support element, the first positioning component, the second positioning component and the positioning drive mechanisms for being supported to chip that are arranged in fixed plate；Wherein, first positioning component includes two the first locating pieces being oppositely arranged, and the first positioning surface is equipped on two the first locating pieces；Second positioning component includes two the second locating pieces being oppositely arranged, it is equipped with the second positioning surface and the confined planes for being limited in the vertical direction to chip on two the second locating pieces, when first locating piece and the second locating piece position chip, the confined planes are located at the top of chip.The chip positioning, which is detached from seat, to carry out precise positioning to the chip on vacuum slot, and will overcome the adsorption capacity of vacuum slot, and the chip after positioning is taken off from vacuum slot, to which for chip, further detection and burning are prepared.
Description
Technical field
The present invention relates to a kind of chip positioning devices, and in particular to a kind of chip positioning disengaging seat.
Background technology
Core component of the chip as electronic product, is widely used in the electrical domains such as Internet of Things, smart card.Wherein,
The production and processing of chip is mostly in that pipeline system carries out, and detection station, burning station, Laser Jet etc. is distributed on the assembly line
Multiple processing stations, and chip handling device is all accordingly equipped between two adjacent processing stations, when work, by the chip
Handling device is responsible for transfer task of the chip between two adjacent processing stations.
The mode of existing chip handling device generally use vacuum slot negative-pressure adsorption carries out, but due to vacuum slot
When adsorbing chip, position of the chip on vacuum slot is difficult to control, therefore when chip is drawn by vacuum slot may go out
Existing deviation, for this purpose, after vacuum slot is by chip pick-up, it is also necessary to carry out ajusting positioning to chip using positioning device, work as core
It after location tasks are ajusted in piece completion, then is carried at next station, can realize accurately be carried to chip in this way
At next station.
Further, since the vacuum slot in multiple chip handling devices is all connected to a feeder connection, therefore its
Negative pressure and mistake negative pressure state are uniformly controlled by a feeder, but in actual operation, since each suction nozzle is when putting card
Machine is different, it is therefore desirable to solenoid valve be separately provided be in controlling positive suction mouth and lose negative pressure state, can make chip with it is true
Suction mouth disengages to complete the placement task of chip, and after multiple solenoid valves are set, it on the one hand can increase whole device
On the other hand manufacturing cost can cause the structure of whole device more complex again, failure rate increases.
Invention content
It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of chip positionings to be detached from seat, the chip positioning
Precise positioning can be carried out to the chip on vacuum slot by being detached from seat, and will overcome the adsorption capacity of vacuum slot, will be positioned
Chip afterwards is rapidly taken off from vacuum slot, to which for chip, further detection and burn job are prepared.
The present invention solve above-mentioned technical problem technical solution be：
A kind of chip positioning is detached from seat, including fixed plate, the branch for being supported to chip that is arranged in fixed plate
Support member, the first positioning component positioned for one group of side to chip are determined for another group of side to chip
Locating driver machine of the position with the second positioning component of limit and for driving the first positioning component and the second positioning component to move
Structure；
Wherein, the upper surface of the support element constitutes supporting surface, and first positioning component includes two and is oppositely arranged
First locating piece is equipped with the first positioning surface for being positioned to chip on two the first locating pieces；Second positioning
Component includes two the second locating pieces being oppositely arranged, and for being positioned to chip is equipped on two the second locating pieces
Two positioning surfaces and confined planes for being limited in the vertical direction to chip, the confined planes are located at the upper of the supporting surface
Side, the confined planes, supporting surface, the first positioning surface and the second positioning surface surround the located space of chip jointly；The positioning
Driving mechanism includes for driving two the first locating pieces while making the first locating piece driving machine close to each other or far from movement
Structure and for drive two the second locating pieces simultaneously make it is close to each other or far from movement the second locating piece driving mechanism.
Preferably, the top of the first positioning surface of first locating piece also is provided with described be used for chip in vertical direction
On the confined planes that are limited, the confined planes on confined planes and the second locating piece on the first locating piece are in same level
On.When work, cooperate between the confined planes on confined planes and the second positioning surface on the first positioning surface, jointly to transporting upwards
Dynamic chip applies downward pressing force, can be more preferable since the pressing force uniformly acts on the four edges of chip
The upward adsorption capacity of vacuum slot is resisted on ground, so that chip can be stablized and rapidly stop position when being detached with vacuum slot.
Preferably, first locating piece and the second locating piece are made of the first locating piece and the second locating piece respectively,
In, be respectively equipped on first locating piece and the second locating piece including for chip positioning positioning region and be used for and positioning
The interconnecting piece of driving mechanism connection.
Preferably, first locating piece and the second locating piece are gradually inside contracted from interconnecting piece to positioning region.It is arranged in this way
Purpose is, since the size of chip is smaller, the first locating piece and the second locating piece are making positioning campaign close to each other
In, limit can be interfered between adjacent the first locating piece and the second locating piece, leads to the first locating piece and the second locating piece
Positioning campaign can not continue, and by it is above-mentioned inside contract setting after, the positioning end of the first locating piece and the second locating piece
Size greatly reduces, therefore will not be interfered in the close positioning campaign for making chip, to ensure that positioning work
Be smoothed out.
Preferably, the end face of the positioning region on first locating piece constitutes first positioning surface, second positioning
The end face of positioning region on block constitutes second positioning surface, and the top of second positioning surface is equipped with outwardly projecting limit convex
The bottom surface of body, the limit convex body constitutes the confined planes.
Preferably, the first locating piece driving mechanism and the second locating piece driving mechanism are made of four paws cylinder, this four
The one pair of which cylinder pawl of pawl cylinder is connect by screw with the interconnecting piece of two the first locating pieces respectively, another pair cylinder pawl point
It is not connect with the interconnecting piece of two the second locating pieces by screw.When work, cylinder drives four cylinder pawls mutually to lean on simultaneously
The first locating piece and the second locating piece is driven to carry out mounting board movement or pine card movement close or remote from movement, to realize to core
The positioning of piece.
Preferably, the fixed plate be equipped with avoidance slot, the four paws cylinder be mounted on fixed plate lower section, described first
The positioning region of locating piece and the second locating piece is arranged after passing through the avoidance slot positioned at the top of the fixed plate, the support element
It is located at the center position of fixed plate in the top of fixed plate, the upper surface of support element constitutes the branch for being supported to chip
Support face.By above-mentioned setting, it can realize that the installation of each component is fixed.
Preferably, two groups of four paws cylinders are equipped in the fixed plate side by side, are divided on four cylinder pawls of every group of four paws cylinder
Not She You first locating piece and the second locating piece, the center position of every group of four paws cylinder is correspondingly provided with support element.Work
When, the chip positioning disengaging seat being made of two groups of four paws cylinders and the first locating piece, the second locating piece and support element can be complete
Positioning at two groups of chip and separation task, so as to improve working efficiency.
Preferably, the support element is made of cylinder, wherein the top surface of cylinder constitutes the supporting surface, the support
The width in face is slightly more than the width of chip, and the side of cylinder is constituted for being carried out on the first locating piece and the second locating piece
The support element confined planes of limit；When two the first locating pieces and two the second locating pieces are made close to each other to move to locating endpoints
When position, the first safety clearance has been retained between the first locating piece and support element and between the second locating piece and support element, and
The second safety clearance has been retained between vacuum slot and limit convex body.By the way that first safety clearance is arranged, the can be prevented
Positioning piece and the second locating piece collide between support element when making positioning campaign close to each other and to locating piece and
Support element damages, and by the way that the width of supporting surface is more than the width of chip after, even if first fixed in case of mistakes
Position part or the second locating piece are collided with support element, since the width of chip is less than the width of supporting surface, that is, are less than two
The distance between a first locating piece and two the second locating pieces, therefore chip will not be pressed from both sides by the first locating piece and the second locating piece
Wound.And due to having retained the second safety clearance between vacuum slot and limit convex body, limit convex body is with the first locating piece
It will not collide with vacuum slot when moving to locating endpoints position with the second locating piece, so as to ensure vacuum slot
Up and down motion can be normally carried out.It should be noted that first gap is small-sized, therefore chip is not interfered with
Positioning accuracy.
The present invention operation principle be：
It is in the open state between the first locating piece and the second locating piece on chip positioning disengaging seat when work, in phase
Under the driving for answering driving mechanism, vacuum slot drives chip to move to downwardly together in the located space above supporting surface, then
First locating piece driving mechanism drives two the first locating pieces to make movement close to each other, by chip positioning in two the first locating pieces
Centre, so as to complete the location tasks of chip in one direction.
At the same time, the second locating piece driving mechanism drives two the second locating pieces to make movement close to each other, and chip is determined
Position is among two the second locating pieces, and after completing positioning, chip is in the center of entire located space in the horizontal direction
Place, that is, realize the location tasks of entire chip.
Later, vacuum slot drives chip to withdraw movement upwards, and during movement, chip is contacted with confined planes,
Confined planes have chip a downward pressing force, the adsorption capacity that chip can overcome vacuum slot upward under the pressing force, and true
Suction mouth detaches, can be realized as removing chip from vacuum slot without solenoid valve of the task.
The present invention has advantageous effect below compared with prior art：
1, chip positioning of the invention is detached from seat and has to chip positioning simultaneously and chip is detached two sides with vacuum slot
The effect in face, wherein for for the effect of chip positioning, by the mutual cooperation of the first locating piece and the second locating piece,
Location tasks of the chip in length and width both direction can be completed, that is, realize the full positioning of chip in the plane, because
This has the advantages that good positioning effect；For the effect for detaching chip with vacuum slot, it is only necessary to increase on positioning surface
Plane of limiting can be realized as the taking off chip from vacuum slot of the task, thus it is simple in structure, feasibility is strong, convenient for pushing away
It is wide to use.
2, chip positioning of the invention disengaging seat need not be arranged solenoid valve and can be realized as chip from vacuum slot
Removing for task, therefore the use cost of solenoid valve can either be reduced, but it is simple in structure excellent to enable to whole device to have
Point.
Description of the drawings
Fig. 1 is the stereoscopic mechanism schematic diagram that a kind of chip positioning of the present invention is detached from a specific implementation mode of seat.
Fig. 2 is the explosive view of Fig. 1.
Fig. 3 is the sectional view of the first positioning component in Fig. 1.
Fig. 4 is the structural schematic diagram of the second positioning component in Fig. 3.
Fig. 5 is the sectional view of the second positioning component in Fig. 1.
Fig. 6 is when fixed plate is equipped with two groups of four paws cylinders and the first positioning component, the second positioning component, support element
Dimensional structure diagram.
Fig. 7 is the explosive view of Fig. 6.
Specific implementation mode
Present invention will now be described in further detail with reference to the embodiments and the accompanying drawings, but embodiments of the present invention are unlimited
In this.
Embodiment 1
Referring to Fig. 1-Fig. 7, a kind of chip positioning of the invention is detached from seat and includes fixed plate 10, is arranged in fixed plate 10
Support element 2 for being supported to chip 1, is used for the first positioning component positioned for one group of side to chip 1
Another group of side of chip 1 is positioned and limited the second positioning component and for driving the first positioning component and second
The positioning drive mechanisms of positioning component movement；
Referring to Fig. 1-Fig. 5, first positioning component includes two the first locating pieces 3 being oppositely arranged, and two first fixed
It is equipped on the part 3 of position for contacting the first positioning surface 5 positioned to chip 1 with chip 1；Second positioning component includes
Two the second locating pieces 4 being oppositely arranged are equipped on two the second locating pieces 4 and determine chip 1 for being contacted with chip 1
Second positioning surface 6 of position and the confined planes 7 for being limited in the vertical direction to chip 1, when 3 He of the first locating piece
When second locating piece 4 positions chip 1, the confined planes 7 are located at the top of chip 1.
Specifically, first locating piece, 3 and second locating piece 4 is made of the first locating piece and the second locating piece respectively,
Wherein, first locating piece is equipped with positioning region 3-1 for being positioned to chip 1 and for being connect with positioning drive mechanisms
Interconnecting piece 3-2, first locating piece are gradually inside contracted from interconnecting piece 3-2 to positioning region 3-1；Second locating piece be equipped with for pair
The positioning region 4-1 that chip 1 the positions and interconnecting piece 4-2 for being connect with positioning drive mechanisms；Second locating piece connects certainly
Portion 4-2 is gradually inside contracted to positioning region 4-1.The purpose being arranged in this way is, since the size of chip 1 is smaller, the first positioning
Part 3 and the second locating piece 4 are in making positioning campaign close to each other, meeting between adjacent the first locating piece and the second locating piece
Limit is interfered, causes the positioning campaign of the first locating piece and the second locating piece that can not continue, and is inside contracted by above-mentioned
After setting, the size of the positioning end of the first locating piece and the second locating piece greatly reduces, therefore in the close positioning for making chip 1
It will not be interfered in movement, to ensure that being smoothed out for positioning work.
Referring to Fig. 3 and Fig. 4, the end face of the positioning region on first locating piece constitutes first positioning surface 5, and described the
The end face of positioning region on two locating pieces constitutes second positioning surface 6, and the top of second positioning surface 6 is equipped with outwardly projecting
Convex body 8 is limited, the bottom surface of the limit convex body 8 constitutes the confined planes 7.
Referring to Fig. 1 and Fig. 2, the first locating piece driving mechanism and the second locating piece driving mechanism are by 11 structure of four paws cylinder
At the one pair of which cylinder pawl 9 of the four paws cylinder 11 is connect by screw with the interconnecting piece of two the first locating pieces respectively, another
Cylinder pawl 9 is connect by screw with the interconnecting piece of two the second locating pieces respectively.When work, cylinder drives four cylinders simultaneously
Pawl 9 is made close to each other or separate movement and is moved to drive the first locating piece and the progress mounting board movement of the second locating piece or pine to block,
To realize the positioning to chip.
Referring to Fig. 6 and Fig. 7, the fixed plate 10 is equipped with avoidance slot, and the four paws cylinder 11 is mounted on fixed plate 10
The positioning region of lower section, first locating piece, 3 and second locating piece 4 is located at the upper of the fixed plate 10 after the avoidance slot
Side, the support element 2 is arranged is located at the center position of fixed plate 10, the upper surface structure of support element 2 in the top of fixed plate 10
At the supporting surface for being supported to chip 1.By above-mentioned setting, it can realize that the installation of each component is fixed.
Referring to Fig. 6 and Fig. 7, as the preferred embodiment of this programme, two groups of four paws cylinders are equipped in the fixed plate 10 side by side
11, first locating piece, 3 and second locating piece 4, every group of four paws are respectively equipped on four cylinder pawls 9 of every group of four paws cylinder 11
The center position of cylinder 11 is correspondingly provided with support element 2.When work, determined by two groups of four paws cylinders 11 and the first locating piece 3, second
The chip positioning that position part 4 and support element 2 are constituted, which is detached from seat, can complete positioning and the separation task of two groups of chip 1, so as to
Enough improve working efficiency.
Referring to Fig. 3-Fig. 5, the support element 2 is made of cylinder, wherein and the top surface of cylinder constitutes the supporting surface,
The width of the supporting surface is more than the width of chip 1, and the side of cylinder is constituted for the first locating piece and the second locating piece
2 confined planes of support element limited；Make close to each other move to when two the first locating pieces and two the second locating pieces to determine
When the final position of position, the first safety has been retained between the first locating piece and support element 2 and between the second locating piece and support element 2
Gap 13, and retained the second safety clearance 14 between vacuum slot and limit convex body.By the way that first safety clearance is arranged
13, it can prevent the first locating piece 3 and the second locating piece 4 from occurring between support element 2 when making positioning campaign close to each other
Collision and locating piece and support element 2 are damaged, and by by the width of supporting surface be more than chip 1 width after, even if
The first locating piece 3 or the second locating piece 4 are collided with support element 2 in the case of error, since the width of chip 1 is less than branch
The width in support face, that is, the distance between less than two the first locating pieces 3 and two second locating pieces 4, therefore chip 1 will not be by
First locating piece 3 and the second locating piece 4 crush.And due to having retained the second safety clearance between vacuum slot and limit convex body
14, therefore limit convex body and will not be inhaled with vacuum when moving to locating endpoints position with the first locating piece 3 and the second locating piece 4
Mouth collides, so as to ensure that the up and down motion of vacuum slot can be normally carried out.It should be noted that between described first
Gap it is small-sized, therefore do not interfere with the positioning accuracy of chip 1.
Referring to Fig. 4, the support element 2 is made of cylinder, and the side of the cylinder is constituted for the first locating piece
The support element confined planes that positioning region on positioning region and the second locating piece is limited, when first locating piece positioning region and
When positioning region on two locating pieces is contacted with the support element confined planes, chip is located in the supporting surface.What is be arranged in this way is good
It is in by being limited to the first limited block and the second limited block, two the first positioning surfaces and two second can be prevented
Positioning surface distance in making movement close to each other is relatively close and causes Clamping damage to chip.
Referring to Fig. 1~Fig. 7, operation principle of the invention is：
It is in the open state between the first locating piece 3 and the second locating piece 4 on the positioning disengaging seat of chip 1 when work,
Under the driving of respective drive mechanism, vacuum slot 12 drives chip 1 to move to downwardly together in the located space above supporting surface,
Then 3 driving mechanism of the first locating piece drives two the first locating pieces 3 to make movement close to each other, and chip 1 is located in two the
Among positioning piece 3, so as to complete the location tasks of chip 1 in one direction.
At the same time, the second locating piece driving mechanism drives two the second locating pieces 4 to make movement close to each other, by chip 1
It is located among two the second locating pieces 4, after completing positioning, chip 1 is in the center of entire located space in the horizontal direction
At position, that is, realize the location tasks of entire chip 1.
Later, vacuum slot 12 drives chip 1 to move upwards, and during movement, chip 1 is contacted with confined planes 7, limit
Plane 7 has chip 1 a downward pressing force, the adsorption capacity that chip 1 can overcome vacuum slot 12 upward under the pressing force, with
Vacuum slot 12 detaches, can be realized as removing chip 1 from vacuum slot 12 without solenoid valve of the task.
Embodiment 2
The present embodiment difference from example 1 is that, the top of the first positioning surface 5 of first locating piece 3
Equipped with the confined planes 7 for being limited in the vertical direction to chip 1, the confined planes 7 and on the first locating piece 3
Confined planes 7 on two locating pieces 4 are in same level.When work, the confined planes 7 and second on the first positioning surface 5 position
It cooperates between confined planes 7 on face 6, downward pressing force is applied to the chip 1 moved upwards jointly, due to the pressing force
On the four edges for uniformly acting on chip 1, thus can better against the upward adsorption capacity of vacuum slot 12 so that
The deformation quantity smaller of chip 1 when being detached with vacuum slot 12.
The present embodiment other embodiment other than the above is implemented referring to embodiment 1.
Above-mentioned is the preferable embodiment of the present invention, but embodiments of the present invention are not limited by the foregoing content,
He it is any without departing from the spirit and principles of the present invention made by changes, modifications, substitutions, combinations, simplifications, should be
The substitute mode of effect, is included within the scope of the present invention.
Claims (9)
1. a kind of chip positioning is detached from seat, which is characterized in that including fixed plate, be arranged in fixed plate for being carried out to chip
The support element of support, the first positioning component positioned for one group of side to chip, for another group of side to chip
The second positioning component that face is positioned and limited and for driving what the first positioning component and the second positioning component moved to determine
Position driving mechanism；
Wherein, first positioning component includes two the first locating pieces being oppositely arranged, and is equipped on two the first locating pieces
For contacting the first positioning surface positioned to chip with chip；Second positioning component include two be oppositely arranged
Two locating pieces are equipped on two the second locating pieces for contacting the second positioning surface positioned to chip with chip and being used for
To the confined planes that chip is limited in the vertical direction, when first locating piece and the second locating piece position chip
When, the confined planes are located at the top of chip；The positioning drive mechanisms include for driving two the first locating pieces to make simultaneously
First locating piece driving mechanism close to each other or far from movement and close to each other for driving two the second locating pieces to make simultaneously
Or the second locating piece driving mechanism far from movement.
2. chip positioning according to claim 1 is detached from seat, which is characterized in that first locating piece and the second locating piece
It is made of respectively the first locating piece and the second locating piece, wherein be respectively equipped with packet on first locating piece and the second locating piece
It includes for the positioning region to chip positioning and the interconnecting piece for being connect with positioning drive mechanisms.
3. chip positioning according to claim 2 is detached from seat, which is characterized in that first locating piece and the second locating piece
It is gradually inside contracted from interconnecting piece to positioning region.
4. chip positioning according to claim 3 is detached from seat, which is characterized in that positioning region on first locating piece
End face constitutes first positioning surface, and the end face of the positioning region on second locating piece constitutes second positioning surface, this
The top of two positioning surfaces is equipped with outwardly projecting limit convex body, and the bottom surface of the limit convex body constitutes the confined planes.
5. being detached from seat according to claim 1-4 any one of them chip positionings, which is characterized in that the first locating piece driving
Mechanism and the second locating piece driving mechanism are made of four paws cylinder, and the one pair of which cylinder pawl of the four paws cylinder passes through screw respectively
It is connect with the interconnecting piece of two the first locating pieces, another pair cylinder pawl passes through the interconnecting piece of screw and two the second locating pieces respectively
Connection.
6. chip positioning according to claim 5 is detached from seat, which is characterized in that the fixed plate is equipped with avoidance slot, institute
The lower section that four paws cylinder is mounted on fixed plate is stated, the positioning region of first locating piece and the second locating piece passes through the avoidance slot
It is located at the top of the fixed plate afterwards, the support element is arranged is located at the center position of four paws cylinder in the top of fixed plate,
The upper surface of support element constitutes the supporting surface for being supported to chip.
7. chip positioning according to claim 6 is detached from seat, which is characterized in that be equipped with two group four in the fixed plate side by side
Pawl cylinder is respectively equipped with first locating piece and the second locating piece, every group of four paws on four cylinder pawls of every group of four paws cylinder
The center position of cylinder is correspondingly provided with support element.
8. being detached from seat according to claim 1-4 any one of them chip positionings, which is characterized in that the of first locating piece
The top of one positioning surface also is provided with the confined planes for being limited in the vertical direction to chip, on the first locating piece
Confined planes on confined planes and the second locating piece are in same level.
9. chip positioning according to claim 4 is detached from seat, which is characterized in that the support element is made of cylinder,
In, the top surface of cylinder constitutes the supporting surface, and the width of the supporting surface is more than the width of chip, and the side of cylinder, which is constituted, to be used
The support element confined planes limited on to the first locating piece and the second locating piece；When two the first locating pieces and two second
Locating piece make it is close to each other when moving to locating endpoints position, between the first locating piece and support element and the second locating piece with
The first safety clearance has been retained between support element, and has retained the second safety clearance between vacuum slot and limit convex body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611103.XA CN108598035A (en) | 2018-06-14 | 2018-06-14 | A kind of chip positioning disengaging seat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611103.XA CN108598035A (en) | 2018-06-14 | 2018-06-14 | A kind of chip positioning disengaging seat |
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| Publication Number | Publication Date |
|---|---|
| CN108598035A true CN108598035A (en) | 2018-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810611103.XA Pending CN108598035A (en) | 2018-06-14 | 2018-06-14 | A kind of chip positioning disengaging seat |
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|---|---|---|---|---|
| CN202655929U (en) * | 2012-05-28 | 2013-01-09 | 周卫星 | Positioning fixture for comprehensive metal machining for differential gear blank of differential mechanism |
| CN203679744U (en) * | 2013-09-06 | 2014-07-02 | 武汉华工正源光子技术有限公司 | Bending and shearing clamp at foot part of light communication device |
| CN206588966U (en) * | 2016-11-09 | 2017-10-27 | 东莞华懋精密机械科技有限公司 | A kind of machinery positioning clamping jaw |
| CN206358900U (en) * | 2016-12-09 | 2017-07-28 | 北京元六鸿远电子科技股份有限公司 | A kind of positioning seat positioned for chip electronic component |
| CN107983978A (en) * | 2017-11-28 | 2018-05-04 | 湖南汉星机械制造有限公司 | A kind of numerically controlled lathe air-actuated jaw |
| CN208706608U (en) * | 2018-06-14 | 2019-04-05 | 广州明森科技股份有限公司 | A kind of chip positioning disengaging seat |
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