CN103531517A - Pickup device for chip on glass based on chip bonding manufacture procedure - Google Patents
Pickup device for chip on glass based on chip bonding manufacture procedure Download PDFInfo
- Publication number
- CN103531517A CN103531517A CN201310490437.3A CN201310490437A CN103531517A CN 103531517 A CN103531517 A CN 103531517A CN 201310490437 A CN201310490437 A CN 201310490437A CN 103531517 A CN103531517 A CN 103531517A
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- Prior art keywords
- chip
- glass
- suction nozzle
- pick
- processing procedure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
Abstract
The invention is applicable to the technical field of package applicable to a chip on glass manufacture procedure. The invention provides a pickup device for a chip on glass based on a chip bonding manufacture procedure. The pickup device comprises two suction nozzle brackets arranged in parallel and fixed rods fixedly connected with the suction nozzle brackets, wherein at least one movable vacuum suction nozzle is arranged at each one of the two ends of each suction nozzle bracket; and the vacuum suction nozzles are connected with a vacuum mechanism. In the working process, with regard to glass with different specifications, the position of each vacuum suction nozzle can be adaptively adjusted to be matched with the size of the glass. Compared with the prior art, the increased workload and debugging time in the process of replacing the pickup device when the glass with the different specifications is sucked can be avoided; and the time for debugging the pick-up device to be adapted to the glass with the different specifications is reduced so as to improve the production efficiency.
Description
Technical field
The present invention relates to chip laminating glass (Chip On Glass; COG) processing procedure is used encapsulation technology field, refers to especially a kind ofly for glass that chip is fitted, to pick up the mobile device of picking up.
Background technology
In traditional COG processing procedure process, the glass of chip need to being fitted moves to chip bonding position, facilitates subsequent handling operational processes.It is by vacuum slot, glass to be inhaled and picked up that existing chip laminating glass moves, then moves, and during for the glass of different specifications, conventionally needs to change the attracting device adapting with glass size size, increases the workloads such as debugging, affects operating efficiency.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind ofly picks up device based on chip bonding processing procedure chip laminating glass, this chip laminating glass is picked up device and can be avoided inhaling while picking up the glass of different size size, the workload of device increase and the time of debugging are picked up in replacing, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
In order to solve the problems of the technologies described above, the invention provides and a kind ofly based on chip bonding processing procedure chip laminating glass, pick up device, this chip laminating glass is picked up device and is comprised: two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, and this vacuum slot is connected with vacuum mechanism.
Say further, the both sides that described suction nozzle support is positioned at fixed lever are respectively equipped with holddown groove, and the cross section of this holddown groove is down convex shape.
Say further, described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.
Say further, described holddown groove is provided with position scale and indicates.
Say further, described vacuum slot comprises the body that is provided with bulge loop, on this body, be arranged with grip block, between this grip block and body, be provided with the elastomeric element that grip block is moved to body lower end, on described grip block, be provided with rotating depression bar, at the middle part of this depression bar, be provided with the straight-bar contacting with bulge loop.
Say further, at least one shoulder of described holddown groove, be provided with latch, the card article arranging on the lower surface of this latch and grip block coordinates.
Chip of the present invention laminating glass is picked up device, comprise two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, this vacuum slot is connected with vacuum mechanism.During work, for the glass of different specifications, by adaptation, regulate the position of each vacuum slot, make it to match with glass size.Compared with prior art, can avoid inhaling while picking up the glass of different size size, change the workload of device increase and the time of debugging picked up, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, and accompanying drawing in describing is some embodiments of the present invention, to those skilled in the art, do not paying under the prerequisite of creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is that chip laminating glass of the present invention is picked up device example structure schematic diagram.
Fig. 2 is along A-A direction cross-sectional schematic in Fig. 1.
Fig. 3 is along vacuum slot center line cross-sectional schematic.
Below in conjunction with embodiment, and with reference to accompanying drawing, the realization of the object of the invention, functional characteristics and advantage are described further.
Embodiment
In order to make object, technical scheme and the advantage of invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of invention, rather than whole embodiment.Embodiment based in the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belongs to the scope of protection of the invention.
As shown in Figure 1, Figure 2 and Figure 3, the invention provides and a kind ofly based on chip bonding processing procedure chip laminating glass, pick up device embodiment.
This chip laminating glass is picked up device and is comprised: two suction nozzle supports 2 that be arranged in parallel and fix 2 fixed lever 1 with this suction nozzle support, the two ends of each suction nozzle support 2 are respectively equipped with movably at least one vacuum slot 3, and this vacuum slot 3 is connected with vacuum mechanism.
Specifically, the both sides that described suction nozzle support 2 is positioned at fixed lever 1 are respectively equipped with holddown groove 21, and the cross section of this holddown groove 21 is down convex shape.Described vacuum slot 3 comprises the body 30 that is provided with bulge loop 35, on this body 30, be arranged with grip block 31, between this grip block 31 and body 30, be provided with the elastomeric element 34 that grip block is moved to body lower end, as Compress Spring etc., on described grip block 31, be provided with rotating depression bar 32, at the middle part of this depression bar 32, be provided with the straight-bar contacting with bulge loop 35.By this contracting spring, coordinate with the limiting section 33 on grip block 31 and body 30, make grip block 31 be clamped to the relative fixed position of holddown groove 21, by suitable adjusting, can make spring 34 have sufficient spring energy that horizontal direction vacuum slot can not moved, the variation that can disregard occurs while picking up glass simultaneously in the vertical direction.At described holddown groove 21 at least one shoulder, be provided with latch 310, this latch 310 coordinates with the card article that the lower surface of grip block 31 arranges, and vacuum slot 3 is coordinated tightr with suction nozzle support 2, can not produce and be moved in the horizontal direction.Described holddown groove 21 is provided with position scale and indicates, and can facilitate user to make the position of each vacuum slot corresponding.In the time of need to moving, by depression bar, press downwards, grip block moved up, make and holddown groove between matching loose, to acting as to vacuum slot horizontal direction.And then can realize movement.
During work, for the glass of different specifications, by adaptation, regulate the position of each vacuum slot, make it to match with glass size.Compared with prior art, can avoid inhaling while picking up the glass of different size size, change the workload of device increase and the time of debugging picked up, the time of debugging when device adapts to different glass size sizes is picked up in this raising, and then enhances productivity.
As required, described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.During work, by position transducer, detect in real time the specification of glass, by control module, control driving mechanism and make the do adaptation of vacuum slot position move earthquake, realize automatically and regulating.
Above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement, and these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (6)
1. based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Comprise two suction nozzle supports that be arranged in parallel and with the fixing fixed lever of this suction nozzle support, the two ends of each suction nozzle support are respectively equipped with movably at least one vacuum slot, this vacuum slot is connected with vacuum mechanism.
2. according to claim 1ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
The both sides that described suction nozzle support is positioned at fixed lever are respectively equipped with holddown groove, and the cross section of this holddown groove is down convex shape.
3. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described chip laminating glass is picked up device and is also comprised the position transducer of being located at vacuum slot and detecting in real time glass, and this position transducer is connected with control module, and this control module also connects with the driving mechanism signal that is connected vacuum slot.
4. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described holddown groove is provided with position scale and indicates.
5. according to claim 1 and 2ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
Described vacuum slot comprises the body that is bulge loop, on this body, be arranged with grip block, between this grip block and body, be provided with the elastomeric element that grip block is moved to body lower end, on described grip block, be provided with rotating depression bar, at the middle part of this depression bar, be provided with the straight-bar contacting with bulge loop.
6. according to claim 5ly based on chip bonding processing procedure chip laminating glass, pick up device, it is characterized in that:
At at least one shoulder of described holddown groove, be provided with latch, the card article arranging on the lower surface of this latch and grip block coordinates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310490437.3A CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310490437.3A CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103531517A true CN103531517A (en) | 2014-01-22 |
| CN103531517B CN103531517B (en) | 2017-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310490437.3A Active CN103531517B (en) | 2013-10-19 | 2013-10-19 | Based on chip bonding processing procedure chip laminating glass picks up device |
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| CN (1) | CN103531517B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742224A (en) * | 2014-12-11 | 2016-07-06 | 南京瀚宇彩欣科技有限责任公司 | Substrate absorption apparatus |
| CN107275275A (en) * | 2017-06-16 | 2017-10-20 | 英特尔产品（成都）有限公司 | Vacuum cups and crawl and placing device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN102332489A (en) * | 2011-07-21 | 2012-01-25 | 常州海硕机械制造有限公司 | Laminated suction cup |
| CN202481753U (en) * | 2012-03-09 | 2012-10-10 | 深圳市华星光电技术有限公司 | Transfer equipment for liquid crystal panel |
| CN202662583U (en) * | 2012-06-01 | 2013-01-09 | 深圳市新益昌自动化设备有限公司 | Support suction device for LED (light-emitting diode) die bonder |
| CN103280422A (en) * | 2013-05-10 | 2013-09-04 | 华南理工大学 | LED (Light-Emitting Diode) suction-nozzle modularizing device |
| CN203536399U (en) * | 2013-10-19 | 2014-04-09 | 深圳市鑫三力自动化设备有限公司 | COG (chip on glass) pick-up apparatus based on chip bonding process |
-
2013
- 2013-10-19 CN CN201310490437.3A patent/CN103531517B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201532943U (en) * | 2009-11-10 | 2010-07-21 | 中芯国际集成电路制造(上海)有限公司 | Wafer moving device |
| CN102332489A (en) * | 2011-07-21 | 2012-01-25 | 常州海硕机械制造有限公司 | Laminated suction cup |
| CN202481753U (en) * | 2012-03-09 | 2012-10-10 | 深圳市华星光电技术有限公司 | Transfer equipment for liquid crystal panel |
| CN202662583U (en) * | 2012-06-01 | 2013-01-09 | 深圳市新益昌自动化设备有限公司 | Support suction device for LED (light-emitting diode) die bonder |
| CN103280422A (en) * | 2013-05-10 | 2013-09-04 | 华南理工大学 | LED (Light-Emitting Diode) suction-nozzle modularizing device |
| CN203536399U (en) * | 2013-10-19 | 2014-04-09 | 深圳市鑫三力自动化设备有限公司 | COG (chip on glass) pick-up apparatus based on chip bonding process |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105742224A (en) * | 2014-12-11 | 2016-07-06 | 南京瀚宇彩欣科技有限责任公司 | Substrate absorption apparatus |
| CN107275275A (en) * | 2017-06-16 | 2017-10-20 | 英特尔产品（成都）有限公司 | Vacuum cups and crawl and placing device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103531517B (en) | 2017-04-05 |
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