CN201532943U - Wafer moving device - Google Patents
Wafer moving device Download PDFInfo
- Publication number
- CN201532943U CN201532943U CN2009202121700U CN200920212170U CN201532943U CN 201532943 U CN201532943 U CN 201532943U CN 2009202121700 U CN2009202121700 U CN 2009202121700U CN 200920212170 U CN200920212170 U CN 200920212170U CN 201532943 U CN201532943 U CN 201532943U
- Authority
- CN
- China
- Prior art keywords
- wafer
- sucker
- suction cup
- suction disc
- mobile device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a wafer moving device which comprises wafer suction cup frames and a connecting rod, wherein two wafer suction cup frames are provided and are symmetrically fixed on two ends of the connecting rod, each water suction cup frame comprises a fixing frame, two suction cup arms and a limiting bar, wherein limiting holes are arranged on one ends of the suction cup arms, the other ends are provided with suction cup installation holes, one ends of the two suction cup arms, provided with the limiting holes, are respectively fixed on two ends of the fixing frame, the suction cup arms can rotate by using the limiting holes thereof as fulcrums on the fixing frame, and two ends of the limiting bar are respectively fixed on the two suction cup arms. The wafer moving device can accurately adjust the wafer suction cup frames on positions with suitable corresponding wafer sizes.
Description
Technical field
The utility model relates to semiconductor integrated circuit and makes field, particularly a kind of wafer mobile device.
Background technology
Carry out wafer when cutting, same cutting machine can satisfy the cutting to multiple different size wafer usually, cuts as the wafer to 8 cun and 12 cun.When the cutting that need switch to from cutting 12 cun wafers to 8 cun wafers, need to change and adjust some associated components in the cutting machine, clean sucker and wafer mobile device etc. as wafer cutting sucker, wafer.
The wafer mobile device is used for fixing the absorption wafer, and wafer is transported to different parts place in the cutting machine, implements the different disposal to wafer.See also Fig. 1, Fig. 1 is the structural representation of wafer mobile device of the prior art, as shown in Figure 1, the wafer mobile device of prior art is movable, comprise two wafer suction disc framves 1 and connecting rod 2, connecting rod 2 passes the through hole in the middle of the wafer suction disc frame 1, makes two wafer absorption framves 1 be symmetrically distributed in the two ends of connecting rod 2, the two ends of each wafer suction disc frame 1 have sucker installing hole 3, are used to install the sucker of absorption wafer.When needs cut the small size wafer as 8 cun wafers, need manually two wafer suction disc framves 1 are adjusted to 8 cun frame positions; And, then need manually wafer suction disc frame 1 is adjusted to 12 cun frame positions when needs cutting large size wafer during as 12 cun wafers.When adjusting wafer suction disc frame 1, need earlier the fixed screw of wafer suction disc frame below is unscrewed, with hand wafer suction disc frame 1 is moved to the frame position of corresponding size then, and then the fixed screw of wafer suction disc frame 1 is tightened, fixedly the wafer suction disc frame 1.Because but the operating space in the cutting machine is narrow and small, the position of manual adjustment wafer suction disc frame is inconvenience very, and the range accuracy of adjusting is difficult to grasp.
The utility model content
The technical problems to be solved in the utility model provides a kind of wafer mobile device, very inconvenience when putting with the wafer mobile device manual adjustment wafer suction disc chord position that solves prior art, and the range accuracy of adjusting is difficult to the problem of grasp.
For solving the problems of the technologies described above, the utility model provides a kind of wafer mobile device, comprises wafer suction disc frame and connecting rod, and described wafer suction disc frame is two, described wafer suction disc frame is symmetrically fixed on the two ends of described connecting rod, and described wafer suction disc frame comprises fixed mount, two sucker arms and gag lever post; One end of described sucker arm has spacing hole, the other end has the sucker installing hole, the end that described two sucker arms have spacing hole is individually fixed in the two ends of described fixed mount, and described sucker arm can be that fulcrum is rotated with its spacing hole on described fixed mount; The two ends of described gag lever post are individually fixed on described two sucker arms.
Optionally, described sucker arm is fixed on the described fixed mount by the screw of installing in its spacing hole.
Optionally, the two ends of described gag lever post have stopper slot, in each stopper slot limited screw are installed, and are individually fixed on described two sucker arms by the two ends of described limited screw with described gag lever post.
Optionally, connect by limit spring between the limited screw of installing in the stopper slot at described gag lever post two ends.
The wafer mobile device that the utility model provides only needs two wafer absorption of manually rotation frame can conveniently adjust two distances between the wafer suction disc frame, make this wafer mobile device be fit to the wafer of different size, and can accurately the wafer suction disc frame be adjusted to the position that is fit to corresponding wafer size.
Description of drawings
Fig. 1 is the structural representation of wafer mobile device of the prior art;
Fig. 2 is the structural representation of wafer mobile device of the present utility model;
Fig. 3 is the structural representation of wafer suction disc frame of the present utility model.
Embodiment
For above-mentioned purpose of the present utility model, feature and advantage can be become apparent more, embodiment of the present utility model is described in detail below in conjunction with accompanying drawing.
Wafer mobile device described in the utility model can be widely used in the manufacturing field of semiconductor integrated circuit; and can utilize multiple substitute mode to realize; be to be illustrated below by preferred embodiment; certainly the utility model is not limited to this specific embodiment, and the known general replacement of one of ordinary skilled in the art is encompassed in the protection range of the present utility model far and away.
Secondly, the utility model utilizes schematic diagram to describe in detail, and when the utility model embodiment was described in detail in detail, for convenience of explanation, schematic diagram disobeyed that general ratio is local amplifies, should be with this as to qualification of the present utility model.
See also Fig. 2, Fig. 2 is the structural representation of wafer mobile device of the present utility model.As shown in Figure 2, wafer mobile device of the present utility model comprises wafer suction disc frame 4 and connecting rod 5, and described wafer suction disc frame 4 is two, is symmetrically fixed on the two ends of described connecting rod 5.
Please referring to Fig. 3, Fig. 3 is the structural representation of wafer suction disc frame of the present utility model, and as shown in Figure 3, wafer suction disc frame of the present utility model comprises fixed mount 6, two sucker arms 7 and gag lever posts 8; One end of described sucker arm 7 has spacing hole 9, the other end has sucker installing hole 10, described two sucker arms 7 are individually fixed in the two ends of described fixed mount 6 by screws of installing in its spacing hole 9, and described sucker arm 7 is that fulcrum can be rotated on described fixed mount 6 with its spacing hole 9; The two ends of described gag lever post 8 have stopper slot 11, in each stopper slot 11 limited screw 12 is installed, the two ends of described gag lever post 8 are individually fixed on described two sucker arms 7 by described limited screw 12, connect by limit spring 13 between the limited screw of installing in the stopper slot 11 at described gag lever post 8 two ends 12.
Please be simultaneously referring to Fig. 2 and Fig. 3, because on the wafer suction disc frame 4, described two sucker arms 7 are that fulcrum can be rotated on described fixed mount 6 with its spacing hole 9, simultaneously the anglec of rotation to described two sucker arms 7 limits under the acting in conjunction of stopper slot 11 on the described gag lever post 8 and described limit spring 13, promptly is fixed after described two sucker arms 7 are rotated to an angle to the right or left.When two wafer suction disc framves 4 of wafer mobile device with relative direction rotation fixedly the time, then the distance between two wafer absorption framves 4 is applicable to the absorption transmission of small size wafer; When two wafer suction disc framves 4 of wafer mobile device with in opposite directions direction rotation fixedly the time, then the distance between two wafer absorption framves 4 is applicable to the absorption transmission of large scale wafer.Therefore, wafer mobile device of the present utility model is being adjusted when adapting to the wafer of different size, only needed two wafers absorption of manually rotation framves get final product, and can accurately wafer suction disc frame 4 be adjusted to the position of suitable corresponding wafer size.
Obviously, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (4)
1. a wafer mobile device comprises wafer suction disc frame and connecting rod, and described wafer suction disc frame is two, it is characterized in that, described wafer suction disc frame is symmetrically fixed on the two ends of described connecting rod, and described wafer suction disc frame comprises fixed mount, two sucker arms and gag lever post; One end of described sucker arm has spacing hole, the other end has the sucker installing hole, the end that described two sucker arms have spacing hole is individually fixed in the two ends of described fixed mount, and described sucker arm can be that fulcrum is rotated with its spacing hole on described fixed mount; The two ends of described gag lever post are individually fixed on described two sucker arms.
2. wafer mobile device as claimed in claim 1 is characterized in that, described sucker arm is fixed on the described fixed mount by the screw of installing in its spacing hole.
3. wafer mobile device as claimed in claim 1 is characterized in that the two ends of described gag lever post have stopper slot, in each stopper slot limited screw is installed, and is individually fixed on described two sucker arms by the two ends of described limited screw with described gag lever post.
4. wafer mobile device as claimed in claim 1 is characterized in that, connects by limit spring between the limited screw of installing in the stopper slot at described gag lever post two ends.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202121700U CN201532943U (en) | 2009-11-10 | 2009-11-10 | Wafer moving device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202121700U CN201532943U (en) | 2009-11-10 | 2009-11-10 | Wafer moving device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201532943U true CN201532943U (en) | 2010-07-21 |
Family
ID=42528344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202121700U Expired - Fee Related CN201532943U (en) | 2009-11-10 | 2009-11-10 | Wafer moving device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201532943U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102390717A (en) * | 2011-06-20 | 2012-03-28 | 安徽省银锐玻璃机械有限公司 | Adjustable sucking disc arm sectional material |
| CN102751224A (en) * | 2011-04-22 | 2012-10-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Sucker, sucker system and transmission system with sucker |
| CN103531517A (en) * | 2013-10-19 | 2014-01-22 | 深圳市鑫三力自动化设备有限公司 | Pickup device for chip on glass based on chip bonding manufacture procedure |
-
2009
- 2009-11-10 CN CN2009202121700U patent/CN201532943U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102751224A (en) * | 2011-04-22 | 2012-10-24 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Sucker, sucker system and transmission system with sucker |
| CN102751224B (en) * | 2011-04-22 | 2015-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Sucker, sucker system and transmission system with sucker |
| CN102390717A (en) * | 2011-06-20 | 2012-03-28 | 安徽省银锐玻璃机械有限公司 | Adjustable sucking disc arm sectional material |
| CN103531517A (en) * | 2013-10-19 | 2014-01-22 | 深圳市鑫三力自动化设备有限公司 | Pickup device for chip on glass based on chip bonding manufacture procedure |
| CN103531517B (en) * | 2013-10-19 | 2017-04-05 | 深圳市鑫三力自动化设备有限公司 | Based on chip bonding processing procedure chip laminating glass picks up device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130219 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130219 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100721 Termination date: 20181110 |