CN103531517B - Based on chip bonding processing procedure chip laminating glass picks up device - Google Patents

Based on chip bonding processing procedure chip laminating glass picks up device Download PDF

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Publication number
CN103531517B
CN103531517B CN201310490437.3A CN201310490437A CN103531517B CN 103531517 B CN103531517 B CN 103531517B CN 201310490437 A CN201310490437 A CN 201310490437A CN 103531517 B CN103531517 B CN 103531517B
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CN
China
Prior art keywords
glass
chip
picks
suction nozzle
processing procedure
Prior art date
Application number
CN201310490437.3A
Other languages
Chinese (zh)
Other versions
CN103531517A (en
Inventor
李先胜
Original Assignee
深圳市鑫三力自动化设备有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市鑫三力自动化设备有限公司 filed Critical 深圳市鑫三力自动化设备有限公司
Priority to CN201310490437.3A priority Critical patent/CN103531517B/en
Publication of CN103531517A publication Critical patent/CN103531517A/en
Application granted granted Critical
Publication of CN103531517B publication Critical patent/CN103531517B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate

Abstract

The applicable chip laminating glass processing procedure of the present invention uses encapsulation technology field.The present invention discloses a kind of based on chip bonding processing procedure chip laminating glass picks up device, the fix bar fixed including two suction nozzle supports be arrangeding in parallel and with the suction nozzle support, each suction nozzle support is respectively arranged at two ends with moveable at least one vacuum slot, and the vacuum slot is connected with vacuum mechanism.During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, it is allowed to match with glass size.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change the time of workload that picks up device increases and debugging, the raising picks up device adapts to the time debugged during different glass size sizes, and then improve production efficiency.

Description

Based on chip bonding processing procedure chip laminating glass picks up device
Technical field
The present invention relates to chip laminating glass (Chip On Glass;COG) processing procedure uses encapsulation technology field, particularly relates to It is a kind of for by chip laminating glass carry out picking up mobile picks up device.
Background technology
During traditional COG processing procedures, need for chip laminating glass to move to chip bonding position, facilitate subsequent handling Operation is processed.Existing chip laminating glass movement is to inhale to pick up by vacuum slot by glass, then is moved, for different specifications Glass when, it usually needs change with glass size size be adapted attracting device, increase debugging etc. workload, affect work Efficiency.
The content of the invention
The invention mainly solves the technical problem of providing a kind of chip bonding processing procedure chip laminating glass that is based on picks up dress Put, the chip laminating glass picks up device can avoid inhaling when picking up the glass of different size size, change what picks up device increased Workload and the time of debugging, the raising picks up device adapt to the time debugged during different glass size sizes, and then improve Production efficiency.
In order to solve above-mentioned technical problem, the present invention provides a kind of chip bonding processing procedure chip laminating glass that is based on and picks up dress Put, the chip laminating glass picks up device includes:Two suction nozzle supports be arrangeding in parallel and the fixation fixed with the suction nozzle support Bar, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum slot, and the vacuum slot connected with vacuum mechanism Connect, the vacuum slot includes the body for being provided with bulge loop, and grip block is arranged with the body, between the grip block and body The elastomeric element for making grip block move to body lower end is provided with, rotatable depression bar is provided with the grip block, in the depression bar Middle part be provided with the straight-bar contacted with bulge loop, be provided with latch at least one shoulder of the fixing groove, the latch and grip block The card article arranged on lower surface coordinates.
Further say, the suction nozzle support is respectively provided on two sides with fixing groove positioned at fix bar, the section of the fixing groove In convex shape.
Further say, chip laminating glass picks up device also includes located at vacuum slot and real-time detection glass Position sensor, the position sensor are connected with control module, and the control module is also believed with the drive mechanism for being connected vacuum slot Number connection.
Further say, the fixing groove is provided with position scale sign.
Chip of the present invention is fitted glass picks up device, including two suction nozzle supports be arrangeding in parallel and solid with the suction nozzle support Fixed fix bar, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum slot, the vacuum slot with it is true Empty mechanism's connection.During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, be allowed to Glass size matches.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change picks up device and increase Plus workload and debugging time, the raising picks up device adapts to the time debugged during different glass size sizes, and then Improve production efficiency.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing Accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, and the accompanying drawing in describing is the one of the present invention A little embodiments, to those skilled in the art, on the premise of not paying creative work, can be with according to these Accompanying drawing obtains other accompanying drawings.
Fig. 1 is chip laminating glass picks up device example structure schematic diagram of the present invention.
Fig. 2 is along A-A directions cross-sectional schematic in Fig. 1.
Fig. 3 is along vacuum slot centrage cross-sectional schematic.
With reference to embodiment, and referring to the drawings, the realization, functional characteristics and advantage to the object of the invention is made furtherly It is bright.
Specific embodiment
In order that invention purpose, technical scheme and advantage it is clearer, below in conjunction with the embodiment of the present invention in it is attached Figure, is clearly and completely described to the technical scheme in the embodiment of the present invention, it is clear that described embodiment is invention one Section Example, rather than the embodiment of whole.Based on the embodiment in the present invention, those of ordinary skill in the art are not doing The every other embodiment obtained on the premise of going out creative work, belongs to the scope of protection of the invention.
As shown in Figure 1, Figure 2 and Figure 3, the present invention provides a kind of based on chip bonding processing procedure chip laminating glass picks up device Embodiment.
The chip laminating glass picks up device includes:Two suction nozzle supports 2 be arrangeding in parallel and 2 are fixed with the suction nozzle support Fix bar 1, each suction nozzle support 2 is respectively arranged at two ends with moveable at least one vacuum slot 3, the vacuum slot 3 with Vacuum mechanism connects.
Specifically, the suction nozzle support 2 is located at fix bar 1 and is respectively provided on two sides with fixing groove 21, the fixing groove 21 Section is in convex shape.The vacuum slot 3 includes the body 30 for being provided with bulge loop 35, on the body 30 is arranged with grip block 31, the elastomeric element 34 for making grip block move to body lower end, such as compression spring etc. are provided between the grip block 31 and body 30, Rotatable depression bar 32 is provided with the grip block 31, the straight-bar contacted with bulge loop 35 is provided with the middle part of the depression bar 32.It is logical Cross the contracting spring to coordinate with the limiting section 33 on grip block 31 and body 30 so that grip block 31 is clamped to 21 phase of fixing groove To fixed position, by appropriate regulation, spring 34 can be made to have sufficient spring energy vacuum slot horizontal direction is not moved, There is the change that can be disregarded when picking up glass simultaneously in vertical direction.Latch is provided with 21 at least one shoulder of the fixing groove 310, the latch 310 is coordinated with the card article of the lower surface setting of grip block 31 so that vacuum slot 3 is coordinated more with suction nozzle support 2 Closely, will not be moved in the horizontal direction.The fixing groove 21 is provided with position scale sign, and user can be facilitated to make each true The position of suction mouth is corresponding.Pressed down on by depression bar when needing to move so that grip block is moved up so that with fixing groove Between matching loose, can realize when acting on movement to vacuum slot horizontal direction.
During work, for the glass of different specifications, by adapting to adjust the position of each vacuum slot, it is allowed to and glass Size matches.Compared with prior art, can avoid inhaling when picking up the glass of different size size, change what picks up device increased Workload and the time of debugging, the raising picks up device adapt to the time debugged during different glass size sizes, and then improve Production efficiency.
As needed, the chip laminating glass picks up device also includes the position located at vacuum slot real-time detection glass Put sensor, the position sensor is connected with control module, the control module also with the drive mechanism signal for being connected vacuum slot Connection.By the specification of position sensor real-time detection glass during work, vacuum slot is made by control module control drive mechanism Position is made to adapt to move earthquake, realizes automatically adjusting.
Above example only to illustrate technical scheme, rather than a limitation;Although with reference to the foregoing embodiments The present invention has been described in detail, it will be understood by those within the art that:Which still can be to aforementioned each enforcement Technical scheme described in example is modified, or equivalent is carried out to which part technical characteristic, and these are changed or replace Change, do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.

Claims (3)

1. based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that:Including two suction nozzles be arrangeding in parallel Support and the fix bar fixed with the suction nozzle support, each suction nozzle support are respectively arranged at two ends with moveable at least one vacuum Suction nozzle, the vacuum slot are connected with vacuum mechanism;The suction nozzle support is respectively provided on two sides with bar shaped fixing groove positioned at fix bar, The fixation slot cross-section includes the body in bulge loop, is arranged with grip block on the body in convex shape, the vacuum slot, is somebody's turn to do The elastomeric element for making grip block move to body lower end is provided between grip block and body, is provided with rotatable on the grip block Depression bar, the straight-bar contacted with bulge loop is provided with the middle part of the depression bar, latch is provided with least one shoulder of the fixing groove, should The card article arranged on the lower surface of latch and grip block coordinates.
2. according to claim 1 based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that:It is described Chip laminating glass picks up device also includes the position sensor located at vacuum slot real-time detection glass, the position sensor It is connected with control module, the control module is also connected with the drive mechanism signal for being connected vacuum slot.
3. according to claim 1 and 2 based on chip bonding processing procedure chip laminating glass picks up device, it is characterised in that: The fixing groove is provided with position scale sign.
CN201310490437.3A 2013-10-19 2013-10-19 Based on chip bonding processing procedure chip laminating glass picks up device CN103531517B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310490437.3A CN103531517B (en) 2013-10-19 2013-10-19 Based on chip bonding processing procedure chip laminating glass picks up device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310490437.3A CN103531517B (en) 2013-10-19 2013-10-19 Based on chip bonding processing procedure chip laminating glass picks up device

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CN103531517A CN103531517A (en) 2014-01-22
CN103531517B true CN103531517B (en) 2017-04-05

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105742224A (en) * 2014-12-11 2016-07-06 南京瀚宇彩欣科技有限责任公司 Substrate absorption apparatus
CN107275275B (en) * 2017-06-16 2018-05-29 英特尔产品(成都)有限公司 Vacuum cups and crawl and placing device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201532943U (en) * 2009-11-10 2010-07-21 中芯国际集成电路制造(上海)有限公司 Wafer moving device
CN102332489A (en) * 2011-07-21 2012-01-25 常州海硕机械制造有限公司 Laminated suction cup
CN202481753U (en) * 2012-03-09 2012-10-10 深圳市华星光电技术有限公司 Transfer equipment for liquid crystal panel
CN202662583U (en) * 2012-06-01 2013-01-09 深圳市新益昌自动化设备有限公司 Support suction device for LED (light-emitting diode) die bonder
CN103280422A (en) * 2013-05-10 2013-09-04 华南理工大学 LED (Light-Emitting Diode) suction-nozzle modularizing device
CN203536399U (en) * 2013-10-19 2014-04-09 深圳市鑫三力自动化设备有限公司 COG (chip on glass) pick-up apparatus based on chip bonding process

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201532943U (en) * 2009-11-10 2010-07-21 中芯国际集成电路制造(上海)有限公司 Wafer moving device
CN102332489A (en) * 2011-07-21 2012-01-25 常州海硕机械制造有限公司 Laminated suction cup
CN202481753U (en) * 2012-03-09 2012-10-10 深圳市华星光电技术有限公司 Transfer equipment for liquid crystal panel
CN202662583U (en) * 2012-06-01 2013-01-09 深圳市新益昌自动化设备有限公司 Support suction device for LED (light-emitting diode) die bonder
CN103280422A (en) * 2013-05-10 2013-09-04 华南理工大学 LED (Light-Emitting Diode) suction-nozzle modularizing device
CN203536399U (en) * 2013-10-19 2014-04-09 深圳市鑫三力自动化设备有限公司 COG (chip on glass) pick-up apparatus based on chip bonding process

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