WO2013000423A1 - Pushrod-type wafer holder apparatus using cylinder for reciprocation - Google Patents

Pushrod-type wafer holder apparatus using cylinder for reciprocation Download PDF

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Publication number
WO2013000423A1
WO2013000423A1 PCT/CN2012/077772 CN2012077772W WO2013000423A1 WO 2013000423 A1 WO2013000423 A1 WO 2013000423A1 CN 2012077772 W CN2012077772 W CN 2012077772W WO 2013000423 A1 WO2013000423 A1 WO 2013000423A1
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WIPO (PCT)
Prior art keywords
wafer
cylinder
tray
clip
fixed
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PCT/CN2012/077772
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French (fr)
Chinese (zh)
Inventor
朱煜
杨开明
李鑫
汪劲松
胡金春
张鸣
徐登峰
穆海华
尹文生
余东东
崔乐卿
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清华大学
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Publication of WO2013000423A1 publication Critical patent/WO2013000423A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the invention adopts the above technical solution, limits the horizontal and vertical degrees of freedom of the wafer, and can be transmitted in any direction.
  • the elastic component increases the flexibility of the device without damage to the wafer, and the position of the convex support member Adjustments can be made, regardless of wafer size.
  • Figure 6 is an enlarged view of the relationship between the fixed clip and the wafer in a fixed state
  • Figure 9 is an enlarged view of the movable device in a wafer release state
  • Figure 11 is a height diagram of the fixed clip, the moving clip, and the raised support
  • the wafer 109 is fixed by the two fixed clips 102 and the movable clip 105 while restricting the horizontal and vertical movement of the wafer 109, so that the wafer 109 can be transported in any direction.

Abstract

A pushrod-type wafer holder apparatus using a cylinder for reciprocation. The apparatus consists of a tray, a fixed clamp, a protruding support, a movable apparatus, and a cylinder. By executing a control unit command, the cylinder actuates a sliding block into a linear reciprocation. The sliding block drives a flexible element and a mobile clamp into a synchronized motion, clamping a wafer between the fixed clamp and the mobile clamp, thus restricting the degrees of freedom of the wafer in the horizontal and vertical directions. Distension of the flexible element exerts a certain pressure on the rim of the wafer. This allows for the water to be fixed securely and for transport in any direction, thus solving the problem of transport direction singularness. Adjustments in the position of the protruding support and in the moving distance of the sliding block allow for transport of wafers of different diameters, solving the problem of singularness in the size of wafers being transported. The flexible element is used to improve the flexibility of the apparatus, thus preventing damages to the wafer caused by deviation in the moving distance when clamping the wafer.

Description

一种利用气缸伸缩的推杆式晶圆夹持装置  Push rod type wafer clamping device using cylinder expansion and contraction
技术领域 Technical field
本发明涉及一种利用气缸伸縮的推杆式晶圆夹持装置, 主要应用于半导体晶圆加工设备 中。  The present invention relates to a pusher type wafer holding device utilizing a cylinder expansion and contraction, which is mainly used in a semiconductor wafer processing apparatus.
背景技术 Background technique
在半导体制造过程中, 如晶圆的清洗、 抛光等, 在片盒-片盒、 片盒 -腔室之间存在对晶 圆进行的大量传输,因此设计出一种安说全有效的晶圆传输装置是半导体行业研究的热点之一。  In the semiconductor manufacturing process, such as wafer cleaning, polishing, etc., there is a large amount of wafer transfer between the cassette-cartridge and the cassette-chamber, so a fully effective wafer is designed. Transmission devices are one of the hotspots in the semiconductor industry.
专利 US2006/0192400A1的晶圆传输装置如图 13所示。 托盘 124上固定有四个凸起支撑 126, 晶圆底面与 126上表面接触, 由 126支撑, 可移动夹子 138通过连杆 136与气缸 130连 接。 通过执行外部控制单元指令, 气缸推动杆 136进行前后直线移动。 夹子 138在推杆 136 的作用下同步前后直线移动。 当气缸推动杆 136向前书移动时, 晶圆 109被夹在托盘前端凸起 件 128与移动夹子前端凸起件 140之间, 使晶圆固定。  The wafer transfer apparatus of the patent US 2006/0192400 A1 is shown in FIG. Four raised supports 126 are secured to the tray 124. The bottom surface of the wafer is in contact with the upper surface of the 126 and is supported by 126. The movable clamp 138 is coupled to the cylinder 130 via a connecting rod 136. The cylinder push lever 136 linearly moves back and forth by executing an external control unit command. The clip 138 is linearly moved back and forth in synchronization with the push rod 136. When the cylinder push lever 136 moves forward, the wafer 109 is sandwiched between the tray front projection 128 and the moving clip front projection 140 to secure the wafer.
专利 US7, 186, 297B2的晶圆传输装置如图 14所示。托盘 1上固定有四个凸起件 10, 传输 过程中晶圆 109底面与 10的上表面接触, 由四个凸起支撑件 10支撑, 通过执行外部控制单 元指令时, 气缸推动杆 2前后直线移动, 杆 2与夹子 8连接, 杆 2的移动带动夹子 8同步移 动。 当杆 2向前移动时, 夹子 8的前端 8a与晶圆 109的边缘接触, 将晶圆 109被夹在 8a与 凸起件 6之间, 使晶圆固定。  The wafer transfer apparatus of US 7,186, 297B2 is shown in FIG. Four protruding members 10 are fixed on the tray 1. During the transmission, the bottom surface of the wafer 109 is in contact with the upper surface of the 10, and is supported by the four convex supporting members 10. When the external control unit is instructed, the cylinder push rod 2 is straight forward and backward. Moving, the rod 2 is connected to the clip 8, and the movement of the rod 2 causes the clip 8 to move synchronously. When the rod 2 moves forward, the front end 8a of the clip 8 comes into contact with the edge of the wafer 109, and the wafer 109 is sandwiched between the 8a and the raised member 6, fixing the wafer.
以上方法可以应用在半导体制造中晶圆的传输, 但存在一些不足: ① 夹子 128、 凸起件 140、 凸起件 6为圆柱状, 在固定晶圆时, 只限制了晶圆水平方向自由度, 没有限制垂直方向 自由度, 因此只能在水平面内传输晶圆; ② 夹子 138、推杆 2为刚性件, 在夹持晶圆过程中, 推杆移动距离的偏差将引起晶圆的破损; ③ 凸起支撑件 126与 10在托盘上的位置固定, 因 此只能传输一定尺寸范围的晶圆, 受到晶圆直径尺寸的限制。  The above method can be applied to the wafer transfer in semiconductor manufacturing, but there are some disadvantages: 1 The clip 128, the protruding member 140, and the protruding member 6 are cylindrical, and only the horizontal degree of freedom of the wafer is limited when the wafer is fixed. There is no restriction on the vertical direction of freedom, so the wafer can only be transported in the horizontal plane; 2 The clip 138 and the push rod 2 are rigid members, and the deviation of the moving distance of the push rod during the wafer clamping process will cause the wafer to be damaged; 3 The positions of the raised supports 126 and 10 on the tray are fixed, so that only a certain range of wafers can be transported, which is limited by the diameter of the wafer.
发明内容 Summary of the invention
本发明设计了一种利用气缸伸縮的推杆式晶圆夹持装置, 目的在于提供能够沿任意方向 安全传输且不受晶圆直径尺寸限制的晶圆夹持装置。  The present invention contemplates a pusher wafer holding device that utilizes a cylinder telescoping to provide a wafer holding device that can be safely transported in any direction and that is not limited by the diameter of the wafer.
本发明技术方案如下:  The technical scheme of the present invention is as follows:
一种利用气缸伸縮的推杆式晶圆夹持装置, 其特征在于: 含有一个薄片 V型托盘 101, 托盘顶端和末端各有两个凸起支撑件 103, 凸起支撑件上表面为平面, 并通过螺纹与薄片 V 型托盘 101连接, 托盘末端两侧各有两个螺纹孔 104, 凸起支撑件 103可以根据晶圆 109直 径尺寸的不同安装在不同的螺纹孔中进行调整。 托盘 101顶端安装有两个固定夹子 102, 固 定夹子形状为两端粗中间细的鼓形, 中间段为过渡圆弧, 下端为倾斜状。 薄片 V型托盘 101 末端安装有一个气缸 200, 气缸 200通过气缸基座 202固定在薄片 V型托盘 101末端。 气缸 200通过推杆 201与滑块 107连接。 滑块 107与弹性元件 108连接, 并与推杆 201连接。 弹 性元件 108—端与滑块连接, 一端与两个固定件 106连接, 固定件 106对称分布在弹性元件 108两侧。两个可移动夹子 105安装在固定件 106上, 可移动夹子 105的形状与固定夹子 102 类似, 为两端粗中间细的鼓形。 A pusher type wafer clamping device using a cylinder telescopic, characterized in that: a sheet V-shaped tray 101 is provided, and the top end and the end of the tray each have two convex supporting members 103, and the upper surface of the convex supporting member is flat. And threadedly connected with the sheet V-shaped tray 101, two threaded holes 104 are formed on both sides of the end of the tray, and the convex support members 103 can be adjusted in different threaded holes according to the different diameters of the wafer 109. Two fixing clips 102 are mounted on the top end of the tray 101. The shape of the fixing clip is a drum shape with thick and thin ends at both ends, the middle portion is a transition arc, and the lower end is inclined. Sheet V-tray 101 A cylinder 200 is mounted at the end, and the cylinder 200 is fixed to the end of the sheet V-tray 101 through the cylinder base 202. The cylinder 200 is connected to the slider 107 via a push rod 201. The slider 107 is coupled to the elastic member 108 and coupled to the push rod 201. The elastic member 108 is connected to the slider, and one end is connected to the two fixing members 106. The fixing member 106 is symmetrically distributed on both sides of the elastic member 108. Two movable clips 105 are mounted on the fixing member 106, and the movable clip 105 has a shape similar to that of the fixed clip 102, and is a thick and thin drum shape at both ends.
本发明由于采用了以上的技术方案, 限制了晶圆的水平与垂直方向自由度, 可以沿任意 方向传输, 采用弹性元件增加了装置的柔性, 不会使晶圆受到损坏, 凸起支撑件位置可以进 行调整, 不受晶圆尺寸的限制。  The invention adopts the above technical solution, limits the horizontal and vertical degrees of freedom of the wafer, and can be transmitted in any direction. The elastic component increases the flexibility of the device without damage to the wafer, and the position of the convex support member Adjustments can be made, regardless of wafer size.
附图说明 DRAWINGS
图 1是该专利晶圆传输装置的俯视图;  Figure 1 is a plan view of the patented wafer transfer apparatus;
图 2是图 1所示的晶圆传输装置的侧视图;  Figure 2 is a side view of the wafer transfer apparatus shown in Figure 1;
图 3是可移动装置及气缸部分放大图;  Figure 3 is an enlarged view of a movable device and a cylinder portion;
图 4是可移动装置的侧视图;  Figure 4 is a side view of the movable device;
图 5是固定夹子和释放状态下的晶圆之间关系的放大图;  Figure 5 is an enlarged view of the relationship between the fixed clip and the wafer in the released state;
图 6是固定夹子和固定状态下的晶圆之间关系的放大图;  Figure 6 is an enlarged view of the relationship between the fixed clip and the wafer in a fixed state;
图 7是可移动夹子和释放状态下的晶圆之间关系放大图;  Figure 7 is an enlarged view showing the relationship between the movable clip and the wafer in the released state;
图 8是可移动夹子和固定状态下的晶圆之间关系放大图;  Figure 8 is an enlarged view showing the relationship between the movable clip and the wafer in a fixed state;
图 9是晶圆释放状态下的可移动装置放大图;  Figure 9 is an enlarged view of the movable device in a wafer release state;
图 10是晶圆固定状态下弹性元件发生变形时的放大图;  Figure 10 is an enlarged view of the elastic member when the wafer is deformed;
图 11是固定夹子、 移动夹子、 凸起支撑间的高度关系图;  Figure 11 is a height diagram of the fixed clip, the moving clip, and the raised support;
图 12是固定夹子尺寸关系图;  Figure 12 is a diagram showing the relationship of the size of the fixed clip;
图 13是一般晶圆传输装置俯视图;  Figure 13 is a plan view of a general wafer transfer device;
图 14是一般晶圆传输装置俯视图;  Figure 14 is a plan view of a general wafer transfer device;
图中: In the picture:
100-晶圆传输装置; 101-薄片 V型托盘; 102-固定夹子; 103-凸起支撑件; 104-螺纹孔; 105-可移动夹子; 106-固定支撑件; 107-滑块; 108-弹性元件; 109-晶圆; 200-气缸; 201-推杆; 202-基座;  100-wafer transfer device; 101-sheet V-tray; 102-fixed clip; 103-bump support; 104-threaded hole; 105-movable clip; 106-fixed support; 107-slider; Elastic element; 109-wafer; 200-cylinder; 201-push rod; 202-base;
具体实施方式 detailed description
下面结合附图对本发明实施方式作进一步详细描述。  The embodiments of the present invention are further described in detail below with reference to the accompanying drawings.
图 1是该发明中晶圆传输装置 100的俯视图。图 2是图 1中晶圆传输装置 100的侧视图。 晶圆传输装置 100包括薄片托盘 101。 101为近似的 V形, 也可以为 Y形或 U形。 托盘 101顶端部位两侧分别布置一个固定夹子 102, 102 为两端较粗中间较细的鼓形, 102b处为 圆弧, 102a具有一定的倾斜角度。 托盘 101顶端两侧各有一个凸起支撑件 103, 103位置靠 近 102, 并且相对 102靠近托盘 101的内侧。 在托盘 101的末端, 两侧分别布置一个凸起支 撑件 103。托盘 101末端位置,两侧分别有螺纹孔 104,每侧螺纹孔 104的数量可以为 2_3个, 相近两孔之间的距离可以为 50 1 is a plan view of a wafer transfer apparatus 100 in the present invention. 2 is a side view of the wafer transfer device 100 of FIG. 1. The wafer transfer apparatus 100 includes a sheet tray 101. 101 is an approximate V shape, and may also be Y-shaped or U-shaped. A fixing clip 102 is arranged on both sides of the top end portion of the tray 101, 102 is a drum shape having a thicker middle and a thinner end, and 102b is an arc, and 102a has a certain inclination angle. There is a convex support member 103 on each side of the top end of the tray 101, and the position of 103 is Near 102, and the opposite 102 is near the inner side of the tray 101. At the end of the tray 101, a convex support member 103 is disposed on each side. The end position of the tray 101 has a threaded hole 104 on each side, and the number of the threaded holes 104 in each side can be 2_3, and the distance between the two holes can be 50.
凸起支撑件 103与托盘 101是螺纹连接。 103上表面 103a为平面, 当托盘 101托起晶圆 109时, 面 103a与晶圆 109底面接触, 此时由四个凸起 103实现对晶圆 109的支撑。  The raised support member 103 is threadedly coupled to the tray 101. The upper surface 103a of the 103 is a flat surface. When the tray 101 holds the wafer 109, the surface 103a is in contact with the bottom surface of the wafer 109, and the wafer 109 is supported by the four protrusions 103 at this time.
如图 3、 图 4所示, 可移动装置包括夹子 105, 支撑件 106, 滑块 107, 弹性元件 108 夹子 105固定在支撑件 106的下方。 105为两端较粗中间较细的鼓状, 105a处为圆弧, 105b 处为倾斜状。 弹性元件 108—端与支撑件 106连接, 另一端与滑块 107连接。  As shown in Figs. 3 and 4, the movable device includes a clip 105, a support member 106, a slider 107, and an elastic member 108. The clip 105 is fixed under the support member 106. 105 is a drum shape with a thicker middle end and a thinner one at 105a, and a slope at 105b. The elastic member 108 is connected to the support member 106 and the other end is coupled to the slider 107.
可移动装置应具有两个夹子 105及支撑件 106, 并使其相对滑块 107对称布置。 这样利 用两点与晶圆 109边缘接触, 可以起到调整晶圆 109中心位置的作用。  The movable device should have two clips 105 and supports 106 and be arranged symmetrically with respect to the slider 107. This makes it possible to adjust the center position of the wafer 109 by using two points in contact with the edge of the wafer 109.
如图 3所示, 200为气缸, 气缸 200固定在托盘 101末端。 气缸 200与外部执行单元连 接, 通过外部指令对其进行操作。 滑块 107与连杆 201固定连接。 连杆 201在气缸的作用下 可前后移动, 进而带动 105 106 107及 108—起前后移动。  As shown in Fig. 3, 200 is a cylinder, and the cylinder 200 is fixed to the end of the tray 101. The cylinder 200 is connected to an external execution unit and is operated by an external command. The slider 107 is fixedly coupled to the link 201. The connecting rod 201 can move back and forth under the action of the cylinder, and then drives the 105 106 107 and 108 to move back and forth.
首先, 当托起晶圆 109时, 晶圆 109底面与凸起支撑 103上表面 103a接触, 晶圆 109仅 仅由 4个凸起 103支撑。 气缸 200执行控制单元的指令进行操作。 当气缸 200作用时, 连杆 201向前移动, 同时带动滑块 107向前移动。 通过弹性元件 108及支撑件 106, 滑块 107带动 夹子 105向前移动。 当夹子 105倾斜处 105b与晶圆 109边缘接触时, 在 105b的约束下, 晶 圆 109被推动一起向前移动。  First, when the wafer 109 is lifted, the bottom surface of the wafer 109 is in contact with the upper surface 103a of the bump support 103, and the wafer 109 is supported only by the four projections 103. The cylinder 200 performs an instruction of the control unit to operate. When the cylinder 200 is actuated, the link 201 moves forward while the slider 107 is moved forward. The slider 107 drives the clip 105 forward by the elastic member 108 and the support member 106. When the inclined portion 105b of the clip 105 comes into contact with the edge of the wafer 109, under the constraint of 105b, the wafer 109 is pushed to move forward together.
如图 6、 图 8所示, 当晶圆 109被继续向前推动时, 其边缘与前端的固定夹子 102的倾斜 边缘 102a接触, 使晶圆沿着倾斜边缘 102a与倾斜边缘 105b向上移动, 晶圆 109底面与凸起 支撑 103上表面 103a分离,最终晶圆 109边缘与 102b 104a接触,被固定在夹子 102与 105 之间。此时气缸推动滑块 107继续向前移动一段距离, 如图 10所示, 使弹性元件 108发生弹 性变形, 使夹子 105对晶圆 109产生一定大小的作用力, 使晶圆 109被固定在 102与 105之 间, 同时限制了晶圆 109的水平与垂直方向的自由度。  As shown in FIG. 6 and FIG. 8, when the wafer 109 is pushed forward, its edge contacts the inclined edge 102a of the front end of the fixed clip 102, causing the wafer to move upward along the inclined edge 102a and the inclined edge 105b. The bottom surface of the circle 109 is separated from the upper surface 103a of the convex support 103, and the edge of the final wafer 109 is in contact with the 102b 104a and is fixed between the clips 102 and 105. At this time, the cylinder push slider 107 continues to move forward by a distance. As shown in FIG. 10, the elastic member 108 is elastically deformed, so that the clip 105 exerts a certain force on the wafer 109, so that the wafer 109 is fixed at 102. Between 105 and 105, the degrees of freedom of the wafer 109 in the horizontal and vertical directions are simultaneously limited.
如图 3所示,在气缸基座 202中增加了位置控制器 203,通过调整高度 L,可以使推杆 201 移动不同的距离, 因此可以实现不同直径尺寸晶圆 109的传输。  As shown in Fig. 3, a position controller 203 is added to the cylinder base 202. By adjusting the height L, the push rods 201 can be moved by different distances, so that the transfer of the wafers 109 of different diameter sizes can be realized.
如图 11所示, 假设夹子 102的圆弧边缘 102b中心与托盘 101上表面的距离为 Hl, 为了 使晶圆 109在传输过程中保持水平状态,夹子 105的圆弧边缘 105a中心与托盘 101上表面的 距离也应该为 HI, 同时 102a的坡度与 105b的坡度也应该相等。。  As shown in FIG. 11, it is assumed that the center of the arcuate edge 102b of the clip 102 is at a distance H1 from the upper surface of the tray 101. In order to maintain the wafer 109 in a horizontal state during transport, the center of the arcuate edge 105a of the clip 105 is on the tray 101. The distance of the surface should also be HI, and the slope of 102a should be equal to the slope of 105b. .
当晶圆 109被传输到指定位置时, 气缸 200执行外部指令, 使连杆 201向后移动。 连杆 201带动滑块 107向后移动, 滑块 107带动夹子 105向后移动, 晶圆 109边缘与 102b 105a 分离, 由于重力的作用, 晶圆 109将沿着斜坡 102a 105b向下滑落, 使晶圆 109底面重新与 103上表面 103a接触, 由凸起 103支撑。 如图 12所示, 当晶圆重新被 103支撑时, 其边缘与夹子 102边缘接触。 设晶圆 109与夹 子 102边缘刚接触时晶圆 109的边缘与 102中心的距离为 L2,为使晶圆 109可以被自由卸载, 应使 L2〉L1。 When the wafer 109 is transferred to the designated position, the cylinder 200 executes an external command to move the link 201 backward. The connecting rod 201 drives the slider 107 to move backward, the slider 107 drives the clip 105 to move backward, and the edge of the wafer 109 is separated from the 102b 105a. Due to the action of gravity, the wafer 109 will slide down along the slope 102a 105b, so that the crystal The bottom surface of the circle 109 is again brought into contact with the upper surface 103a of the 103, and is supported by the projection 103. As shown in Figure 12, when the wafer is again supported by 103, its edges are in contact with the edges of the clip 102. When the wafer 109 is in contact with the edge of the clip 102, the distance between the edge of the wafer 109 and the center of the 102 is L2. To enable the wafer 109 to be freely unloaded, L2 > L1.
该发明中的晶圆传输机械手装置,晶圆 109由两个固定夹子 102和可移动夹子 105固定, 同时限制了晶圆 109的水平与垂直方向的运动, 因此晶圆 109可以在任意方向传输。 在托盘 101末端两侧各有 2-3个螺纹孔, 通过调整凸起支撑 103的位置及滑块 107的移动距离, 可 以传输不同直径尺寸的晶圆 109, 使晶圆 109传输装置不受晶圆 109尺寸的限制。  In the wafer transfer robot apparatus of the present invention, the wafer 109 is fixed by the two fixed clips 102 and the movable clip 105 while restricting the horizontal and vertical movement of the wafer 109, so that the wafer 109 can be transported in any direction. There are 2-3 threaded holes on both sides of the end of the tray 101. By adjusting the position of the protrusion support 103 and the moving distance of the slider 107, the wafer 109 of different diameters can be transported, so that the wafer 109 transmission device is not subjected to crystal The size of the circle 109 is limited.
滑块 107与可移动夹子 105通过弹性元件连接,增加了系统的柔性,避免了由于滑块 107 移动距离的偏差造成的晶圆 109的损坏, 同时弹性元件 108降低了夹子 105与晶圆 109边缘 的碰撞程度。 通过改变滑块 107的移动距离或弹性元件 108的刚度系数可以改变作用在晶圆 109上的力。  The slider 107 and the movable clip 105 are connected by the elastic member, which increases the flexibility of the system, avoids damage of the wafer 109 due to the deviation of the moving distance of the slider 107, and the elastic member 108 lowers the edge of the clip 105 and the wafer 109. The degree of collision. The force acting on the wafer 109 can be changed by changing the moving distance of the slider 107 or the stiffness coefficient of the elastic member 108.

Claims

权 利 要 求 书 Claim
1. 一种利用气缸伸縮的推杆式晶圆夹持装置, 其特征在于: 该夹持装置含有一个薄片 V 型托盘 (101 ), 托盘顶端和末端各有两个凸起支撑件 (103), 凸起支撑件上表面为平面, 并 通过螺纹与薄片 V型托盘(101 )连接,托盘末端两侧各有两个螺纹孔(104),凸起支撑件(103) 可以根据晶圆 (109) 直径尺寸的不同安装在不同的螺纹孔中进行调整; 托盘 (101 ) 顶端安 装有两个固定夹子 (102), 固定夹子形状为两端粗中间细的鼓形, 中间段为过渡圆弧, 下端 为倾斜状;薄片 V型托盘(101 )末端安装有一个气缸(200),气缸(200)通过气缸基座(202) 固定在薄片 V型托盘 (101 ) 末端; 气缸 (200) 通过推杆 (201 ) 与滑块 (107) 连接; 滑块 ( 107) 与弹性元件 (108)连接, 并与推杆 (201 )连接; 弹性元件 (108) —端与滑块连接, 一端与两个固定件(106)连接, 固定件 (106)对称分布在弹性元件(108) 两侧; 两个可移 动夹子 (105) 安装在固定件 (106) 上, 可移动夹子 (105) 的形状与固定夹子 (102)类似, 为两端粗中间细的鼓形。  A pusher type wafer holding device using a cylinder expansion and contraction, characterized in that: the holding device comprises a sheet V-shaped tray (101), and the top end and the end of the tray each have two convex support members (103) The upper surface of the raised support member is flat and is connected by thread to the V-shaped tray (101). The two ends of the tray have two threaded holes (104), and the raised support member (103) can be based on the wafer (109). The different diameters are installed in different threaded holes for adjustment; the top of the tray (101) is equipped with two fixing clips (102). The shape of the fixing clip is a thick and thin drum shape at both ends, and the middle section is a transition arc. The lower end is inclined; a cylinder (200) is mounted at the end of the sheet V-shaped tray (101), and the cylinder (200) is fixed to the end of the sheet V-shaped tray (101) through the cylinder base (202); the cylinder (200) is passed through the push rod (201) is connected with the slider (107); the slider (107) is connected to the elastic member (108) and connected to the push rod (201); the elastic member (108) is connected to the slider at one end and fixed at both ends Piece (106) connection, solid The pieces (106) are symmetrically distributed on both sides of the elastic member (108); the two movable clips (105) are mounted on the fixing member (106), and the movable clip (105) has a shape similar to the fixed clip (102), which is two The end is thick and thin in the middle.
PCT/CN2012/077772 2011-06-28 2012-06-28 Pushrod-type wafer holder apparatus using cylinder for reciprocation WO2013000423A1 (en)

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Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202712152U (en) * 2011-06-28 2013-01-30 清华大学 Push rod type wafer clamping device which is retractable through air cylinder
CN107785298B (en) * 2016-08-25 2021-02-02 苏州能讯高能半导体有限公司 Separation equipment and method for wafer temporary bonding
CN108666258A (en) * 2017-03-31 2018-10-16 奇景光电股份有限公司 Wafer jig and the method that wafer is clamped
CN109865642B (en) * 2017-12-05 2021-05-14 株洲中车时代半导体有限公司 Chip center positioning clamp
CN109686696A (en) * 2018-12-27 2019-04-26 北京半导体专用设备研究所(中国电子科技集团公司第四十五研究所) A kind of chuck assembly
CN111244022B (en) * 2020-01-22 2023-02-10 北京北方华创微电子装备有限公司 Wafer box clamping device and wafer cleaning machine
DE102020109866B3 (en) * 2020-04-08 2021-07-01 Muetec Automatisierte Mikroskopie Und Messtechnik Gmbh Apparatus and method for removing a framed wafer from a wafer tray
CN113764330A (en) * 2020-06-03 2021-12-07 中芯北方集成电路制造(北京)有限公司 Wafer clamping device
CN111916381A (en) * 2020-08-24 2020-11-10 台州市老林装饰有限公司 Auxiliary material taking mechanism for wafer material placing box
CN112992747B (en) * 2021-02-10 2022-01-25 江苏亚电科技有限公司 Wafer cleaning feeding and discharging device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006150538A (en) * 2004-11-30 2006-06-15 Rorze Corp Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method
US20060192400A1 (en) * 2005-02-25 2006-08-31 Woo-Young Kim Wafer transfer apparatus

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100331157B1 (en) * 1998-07-24 2002-04-03 다니구찌 이찌로오, 기타오카 다카시 Wafer holding hand
DE59914581D1 (en) * 1998-09-02 2008-01-24 Tec Sem Ag DEVICE AND METHOD FOR HANDLING INDIVIDUAL WAFERS
US6752585B2 (en) * 2001-06-13 2004-06-22 Applied Materials Inc Method and apparatus for transferring a semiconductor substrate
CN202712152U (en) * 2011-06-28 2013-01-30 清华大学 Push rod type wafer clamping device which is retractable through air cylinder

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006150538A (en) * 2004-11-30 2006-06-15 Rorze Corp Holding type conveying device, robot using the same, disk-shaped article working equipment, and disk-shaped article conveying method
US20060192400A1 (en) * 2005-02-25 2006-08-31 Woo-Young Kim Wafer transfer apparatus

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