WO2012164930A1 - Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法 - Google Patents
Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法 Download PDFInfo
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- WO2012164930A1 WO2012164930A1 PCT/JP2012/003557 JP2012003557W WO2012164930A1 WO 2012164930 A1 WO2012164930 A1 WO 2012164930A1 JP 2012003557 W JP2012003557 W JP 2012003557W WO 2012164930 A1 WO2012164930 A1 WO 2012164930A1
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
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Definitions
- the present invention relates to an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and a resin coating method in the LED package manufacturing system.
- LEDs light emitting diodes having excellent characteristics of low power consumption and long life have been widely used as light sources for various lighting devices. Since the basic light emitted from the LED element is currently limited to three colors of red, green, and blue, in order to obtain white light suitable for general lighting applications, the above three basic lights are added.
- a method of obtaining white light by color mixing, a method of obtaining pseudo white light by combining a blue LED and a phosphor emitting yellow fluorescence having a complementary color relationship with blue are used.
- the latter method has been widely used, and an illumination device using an LED package in which a blue LED and a YAG phosphor are combined has been used for a backlight of a liquid crystal panel (for example, a patent). Reference 1).
- YAG phosphor particles are placed in a mounting portion in which YAG phosphor particles are dispersed in the mounting portion.
- An LED package is configured by injecting dispersed silicone resin, epoxy resin, or the like to form a resin packaging portion. And, for the purpose of uniforming the height of the resin packaging part in the mounting part after the resin injection, a residual resin storage part for discharging and storing the surplus resin injected more than a specified amount from the mounting part is formed.
- An example is given. As a result, even when the discharge amount from the dispenser varies at the time of resin injection, a resin packaging portion having a certain resin amount and a specified height is formed on the LED element.
- the LED element has undergone a manufacturing process in which a plurality of elements are formed on the wafer at the same time, and due to various error factors in this manufacturing process, such as non-uniform composition during film formation on the wafer, the wafer state Inevitably, variations in emission wavelength occur in the LED elements divided into individual pieces. And in the above-mentioned example, since the height of the resin wrapping part covering the LED element is set uniformly, the variation in the emission wavelength in the individual LED element is directly reflected in the variation in the emission characteristic of the LED package as a product.
- the conventional LED package manufacturing technology has a problem in that the emission characteristics of the LED package as a product vary due to variations in the emission wavelength of the individual LED elements, leading to a decrease in production yield. .
- the present invention provides a resin coating apparatus and a resin coating that can make the light emission characteristics of the LED package uniform and improve the production yield even when the light emission wavelength of the individual LED elements varies in the LED package manufacturing system. It aims to provide a method.
- the LED package manufacturing system of the present invention is an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and a plurality of the LED elements are mounted on the substrate.
- a component mounting apparatus an element characteristic information providing unit for providing information obtained by separately measuring light emission characteristics including light emission wavelengths of the plurality of LED elements as element characteristic information, and an LED having a prescribed light emission characteristic
- a resin information providing unit that provides, as resin coating information, information corresponding to the appropriate resin coating amount of the resin for obtaining a package and the element characteristic information Map data associating the mounting position information indicating the position with the element characteristic information about the LED element, Based on the map data creation unit to be created for each substrate, the map data and the resin application information, the resin having an appropriate resin application amount for providing specified light emission characteristics is applied to each LED element mounted on the substrate.
- a resin application device that applies the resin, and the resin application device controls the resin application unit by controlling the resin application unit and the resin application unit that discharges the resin in a variable amount and applies the resin to any application target position.
- a coating control unit that executes a coating process for measurement for applying a resin to a translucent member for light emission characteristic measurement and a production coating process for coating the LED element for actual production; and the resin in the coating process for measurement
- the A light emission characteristic measurement unit that measures light emission characteristics of the light received from below the light transmission member by irradiating the resin applied to the light transmission member from above, and the light emission characteristic measurement
- the appropriate resin coating amount for actual production to be applied to the LED element is derived by obtaining the deviation between the measurement result of the part and the predetermined light emission characteristic and correcting the appropriate resin coating amount based on the
- the resin coating method in the LED package manufacturing system of the present invention is an LED package manufacturing system for manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor, and is mounted on the substrate by a component mounting apparatus.
- a resin coating method in an LED package manufacturing system that covers the plurality of LED elements and applies the resin, wherein the LED package manufacturing system includes a component mounting apparatus that mounts the plurality of LED elements on the substrate, and the plurality of the plurality of LED elements.
- An element characteristic information providing unit for providing information obtained by individually measuring emission characteristics including the emission wavelength of the LED element as element characteristic information, and the resin for obtaining an LED package having a prescribed emission characteristic Information corresponding to the appropriate resin application amount and the element characteristic information Map data associating a resin information providing unit provided as information, mounting position information indicating a position of the LED element mounted by the component mounting apparatus on the substrate, and the element characteristic information of the LED element; Based on the map data creation unit to be created every time, the map data and the resin application information, the resin having an appropriate resin application amount for providing a normal light emission characteristic required for a finished product is mounted on the substrate.
- a resin coating device that coats each LED element, and a measurement application step of applying the resin to a translucent member as a light emission characteristic measurement by a resin discharge unit that discharges the resin in a variable amount; and A translucent member placement step of placing the translucent member on which the resin has been trial-applied on the translucent member placement portion; and a light source portion disposed above the translucent member placement portion.
- An excitation light emitting step for emitting excitation light for exciting the phosphor, and light emitted from the resin by irradiating the resin applied to the light transmissive member from above from below the light transmissive member.
- a correction amount deriving process for deriving a proper resin application amount for actual production to be applied to the LED element by correcting, and a coating control unit for controlling the resin discharge unit for the derived proper resin application amount A production execution step of executing a production coating process for coating the LED element with a resin having an appropriate resin coating amount.
- a translucent member on which a resin has been trial-coated is placed on a translucent member placement unit
- the light emitted from the resin is emitted by emitting excitation light that excites the phosphor from the light source unit disposed above the translucent member mounting unit and irradiating the resin applied to the translucent member from above with the excitation light.
- the deviation between the measurement result obtained by measuring the light emission characteristics by receiving light from below the translucent member and the predetermined light emission characteristics is obtained, and the appropriateness of the resin to be applied to the LED element for actual production is determined based on this deviation.
- the block diagram which shows the structure of the control system of the LED package manufacturing system of one embodiment of this invention Flowchart of LED package manufacturing by LED package manufacturing system of one embodiment of the present invention Flow chart of threshold data creation processing for non-defective product determination in LED package manufacturing system of one embodiment of the present invention (A)-(c) Explanatory drawing of threshold data for non-defective product determination in the LED package manufacturing system of one embodiment of the present invention Chromaticity diagram for explaining threshold data for non-defective product determination in the LED package manufacturing system of one embodiment of the present invention
- the LED package manufacturing system 1 has a function of manufacturing an LED package in which an LED element mounted on a substrate is covered with a resin containing a phosphor.
- the component mounting apparatus M1, the curing apparatus M2, the wire bonding apparatus M3, the resin coating apparatus M4, the curing apparatus M5, and the piece cutting apparatus M6 are connected by the LAN system 2. These devices are connected and controlled by the management computer 3 in an integrated manner.
- the component mounting apparatus M1 mounts the LED element 5 on the substrate 4 (see FIGS. 2A and 2B) serving as the base of the LED package by bonding with a resin adhesive.
- the curing device M2 cures the resin adhesive used for bonding at the time of mounting by heating the substrate 4 after the LED element 5 is mounted.
- the wire bonding apparatus M3 connects the electrode of the substrate 4 and the electrode of the LED element 5 with a bonding wire.
- the resin coating device M4 applies a resin containing a phosphor to each LED element 5 on the substrate 4 after wire bonding.
- the curing device M5 cures the resin applied so as to cover the LED elements 5 by heating the substrate 4 after the resin application.
- the piece cutting device M6 cuts the substrate 4 after the resin is cured into each individual LED element 5 and divides it into individual LED packages. Thereby, the LED package divided
- FIG. 1 shows an example in which a production line is configured by arranging each of the component mounting device M1 to the piece cutting device M6 in series.
- the LED package manufacturing system 1 does not necessarily have such a line configuration.
- each process work may be sequentially executed by each of the distributed devices.
- a plasma processing apparatus that performs plasma treatment for electrode cleaning prior to wire bonding before and after the wire bonding apparatus M3, and a surface modification for improving resin adhesion before resin application after wire bonding. You may make it interpose the plasma processing apparatus which performs the plasma processing for the purpose of quality.
- the substrate 4 is a multiple-type substrate in which a plurality of individual substrates 4a serving as a base of one LED package 50 in a finished product are formed.
- Each individual substrate 4a includes Each LED mounting portion 4b on which the LED element 5 is mounted is formed.
- the LED element 5 is mounted in the LED mounting portion 4b for each individual substrate 4a, and then the resin 8 is applied to cover the LED element 5 in the LED mounting portion 4b. Is cut for each individual substrate 4a to complete the LED package 50 shown in FIG.
- the LED package 50 has a function of irradiating white light used as a light source of various lighting devices, and includes a phosphor that emits yellow fluorescence that is complementary to the blue LED element 5 and blue. By combining with the resin 8, pseudo white light is obtained.
- the individual substrate 4a is provided with a cavity-shaped reflecting portion 4c having, for example, a circular or elliptical annular bank that forms the LED mounting portion 4b.
- the N-type part electrode 6a and the P-type part electrode 6b of the LED element 5 mounted inside the reflection part 4c are connected to the wiring layers 4e and 4d formed on the upper surface of the individual substrate 4a by bonding wires 7, respectively.
- the resin 8 covers the LED element 5 in this state and is applied to the inside of the reflecting portion 4c with a predetermined thickness.
- the resin 8 The contained phosphor is mixed with yellow light to emit light, and is irradiated as white light.
- the LED element 5 is configured by stacking an N-type semiconductor 5b and a P-type semiconductor 5c on a sapphire substrate 5a, and further covering the surface of the P-type semiconductor 5c with a transparent electrode 5d.
- An N-type part electrode 6a and a P-type part electrode 6b for external connection are formed on the N-type semiconductor 5b and the P-type semiconductor 5c, respectively.
- the LED elements 5 are taken out from the LED wafer 10 that is stuck and held on the holding sheet 10a in a state where a plurality of LED elements 5 are formed in a lump and then divided into pieces.
- the LED element 5 is divided into individual pieces from the wafer state due to various error factors in the manufacturing process, for example, non-uniform composition during film formation on the wafer. It is inevitable that variations occur in the case. If such an LED element 5 is mounted on the substrate 4 as it is, the emission characteristics of the LED package 50 as a product will vary.
- the light emission characteristics of a plurality of LED elements 5 manufactured in the same manufacturing process are measured in advance, Element characteristic information corresponding to data indicating the light emission characteristics of the LED elements 5 is created, and an appropriate amount of the resin 8 corresponding to the light emission characteristics of each LED element 5 is applied in the application of the resin 8. .
- resin application information to be described later is prepared in advance.
- the LED elements 5 taken out from the LED wafer 10 are individually identified by element IDs (in this case, the individual LED elements 5 with the serial number (i) in the LED wafer 10). Are given sequentially to the light emission characteristic measuring device 11.
- element ID if it is the information which can specify the LED element 5 separately, you may make it use the matrix coordinate which shows the arrangement
- the LED element 5 can be supplied in the state of the LED wafer 10 in the component mounting apparatus M1 described later.
- the light emission characteristic measuring device 11 power is actually supplied to each LED element 5 through a probe to actually emit light, and the light is spectrally analyzed to measure predetermined items such as a light emission wavelength and light emission intensity.
- a standard distribution of emission wavelengths is prepared as reference data in advance, and the wavelength range corresponding to the standard range in the distribution is further divided into a plurality of wavelength ranges.
- the plurality of target LED elements 5 are ranked according to the emission wavelength.
- Bin codes [1], [2], [3], [4], [5] are assigned in order from the low wavelength side corresponding to each of the ranks set by dividing the wavelength range into five. ] Is given.
- element characteristic information 12 having a data structure in which the Bin code 12b is associated with the element ID 12a is created.
- the element characteristic information 12 is information obtained by individually measuring the light emission characteristics including the light emission wavelengths of the plurality of LED elements 5 in advance. Is transmitted.
- the element characteristic information 12 may be transmitted in a form recorded on a single storage medium, or may be transmitted to the management computer 3 via the LAN system 2. In any case, the transmitted element characteristic information 12 is stored in the management computer 3 and provided to the component mounting apparatus M1 as necessary.
- the plurality of LED elements 5 for which the light emission characteristic measurement is completed in this way are sorted for each characteristic rank as shown in FIG. 3D, and are distributed into five types according to each characteristic rank. Attached individually to 13a. Thereby, the three types of LED sheets 13A, 13B in which the LED elements 5 corresponding to the Bin codes [1], [2], [3], [4], and [5] are adhered and held on the adhesive sheet 13a, respectively. 13C, 13D, and 13E are created, and when these LED elements 5 are mounted on the individual substrate 4a of the substrate 4, the LED elements 5 are already classified into LED sheets 13A, 13B, 13C, and 13D. , 13E in the form of the component mounting apparatus M1.
- the LED elements 5 corresponding to any of the Bin codes [1], [2], [3], [4], and [5] are held in the LED sheets 13A, 13B, 13C, 13D, and 13E, respectively.
- the element characteristic information 12 is provided from the management computer 3 in a form indicating whether or not it has been.
- the LED package 50 configured to obtain white light by combining a blue LED and a YAG phosphor
- the blue light emitted from the LED element 5 and the yellow light emitted from the phosphor excited by the blue light are emitted. Since mixing is performed, the amount of the phosphor particles in the concave LED mounting portion 4b on which the LED element 5 is mounted is an important factor in securing the normal light emission characteristics of the LED package 50 of the product.
- the appropriate amount of the phosphor particles in the resin 8 applied to cover the LED element 5 differs depending on the Bin codes [1], [2], [3], [4], and [5]. It will be a thing.
- the appropriate resin application amount for each Bin classification of the resin 8 containing YAG-based phosphor particles in a silicone resin, an epoxy resin, or the like It is defined in advance according to the Bin code section 17 in units of nl (nanoliter).
- the amount of the phosphor particles in the resin covering the LED element 5 is an appropriate amount of supplying phosphor particles. This ensures the normal emission wavelength required for the finished product after the resin is thermally cured.
- the appropriate resin coating amount of the resin 8 is also set to an appropriate value (uncomfortable expression) according to the phosphor concentration of the resin 8 to be used. That is, when the resin having the phosphor concentration D1 is applied, the appropriate resin application amounts VA0, VB0, VC0, and Bin codes [1], [2], [3], [4], and [5] are applied. Resin 8 of VD0, VE0 (appropriate resin application amount 15 (1)) is applied.
- the appropriate resin application amounts VF0, VG0, VH0 for the Bin codes [1], [2], [3], [4], and [5], respectively.
- VJ0, VK0 appropriate resin coating amount 15 (2) of resin 8 is applied.
- the appropriate resin application amounts VL0, VM0, VN0, and VP0 for the Bin codes [1], [2], [3], [4], and [5], respectively.
- VR0 appropriate resin application amount 15 (3) of resin 8 is applied.
- the appropriate resin coating amount is set for each of a plurality of different phosphor concentrations as described above, in order to ensure quality by applying the resin 8 having the optimum phosphor concentration according to the degree of variation in the emission wavelength. This is because it is more preferable.
- the component mounting apparatus M1 includes a substrate transport mechanism 21 that transports the work target substrate 4 supplied from the upstream side in the substrate transport direction (arrow a).
- the substrate transport mechanism 21 is provided with an adhesive application part A shown in section AA in FIG. 5B and a component mounting part B shown in section BB in FIG. 4C. It is installed.
- the adhesive application unit A is disposed on the side of the substrate transport mechanism 21 and supplies the resin adhesive 23 in the form of a coating film having a predetermined film thickness, and the substrate transport mechanism 21 and the adhesive supply unit 22.
- the component mounting portion B is disposed on the side of the board transport mechanism 21, and the parts supply mechanism 25 and the board transport mechanism 21 that hold the LED sheets 13A, 13B, 13C, 13D, and 13E shown in FIG.
- a component mounting mechanism 26 that is movable in the horizontal direction (arrow c) above the supply mechanism 25 is provided.
- the substrate 4 carried into the substrate transport mechanism 21 is positioned by the adhesive application portion A, and is bonded to the LED mounting portion 4b formed on each individual substrate 4a.
- the agent 23 is applied. That is, first, the adhesive transfer mechanism 24 is moved above the adhesive supply unit 22 so that the transfer pin 24a is brought into contact with the coating film of the resin adhesive 23 formed on the transfer surface 22a, and the resin adhesive 23 is adhered. Next, the adhesive transfer mechanism 24 is moved above the substrate 4 and the transfer pin 24a is lowered to the LED mounting portion 4b (arrow d), whereby the resin adhesive 23 attached to the transfer pin 24a is moved into the LED mounting portion 4b. Supplied by transfer to the element mounting position.
- the substrate 4 after application of the adhesive is conveyed to the downstream side, positioned at the component mounting portion B as shown in FIG. 5 (c), and the LED elements are targeted for each LED mounting portion 4b after the adhesive is supplied.
- 5 is implemented. That is, first, the component mounting mechanism 26 is moved above the component supply mechanism 25, and the mounting nozzle 26a is lowered with respect to any of the LED sheets 13A, 13B, 13C, 13D, and 13E held by the component supply mechanism 25, and mounted. The LED element 5 is held and taken out by the nozzle 26a.
- the component mounting mechanism 26 is moved above the LED mounting portion 4b of the substrate 4 to lower the mounting nozzle 26a (arrow e), whereby the LED element 5 held by the mounting nozzle 26a is bonded to the adhesive in the LED mounting portion 4b. It is mounted at the element mounting position where is applied.
- any of the LED sheets 13A, 13B, 13C, 13D, and 13E is used in the element mounting program created in advance, that is, in the individual mounting operation by the component mounting mechanism 26.
- the order in which the LED elements 5 are taken out and mounted on the plurality of individual boards 4a of the board 4 is set in advance, and the component mounting work is executed according to this element mounting program.
- mounting position information 71a (see FIG. 11) indicating which of the plurality of individual boards 4a of the board 4 is mounted from the work execution history is extracted. Record.
- the mounting position information 71a and the LED element 5 mounted on each individual substrate 4a correspond to any characteristic rank (Bin code [1], [2], [3], [4], [5]).
- Data associated with the element characteristic information 12 indicating whether or not to be created is created as map data 18 shown in FIG. 6 by the map creation processing unit 74 (see FIG. 11).
- the individual positions of the plurality of individual substrates 4a of the substrate 4 are specified by combinations of matrix coordinates 19X and 19Y indicating the positions in the X direction and the Y direction, respectively. Then, by making the Bin code to which the LED element 5 mounted at the position belongs correspond to the individual cell of the matrix constituted by the matrix coordinates 19X and 19Y, the LED element 5 mounted by the component mounting apparatus M1 on the substrate 4 Map data 18 in which the mounting position information 71a indicating the position and the element characteristic information 12 about the LED element 5 are associated is created.
- the component mounting apparatus M1 displays the map data 18 in which the mounting position information indicating the position of the LED element 5 mounted by the apparatus on the board 4 and the element characteristic information 12 on the LED element 5 are associated with the board 4
- a map creation processing unit 74 as a map data creation unit created every time is provided.
- the created map data 18 is transmitted as feedforward data to the resin coating apparatus M4 described below via the LAN system 2.
- the resin coating device M4 has a function of coating the resin 8 so as to cover the plurality of LED elements 5 mounted on the substrate 4 by the component mounting device M1.
- the resin coating apparatus M4 transfers the work target substrate 4 supplied from the upstream side to the substrate transport mechanism 31 that transports the substrate 4 in the substrate transport direction (arrow f).
- the resin application part C is provided with a resin discharge head 32 configured to discharge the resin 8 from the discharge nozzle 33a attached to the lower end.
- the resin discharge head 32 is driven by the nozzle moving mechanism 34, and the nozzle moving mechanism 34 is controlled by the application control unit 36, whereby the horizontal direction (arrow g shown in FIG. 7A). ) Move and lift operations.
- the resin discharge head 32 is supplied with the resin 8 stored in a syringe attached to the dispenser 33, and the resin discharge mechanism 35 discharges the resin 8 in the dispenser 33 by applying air pressure into the dispenser 33. It is discharged through the nozzle 33 a and applied to the LED mounting portion 4 b formed on the substrate 4. At this time, by controlling the resin discharge mechanism 35 by the application control unit 36, the discharge amount of the resin 8 can be arbitrarily controlled.
- the resin application part C has a function of discharging the resin 8 in a variable amount and applying it to any application target position.
- various liquid discharge methods such as a plunger method using a mechanical cylinder and a screw pump method can be employed for the resin discharge mechanism 35.
- a test hitting / measurement unit 40 is disposed on the side of the substrate transport mechanism 31 so as to be located within the movement range of the resin discharge head 32.
- the test hitting / measurement unit 40 determines whether or not the application amount of the resin 8 is appropriate. It has a function of determining by measuring the light emission characteristics. That is, the light emission characteristics when the light emitted from the measurement light source unit 45 is irradiated onto the translucent member 43 on which the resin 8 has been trial-applied by the resin application unit C, and the light emission characteristics including the spectroscope 42 and the light emission characteristic measurement processing unit 39. By measuring by the characteristic measuring unit and comparing the measurement result with a preset threshold value, the suitability of the preset resin coating amount defined by the resin coating information 14 shown in FIG. 4 is determined.
- composition and properties of the resin 8 containing the phosphor particles are not necessarily stable, and even if an appropriate resin application amount is set in advance in the resin application information 14, the concentration of the phosphor and the resin viscosity over time. Inevitable fluctuations. For this reason, even if the resin 8 is discharged with the discharge parameters corresponding to the preset appropriate resin application amount, the resin application amount itself varies from the preset appropriate value, or the resin application amount itself is appropriate. However, the amount of the phosphor particles to be originally supplied varies depending on the concentration change.
- a test coating for inspecting whether or not an appropriate supply amount of phosphor particles is supplied at a predetermined interval is executed by the resin coating apparatus M4.
- the resin coating unit C provided in the resin coating apparatus M4 shown in the present embodiment includes a measurement coating process for applying the resin 8 to the light-transmitting member 43 for the above-described light emission characteristic measurement, and a substrate for actual production. 4 has a function of executing a production coating process to be applied to the LED element 5 mounted in the state 4. Both the coating process for measurement and the coating process for production are executed when the coating control unit 36 controls the resin coating unit C.
- the translucent member 43 is wound and supplied on the supply reel 47 and fed along the upper surface of the trial hitting stage 40a, and then irradiated with the translucent member mounting portion 41. It is wound around a collection reel 48 driven by a take-up motor 49 via a portion 46.
- a mechanism for rotating the translucent member 43 various methods such as a method of feeding the translucent member 43 into the collection box by a feeding mechanism are adopted in addition to a method of winding the translucent member 43 to collect it. be able to.
- the irradiation unit 46 has a function of irradiating the translucent member 43 with measurement light emitted from the light source unit 45, and the measurement light emitted from the light source unit 45 is contained in a light shielding box 46a having a simple dark box function.
- a light focusing tool 46b guided by a fiber cable is provided.
- the light source unit 45 has a function of emitting excitation light that excites the phosphor contained in the resin 8.
- the light source unit 45 is disposed above the translucent member mounting unit 41 and transmits measurement light.
- the light member 43 is irradiated from above via the light focusing tool 46b.
- the translucent member 43 a flat sheet-like member made of transparent resin is used as a tape material having a predetermined width, or an embossed portion 43a corresponding to the concave shape of the LED package 50 is provided on the lower surface of the same tape material.
- the embossed type etc. which were made are used (refer FIG.8 (b)).
- the resin 8 is trial-applied to the translucent member 43 by the resin ejection head 32.
- a prescribed amount of resin 8 is applied to the translucent member 43 by the discharge nozzle 33a, as shown in FIG. 8B, with respect to the translucent member 43 whose lower surface is supported by the trial hitting stage 40a. This is done by discharging.
- FIGS. 8B and 8I show a state in which the preset appropriate discharge amount of the resin 8 defined by the resin application information 14 is applied to the translucent member 43 made of the tape material described above.
- FIGS. 8B and 8II show a state in which the resin 8 having a preset appropriate discharge amount is similarly applied to the embossed portion 43a of the embossed type translucent member 43 described above.
- the resin 8 applied in the test hitting stage 40a is a test application for empirically determining whether or not the phosphor supply amount is appropriate for the target LED element 5. Therefore, when the resin 8 is continuously applied to the plurality of points on the translucent member 43 by the same trial application operation by the resin discharge head 32, the correlation between the measured light emission characteristic value and the application amount is known. Based on the data, the application amount is varied in stages and applied.
- FIG. 8C shows the structure of the translucent member mounting portion 41 and the integrating sphere 44.
- the translucent member mounting portion 41 has a structure in which an upper guide member 41 c having a function of guiding both end surfaces of the translucent member 43 is mounted on the upper surface of the lower support member 41 b that supports the lower surface of the translucent member 43. Yes.
- the translucent member placement section 41 guides the translucent member 43 during conveyance in the test hitting / measurement unit 40, and places the translucent member 43 on which the resin 8 has been trial-applied in the measurement coating process to hold the position. It has a function to do.
- the integrating sphere 44 has a function of collecting the transmitted light that has been irradiated from the light focusing tool 46 b (arrow h) and transmitted through the resin 8 and led to the spectroscope 42. That is, the integrating sphere 44 has a spherical spherical reflecting surface 44 c inside, and transmitted light (arrow i) incident from the opening 44 a located immediately below the light transmitting opening 41 a is the top of the integrating sphere 44.
- the white light emitted by the LED package used for the light source unit 45 is applied to the resin 8 that has been trial-applied to the translucent member 43.
- the blue light component contained in the white light excites the phosphor in the resin 8 to emit yellow light.
- White light obtained by adding and mixing yellow light and blue light is irradiated upward from the resin 8 and is received by the spectroscope 42 via the integrating sphere 44 described above.
- the received white light is analyzed by the light emission characteristic measurement processing unit 39 to measure the light emission characteristic, as shown in FIG. 7B.
- the light emission characteristics such as the color tone rank of white light and the luminous flux are inspected, and a deviation from the prescribed light emission characteristics is detected as the inspection result.
- the integrating sphere 44, the spectroscope 42, and the light emission characteristic measurement processing unit 39 emit excitation light emitted from the light source unit 45 onto the resin 8 coated with the light transmitting member 43 (here, white light emitted from the white LED). )
- the light emitted from the resin 8 is received from below the translucent member 43, and a light emission characteristic measuring unit for measuring the light emission characteristic of the light emitted from the resin 8 is configured.
- the light emission characteristic measuring unit is configured by disposing the integrating sphere 44 below the translucent member 43, and configured to receive light emitted from the resin 8 through the opening 44a of the integrating sphere 44. Has been.
- the following effects can be obtained by configuring the light emission characteristic measuring unit as described above. That is, in the application shape of the resin 8 to be applied to the translucent member 43 shown in FIG. 8B, the lower surface side is always in contact with the upper surface of the translucent member 43 or the bottom surface of the embossed portion 43a.
- the lower surface of 8 is always at a reference height defined by the translucent member 43. Therefore, the height difference between the lower surface of the resin 8 and the opening 44a of the integrating sphere 44 is always kept constant.
- the upper surface of the resin 8 is not necessarily realized to have the same liquid surface shape and height due to disturbances such as application conditions by the discharge nozzle 33a, and between the upper surface of the resin 8 and the light focusing tool 46b. The interval of will vary.
- the irradiation light irradiated on the resin 8 is the light focusing tool 46b. Therefore, the degree of focusing is high, and the influence of the variation in the distance between the upper surface of the resin 8 and the light focusing tool 46b on the light transmission can be ignored.
- the transmitted light that has passed through the resin 8 is excitation light in which the phosphor is excited inside the resin 8, so that the degree of scattering is high, and the distance between the lower surface of the resin 8 and the opening 44 a varies. Has an influence on the degree of light being taken in by the integrating sphere 44.
- the light emitted from the resin 8 is transmitted by irradiating the resin 8 with the excitation light emitted from the light source unit 45 as described above. Since the configuration in which light is received by the integrating sphere 44 from below the optical member 43 is employed, it is possible to determine stable light emission characteristics. Further, by using the integrating sphere 44, it is not necessary to separately provide a dark room structure in the light receiving portion, so that the apparatus can be made compact and the equipment cost can be reduced.
- the measurement result of the light emission characteristic measurement processing unit 39 is sent to the application amount derivation processing unit 38, and the application amount derivation processing unit 38 defines the measurement result of the light emission characteristic measurement processing unit 39 in advance.
- a deviation from the emitted light emission characteristic is obtained, and a process for deriving an appropriate resin application amount of the resin 8 to be applied to the LED element 5 for actual production is performed based on the deviation.
- the new appropriate discharge amount derived by the application amount derivation processing unit 38 is sent to the production execution processing unit 37, and the production execution processing unit 37 commands the newly derived appropriate resin application amount to the application control unit 36.
- the application control unit 36 controls the nozzle moving mechanism 34 and the resin discharge mechanism 35 to perform a production application process for applying an appropriate resin application amount of the resin 8 to the LED elements 5 mounted on the substrate 4. 32.
- a resin 8 having an appropriate resin coating amount specified in the resin coating information 14 is actually applied, and light emission characteristics are measured while the resin 8 is uncured. Then, based on the obtained measurement results, a non-defective range of emission characteristic measurement values when the emission characteristics are measured for the resin 8 applied in the production coating is set, and the non-defective range is determined for the quality determination in the production coating. It is used as a threshold value (see threshold value data 81a shown in FIG. 11).
- a white LED is used as the light source unit 45 for measuring the light emission characteristics, and is prescribed in advance as a basis for setting a threshold value for quality determination in production coating.
- the regular emission characteristics required for the finished product in which the resin 8 applied to the LED element 5 is cured are biased by the difference in emission characteristics due to the resin 8 being in an uncured state. Emission characteristics are used. Thereby, control of the resin application amount in the resin application process to the LED element 5 can be performed based on the normal light emission characteristics of the finished product.
- the LED package 50 that emits white light is used as the light source unit 45.
- the light emission characteristic measurement of the resin 8 applied by trial can be performed by the light having the same characteristic as the excitation light emitted in the finished LED package 50, and a more reliable test result can be obtained.
- a light source device that can stably emit blue light having a constant wavelength for example, a blue LED that emits blue light or a blue laser light source
- a light source unit for inspection for example, a blue LED that emits blue light or a blue laser light source
- blue light having a predetermined wavelength may be extracted using a band-pass filter.
- a trial placement / measurement unit 140 having the configuration shown in FIGS. 9B and 10A may be used instead of the trial placement / measurement unit 40 having the above-described configuration. That is, as shown in FIGS. 9B and 10A, the test hitting / measurement unit 140 has an external structure in which a cover portion 140b is disposed above an elongated horizontal base portion 140a. The cover part 140b is provided with an opening part 140c, and the opening part 140c can be freely opened and closed by a sliding slide window 140d for application (arrow l).
- a trial hitting stage 145a for supporting the translucent member 43 from the lower surface side, a translucent member mounting portion 141 on which the translucent member 43 is placed, and a translucent member mounting portion 141.
- a spectroscope 42 is provided above.
- the translucent member mounting unit 141 includes a light source device that emits excitation light that excites the phosphor, and the resin 8 is trial-coated in the measurement coating process.
- the light transmissive member 43 is irradiated with excitation light from the lower surface side of the light source device.
- the translucent member 43 is wound and supplied on the supply reel 47 in the same manner as in the example shown in FIG. 8A, and is sent along the upper surface of the test strike stage 145a (arrow m). It is wound around a collection reel 48 that is driven by a winding motor 49 via a space between the mounting portion 141 and the spectroscope 42.
- the resin discharge head 32 applies the resin 8 to the light transmitting member 43 placed on the upper surface. Is possible.
- the resin 8 having a prescribed application amount is applied to the translucent member 43 by the discharge nozzle 33a with respect to the translucent member 43 whose lower surface is supported by the test strike stage 145a. This is done by discharging.
- FIG. 10B the translucent member 43 on which the resin 8 has been trial-applied is moved by the trial hitting stage 145a so that the resin 8 is positioned above the translucent member mounting portion 141, and the cover portion 140b is further moved.
- a state in which a darkroom for measuring light emission characteristics is formed between the base 140a and the base 140a is shown.
- An LED package 50 that emits white light is used as the light source device for the translucent member mounting portion 141.
- the wiring layers 4e and 4d connected to the LED element 5 are connected to the power supply device 142.
- the power supply device 142 When the power supply device 142 is turned on, the LED element 5 is supplied with power for light emission.
- the LED package 50 emits white light.
- the yellow light emitted from the phosphor in the resin 8 is excited by the blue light contained in the white light.
- White light in which light and blue light are added and mixed is irradiated upward from the resin 8.
- a spectroscope 42 is disposed above the trial hitting / measurement unit 140, and the white light emitted from the resin 8 is received by the spectroscope 42, and the received white light is analyzed by the light emission characteristic measurement processing unit 39. The emission characteristics are measured.
- the light emission characteristic measurement processing unit 39 measures the light emission characteristic of the light emitted by the resin 8 by irradiating the resin 8 applied to the light transmitting member 43 with the excitation light emitted from the LED element 5 as the light source part. . Then, the measurement result of the light emission characteristic measurement processing unit 39 is sent to the coating amount derivation processing unit 38, and the same processing as in the example shown in FIG.
- the configuration of the control system of the LED package manufacturing system 1 will be described with reference to FIG.
- the component mounting device M1 and the resin coating device M4 the element characteristic information 12, the resin coating information 14, the map data 18, and the above-mentioned
- the components related to the transmission / reception and update processing of the threshold data 81a are shown.
- the management computer 3 includes a system control unit 60, a storage unit 61, and a communication unit 62.
- the system control unit 60 controls the LED package manufacturing work by the LED package manufacturing system 1 in an integrated manner.
- the storage unit 61 stores element characteristic information 12, resin application information 14, and map data 18 and threshold data 81a as necessary. ing.
- the communication unit 62 is connected to other devices via the LAN system 2 and exchanges control signals and data.
- the element characteristic information 12 and the resin application information 14 are transmitted from the outside via the LAN system 2 and the communication unit 62 or via a single storage medium such as a CD ROM, USB memory storage, SD card, and stored in the storage unit 61. Is done.
- the component mounting apparatus M1 includes a mounting control unit 70, a storage unit 71, a communication unit 72, a mechanism driving unit 73, and a map creation processing unit 74.
- the mounting control unit 70 controls each unit described below based on various programs and data stored in the storage unit 71 in order to execute a component mounting operation by the component mounting apparatus M1.
- the storage unit 71 stores mounting position information 71 a and element characteristic information 12 in addition to programs and data necessary for control processing by the mounting control unit 70.
- the mounting position information 71 a is created from execution history data of mounting operation control by the mounting control unit 70.
- the element characteristic information 12 is transmitted from the management computer 3 via the LAN system 2.
- the communication unit 72 is connected to other devices via the LAN system 2 and exchanges control signals and data.
- the mechanism driving unit 73 is controlled by the mounting control unit 70 to drive the component supply mechanism 25 and the component mounting mechanism 26.
- the map creation processing unit 74 includes mounting position information 71a indicating the position on the substrate 4 of the LED element 5 stored in the storage unit 71 and mounted by the component mounting apparatus M1, and an element for the LED element 5 A process of creating the map data 18 associated with the characteristic information 12 for each substrate 4 is performed. That is, the map data creation unit is provided in the component mounting apparatus M1, and the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4. The map data 18 may be transmitted from the component mounting apparatus M1 to the resin coating apparatus M4 via the management computer 3. In this case, the map data 18 is also stored in the storage unit 61 of the management computer 3 as shown in FIG.
- the resin coating apparatus M4 includes a coating control unit 36, a storage unit 81, a communication unit 82, a production execution processing unit 37, a coating amount derivation processing unit 38, and a light emission characteristic measurement processing unit 39.
- the application control unit 36 controls the nozzle moving mechanism 34, the resin discharge mechanism 35, and the test hitting / measurement unit 40 constituting the resin application unit C, so that the resin 8 is applied to the translucent member 43 for light emission characteristic measurement.
- the measurement coating process to be performed and the production coating process to be applied to the LED element 5 for actual production are performed.
- the storage unit 81 stores programs and data necessary for control processing by the application control unit 36, as well as resin application information 14, map data 18, threshold data 81a, and actual production application amount 81b.
- the resin application information 14 is transmitted from the management computer 3 via the LAN system 2, and the map data 18 is similarly transmitted from the component mounting apparatus M1 via the LAN system 2.
- the communication unit 82 is connected to other devices via the LAN system 2 and exchanges control signals and data.
- the light emission characteristic measurement processing unit 39 performs a process of measuring the light emission characteristic of the light emitted from the resin by irradiating the resin 8 applied to the light transmitting member 43 with the excitation light emitted from the light source unit 45.
- the application amount derivation processing unit 38 obtains a deviation between the measurement result of the light emission characteristic measurement processing unit 39 and a predetermined light emission characteristic, and based on this deviation, the resin 8 to be applied to the LED element 5 for actual production. An arithmetic process for deriving an appropriate resin application amount is performed. Then, the production execution processing unit 37 instructs the application control unit 36 to specify the appropriate resin application amount derived by the application amount derivation processing unit 38, thereby applying the appropriate resin application amount of resin to the LED element 5. Execute the process.
- processing functions other than the function for executing work operations unique to each apparatus for example, the function of the map creation processing unit 74 provided in the component mounting apparatus M1, and the resin coating apparatus M4 are provided.
- the function of the applied amount derivation processing unit 38 is not necessarily attached to the apparatus.
- the functions of the map creation processing unit 74 and the coating amount derivation processing unit 38 are covered by the arithmetic processing function of the system control unit 60 of the management computer 3 and necessary signal exchange is performed via the LAN system 2. It may be configured.
- both the component mounting apparatus M1 and the resin coating apparatus M4 are connected to the LAN system 2. Then, the management computer 3 and the LAN system 2 in which the element characteristic information 12 is stored in the storage unit 61 uses the information obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance as the element characteristic information. 12 is an element characteristic information providing unit provided to the component mounting apparatus M1.
- the element characteristic information providing unit that provides the element characteristic information 12 to the component mounting apparatus M1 and the resin information providing unit that provides the resin coating information 14 to the resin coating apparatus M4 are the storage unit 61 of the management computer 3 that is an external storage unit.
- the element characteristic information and the resin application information read out are transmitted to the component mounting apparatus M1 and the resin application apparatus M4 via the LAN system 2, respectively.
- element characteristic information 12 and resin application information 14 are acquired (ST1). That is, the appropriate resin application amount of the resin 8 for obtaining the LED package 50 having the element characteristic information 12 obtained by separately measuring the emission characteristics including the emission wavelengths of the plurality of LED elements 5 in advance and the prescribed emission characteristics.
- the resin application information 14 in which the element characteristic information 12 is associated is acquired from an external device via the LAN system 2 or via a storage medium.
- the board 4 to be mounted is carried into the component mounting apparatus M1 (ST2).
- the resin adhesive 23 is supplied to the element mounting position in the LED mounting portion 4b by raising and lowering the transfer pin 24a of the adhesive transfer mechanism 24 (arrow n).
- the LED element 5 held by the mounting nozzle 26a of the component mounting mechanism 26 is lowered (arrow o) and mounted in the LED mounting portion 4b of the substrate 4 via the resin adhesive 23 ( ST3).
- the map creation processing unit 74 creates map data 18 that associates the mounting position information 71a with the element characteristic information 12 of each LED element 5 for the board 4 from the execution data of the component mounting work (ST4). ).
- the map data 18 is transmitted from the component mounting apparatus M1 to the resin coating apparatus M4, and the resin coating information 14 is transmitted from the management computer 3 to the resin coating apparatus M4 (ST5). Thereby, it will be in the state which can perform the resin coating operation
- the substrate 4 after component mounting is sent to the curing device M2, where it is heated, whereby as shown in FIG. 18 (c), the resin adhesive 23 is thermally cured to become a resin adhesive 23 *.
- the LED element 5 is fixed to the individual substrate 4a.
- the substrate 4 after resin curing is sent to the wire bonding apparatus M3, and as shown in FIG. 18 (d), the wiring layers 4e and 4d of the individual substrate 4a are respectively connected to the N-type portion electrodes 6a and P of the LED element 5.
- the mold part electrode 6 b is connected to the bonding wire 7.
- threshold data creation processing for non-defective product determination is executed (ST6). This process is executed in order to set a pass / fail judgment threshold value in production coating (see threshold value data 81a shown in FIG. 11). Bin codes [1], [2], [3 ], [4], and [5] are repeatedly executed for each of the production coatings. Details of the threshold data creation processing will be described with reference to FIGS. 13, 14A to 14C, and FIG. In FIG. 13, first, a resin 8 containing a phosphor specified in the resin application information 14 at a genuine concentration is prepared (ST11).
- the resin discharge head 32 is moved to the test hitting stage 40 a of the test hitting / measurement unit 40, and the resin 8 is applied to the specified application amount (appropriate resin application) indicated in the resin application information 14.
- the amount is applied to the translucent member 43 (ST12).
- the resin 8 applied to the translucent member 43 is moved onto the translucent member mounting portion 41, the LED element 5 is caused to emit light, and the light emission characteristics in an uncured state of the resin 8 are measured by the light emission characteristic measuring section having the above-described configuration. Measure (ST13).
- a non-defective product determination range of the measurement value for determining the light emission characteristic to be non-defective is set (ST14).
- the non-defective product determination range is stored as threshold data 81a in the storage unit 81, transferred to the management computer 3, and stored in the storage unit 61 (ST15).
- FIGS. 14A to 14C show threshold data created in this way, that is, measurement of light emission characteristics obtained in the uncured state of resin after applying resin 8 containing a genuine phosphor content.
- the non-defective product determination range (threshold value) of the measured value for determining that the value and the light emission characteristic are good products is shown.
- the phosphor concentration in the resin 8 is 5%, respectively.
- the threshold values corresponding to the Bin codes [1], [2], [3], [4], and [5] in the case of 10% and 15% are shown.
- each of the Bin codes 12b corresponds to the application amount shown in each of the appropriate resin application amounts 15 (1).
- the measurement result obtained by measuring the light emission characteristics of the light emitted from the resin 8 by irradiating the resin 8 coated with the respective coating amounts with the blue light of the LED element 5 is the light emission characteristic measured value 39a (1 ).
- threshold data 81a (1) is set based on the respective emission characteristic measurement values 39a (1).
- the measurement result of measuring the light emission characteristics of the resin 8 coated with the appropriate resin coating amount VA0 corresponding to the Bin code [1] is based on the chromaticity coordinates ZA0 (XA0, YA0) on the chromaticity table shown in FIG. expressed.
- a predetermined range for example, ⁇ 10%
- a non-defective product determination range for example, ⁇ 10%
- a non-defective product determination range (threshold value) is set based on the light emission characteristic measurement results (chromaticity table shown in FIG. 15). (See chromaticity coordinates ZB0 to ZE0 above).
- the predetermined range set as the threshold is appropriately set according to the accuracy level of the light emission characteristics required for the LED package 50 as a product.
- 14 (b) and 14 (c) show the emission characteristic measurement values and non-defective product determination ranges (threshold values) when the phosphor concentrations of the resin 8 are 10% and 15%, respectively.
- the appropriate resin application amount 15 (2) and the appropriate resin application amount 15 (3) indicate the appropriate resin application amounts when the phosphor concentrations are 10% and 15%, respectively.
- the emission characteristic measurement value 39a (2) and the emission characteristic measurement value 39a (3) are emission specific measurement values when the phosphor concentrations are 10% and 15%, respectively, and threshold data 81a ( 2)
- the threshold value data 81a (3) indicates a non-defective product determination range (threshold value) in each case.
- the threshold data created in this way is selectively used according to the Bin code 12b to which the target LED element 5 belongs in the production application work.
- the threshold data creation process shown in (ST6) is executed as an off-line operation by a single inspection apparatus provided separately from the LED package manufacturing system 1, and is stored in the management computer 3 as threshold data 81a in advance. It is also possible to transmit the received data to the resin coating apparatus M4 via the LAN system 2.
- the substrate 4 after wire bonding is transported to the resin coating device M4 (ST7), and as shown in FIG. 19A, the resin is discharged from the discharge nozzle 33a into the LED mounting portion 4b surrounded by the reflecting portion 4c. 8 is discharged.
- the resin application information 14 based on the map data 18, the threshold value data 81a, and the resin application information 14, an operation of applying a prescribed amount of the resin 8 shown in FIG. 19B covering the LED element 5 is performed (ST8). Details of this resin coating operation processing will be described with reference to FIGS. 14 (a) to 14 (c) and FIG.
- the resin container is exchanged as necessary (ST21). That is, the dispenser 33 attached to the resin discharge head 32 is replaced with one containing a resin 8 having a phosphor concentration selected according to the characteristics of the LED element 5.
- the resin application portion C is used to test-apply the resin 8 to the translucent member 43 for measurement of light emission characteristics (measurement application step) (ST22). That is, the resin 8 having an appropriate resin application amount (VA0 to VE0) for each of the Bin cords 12b defined in FIG. 4 is formed on the light transmitting member 43 drawn out to the trial placement stage 40a by the trial placement / measurement unit 40. Apply. At this time, even if the discharge operation parameter corresponding to the appropriate resin application amount (VA0 to VE0) is commanded to the resin discharge mechanism 35, the actual resin application amount discharged from the discharge nozzle 33a and applied to the translucent member 43 is the resin.
- the proper resin coating amount does not necessarily become the above-mentioned appropriate resin coating amount due to the change in the property of 8 over time, and the actual resin coating amount is VA1 to VE1 somewhat different from VA0 to VE0, as shown in FIG.
- the translucent member 43 on which the resin 8 has been trial-applied is sent and placed on the translucent member mounting portion 41 (translucent member mounting step).
- the excitation light which excites a fluorescent substance is light-emitted from the light source part 45 arrange
- the light emission characteristic measurement processing unit 39 measures the light emission characteristic (light emission characteristic measurement step) (ST23).
- the measurement result is within the threshold value (ST24), and as shown in FIG. 17C, the deviation obtained in (ST23) is compared with the threshold value.
- the deviations ( ⁇ XA, ⁇ YA) to ( ⁇ XE, ⁇ YE) are within a range of ⁇ 10% with respect to ZA0 to ZE0.
- the application amount is corrected (ST25). That is, the deviation between the measurement result in the light emission characteristic measurement step and the predetermined light emission characteristic is obtained, and as shown in FIG. 17 (d), the actual production to be applied to the LED element 5 based on the obtained deviation.
- the process of deriving the new appropriate resin application amount (VA2 to VE2) is executed by the application amount deriving processing unit 38 (application amount deriving process step).
- the corrected appropriate resin coating amount (VA2 to VE2) is an updated value obtained by adding a correction amount corresponding to each deviation to the preset appropriate resin coating amount VA0 to VE0.
- the relationship between the deviation and the correction amount is recorded in the resin application information 14 as known accompanying data in advance.
- the processes of (ST22), (ST23), (ST24), and (ST25) are repeatedly executed, and the measurement result is defined in advance in (ST24).
- the proper resin coating amount for actual production is determined.
- the appropriate resin coating amount is determined by repeatedly executing the measurement coating step, the translucent member placement step, the excitation light emission step, the light emission characteristic measurement step, and the coating amount derivation step. I try to derive.
- the determined proper resin application amount is stored in the storage unit 81 as the actual production application amount 81b.
- the production coating is executed (ST31). That is, when the production execution processing unit 37 instructs the application control unit 36 that controls the resin discharge mechanism 35, the appropriate resin application amount derived by the application amount derivation processing unit 38 and stored as the actual production application amount 81b. A production application process for applying the appropriate amount of resin 8 on the LED element 5 mounted on the substrate 4 is executed (production execution step).
- the number of times of application by the dispenser 33 is counted, and it is monitored whether or not the predetermined number of times of application has passed (ST32). That is, until the predetermined number of times is reached, it is determined that there is little change in the properties of the resin 8 and the phosphor concentration, and the production coating execution (ST31) is repeated while maintaining the same actual production coating amount 81b. If the predetermined number of times has been confirmed in (ST32), it is determined that there is a possibility that the property of the resin 8 or the phosphor concentration has changed, and the process returns to (ST22). And the coating amount correction process based on the measurement result is repeatedly executed.
- the substrate 4 is sent to the curing device M5, and the resin 8 is cured by heating by the curing device M5 (ST9).
- the resin 8 applied so as to cover the LED element 5 is thermally cured to become the resin 8 *, and is fixed in the LED mounting portion 4b.
- the substrate 4 after the resin curing is sent to the individual piece cutting device M6, where the substrate 4 is cut into the individual piece substrates 4a, and as shown in FIG. (ST10). Thereby, the LED package 50 is completed.
- the LED package manufacturing system 1 shown in the embodiment described above separately measures the component mounting apparatus M1 for mounting the plurality of LED elements 5 on the substrate 4 and the emission wavelengths of the plurality of LED elements 5 in advance.
- the element characteristic information providing unit that provides the obtained information as element characteristic information 12 and the appropriate resin application amount of the resin 8 for obtaining the LED package 50 having the prescribed light emission characteristic correspond to the element characteristic information 12.
- the appropriate resin coating amount of the resin 8 for having a light emitting property has a configuration that includes a resin coating device M4 to be applied to each LED element mounted on the substrate 4.
- the resin coating apparatus M4 controls the resin coating unit C that discharges the resin 8 in a variable amount and applies the resin 8 to an arbitrary coating target position, and the resin coating unit C.
- a coating control unit 36 that executes a coating process for measurement that is applied to the translucent member 43 and a production coating process that is applied to the LED element 5 for actual production, and a light source unit that emits excitation light that excites the phosphor.
- the translucent member mounting portion 41 on which the translucent member 43 on which the resin 8 has been trial-applied in the measurement application process is placed, and the excitation light emitted from the light source unit on the translucent member 43.
- a light emission characteristic measuring unit that measures the light emission characteristic of the light emitted from the resin 8 by irradiation, and obtaining a deviation between a measurement result of the light emission characteristic measuring part and a predetermined light emission characteristic, and applying an appropriate resin based on this deviation Correct the amount
- the application control unit 36 with the application amount derivation processing unit 38 for deriving the appropriate resin application amount for actual production to be applied to the LED element 5
- It has a configuration including a production execution processing unit 37 that executes a production application process for applying a resin application amount of resin to the LED element 5.
- the translucent member 43 on which the resin 8 is trial-coated for light emission characteristic measurement is placed on the translucent member.
- This resin is placed on the unit 41, emits excitation light for exciting the phosphor from the light source unit 45 disposed above, and irradiates the resin 8 applied to the translucent member 43 from above with this resin. 8 is obtained from the lower side of the translucent member 43 and the light emission characteristic of the light is measured, and a deviation between the predetermined light emission characteristic is obtained, and the LED element 5 is used for actual production based on this deviation.
- the appropriate resin application amount of the resin to be applied can be derived. Thereby, even when the light emission wavelengths of the individual LED elements 5 vary, the light emission characteristics of the LED package 50 can be made uniform and the production yield can be improved.
- the LED package manufacturing system 1 having the above-described configuration shows a configuration in which the management computer 3 and the component mounting apparatus M1 to the individual piece cutting apparatus M6 are connected by the LAN system 2.
- the LAN system 2 is indispensable. It is not a configuration requirement. That is, there is a storage unit that stores element characteristic information 12 and resin application information 14 that are prepared in advance and transmitted from the outside for each LED package 50, and from these storage units, the element characteristics are transmitted to the component mounting apparatus M1. If there is a data providing unit that can provide the information 12 and the resin coating information 14 and the map data 18 to the resin coating apparatus M4 as needed, the LED package manufacturing system 1 according to the present embodiment can be provided. Function can be realized.
- the LED package manufacturing system of the present invention has the effect that even if the light emission wavelength of individual LED elements varies, the light emission characteristics of the LED package can be made uniform and the production yield can be improved.
- the present invention can be used in the field of manufacturing an LED package in which the element is covered with a resin containing a phosphor.
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Abstract
Description
2 LANシステム
4 基板
4a 個片基板
4b LED実装部
4c 反射部
5 LED素子
8 樹脂
12 素子特性情報
13A,13B,13C,13D,13E LEDシート
14 樹脂塗布情報
18 マップデータ
23 樹脂接着剤
24 接着剤転写機構
25 部品供給機構
26 部品実装機構
32 樹脂吐出ヘッド
33 ディスペンサ
33a 吐出ノズル
40、140 試し打ち・測定ユニット
40a 試し打ちステージ
41、141 透光部材載置部
42 分光器
43 透光部材
44 積分球
46 照射部
50 LEDパッケージ
Claims (8)
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムであって、
前記基板に複数の前記LED素子を実装する部品実装装置と、
前記複数のLED素子の発光波長を含む発光特性を予め個別に測定して得られた情報を素子特性情報として提供する素子特性情報提供部と、
規定の発光特性を具備したLEDパッケージを得るための前記樹脂の適正樹脂塗布量と前記素子特性情報とを対応させた情報を樹脂塗布情報として提供する樹脂情報提供部と、
前記部品実装装置によって実装されたLED素子の前記基板における位置を示す実装位置情報と当該LED素子についての前記素子特性情報とを関連付けたマップデータを、前記基板毎に作成するマップデータ作成部と、
前記マップデータと前記樹脂塗布情報に基づき、規定の発光特性を具備するための適正樹脂塗布量の前記樹脂を、前記基板に実装された各LED素子に塗布する樹脂塗布装置とを備え、
前記樹脂塗布装置は、前記樹脂を塗布量を可変に吐出して任意の塗布対象位置に塗布する樹脂塗布部と、前記樹脂塗布部を制御することにより、前記樹脂を発光特性測定用として透光部材に試し塗布する測定用塗布処理および実生産用として前記LED素子に塗布する生産用塗布処理を実行させる塗布制御部と、前記測定用塗布処理において前記樹脂が試し塗布された透光部材が載置される透光部材載置部と、前記透光部材載置部の上方に配置され前記蛍光体を励起する励起光を発光する光源部と、前記励起光を前記透光部材に塗布された樹脂に上方から照射することによりこの樹脂が発する光を前記透光部材の下方から受光して前記光の発光特性を測定する発光特性測定部と、前記発光特性測定部の測定結果と予め規定された発光特性との偏差を求めこの偏差に基づいて前記適正樹脂塗布量を補正することにより、前記LED素子に塗布されるべき実生産用の適正樹脂塗布量を導出する塗布量導出処理部と、
前記導出された適正樹脂塗布量を前記塗布制御部に指令することにより、この適正樹脂塗布量の樹脂をLED素子に塗布する生産用塗布処理を実行させる生産実行処理部とを備えたことを特徴とするLEDパッケージ製造システム。 - 前記光源部として、白色光を発するLEDパッケージを用いることを特徴とする請求項1記載のLEDパッケージ製造システム。
- 前記発光特性測定部は積分球を前記透光部材の下方に配置して成り、前記樹脂が発する光を前記積分球の開口部を介して受光することを特徴とする請求項1または2のいずれかに記載のLEDパッケージ製造システム。
- 前記部品実装装置、樹脂塗布装置はいずれもLANシステムに接続されており、前記素子特性情報提供部および樹脂情報提供部は、外部記憶手段より読み出された前記素子特性情報および樹脂塗布情報を、前記LANシステムを介して前記部品実装装置および樹脂塗布装置にそれぞれ送信することを特徴とする請求項1乃至3のいずれか一項に記載のLEDパッケージ製造システム。
- 前記マップデータ作成部は前記部品実装装置に設けられており、前記マップデータは部品実装装置から前記樹脂塗布装置に送信されることを特徴とする請求項1乃至4のいずれか一項に記載のLEDパッケージ製造システム。
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムにおいて、部品実装装置によって前記基板に実装された複数のLED素子を覆って前記樹脂を塗布するLEDパッケージ製造システムにおける樹脂塗布方法であって、
前記LEDパッケージ製造システムは、前記基板に複数の前記LED素子を実装する部品実装装置と、前記複数のLED素子の発光波長を含む発光特性を予め個別に測定して得られた情報を素子特性情報として提供する素子特性情報提供部と、規定の発光特性を具備したLEDパッケージを得るための前記樹脂の適正樹脂塗布量と前記素子特性情報とを対応させた情報を樹脂塗布情報として提供する樹脂情報提供部と、前記部品実装装置によって実装されたLED素子の前記基板における位置を示す実装位置情報と当該LED素子についての前記素子特性情報とを関連付けたマップデータを、前記基板毎に作成するマップデータ作成部と、前記マップデータと前記樹脂塗布情報に基づき、完成製品に求められる正規の発光特性を具備するための適正樹脂塗布量の前記樹脂を、前記基板に実装された各LED素子に塗布する樹脂塗布装置とを備え、
前記樹脂を塗布量を可変に吐出する樹脂吐出部によって、前記樹脂を発光特性測定用として透光部材に試し塗布する測定用塗布工程と、
前記樹脂が試し塗布された透光部材を透光部材載置部に載置する透光部材載置工程と、
前記透光部材載置部の上方に配置された光源部から前記蛍光体を励起する励起光を発光する励起光発光工程と、
前記励起光を前記透光部材に塗布された樹脂に上方から照射することによりこの樹脂が発する光を前記透光部材の下方から受光して、前記光の発光特性を測定する発光特性測定工程と、
前記発光特性測定工程における測定結果と予め規定された発光特性との偏差を求め、この偏差に基づいて前記適正樹脂塗布量を補正することにより、前記LED素子に塗布されるべき実生産用の適正樹脂塗布量を導出する塗布量導出処理工程と、
前記導出された適正樹脂塗布量を前記樹脂吐出部を制御する塗布制御部に指令することにより、この適正樹脂塗布量の樹脂をLED素子に塗布する生産用塗布処理を実行させる生産実行工程とを含むことを特徴とするLEDパッケージ製造システムにおける樹脂塗布方法。 - 前記光源部として白色光を発するLEDパッケージを用い、前記予め規定された発光特性は、LED素子に塗布された前記樹脂が硬化した状態の完成製品について求められる正規の発光特性を、前記樹脂が未硬化の状態であることによる発光特性の相違分だけ偏らせた発光特性であることを特徴とする請求項6に記載のLEDパッケージ製造システムにおける樹脂塗布方法。
- 前記測定用塗布工程、透光部材載置工程、励起光発光工程、発光特性測定工程および塗布量導出工程を反復実行することにより、前記適正樹脂塗布量を確定的に導出することを特徴とする請求項6または7のいずれかに記載のLEDパッケージ製造システムにおける樹脂塗布方法。
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US14/000,346 US8993353B2 (en) | 2011-05-30 | 2012-05-30 | LED package manufacturing system and resin coating method for use in LED package manufacturing system |
DE112012002301.3T DE112012002301T5 (de) | 2011-05-30 | 2012-05-30 | LED-Gehäusefertigungssystem und Harzbeschichtungsverfahren zur Verwendung in einem LED-Gehäusefertigungssystem |
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US20130323862A1 (en) | 2013-12-05 |
US8993353B2 (en) | 2015-03-31 |
KR20140004736A (ko) | 2014-01-13 |
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