JP2012094674A - 樹脂塗布装置および樹脂塗布方法 - Google Patents
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Abstract
【解決手段】LED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージの製造に用いられる樹脂塗布において、樹脂8を発光特性測定用として試し塗布した透光部材43を光源部を備えた透光部材載置部41に載置し、光源部から発光された励起光を透光部材43に塗布された樹脂8に照射することによりこの樹脂8が発する光の発光特性を発光特性測定部39によって測定した測定結果と予め規定された発光特性との偏差を求め、この偏差に基づいて実生産用としてLED素子に塗布されるべき樹脂の適正樹脂塗布量を導出する。
【選択図】図7
Description
2 LANシステム
4 基板
4a 個片基板
4b LED実装部
4c 反射部
5 LED素子
8 樹脂
12 素子特性情報
13A,13B,13C,13D,13E LEDシート
14 樹脂塗布情報
18 マップデータ
23 樹脂接着剤
24 接着剤転写機構
25 部品供給機構
26 部品実装機構
32 樹脂吐出ヘッド
33 ディスペンサ
33a 吐出ノズル
40 試し打ち・測定ユニット
41 透光部材載置部
42 分光器
43 透光部材
45 試し打ちステージ
50 LEDパッケージ
Claims (5)
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムに用いられ、前記基板に実装されたLED素子を覆って前記樹脂を塗布する樹脂塗布装置であって、
前記樹脂を塗布量を可変に吐出して任意の塗布対象位置に塗布する樹脂塗布部と、
前記樹脂塗布部を制御することにより、前記樹脂を発光特性測定用として透光部材に試し塗布する測定用塗布処理および実生産用として前記LED素子に塗布する生産用塗布処理を実行させる塗布制御部と、
前記蛍光体を励起する励起光を発光する光源部を備え前記測定用塗布処理において前記樹脂が試し塗布された透光部材が載置される透光部材載置部と、
前記光源部から発光された励起光を前記透光部材に塗布された樹脂に照射することによりこの樹脂が発する光の発光特性を測定する発光特性測定部と、
前記発光特性測定部の測定結果と予め規定された発光特性との偏差を求め、この偏差に基づいて実生産用として前記LED素子に塗布されるべき前記樹脂の適正樹脂塗布量を導出する塗布量導出処理部と、
前記適正樹脂塗布量を前記塗布制御部に指令することにより、この適正樹脂塗布量の樹脂をLED素子に塗布する生産用塗布処理を実行させる生産実行処理部とを備えたことを特徴とする樹脂塗布装置。 - 前記光源部として、LED素子を用いることを特徴とする請求項1記載の樹脂塗布装置。
- 基板に実装されたLED素子を蛍光体を含む樹脂によって覆って成るLEDパッケージを製造するLEDパッケージ製造システムに用いられ、前記基板に実装されたLED素子を覆って前記樹脂を塗布する樹脂塗布方法であって、
前記樹脂を塗布量を可変に吐出する樹脂吐出部によって、前記樹脂を発光特性測定用として透光部材に試し塗布する測定用塗布工程と、
前記樹脂が試し塗布された透光部材を前記蛍光体を励起する励起光を発光する光源部を備えた透光部材載置部に載置する透光部材載置工程と、
前記光源部から発光された励起光を前記透光部材に塗布された樹脂に照射することによりこの樹脂が発する光の発光特性を測定する発光特性測定工程と、
前記発光特性測定工程における測定結果と予め規定された発光特性との偏差を求め、この偏差に基づいて実生産用として前記LED素子に塗布されるべき前記樹脂の適正樹脂塗布量を導出する塗布量導出処理工程と、
前記導出された適正樹脂塗布量を前記樹脂吐出部を制御する塗布制御部に指令することにより、この適正樹脂塗布量の樹脂をLED素子に塗布する生産用塗布処理を実行させる生産実行工程とを含むことを特徴とする樹脂塗布方法。 - 前記光源部として蛍光体を含まない樹脂で封止されたLED素子を用い、前記予め規定された発光特性は、LED素子に塗布された前記樹脂が硬化した状態の完成製品について求められる正規の発光特性を、前記樹脂が未硬化の状態であることによる発光特性の相違分だけ偏らせた発光特性であることを特徴とする請求項3に記載の樹脂塗布方法。
- 前記測定用塗布工程、透光部材載置工程、発光特性測定工程および塗布量導出工程を反復実行することにより、前記適正樹脂塗布量を確定的に導出することを特徴とする請求項3または4に記載の樹脂塗布方法。
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JP2010240467A JP5310699B2 (ja) | 2010-10-27 | 2010-10-27 | 樹脂塗布装置および樹脂塗布方法 |
US13/881,881 US20130210174A1 (en) | 2010-10-27 | 2011-05-11 | Resin coating device and resin coating method |
PCT/JP2011/002615 WO2012056604A1 (ja) | 2010-10-27 | 2011-05-11 | 樹脂塗布装置および樹脂塗布方法 |
CN201180062311.5A CN103270613B (zh) | 2010-10-27 | 2011-05-11 | 树脂涂覆装置和树脂涂覆方法 |
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Cited By (4)
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WO2012164931A1 (ja) * | 2011-05-30 | 2012-12-06 | パナソニック株式会社 | 樹脂塗布装置および樹脂塗布方法 |
WO2012164930A1 (ja) * | 2011-05-30 | 2012-12-06 | パナソニック株式会社 | Ledパッケージ製造システムおよびledパッケージ製造システムにおける樹脂塗布方法 |
JP2014003093A (ja) * | 2012-06-15 | 2014-01-09 | Sharp Corp | 発光装置の製造方法及び色計測装置 |
US10290780B2 (en) | 2016-06-30 | 2019-05-14 | Nichia Corporation | Method for manufacturing light-emitting device |
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JP2013168534A (ja) * | 2012-02-16 | 2013-08-29 | Panasonic Corp | 樹脂塗布装置および樹脂塗布方法 |
JP2013168533A (ja) * | 2012-02-16 | 2013-08-29 | Panasonic Corp | 樹脂塗布装置および樹脂塗布方法 |
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WO2012023425A1 (ja) * | 2010-08-17 | 2012-02-23 | コニカミノルタオプト株式会社 | 発光装置の製造方法 |
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Also Published As
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WO2012056604A1 (ja) | 2012-05-03 |
CN103270613B (zh) | 2016-07-06 |
CN103270613A (zh) | 2013-08-28 |
US20130210174A1 (en) | 2013-08-15 |
JP5310699B2 (ja) | 2013-10-09 |
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