WO2012162917A1 - 阵列基板的检测方法及检测系统 - Google Patents

阵列基板的检测方法及检测系统 Download PDF

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Publication number
WO2012162917A1
WO2012162917A1 PCT/CN2011/076048 CN2011076048W WO2012162917A1 WO 2012162917 A1 WO2012162917 A1 WO 2012162917A1 CN 2011076048 W CN2011076048 W CN 2011076048W WO 2012162917 A1 WO2012162917 A1 WO 2012162917A1
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Prior art keywords
signal line
control signal
temperature
array substrate
point
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PCT/CN2011/076048
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English (en)
French (fr)
Inventor
郑文达
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/265,869 priority Critical patent/US20120310552A1/en
Publication of WO2012162917A1 publication Critical patent/WO2012162917A1/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/72—Investigating presence of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J2005/0077—Imaging

Definitions

  • the invention relates to LCD (liquid-crystal)
  • LCD liquid-crystal
  • the invention relates to the field of manufacturing technology, and particularly to a method and a detection system for an LCD array substrate.
  • TFT-LCD thin-film transistor liquid-crystal Display, thin film transistor liquid crystal display
  • color film color Film
  • array process the wiring on the array substrate is tested to avoid defects in order to ensure the quality of the product.
  • open/short test or open AOI Automatic optical inspection
  • Optical Inspection automatic optical inspection
  • the array substrate is distributed with a plurality of vertically arranged data lines and gate lines, as shown in FIG. 1 , the m rows and n columns of the array substrate, wherein x1, x2, x3, x4, ...xm Indicates m gate lines, and y1, y2, y3, y4, ... yn denotes n data lines.
  • DEFECT defects inside these data lines and/or gate lines, such as hollows, bubbles, etc., which cause defects in their density, and open/short Test (open circuit / short circuit detection) or AOI (Automatic Optical Inspection) is not easy to detect.
  • open/short Test open circuit / short circuit detection
  • AOI Automatic Optical Inspection
  • the product enters the subsequent process, which causes a lot of waste.
  • An object of the present invention is to provide an array substrate detecting method and a detecting system for solving the problem of detecting defects inside the data line/gate line of the array substrate.
  • An object of the present invention is to provide an array substrate detecting method and a detecting system for solving the problem of detecting defects inside the data line/gate line of the array substrate.
  • the present invention is implemented as follows:
  • a method for detecting an array substrate comprising:
  • thermo imager performs temperature sensing on the control signal line to form an infrared thermal image
  • control signal line is a data line or a gate line on the array substrate.
  • the temperature sensing is performed on the control signal line after the power supply, and the recording the temperature sensing result specifically includes: sensing the control signal line after power supply point by point, and recording point by point The temperature data of the control signal line.
  • the temperature sensing is performed on the control signal line after the power supply, and the recording the temperature sensing result specifically includes: sensing the entire control signal line after the power supply, and recording the entire The temperature data of the control signal line is described.
  • the method further includes:
  • the detected defect points on the control signal line are cleared, and the defect points are filled with a material forming the control signal line.
  • the invention also provides another method for detecting an array substrate, the method comprising:
  • Finding abnormal temperature data in the temperature sensing result searching for a point on the control signal line corresponding to the abnormal temperature data, and using a point on the control signal line corresponding to the abnormal temperature data as a defect point.
  • control signal line is a data line or a gate line on the array substrate.
  • the temperature sensing is performed on the control signal line after the power supply
  • the recording the temperature sensing result specifically includes: sensing the control signal line point by point, and recording the point by point
  • the temperature data of the control signal line is determined.
  • the searching for the abnormal temperature data in the temperature sensing result specifically includes: comparing the recorded temperature data of the control signal line, and using the temperature value as the abnormal temperature data.
  • the temperature sensing is performed on the control signal line after the power supply, and the recording the temperature sensing result specifically includes: sensing the entire control signal line, and recording the entire control signal.
  • the temperature data of the line forms a temperature profile of the control signal line; and the searching for the abnormal temperature data in the temperature sensing result specifically includes: searching for a point having an amplitude change in the temperature curve, and the amplitude is The temperature value of the changed point is taken as the abnormal temperature data.
  • the method specifically includes:
  • thermo imager senses temperature of the control signal line to form an infrared thermal image; determining the color according to the color of the image in the infrared thermal image The abnormal temperature data is searched for a point on the control signal line corresponding to the abnormal temperature data.
  • the method further includes:
  • the detected defect points on the control signal line are cleared, and the defect points are filled with a material forming the control signal line.
  • the sensing the temperature of the control signal line after the power supply specifically includes:
  • temperature sensing is performed on the gate lines on the array substrate; after the data lines on the array substrate are formed, the data lines on the array substrate are performed Temperature sensing.
  • the sensing the temperature of the control signal line after the power supply specifically includes:
  • temperature sensing is performed on the gate lines and the data lines on the array substrate at the same time.
  • the invention also provides a detection system for an array substrate, characterized in that the system comprises:
  • a power source for supplying power to at least one type of control signal line on the array substrate through the detecting circuit
  • a detecting circuit configured to connect the power source and the control signal line, so that the power source supplies power to the control signal line, and inputs an input current
  • the temperature sensing device is configured to sense the temperature of each point of the control signal line after the power-on set time, and is used to record and display the temperature sensing result.
  • the temperature sensing device is a thermal imager, and the thermal imager is configured to sense a temperature of the control signal line after a set time of power-on, forming and controlling The infrared thermal image corresponding to the signal line.
  • the defect detection method and system of the array substrate provided by the present invention can detect defects of the array substrate data line or/and the inside of the gate line, thereby preventing bad products from entering the subsequent process. Improve product quality and avoid waste.
  • the defect detection method and system of the array substrate provided by the present invention can detect defects of the array substrate data line or/and the inside of the gate line, thereby preventing bad products from entering the subsequent process. Improve product quality and avoid waste.
  • FIG. 1 is a schematic diagram showing a distribution of data lines and gate lines of a prior art array substrate
  • FIG. 2 is a flow chart of a first preferred embodiment of a method for detecting an array substrate defect according to the present invention
  • FIG. 3 is a schematic diagram of an infrared thermal image provided by the present invention.
  • FIG. 4 is a flowchart of a second preferred embodiment of the array substrate defect detecting method provided by the present invention.
  • FIG. 5 is a schematic block diagram of a preferred embodiment of an array substrate defect detecting system according to the present invention.
  • control signal lines the data lines and the gate lines on the array substrate are collectively referred to as control signal lines.
  • FIG. 2 is a flowchart of a first preferred embodiment of a method for detecting an array substrate defect according to the present invention, including the following steps:
  • the power supply to the data line can be performed one by one, and the data line generates a certain amount of heat due to the current input, and the temperature is accumulated for the data line after the data line is accumulated due to the power supply; All the data lines on the array substrate are simultaneously powered. After all the data lines accumulate a certain amount of heat due to energization, temperature sensing is performed, and then the point where the data line defects are located is found according to the temperature sensing result.
  • step S203 the temperature of the data line is sensed by using a temperature sensor, which may be point-by-point sensing, and the temperature values of the respective points are recorded one by one; and the abnormal temperature data is specifically found in step S204, and the recorded points may be specifically The temperature values are compared.
  • a temperature sensor which may be point-by-point sensing, and the temperature values of the respective points are recorded one by one; and the abnormal temperature data is specifically found in step S204, and the recorded points may be specifically The temperature values are compared.
  • the temperature rise after the energization for a period of time is greater than the temperature rise of the portion having no defect. If the temperature value of one or more points is found to be greater than the temperature value of the other points, it indicates that the corresponding data line is defective. If the temperature values of the respective points are the same, it means that the corresponding data line has no defects.
  • step S203 the temperature of the data line is sensed by the temperature sensor, and the temperature curve of the data line is obtained by sensing the entire data line (the coordinates corresponding to the respective points in the temperature curve). If the corresponding data line has no defects, the temperature values of the respective points are approximately the same, and the temperature curve is approximately a straight line. If there is a temperature amplitude change in the temperature curve, it means that there is a defect in the data line, and the coordinates of the point where the temperature changes in the temperature curve are found, and the point is located from the coordinate to the corresponding data line, and the defect can be found. position.
  • the temperature sensor can be a thermal imager, and the thermal imager receives infrared rays emitted after the data line is warmed up, forming an infrared thermal image as shown in FIG. 3, and different colors on the infrared thermal image represent corresponding data lines.
  • the temperature of the point If there is no defect inside the corresponding data line, the heat is the same after the temperature rises, and the color on the corresponding infrared thermal image is the same or similar; if the color of the image in the infrared thermal image corresponds to the temperature corresponding to the other image color The temperature, so that it can be judged whether the data line is defective. It is also possible to locate the point where the internal defect is located on the corresponding data line according to the point where the temperature in the thermal image is high.
  • step S205 repairing the detected data line defect specifically includes: first removing the defect point detected in step S204, and then filling the defect point with the material forming the data line to complete the repair of the defect.
  • FIG. 4 is a flowchart of a second preferred embodiment of a method for detecting an array substrate defect according to the present invention, including the following steps:
  • the power supply to the gate lines can be performed one by one, and the gate lines generate a certain amount of heat due to the input of the current. After the gate lines are accumulated due to energization, a certain amount of heat is accumulated, and then the temperature is applied to the gate lines. Sensing. It is also possible to simultaneously supply all the gate lines on the array substrate, and wait for all the gate lines to accumulate a certain amount of heat due to energization before performing temperature sensing, and then find the point where the gate line defects are located according to the temperature sensing result.
  • step S403 the temperature of the gate line is sensed by the temperature sensor, which may be point-by-point sensing, and the temperature values of the respective points are recorded one by one; and the temperature data of the abnormality is found in step S404, and the recorded points may be specifically recorded.
  • the temperature values are compared.
  • the resistance of the dot having a defect in which the density of the gate line becomes small due to voids, bubbles, or the like is large, and when the current is applied for a certain period of time, the temperature rise is higher than the temperature rise of the dot having no defect. If the temperature value of one or more points is found to be greater than the temperature value of the other points, it indicates that the corresponding gate line is defective. If the temperatures of the respective points are the same, it means that the corresponding gate lines are free from defects.
  • step S403 the temperature of the gate line is sensed by a temperature sensor, and the temperature curve of the gate line is obtained by sensing the entire gate line (the temperature curve has corresponding points at each point) coordinate). If the corresponding gate line has no defects, the temperature values of the respective points are approximately the same, and the temperature curve is approximately a straight line. If there is a temperature amplitude change in the temperature curve, it means that there is a defect in the gate line, and the coordinates of the point where the temperature changes in the temperature curve are found, and the position of the defect can be found.
  • repairing the detected data line defect specifically includes: first removing the defect point detected in step S404, and then filling the defect point with the material forming the data line to complete the repair of the defect.
  • the temperature sensor can be a thermal imager, the thermal imager receives infrared rays emitted by the temperature of the gate line, forms an infrared thermal image (similar to FIG. 3), and different colors on the infrared thermal image represent corresponding data lines.
  • the temperature of the image of a certain part of the infrared thermal image corresponds to the temperature corresponding to the color of the other image, it can be judged whether the data line is defective. It is also possible to locate the point at which the defect is located on the corresponding data line based on the point at which the temperature in the thermal image is high.
  • the gate line is usually formed first, and then the data line is formed.
  • the detection and repair of the gate line/data line may be performed in the following manners. one:
  • the gate line is first detected. If a defect in the gate line is detected, the detected defect point is repaired; then the data line is formed, after the data line is formed, and then The data line is detected, and if a defect point is detected in the data line, the detected defect point is repaired;
  • the order of the defect points is not limited, and the defect points in the gate lines may be repaired first, or the defect points in the data lines may be repaired first.
  • FIG. 5 A schematic diagram of the array substrate defect detecting system 100 provided by the embodiment of the present invention is shown in FIG. 5, and includes a power source 10, a detecting circuit 20, and a temperature sensing device 30.
  • the power source 10 is connected to the detecting circuit 20 for supplying power to the data line or/and the gate line of the array substrate through the detecting circuit 20;
  • the detecting circuit 20 is configured to connect the data lines or/and the gate lines of the array substrate, and connect the power lines 10 and the data lines or/and the gate lines of the array substrate, so that the power source 10 supplies power to the data lines or/and the gate lines of the array substrate. ,Input Current;
  • the temperature sensing device 30 is configured to sense the temperature of each line of the data line or/and the gate line of the array substrate after being energized for a certain time, and is used to record and display the temperature data of each point.
  • the temperature sensing device 30 may be a thermal imager, and the thermal imager receives infrared rays emitted after the data line/gate line is warmed up, and forms an infrared thermal image (similar to FIG. 3), and different colors on the thermal image represent corresponding The data line or / and the temperature of a point on the gate line, so that the data line or / and the gate line can be judged to be defective. According to the high temperature point in the thermal image, the point where the defect is located on the corresponding data line can be located.
  • the array substrate defect detecting method and the defect detecting device provided by the present invention supply power to the data line or/and the gate line for a certain period of time after the wiring of the array substrate is completed, and then detect the array substrate data line or/and the gate line.
  • the temperature is based on the abnormal temperature data to find the defect inside the data line or / and the gate line.
  • the array substrate data line or/and gate line defect detecting method and device provided by the invention can detect defects of the array substrate data line or/and the inside of the gate line, thereby preventing bad products from entering a subsequent process and improving product quality. ,Prevent wastage.

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Abstract

一种阵列基板的检测方法及检测系统。该检测方法包括：向阵列基板上的至少一类控制信号线供电，并持续设定的时间；采用热像仪（30）对供电后的控制信号线进行温度感测，记录温度感测结果，热像仪（30）对控制信号线进行温度感测后形成红外热像图；根据红外热像图中图像的颜色确定异常的温度数据，将异常的温度数据对应的控制信号线上的点作为缺陷点。该阵列基板的检测方法及检测系统可以检测出阵列基板上控制信号线内部的缺陷，从而避免不良产品进入后续的制程。

Description

阵列基板的检测方法及检测系统 技术领域
本发明涉及LCD（liquid-crystal display，液晶显示器）制造技术领域，尤其涉及一种LCD阵列基板的检测方法及检测系统。
 背景技术
TFT-LCD（thin-film transistor liquid-crystal display，薄膜晶体管液晶显示器）包括三个主要的制程，彩膜（color film）制程、阵列（array）制程和整盒（cell）制程。在阵列制程中，完成布线之后，为保证产品的质量，将对阵列基板上的布线进行检测，以避免缺陷。
现有技术中，通常采用open/short test（开路/短路检测）或AOI（Automatic Optical Inspection，自动光学检测）的方式对阵列基板上的布线进行检测。但由于阵列基板上分布有多条垂直交叉排列的dataline（数据线）和gateline（栅极线），如图1所示的m行、n列的阵列基板，其中x1、x2、x3、x4、……xm 表示m条栅极线，y1、y2、y3、y4、……yn表示n条数据线。这些数据线和/或栅极线内部也可能存在缺陷（DEFECT），如内部有空心、气泡等造成其密度减小的缺陷，而采用open/short test（开路/短路检测）或AOI（Automatic Optical Inspection，自动光学检测）不易检测出。
如果在阵列制程中未检测出数据线或者栅极线内部的缺陷，产品进入后续的制程中，会造成大量的浪费。
故，有必要提供一种阵列基板缺陷检测方法和检测系统，以解决现有技术所存在的问题。
 技术问题
本发明的目的在于提供一种阵列基板检测方法及检测系统，以解决对阵列基板的数据线/栅极线内部进行缺陷检测问题。
 技术解决方案
本发明的目的在于提供一种阵列基板检测方法及检测系统，以解决对阵列基板的数据线/栅极线内部进行缺陷检测问题。
本发明是这样实现的：
一种阵列基板的检测方法，所述的方法包括：
向阵列基板上的至少一类控制信号线供电，并持续设定的时间；
采用热像仪对供电后的控制信号线进行温度感测，记录温度感测结果，所述热像仪对所述控制信号线进行温度感测后形成红外热像图；
根据所述红外热像图中图像的颜色确定所述异常的温度数据，将所述异常的温度数据对应的控制信号线上的点作为缺陷点。
在本发明的一较佳实施例中，所述控制信号线为所述阵列基板上的数据线或者栅极线。
在本发明的一较佳实施例中，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对供电后的控制信号线逐点感测，并逐点记录所述控制信号线的温度数据。
在本发明的一较佳实施例中，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对供电后的控制信号线整条感测，记录整条所述控制信号线的温度数据。
在本发明的一较佳实施例中，还包括：
清除所检测到的所述控制信号线上的缺陷点，用形成所述控制信号线的材料填补所述缺陷点。
本发明还提供了另一种阵列基板的检测方法，所述的方法包括：
向阵列基板上的至少一类控制信号线供电，并持续设定的时间；
对供电后的控制信号线进行温度感测，记录温度感测结果；
查找所述温度感测结果中异常的温度数据，查找所述异常的温度数据对应的控制信号线上的点，将所述异常的温度数据对应的控制信号线上的点作为缺陷点。
在本发明的一较佳实施例中，所述控制信号线为所述阵列基板上的数据线或者栅极线。
在本发明的一较佳实施例中，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对所述控制信号线逐点感测，并逐点记录所述控制信号线的温度数据；所述的查找所述温度感测结果中异常的温度数据具体包括：比较记录的所述控制信号线的温度数据，将其中温度数值高的作为异常温度数据。
在本发明的一较佳实施例中，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对所述控制信号线整条感测，记录整条控制信号线的温度数据，形成所述控制信号线的温度曲线；所述的查找所述温度感测结果中异常的温度数据具体包括：查找所述温度曲线中有幅度变化的点，将所述有幅度变化的点的温度数值作为异常温度数据。
在本发明的一较佳实施例中，具体包括：
采用热像仪对所述控制信号线进行温度感测，所述热像仪对所述控制信号线进行温度感测后形成红外热像图；根据所述红外热像图中图像的颜色确定所述异常的温度数据，查找所述异常的温度数据对应的控制信号线上的点。
在本发明的一较佳实施例中，还包括：
清除所检测到的所述控制信号线上的缺陷点，用形成所述控制信号线的材料填补所述缺陷点。
在本发明的一较佳实施例中，所述对供电后的控制信号线进行温度感测具体包括：
在所述阵列基板上的栅极线形成之后，对所述阵列基板上的栅极线进行温度感测；在所述阵列基板上的数据线形成之后，对所述阵列基板上的数据线进行温度感测。
在本发明的一较佳实施例中，所述对供电后的控制信号线进行温度感测具体包括：
在所述阵列基板上的栅极线和数据线形成之后，同时对所述阵列基板上的栅极线和数据线进行温度感测。
本发明还提供了一种阵列基板的检测系统，其特征在于，所述的系统包括：
电源，用来通过所述检测电路向阵列基板上的至少一类控制信号线供电；
检测电路，用来连通所述电源与所述控制信号线，使得所述电源向所述控制信号线供电，输入电流；以及，
温度感测装置，用来感测所述控制信号线在通电设定时间后各个点的温度，并用来记录和显示温度感测结果。
在本发明的一较佳实施例中，所述温度感测装置为热像仪，所述热像仪用来感测所述控制信号线在通电设定时间后的温度，形成与所述控制信号线对应的红外热像图。
相较于现有的阵列基板缺陷检测方案，本发明提供的阵列基板的缺陷检测方法和系统，可以检测出阵列基板数据线或/和栅极线内部的缺陷，从而避免不良产品进入后续的制程，提升产品的品质，避免浪费。
为让本发明的上述内容能更明显易懂，下文特举较佳实施例，并配合所附图式，作详细说明如下：
 有益效果
相较于现有的阵列基板缺陷检测方案，本发明提供的阵列基板的缺陷检测方法和系统，可以检测出阵列基板数据线或/和栅极线内部的缺陷，从而避免不良产品进入后续的制程，提升产品的品质，避免浪费。
附图说明
图1为现有技术阵列基板数据线和栅极线分布示意图；
图2为本发明提供的阵列基板缺陷检测方法的第一较佳实施例的流程图；
图3为本发明提供的红外热像图示意图；
如4为本发明提供的阵列基板缺陷检测方法的第二较佳实施例的流程图；
图5为本发明提供的阵列基板缺陷检测系统较佳实施例的原理框图。
 本发明的最佳实施方式
以下各实施例的说明是参考附加的图式，用以例示本发明可用以实施的特定实施例。本发明所提到的方向用语，例如「上」、「下」、「前」、「后」、「左」、「右」、「内」、「外」、「侧面」等，仅是参考附加图式的方向。因此，使用的方向用语是用以说明及理解本发明，而非用以限制本发明。
本发明实施例中，将阵列基板上的数据线和栅极线统称为控制信号线。
请参照图2，为本发明提供的阵列基板缺陷检测方法的第一较佳实施例的流程图，包括如下的步骤：
S201.在阵列基板的阵列制程中完成数据线的布线；
S202.向数据线供电，输入电流，并持续一定的时间；
S203.用温度感测仪对数据线的温度进行感测，记录温度感测结果；
S204.查找温度感测结果中异常的温度数据，查找所述异常的温度数据对应的数据线上的点，将所述异常的温度数据对应的数据线的点作为缺陷点；
S205.对发现的缺陷进行修补。
在上述的流程中，对数据线的供电可以逐条进行，数据线因电流输入将产生一定的热量，待数据线因通电而累积一定的热量后再针对该条数据线进行温度感测；也可以对阵列基板上的所有数据线同时供电，待所有数据线因通电而累积一定的热量后再进行温度感测，然后根据温度感测结果查找数据线缺陷所在的点。
步骤S203中，用温度感测仪对数据线的温度进行感测，可以是逐点感测，并逐一记录各个点的温度值；步骤S204中查找异常的温度数据具体可以将记录的各个点的温度数值进行比较。在数据线中，由于数据线中有空心、气泡等造成数据线密度变小的缺陷的部分的电阻较大，通电一段时间后其升温将大于没有缺陷的部分的升温。如果发现某一个或者多个点的温度数值大于其他点的温度数值，则表示对应的数据线有缺陷。如果各个点的温度数值相同，则表示对应的数据线没有缺陷。
步骤S203中，用温度感测仪对数据线的温度进行感测，也可以对整条数据线进行感测后得到该条数据线的温度曲线（该温度曲线中有各个点对应的坐标）。如果对应的数据线没有缺陷，则各个点温度数值大致相同，温度曲线近似为直线。如果该温度曲线中有温度幅度变化，即表示该数据线存在缺陷，找出温度曲线中温度发生变化的点的坐标，从该坐标定位到对应的数据线上的点，即可找出缺陷的位置。
其中，温度感测仪可以是热像仪，热像仪接收数据线升温后发出的红外线，形成如图3所示的红外热像图，红外热像图上不同的颜色代表对应的数据线上个点的温度。如果对应的数据线内部没有缺陷，则其升温后发热相同，对应的红外热像图上颜色相同或者近似；如果红外热像图中的某部分图像的颜色对应的温度高于其他图像颜色对应的温度，从而可以判断数据线是否有缺陷。还可以根据热像图中温度高的点，定位到对应的数据线上内部缺陷所在的点。
在步骤S205中，对检测到的数据线缺陷进行修补具体包括：先清除步骤S204中检测到的缺陷点，然后用形成数据线的材料填补该缺陷点即完成对缺陷的修补。
请参照图4，为本发明提供的阵列基板缺陷检测方法的第二较佳实施例的流程图，包括如下的步骤：
S401.在阵列基板的阵列制程中完成栅极线的布线；
S402.向栅极线供电，输入电流，并持续一定的时间；
S403.用温度感测仪对栅极线的温度进行感测，记录温度感测结果；
S404. 查找温度感测结果中异常的温度数据，查找所述异常的温度数据对应的栅极线上的点，将所述异常的温度数据对应的栅极线上的点作为缺陷点；
S405.对发现的缺陷进行修补。
在上述的流程中，对栅极线的供电可以逐条进行，栅极线因电流的输入将产生一定的热量，待栅极线因通电而累积一定的热量后再针对该条栅极线进行温度感测。也可以对阵列基板上的所有栅极线同时供电，待所有栅极线因通电而累积一定的热量后再进行温度感测，然后根据温度感测结果查找栅极线缺陷所在的点。
步骤S403中，用温度感测仪对栅极线的温度进行感测，可以是逐点感测，并逐一记录各个点的温度值；步骤S404中查找异常的温度数据具体可以将记录的各个点的温度数值进行比较。在栅极线中，由于有空洞、气泡等造成栅极线密度变小的缺陷的点的电阻较大，通电一定时间后，其升温将大于没有缺陷的点的升温。如果发现某一个或者多个点的温度数值大于其他点的温度数值，则表示对应的栅极线有缺陷。如果各个点的温度相同，则表示对应的栅极线没有缺陷。
步骤S403中，用温度感测仪对栅极线的温度进行感测，也可以对整条栅极线进行感测后得到该条栅极线的温度曲线（该温度曲线中有各个点对应的坐标）。如果对应的栅极线没有缺陷，则各个点温度数值大致相同，温度曲线近似为直线。如果该温度曲线中有温度幅度变化，即表示该栅极线存在缺陷，找出温度曲线中温度发生变化的点的坐标，即可找出缺陷的位置。
在步骤S405中，对检测到的数据线缺陷进行修补具体包括：先清除步骤S404中检测到的缺陷点，然后用形成数据线的材料填补该缺陷点即完成对缺陷的修补。
其中，温度感测仪可以是热像仪，热像仪接收栅极线升温后发出的红外线，形式红外热像图（与图3类似），红外热像图上不同的颜色代表对应的数据线上个点的温度，如果红外热像图中的某部分图像的颜色对应的温度高于其他图像颜色对应的温度，从而可以判断数据线是否有缺陷。还可以根据热像图中温度高的点，定位到对应的数据线上缺陷所在的点。
在阵列基板的制程中，通常是先形成栅极线，然后再形成数据线，具体应用本发明提供的技术方案时，对栅极线/数据线的检测和修补可以是采用如下的几种方式之一：
1.在栅极线形成之后，首先对栅极线进行检测，如果检测到栅极线中有缺陷，就对检测到的缺陷点进行修补；然后再形成数据线，在数据线形成之后，再对数据线进行检测，如果检测到数据线中有缺陷点，再对检测到的缺陷点进行修补；
2.先形成栅极线，再形成数据线，同时检测栅极线和数据线中的缺陷点，如果栅极线和/或数据线中有缺陷点，则对栅极线和/或数据线中的缺陷点进行修补；
3.先形成栅极线，再形成数据线；然后检测栅极线中的缺陷点，再检测数据线中的缺陷点；然后对栅极线和数据线中的缺陷点（如有）进行修补，修补缺陷点的顺序不限，既可先修补栅极线中的缺陷点，也可先修补数据线中的缺陷点；
4. 先形成栅极线，再形成数据线；然后检测数据线中的缺陷点，再检测栅极线中的缺陷点；然后对栅极线和数据线中的缺陷点（如有）进行修补，修补缺陷点的顺序不限，既可先修补栅极线中的缺陷点，也可先修补数据线中的缺陷点。
本发明实施例提供的阵列基板缺陷检测系统100的原理图如图5所示，包括电源10、检测电路20和温度感测装置30。
其中：电源10与检测电路20连接，用来通过检测电路20向阵列基板的数据线或/和栅极线供电；
检测电路20用来连接阵列基板的数据线或/和栅极线，连通电源10与阵列基板的数据线或/和栅极线，使得电源10向阵列基板的数据线或/和栅极线供电，输入电流；
温度感测装置30用来感测阵列基板的数据线或/和栅极线在通电一定时间后各个点的温度，并用来记录和显示各个点的温度数据。
其中，温度感测装置30可以是热像仪，热像仪接收数据线/栅极线升温后发出的红外线，形式红外热像图（与图3类似），热像图上不同的颜色代表对应的数据线或/和栅极线上个点的温度，从而可以判断数据线或/和栅极线是否有缺陷。可以根据热像图中温度高的点，定位到对应的数据线上缺陷所在的点。
如上所述，本发明提供的阵列基板缺陷检测方法和缺陷检测装置，在阵列基板完成布线后，对数据线或/和栅极线供电一定时间，再检测阵列基板数据线或/和栅极线的温度，根据异常温度数据查找到数据线或/和栅极线内部的缺陷。本发明提供的阵列基板数据线或/和栅极线缺陷检测方法和装置，可以检测出阵列基板数据线或/和栅极线内部的缺陷，从而避免不良产品进入后续的制程，提升产品的品质，避免浪费。
综上所述，虽然本发明已以较佳实施例揭露如上，但上述较佳实施例并非用以限制本发明，本领域的普通技术人员，在不脱离本发明的精神和范围内，均可作各种更动与润饰，因此本发明的保护范围以权利要求界定的范围为准。
 本发明的实施方式
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Claims (15)

  1. 一种阵列基板的检测方法，所述的方法包括：
    向阵列基板上的至少一类控制信号线供电，并持续设定的时间；
    采用热像仪对供电后的控制信号线进行温度感测，记录温度感测结果，所述热像仪对所述控制信号线进行温度感测后形成红外热像图；
    根据所述红外热像图中图像的颜色确定所述异常的温度数据，将所述异常的温度数据对应的控制信号线上的点作为缺陷点。
  2. 根据权利要求1所述的检测方法，其特征在于，所述控制信号线为所述阵列基板上的数据线或者栅极线。
  3. 根据权利要求1所述的检测方法，其特征在于，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对供电后的控制信号线逐点感测，并逐点记录所述控制信号线的温度数据。
  4. 根据权利要求1所述的方法，其特征在于，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对供电后的控制信号线整条感测，记录整条所述控制信号线的温度数据。
  5. 根据权利要求1所述的方法，其特征在于，还包括：
    清除所检测到的所述控制信号线上的缺陷点，用形成所述控制信号线的材料填补所述缺陷点。
  6. 一种阵列基板的检测方法，所述的方法包括：
    向阵列基板上的至少一类控制信号线供电，并持续设定的时间；
    对供电后的控制信号线进行温度感测，记录温度感测结果；
    查找所述温度感测结果中异常的温度数据，查找所述异常的温度数据对应的控制信号线上的点，将所述异常的温度数据对应的控制信号线上的点作为缺陷点。
  7. 根据权利要求6所述的检测方法，其特征在于，所述控制信号线为所述阵列基板上的数据线或者栅极线。
  8. 根据权利要求6所述的检测方法，其特征在于，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对所述控制信号线逐点感测，并逐点记录所述控制信号线的温度数据；所述的查找所述温度感测结果中异常的温度数据具体包括：比较记录的所述控制信号线的温度数据，将其中温度数值高的作为异常温度数据。
  9. 根据权利要求6所述的方法，其特征在于，所述的对供电后的控制信号线进行温度感测，记录温度感测结果具体包括：对所述控制信号线整条感测，记录整条控制信号线的温度数据，形成所述控制信号线的温度曲线；所述的查找所述温度感测结果中异常的温度数据具体包括：查找所述温度曲线中有幅度变化的点，将所述有幅度变化的点的温度数值作为异常温度数据。
  10. 根据权利要求6所述的方法，其特征在于，具体包括：
    采用热像仪对所述控制信号线进行温度感测，所述热像仪对所述控制信号线进行温度感测后形成红外热像图；根据所述红外热像图中图像的颜色确定所述异常的温度数据，查找所述异常的温度数据对应的控制信号线上的点。
  11. 根据权利要求6所述的方法，其特征在于，还包括：
    清除所检测到的所述控制信号线上的缺陷点，用形成所述控制信号线的材料填补所述缺陷点。
  12. 根据权利要求6所述的方法，其特征在于，所述对供电后的控制信号线进行温度感测具体包括：
    在所述阵列基板上的栅极线形成之后，对所述阵列基板上的栅极线进行温度感测；在所述阵列基板上的数据线形成之后，对所述阵列基板上的数据线进行温度感测。
  13. 根据权利要求6所述的方法，其特征在于，所述对供电后的控制信号线进行温度感测具体包括：
    在所述阵列基板上的栅极线和数据线形成之后，同时对所述阵列基板上的栅极线和数据线进行温度感测。
  14. 一种阵列基板的检测系统，其特征在于，所述的系统包括：
    电源，用来通过所述检测电路向阵列基板上的至少一类控制信号线供电；
    检测电路，用来连通所述电源与所述控制信号线，使得所述电源向所述控制信号线供电，输入电流；以及，
    温度感测装置，用来感测所述控制信号线在通电设定时间后各个点的温度，并用来记录和显示温度感测结果。
  15. 根据权利要求14所述的系统，其特征在于，所述温度感测装置为热像仪，所述热像仪用来感测所述控制信号线在通电设定时间后的温度，形成与所述控制信号线对应的红外热像图。
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