WO2012133090A1 - Carte de circuit imprimé et procédé de fabrication de la carte de circuit imprimé - Google Patents

Carte de circuit imprimé et procédé de fabrication de la carte de circuit imprimé Download PDF

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Publication number
WO2012133090A1
WO2012133090A1 PCT/JP2012/057292 JP2012057292W WO2012133090A1 WO 2012133090 A1 WO2012133090 A1 WO 2012133090A1 JP 2012057292 W JP2012057292 W JP 2012057292W WO 2012133090 A1 WO2012133090 A1 WO 2012133090A1
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WO
WIPO (PCT)
Prior art keywords
blind via
printed wiring
wiring board
standard
manufacturing
Prior art date
Application number
PCT/JP2012/057292
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English (en)
Japanese (ja)
Inventor
岡　良雄
直太 上西
春日　隆
辰珠 朴
上田　宏
寛 富岡
澄人 上原
Original Assignee
住友電気工業 株式会社
住友電工プリントサーキット 株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 住友電気工業 株式会社, 住友電工プリントサーキット 株式会社 filed Critical 住友電気工業 株式会社
Priority to CN201280001266.7A priority Critical patent/CN102870505B/zh
Publication of WO2012133090A1 publication Critical patent/WO2012133090A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Definitions

  • the present invention relates to a printed wiring board having blind vias and a method for manufacturing the printed wiring board.
  • the blind via of the printed wiring board connects the first conductive layer and the second conductive layer with a conductor.
  • the connection state between the conductor and the first conductive layer or the second conductive layer is not good, there is a risk of disconnection due to long-term use of the printed wiring board.
  • the printed wiring board may repeat expansion and contraction cycles, leading to disconnection at a defective portion of a blind via. For this reason, in the manufacturing process of a printed wiring board, the operation
  • Defective products in which there are few conductors filled in the blind via, the surface of the blind via is recessed, and the bottom of the blind via is exposed can be detected by visual inspection.
  • defective products due to poor adhesion between the conductor and the metal layer inside the blind via, and defective products in which bubbles or insulating foreign substances exist inside the blind via cannot be detected by visual inspection.
  • Patent Document 1 As a method for detecting a defective blind via that cannot be detected by appearance inspection, for example, there is a method described in Patent Document 1. In this method, the printed wiring board is heated after a film is formed in the opening of the blind via. Since a defective blind via generates gas by heating, the coating on the defective blind via is deformed. Therefore, the quality of the blind via is determined by inspecting the appearance of the film for deformation.
  • test blind vias are provided, and the test blind vias are inspected. Has not done the inspection.
  • the present invention has been made in view of such a situation, and an object of the present invention is to provide a printed wiring board that can easily determine whether a blind via is good or bad, and a printed wiring that can determine whether a blind via is within or outside of a standard. It is in providing the manufacturing method of a board.
  • the first conductive layer and the first conductive layer are formed by a blind via having an insulating layer between the first conductive layer and the second conductive layer and including a conductor penetrating the insulating layer.
  • a method for manufacturing a printed wiring board to which a second conductive layer is connected is provided. The manufacturing method determines whether the blind via is within the standard or out of the standard, recognizes that the blind via is within the standard, and identifies the non-standard blind via as the non-standard blind via. Energizing the blind via under a current-carrying condition in which the non-standard blind via is disconnected and the intra-standard blind via is not disconnected.
  • the non-standard blind via can be disconnected and the non-standard blind via can be disconnected by energization.
  • the electrical inspection that is subsequently performed it is possible to easily discriminate between the non-standard blind via and the non-standard blind via by the electrical inspection that is subsequently performed.
  • the following two actions are obtained.
  • ⁇ When a blind via with a filling rate equal to or lower than the first reference value is recognized as a non-standard blind via, it is desirable to set energization conditions based on the square of the first reference value. In this case, it is possible to increase the probability that a blind via having a filling rate equal to or less than the first reference value is selectively disconnected as a non-standard blind via.
  • the energization condition is set so that the ratio of the calorific value to the heat capacity is 1 or more, the blind via with a filling rate of 1 may break.
  • the energization condition is set such that the ratio of the heat generation amount to the heat capacity is less than the square of the first reference value, there is a possibility that blind vias whose charging rate is equal to or less than the first reference value will not be disconnected.
  • the energization condition is set as described in (4) above, it is possible to suppress the blind via having a filling rate of 1 from being broken and to open the blind via having a filling rate equal to or less than the first reference value. It can be suppressed.
  • the energization condition is set based on the second reference value. It is desirable.
  • the contact resistance between the first conductive layer and the conductor increases. This acts to promote blind via disconnection.
  • the energization condition is set so that the ratio of the calorific value to the heat capacity is 1 or more, the blind via with a contact rate of 1 may be broken.
  • the energization condition is set with the ratio of the calorific value to the heat capacity being less than the second reference value, there is a possibility that blind vias having a contact rate of the second reference value or less will not be disconnected.
  • the energization condition is set as described in (6) above, it is possible to suppress the blind via having a contact rate of 1 from being disconnected and the blind via having a contact rate of not more than the second reference value from being disconnected. This can be suppressed.
  • the conductor preferably contains silver particles having an average particle diameter of 0.5 ⁇ m to 2.0 ⁇ m and silver particles having an average particle diameter of 10 nm to 500 nm.
  • the blind via expands due to heating by energization. As a result, contact between silver particles may be reduced, and resistance may be increased.
  • the resistance hardly increases. This is because the surface of the silver particles of 10 nm to 500 nm or the whole is melted by heating by energization to increase the conduction path in the blind via. That is, in this type of blind via, the increase in resistance before and after energization is small compared to the conductive paste 30 that does not contain silver particles having an average particle diameter of 10 nm to 500 nm.
  • At least one of the first conductive layer and the second conductive layer is formed of stainless steel.
  • stainless steel is known to be easily oxidized on the surface. For this reason, when the 1st conductive layer or the 2nd conductive layer is formed with stainless steel, the adhesive force of a conductor and a conductive layer falls by surface oxidation of stainless steel, and between a conductor and these conductive layers The contact resistance increases. Blind vias with surface oxidation may break in the future.
  • At least one of the first conductive layer and the second conductive layer is formed of stainless steel.
  • the reason for this is that blind vias in which the adhesive force between the conductor and the conductive layer is reduced due to the oxidation of stainless steel, or blind vias in which the contact resistance between the conductor and the conductive layer is increased, are out of specification. This is because it can be distinguished electrically.
  • the non-standard blind via may burn out and generate dust.
  • the dust may be caught between the terminals of the electronic components and cause malfunction. .
  • the blind via is covered with a coating layer so that dust due to burning does not move. Thereby, it can suppress that the malfunctioning by a dust arises.
  • the printed wiring board is preferably manufactured by the above manufacturing method.
  • the selected non-standard blind via contains almost no non-standard blind via. For this reason, even if the printed wiring board is deformed or expanded / contracted due to a change in the surrounding environment, the standard blind via is hardly broken. That is, the frequency of blind via disconnection due to deformation or expansion / contraction of the printed wiring board can be reduced as compared with a printed wiring board that is not energized.
  • a printed wiring board that can easily determine whether a blind via is acceptable or not, and a printed wiring board manufacturing method that can determine whether a blind via is within specifications.
  • FIG. 3A to FIG. 3C are cross-sectional views in each manufacturing process of the printed wiring board.
  • 4A to 4C show a cross-sectional structure of a non-standard blind via
  • FIG. 4A is a cross-sectional view of an unfilled blind via
  • FIG. 4B is a blind containing an insulating foreign material.
  • 4 is a cross-sectional view of a via
  • FIG. 4C is a cross-sectional view of a blind via in which a part of a contact surface is in a non-contact state.
  • inducing energization conditions about a non-standard blind via with an unfilling The graph which shows the relationship between the upper limit of the filling rate of a non-standard blind via, and JA / QA.
  • the printed wiring board 1 includes a first conductive layer 2 formed of a metal foil, an insulating layer 3 provided on the surface of the first conductive layer 2, and a predetermined wiring pattern provided on the surface of the insulating layer 3.
  • the second conductive layer 4 is formed, the blind via 5 connecting the first conductive layer 2 and the second conductive layer 4, and the covering layer 11 covering the second conductive layer 4. Note that the first conductive layer 2 and the second conductive layer 4 are not electrically connected at portions other than the blind via 5.
  • the first conductive layer 2 is made of stainless steel, and the thickness of the first conductive layer 2 is 1 ⁇ m to 100 ⁇ m.
  • the 1st conductive layer 2 you may use the metal foil which consists of aluminum, iron, copper, nickel, titanium, molybdenum, chromium, zinc other than stainless steel.
  • the insulating layer 3 is formed of a resin material having excellent flexibility.
  • the insulating layer 3 is formed of a polyester resin, a polyamide resin, or a polyimide resin.
  • the insulating layer 3 has a thickness of 5 ⁇ m to 200 ⁇ m.
  • the second conductive layer 4 is made of copper.
  • the second conductive layer 4 may be formed of, for example, aluminum, nickel, gold, alloys thereof, solder, or the like.
  • the second conductive layer 4 may contain nickel and chromium.
  • an additional layer is provided between the second conductive layer 4 and the insulating layer 3, and this additional layer is formed on the surface of the second conductive layer 4. You may comprise by the nickel plating layer formed and the gold plating layer formed on the surface of the nickel plating layer.
  • the covering layer 11 is formed of the same resin material as that of the insulating layer 3.
  • a polyester resin, a polyamide resin, or a polyimide resin is used for forming the coating layer 11.
  • the thickness of the coating layer 11 is 5 ⁇ m to 200 ⁇ m.
  • the blind via 5 is composed of a conductor 7 that connects the first conductive layer 2 and the second conductive layer 4.
  • the conductor 7 is obtained by heat-curing the conductive paste 30.
  • the blind via 5 has a diameter of 10 ⁇ m to 200 ⁇ m and a depth of 5 ⁇ m to 200 ⁇ m.
  • the conductive paste 30 includes a conductive filler and an epoxy resin (cured product). The volume ratio between the conductive filler and the epoxy resin is 60:40.
  • the conductive paste 30 a paste in which two kinds of conductive fillers having different average particle diameters are dispersed in an epoxy resin is used.
  • the epoxy resin functions as a binder.
  • silver powder having an average particle size of 0.5 ⁇ m to 2.0 ⁇ m is used, and as the second conductive filler 22, silver powder having an average particle size of 10 nm to 500 nm is used.
  • the powder of silver coat copper powder platinum, gold
  • An average particle diameter shows the value (D50) of the integrated value 50% in the integrated distribution of a particle diameter.
  • the integrated distribution is obtained from a value obtained by volume-converting the radius of the particle measured based on the image analysis of 500 particles observed by a scanning electron microscope (SEM). It is determined by a particle size distribution measuring device.
  • the epoxy resin in the conductive paste 30 is thermosetting and is used by being dissolved in an organic solvent. Since the conductive paste 30 is filled in the through holes 6 by screen printing or the like, a solvent having excellent printability is used as the organic solvent of the conductive paste 30. For example, carbitol acetate or butyl carbitol acetate is used.
  • the blind via 5 is formed by filling the through-hole 6 penetrating the insulating layer 3 and the second conductive layer 4 with the conductive paste 30 and performing a heat treatment. By the heat treatment, the solvent in the conductive paste 30 is removed, and the conductive paste 30 is cured and contracted so that the conductive fillers are in contact with each other in a pressed state. Since two types of conductive fillers having different average particle diameters are used, when the through-hole 6 is filled with the conductive paste 30, the second conductive filler 22 is inserted into the gap between the first conductive fillers 21. Enters.
  • the blind via 5 formed using the two types of conductive fillers 21 and 22 having different average particle diameters has a through hole compared to the blind via 5 formed using only the first conductive filler 21.
  • 6 has a high density of conductive fillers 21 and 22 and a small resistance value. Further, since there are many contact points between the conductive fillers 21 and 22, the resistance change when the conductor 7 expands is smaller than that of the blind via 5 formed using only the first conductive filler 21.
  • FIG. 3A to 3C are cross-sectional views for explaining a method of manufacturing the printed wiring board 1.
  • FIG. 3A to 3C are cross-sectional views for explaining a method of manufacturing the printed wiring board 1.
  • the second conductive layer 4 is formed on the upper surface of the insulating layer 3 by a semi-additive method.
  • the first conductive layer 2 and the second conductive layer 4 are separated. It is electrically connected via the conductive paste 30.
  • the filling of the conductive paste 30 is performed by a screen printing method. After the conductive paste 30 is filled, the conductive paste 30 is heated and cured.
  • a coating layer 11 is laminated on the surface of the second conductive layer 4, and the second conductive layer 4 and the conductor 7 are covered with the coating layer 11.
  • a polyimide-based photosensitive cover coat ink is applied on the surface of the second conductive layer 4 and the surface of the conductor 7 by screen printing or the like, then dried, further exposed and developed, and polyimide A film-like coating layer 11 made of resin is formed.
  • the printed wiring board 1 is formed by the above steps.
  • the property of the conductive paste 30 varies among lots, and the property of the conductive paste 30 changes with time.
  • the surface state of the first conductive layer 2 is various, and the surface is oxidized, the surface is uneven, or the plating solution is attached to the surface. There are things. Due to these factors, various defective products are formed in the manufacturing process of the blind via 5.
  • the unfilled portion 50 may be formed inside the blind via 5 or air bubbles may be contained inside the blind via 5.
  • the blind via 5 in which the unfilled portion 50 exists and the blind via 5 including bubbles are referred to as “unfilled blind via 5X”.
  • the unfilled portion 50 inside the blind via 5 is generated due to an inappropriate viscosity of the conductive paste 30 or an execution time of the printing process being too short.
  • the factors that cause bubbles to enter inside the blind via 5 are that the conductive paste 30 contains bubbles inside itself, and bubbles are formed when the conductive paste 30 is filled in the through holes 6. And so on. Some of the bubbles or the unfilled portion 50 may disappear due to the heat treatment process of the blind via 5, but some may remain.
  • the bubbles or the unfilled portion 50 reduces the amount of the conductor 7 in the blind via 5, and thus increases the resistance value of the blind via 5.
  • an insulating foreign material 51 may be present inside the blind via 5.
  • the blind via 5 including the insulating foreign material 51 is referred to as “foreign-material-containing blind via 5Y”.
  • the insulating foreign matter 51 is included in the conductive paste 30, and an insulating property when filling the through-hole 6 with the conductive paste 30 by a printing method or the like.
  • foreign matter 51 may be mixed.
  • the insulating foreign matter 51 is generated, for example, when the insulating layer 3 is missing in the transport process of the printed wiring board 1. Since the insulating foreign matter 51 does not conduct electricity, it increases the resistance of the blind via 5 when mixed.
  • the contact surface 7A between the conductor 7 and the first conductive layer 2 may not be in contact with each other.
  • the blind via 5 in which the conductor 7 and the first conductive layer 2 are in partial contact or the blind via 5 in which the conductor 7 and the first conductive layer 2 are not in contact is referred to as “partial contact”. It is called "blind via 5Z”.
  • the non-contact state between the conductor 7 and the first conductive layer 2 is that the conductor 7 and the first conductive layer 2 are peeled off due to expansion or contraction of the conductor 7 in the heat treatment process of the blind via 5, and printed in the manufacturing process. It is formed by applying an external force to the wiring board 1. Further, the blind via 5 in a non-contact state is formed due to a decrease in adhesive force due to oxidation of the surface of the first conductive layer 2. When the conductor 7 and the first conductive layer 2 are in a non-contact state, the resistance of the blind via 5 is increased.
  • the portion where the cross-sectional area is small in the axial direction of the blind via 5. Since the portion has a small cross-sectional area, the force is likely to concentrate, or the current is likely to be concentrated to be overheated, so that there is a risk of disconnection at the portion.
  • the partial contact blind via 5Z has a larger contact resistance between the conductor 7 and the first conductive layer 2 than the blind contact 5 in a normal contact state, or starts from the non-contact state portion. As a result, it is likely to be disconnected at the relevant part.
  • the inspection for determining the quality of the blind via 5 is performed during the manufacturing process.
  • the standard blind via 5A and the non-standard blind via 5B are distinguished.
  • the non-standard blind via 5B is in a disconnected state, and further, a marking is given so that both can be discriminated visually.
  • the standard blind via 5A has a filling ratio with respect to the filling volume of the blind via 5 larger than the first reference value C, and a contact ratio at the contact surface 7A between the conductor 7 and the first conductive layer 2 is the second reference. Points larger than the value D.
  • the non-standard blind via 5B is that the filling rate with respect to the filling volume in the blind via 5 is equal to or less than the first reference value C, and the contact rate at the contact surface 7A between the conductor 7 and the first conductive layer 2 is equal to or less than the second reference value D.
  • the filling volume in the blind via 5 indicates the volume of the hole defined by the through hole 6 and the first conductive layer 2.
  • the filling rate is 1, it is assumed that the volume of the conductor 7 and the filling volume in the blind via 5 match.
  • Energization and electrical inspection are performed by one inspection machine.
  • the head of the inspection machine is provided with a first probe 40A for energization and a second probe 40B for electrical inspection.
  • the first probe 40A includes a first terminal 41 and a second terminal 42 that face each other along the axial direction.
  • the first terminal 41 is connected to a current circuit.
  • the second probe 40B includes a third terminal 43 and a fourth terminal 44 that face each other along the axial direction.
  • the third terminal 43 and the fourth terminal 44 are connected to a voltage measuring device 60 that measures the voltage between both terminals. Then, the resistance value of the conductor 7 is derived from the current flowing through the first terminal 41 and the measured voltage.
  • the first terminal 41 and the third terminal 43 are connected to the conductor 7, and the second terminal 42 and the fourth terminal 44 are connected to the first conductive layer 2.
  • the pass / fail judgment inspection of the blind via 5 includes a step of energizing the blind via 5 (hereinafter referred to as “energization step”), and a step of performing an electrical inspection of the blind via 5 after energization for a predetermined time (hereinafter referred to as “below”). And “marking the blind via 5 based on the result of the electric inspection” (hereinafter, “marking process”).
  • energization step a step of energizing the blind via 5
  • below a step of performing an electrical inspection of the blind via 5 after energization for a predetermined time
  • marking process hereinafter, each step will be described.
  • a current of a predetermined condition (hereinafter referred to as “energization condition”) is passed through the blind via 5.
  • energization condition a current of a predetermined condition
  • the non-standard blind via 5A and the non-standard blind via 5B are discriminated as follows in the electrical inspection process.
  • the blind via 5 to be inspected when the resistance value of the blind via 5 to be inspected is equal to or greater than the determination value, it is determined that the blind via 5 is in a disconnected state, that is, the blind via to be inspected is a non-standard blind via 5B. I do. When the resistance value of the blind via 5 to be inspected is less than the determination value, it is determined that the blind via 5 is not disconnected, that is, the blind via to be inspected is the intra-standard blind via 5A.
  • marking is performed around the blind via 5 with respect to what is determined to be a non-standard blind via 5B.
  • the size of the mark can be determined visually.
  • energization conditions are set by a setting formula.
  • the energization condition setting formula is obtained based on a model of the non-standard blind via 5B.
  • the first model corresponds to the unfilled blind via 5X and the foreign-containing blind via 5Y.
  • the second model corresponds to the partial contact blind via 5Z. Since the setting formulas for the energization conditions are different for each model, these setting formulas will be described.
  • the first model will be described with reference to FIG.
  • the blind via 5 is disconnected according to the filling rate, that is, the ratio of the volume of the conductor 7 to the filled volume in the blind via 5.
  • the filling rate that is, the ratio of the volume of the conductor 7 to the filled volume in the blind via 5.
  • a setting equation for deriving an energization condition in which the filling rate is less than the first reference value C is obtained as follows.
  • the “energization condition in which the filling rate is not greater than the first reference value C” means that the blind via 5 whose filling rate is not greater than the first reference value C is recognized as a non-standard blind via 5B, An energization condition for disconnecting the outer blind via 5B.
  • the energization conditions are firstly required to disconnect the blind via 5 having a filling rate equal to or less than the first reference value C, and secondly, to prevent the blind via 5 having a filling rate of 1 from being disconnected.
  • firstly required to disconnect the blind via 5 having a filling rate equal to or less than the first reference value C and secondly, to prevent the blind via 5 having a filling rate of 1 from being disconnected.
  • the conditions for breaking the blind via 5 whose filling rate is the first reference value C are as follows.
  • the amount of heat generated by the blind via 5 when energized is JA.
  • the heat capacity from the state in which the blind via 5 is at room temperature to the state in which the conductor 7 is melted and disconnected is defined as QA.
  • a conditional expression for preventing the blind via 5 having a filling rate of 1 from being disconnected is given as follows.
  • the specific resistance of the conductor 7 is “ ⁇ ”
  • the contact resistance between the conductor 7 and the first conductive layer 2 is “Rc”
  • the ratio of heat generated by the contact resistance to the heating of the conductor 7 is “ ⁇ ”
  • the conductor 7 is “S”
  • the resistance is inversely proportional to the filling rate based on this assumption and the above equation of resistance. That is, the relationship between the heat generation amount (JA) of the blind via 5 having a filling rate of 1 and the heat generation amount (J1) of the blind via 5 having a filling rate of the first reference value C is as follows.
  • Samples for this test were prepared as follows. As the blind via 5 having a filling rate of 1, a through hole 6 having a radius of 30 ⁇ m and a depth of 25 ⁇ m is formed in the insulating layer 3 and the second conductive layer 4 by a UV-YAG laser, and the conductive paste 30 is formed in the through hole 6. And the conductive paste 30 was heat-cured.
  • a through hole 6 having a radius of 19 ⁇ m and a depth of 25 ⁇ m is formed in the insulating layer 3 and the second conductive layer 4 by laser, and the through hole 6 is filled with the conductive paste 30. Then, the conductive paste 30 was heat-cured. That is, the non-standard blind via 5B was formed based on the first model.
  • the following values were used as parameters other than the current I and the energization time t.
  • the specific resistance ( ⁇ ) of the conductor 7 was set to 1.0 ⁇ 10 ⁇ 4 ⁇ ⁇ cm.
  • the depth (d) of the blind via 5 was 25 ⁇ m.
  • the cross-sectional area (S) of the conductor 7 was a circle area with a radius of 30 ⁇ m.
  • the contact resistance (Rc) between the conductor 7 and the first conductive layer 2 (stainless steel) was 2.4 ⁇ 10 ⁇ 6 ⁇ ⁇ cm 2 .
  • the ratio ( ⁇ ) that the heat generated by the contact resistance contributes to the heating of the conductor 7 was set to 0.5. This value was set on the assumption that half of the calorific value at the contact portion was transferred to the conductor 7 and the other half was transferred to the first conductive layer 2.
  • the heat capacity (QA) was determined as follows.
  • the filling volume (V) of the blind via was calculated by regarding the through hole 6 of the blind via 5 as a cylinder having a radius of 30 ⁇ m and a depth of 25 ⁇ m.
  • the difference (Td) between the room temperature and the melting temperature of the conductor 7 was calculated using a silver melting temperature of 962 ° C. and a room temperature of 20 ° C.
  • the heat capacity density (H) of the conductor 7 was 2.02 J / (K ⁇ cm 3 ).
  • the value of the heat capacity density (H) of the conductor 7 is based on the fact that the volume ratio of the conductive filler (silver particles) to the epoxy resin is 60:40, and the heat capacity of the conductive filler itself and the heat capacity of the epoxy resin itself. And calculated by proportional distribution.
  • 2.48 J / (K ⁇ cm 3 ) was used as the heat capacity density of the conductive filler (silver particles).
  • 1.32 J / (K ⁇ cm 3 ) was used as the heat capacity density of the epoxy resin.
  • Each energization condition shown in Table 1 is whether or not the energization condition setting formula (the above formula (5)) for breaking the blind via 5 having a filling rate of 0.4 or less as a non-standard blind via 5B is valid. This is the condition set to confirm
  • the blind via 5 having a filling rate of 0.4 could be disconnected. Further, the blind via 5 having a filling rate of 1 could be present without being disconnected.
  • the fourth condition and the fifth condition in Table 1 are conditions set so that the value of JA / QA is smaller than the lower limit value of the above formula (5). That is, the energization condition is set so that the value of JA / QA is smaller than 0.16 (0.4 2 ). When energization was performed under these energization conditions, the blind via 5 having a filling rate of 0.4 could not be disconnected.
  • the sixth condition in Table 1 is a condition set so that the value of JA / QA is larger than the upper limit value of the above formula (5). That is, the energization condition is set so that the value of JA / QA is greater than 1. When energization was performed under these energization conditions, the blind via 5 having a filling rate of 1 was disconnected.
  • the blind via 5 having a filling rate of 0.4 or less can be disconnected, and the blinding rate is 1.
  • the via 5 can be prevented from being disconnected.
  • FIG. 7 illustrates the energization condition setting formula.
  • the vertical axis represents the value of JA / QA, that is, the ratio between the heat generation amount JA and the heat capacity QA in a blind via having a filling rate of 1.
  • the horizontal axis represents the upper limit value of the filling rate of the non-standard blind via 5B.
  • Each point in FIG. 7 shows a disconnection result under each energization condition shown in Table 1.
  • the range where JA / QA is 1 or more indicates a range where all blind vias 5 having a filling rate of 1 to 0 are disconnected (all blind via disconnection range). That is, under the energization conditions in this range, there is a possibility that all the blind vias 5 are disconnected.
  • the blind via 5 with a filling rate of the first reference value C or less can be disconnected, and the blind via 5 with a filling rate of 1 is disconnected.
  • the range satisfying “JA / QA ⁇ C 2 ” indicates a range in which the blind via 5 having the filling rate of the first reference value C cannot be disconnected (range where disconnection is not possible). That is, under the energization conditions in this range, the blind via 5 having a filling rate equal to or lower than the first reference value C cannot be disconnected.
  • the second model models the blind via 5 having a non-contact portion on the contact surface 7A between the conductor 7 and the first conductive layer 2.
  • the blind via 5 does not include bubbles or unfilled portions 50 or insulating foreign matter 51. That is, the filling rate is 1.
  • a setting equation for deriving an energization condition in which the contact rate is less than the second reference value D is obtained as follows.
  • the “energization condition in which the contact rate is less than or equal to the second reference value D” means that the blind via 5 whose contact rate is less than or equal to the second reference value D is defined as a non-standard blind via 5B.
  • the contact rate represents the ratio of the contact area between the conductor 7 and the first conductive layer 2 with respect to the reference area, with the size of the contact surface 7A between the conductor 7 and the first conductive layer 2 as a reference area.
  • the energization conditions are firstly required to disconnect the blind via 5 whose contact rate is equal to or less than the second reference value D, and secondly, not to disconnect the blind via 5 whose contact rate is 1.
  • each requirement will be described.
  • the conditions for breaking the blind via 5 whose contact rate is the second reference value D are as follows.
  • the condition for preventing the blind via 5 having a contact ratio of 1 from being disconnected is obtained in the same manner as in the first model. That is, when the following conditional expression is satisfied, the blind via 5 is not disconnected.
  • the non-standard blind via 5B set as non-standard using a predetermined parameter can be disconnected.
  • the formula corresponding to the type is selected based on the type of failure that is likely to occur in the manufacturing process of the printed wiring board 1. That is, in the manufacturing process of the printed wiring board 1, unfilled blind vias 5X and foreign matter-containing blind vias 5Y often occur, and when the partial contact blind via 5Z hardly occurs, a defect standard is set for the filling rate, The energization condition is set based on the above formula (5).
  • the energization condition is set based on the above equation (10). Further, when any defect of the unfilled blind via 5X, the foreign-containing blind via 5Y, and the partial contact blind via 5Z occurs, the energization condition is derived based on the above formula (5) and the above formula (10), and the most severe Select a condition.
  • An energization condition is set such that the blind via is disconnected if it is out of standard and is not disconnected if it is within the standard, and the blind via 5 is energized based on the energization condition. Thereby, it is possible to easily discriminate between the non-standard blind via 5A and the non-standard blind via 5B by electrical inspection.
  • the blind via 5 After the blind via 5 is energized, the blind via 5 is subjected to electrical inspection to distinguish between the standard blind via 5A and the non-standard blind via 5B by marking. Thereby, it is possible to easily grasp whether or not the non-standard blind via 5B exists in the printed wiring board 1.
  • the energization condition is the first reference value C. Is set based on the square of. Thereby, it is possible to increase the probability that the blind via 5 whose filling rate is equal to or less than the first reference value C will be selectively disconnected as the non-standard blind via 5B.
  • the energization condition is set so that the ratio of the heat generation amount to the heat capacity (JA / QA) is a value equal to or larger than the first reference value C square and smaller than 1. Thereby, it can suppress that the blind via 5 with a filling rate of 1 breaks, and can suppress that the blind via 5 whose filling rate is below the 1st reference value C does not break.
  • the energization condition is the second reference It is set based on the value D. Thereby, the probability that the blind via 5 whose contact rate is equal to or less than the second reference value D is selectively disconnected as the non-standard blind via 5B can be increased.
  • the energization conditions are set so that the ratio of the heat generation amount to the heat capacity (JA / QA) is equal to or larger than the second reference value D and smaller than 1. Thereby, it can suppress that the blind via 5 with a contact rate of 1 breaks, and can suppress that the blind via 5 whose contact rate is below the 2nd reference value D does not break.
  • the above energization and electrical inspection are performed on the printed wiring board 1 having the blind via 5 containing silver particles having an average particle diameter of 10 nm to 500 nm.
  • the increase in the resistance of the blind via 5 before and after energization can be reduced as compared with the case where the energization is performed to the blind via 5 that does not contain silver particles having an average particle diameter of 10 nm to 500 nm. That is, it is possible to suppress deterioration of the standard blind via 5A that may occur due to the energization.
  • the blind via in which the adhesive force between the conductor 7 and the first conductive layer 2 is reduced due to oxidation of the stainless steel. 5 or a blind via whose contact resistance between the conductor 7 and the first conductive layer 2 is increased can be distinguished from the non-standard blind via 5A by being electrically distinguished from the standard non-standard blind via 5A. Furthermore, it is possible to easily determine whether or not the printed wiring board 1 includes the non-standard blind via 5B by performing an electrical inspection and marking. Thereby, when the printed wiring board 1 is used as a component of an electric device, the printed wiring board 1 including the nonstandard blind via 5B can be easily removed.
  • the blind via 5 is covered with a coating layer so that dust due to burning does not move. Thereby, it can suppress that the malfunctioning by the said dust arises in the electronic device using the printed wiring board 1.
  • the pass / fail judgment inspection of the blind via 5 is performed.
  • the non-standard blind via 5A selected by energization contains almost no non-standard blind via 5B. Therefore, even if the printed wiring board 1 is deformed or expanded / contracted due to environmental changes, the standard blind via 5A is hardly disconnected. That is, the frequency with which the blind via 5 is disconnected due to deformation or expansion / contraction of the printed wiring board 1 can be reduced compared to a printed wiring board that is not energized.
  • the embodiment of the present invention is not limited to each of the above embodiments, and can be modified as follows. Further, the following modifications may be implemented in combination with each other.
  • JA is the amount of heat generated by the blind via 5 with a filling rate of 1
  • QA is the heat capacity of the blind via 5 with a filling rate of 1
  • I is the energizing current
  • t is the energizing time
  • H is the energizing time of the conductor 7.
  • Thermal capacity density V is the filling volume of the blind via
  • Td is the difference between the room temperature and the melting temperature of the conductor 7
  • R is the resistance of the blind via 5.
  • a specific parameter can also be obtained from an actual measurement value as follows.
  • the energization condition is set based on the conditional expression (5) or the conditional expression (10). Instead, the conditional expression (5) or the conditional expression (10) is used as the actual inspection result. And the energization condition may be obtained based on this correction formula.
  • the disconnection state of the blind via 5 is determined based on the measured value of the resistance of the blind via 5 by electrical inspection. Instead, the disconnection state of the blind via 5 may be determined based on the current amount or voltage value of the blind via 5.
  • the present invention can also be applied to the printed wiring board 1 having the following conditions.
  • the first conductive layer 2 and the second conductive layer 4 are connected by two blind vias 5, the first blind via 5 is determined to be defective, and the second blind via 5 has almost no current.
  • the present invention can be applied to the case where the two blind vias 5 are arranged so as not to flow. That is, when the blind via 5 is energized, no current flows between the first conductive layer and the second conductive layer through a path other than the blind via 5 to be inspected, or even if a current flows.
  • the condition is that the value does not affect the determination result.
  • energization is performed between the conductor 7 and the first conductive layer 2, but instead, energization may be performed between the conductor 7 and the second conductive layer 4.
  • a decrease in the contact ratio between the two affects the quality of the blind via, and therefore the energization condition is set based on a model that approximates the second model. That is, when the blind via 5 whose contact ratio with respect to the contact surface between the conductor 7 and the second conductive layer 4 is equal to or less than the third reference value is set as the non-standard blind via 5B, the energization condition is set based on the third reference value. To do.
  • the present invention is applied to the printed wiring board 1 having the blind via 5 formed by the conductive paste 30, but the present invention is applied to the printed wiring board 1 having the blind via 5 formed by electroplating. The invention can also be applied.
  • the present invention is applied to the printed wiring board 1 in which the first conductive layer 2 connected to the conductor 7 is stainless steel, but the material for forming the first conductive layer 2 is not limited to this. .
  • the present invention can be applied to the printed wiring board 1 in which the first conductive layer 2 is formed of copper.
  • the manufacturing method of the present invention is applied to the printed wiring board 1 having two conductive layers, but the present invention can also be applied to a multilayer printed wiring board having three or more conductive layers. .

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

La présente invention concerne une carte de circuit imprimé présentant une couche isolante (3) entre une première couche conductrice (2) et une seconde couche conductrice (4). Les première et seconde couches conductrices (2, 4) sont reliées par un trou de liaison borgne (5) comprenant un conducteur pénétrant à travers la couche isolante (3). Pendant la fabrication de ces cartes de circuit imprimé, il est déterminé si les trous de liaison borgnes (5) sont conformes à une spécification ou non, ceux conformes à une spécification étant identifiés comme des trous de liaison conformes à une spécification, et ceux non conformes à une spécification étant identifiés comme des trous de liaison borgnes non conformes à une spécification. Du courant est amené à passer à travers les trous de liaison borgnes (5) dans des conditions de passage de courant, de telle sorte que les trous de liaison borgne non conformes à une spécification se briseront et que les trous de liaison borgnes non conformes à une spécification ne se briseront pas.
PCT/JP2012/057292 2011-03-28 2012-03-22 Carte de circuit imprimé et procédé de fabrication de la carte de circuit imprimé WO2012133090A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201280001266.7A CN102870505B (zh) 2011-03-28 2012-03-22 印刷配线板及印刷配线板的制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-070894 2011-03-28
JP2011070894A JP5400823B2 (ja) 2011-03-28 2011-03-28 プリント配線板およびプリント配線板の製造方法

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WO2012133090A1 true WO2012133090A1 (fr) 2012-10-04

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JP (1) JP5400823B2 (fr)
CN (1) CN102870505B (fr)
WO (1) WO2012133090A1 (fr)

Cited By (5)

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DE102012100139A1 (de) * 2012-01-10 2013-07-11 Hella Kgaa Hueck & Co. Lichtmodul für einen Scheinwerfer eines Fahrzeugs mit einer Laserstrahlquelle
EP4366473A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Évaluation de l'état de santé d'un support à composant unique
EP4366472A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices
WO2024094434A1 (fr) * 2022-11-02 2024-05-10 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électroconductrices
WO2024094430A1 (fr) * 2022-11-02 2024-05-10 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices

Families Citing this family (1)

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JP7257785B2 (ja) * 2018-12-26 2023-04-14 日本シイエムケイ株式会社 プリント配線板及びその導通検査方法

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JP4844714B2 (ja) * 2005-08-22 2011-12-28 ミツミ電機株式会社 多層配線基板
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JPS58155370A (ja) * 1982-03-12 1983-09-16 Hitachi Ltd 導体パタ−ンの傷判定装置
JP2002329947A (ja) * 2002-02-15 2002-11-15 Ngk Spark Plug Co Ltd 配線基板の配線検査方法および配線基板の製造方法
JP2006278762A (ja) * 2005-03-29 2006-10-12 Tdk Corp 多層基板の検査方法および検査装置

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012100139A1 (de) * 2012-01-10 2013-07-11 Hella Kgaa Hueck & Co. Lichtmodul für einen Scheinwerfer eines Fahrzeugs mit einer Laserstrahlquelle
DE102012100139B4 (de) 2012-01-10 2022-10-13 HELLA GmbH & Co. KGaA Lichtmodul für einen Scheinwerfer eines Fahrzeugs mit einer Laserstrahlquelle
EP4366473A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Évaluation de l'état de santé d'un support à composant unique
EP4366472A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices
WO2024094434A1 (fr) * 2022-11-02 2024-05-10 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électroconductrices
WO2024094544A1 (fr) * 2022-11-02 2024-05-10 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Évaluation de l'état de santé d'un support monocomposant
WO2024094430A1 (fr) * 2022-11-02 2024-05-10 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices

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CN102870505A (zh) 2013-01-09
JP5400823B2 (ja) 2014-01-29
JP2012204803A (ja) 2012-10-22
CN102870505B (zh) 2015-09-23

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