CN102870505B - 印刷配线板及印刷配线板的制造方法 - Google Patents

印刷配线板及印刷配线板的制造方法 Download PDF

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Publication number
CN102870505B
CN102870505B CN201280001266.7A CN201280001266A CN102870505B CN 102870505 B CN102870505 B CN 102870505B CN 201280001266 A CN201280001266 A CN 201280001266A CN 102870505 B CN102870505 B CN 102870505B
Authority
CN
China
Prior art keywords
blind hole
distributing board
printing distributing
conductive layer
condition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201280001266.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN102870505A (zh
Inventor
冈良雄
上西直太
春日隆
朴辰珠
上田宏
富冈宽
上原澄人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Original Assignee
Sumitomo Electric Industries Ltd
Sumitomo Electric Printed Circuits Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd, Sumitomo Electric Printed Circuits Inc filed Critical Sumitomo Electric Industries Ltd
Publication of CN102870505A publication Critical patent/CN102870505A/zh
Application granted granted Critical
Publication of CN102870505B publication Critical patent/CN102870505B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN201280001266.7A 2011-03-28 2012-03-22 印刷配线板及印刷配线板的制造方法 Expired - Fee Related CN102870505B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011-070894 2011-03-28
JP2011070894A JP5400823B2 (ja) 2011-03-28 2011-03-28 プリント配線板およびプリント配線板の製造方法
PCT/JP2012/057292 WO2012133090A1 (fr) 2011-03-28 2012-03-22 Carte de circuit imprimé et procédé de fabrication de la carte de circuit imprimé

Publications (2)

Publication Number Publication Date
CN102870505A CN102870505A (zh) 2013-01-09
CN102870505B true CN102870505B (zh) 2015-09-23

Family

ID=46930818

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280001266.7A Expired - Fee Related CN102870505B (zh) 2011-03-28 2012-03-22 印刷配线板及印刷配线板的制造方法

Country Status (3)

Country Link
JP (1) JP5400823B2 (fr)
CN (1) CN102870505B (fr)
WO (1) WO2012133090A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012100139B4 (de) * 2012-01-10 2022-10-13 HELLA GmbH & Co. KGaA Lichtmodul für einen Scheinwerfer eines Fahrzeugs mit einer Laserstrahlquelle
JP7257785B2 (ja) * 2018-12-26 2023-04-14 日本シイエムケイ株式会社 プリント配線板及びその導通検査方法
WO2024094434A1 (fr) * 2022-11-02 2024-05-10 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électroconductrices
EP4366473A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Évaluation de l'état de santé d'un support à composant unique
EP4366472A1 (fr) * 2022-11-02 2024-05-08 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices
WO2024094430A1 (fr) * 2022-11-02 2024-05-10 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Test d'interconnexions électriquement conductrices

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1920587A (zh) * 2005-08-22 2007-02-28 三美电机株式会社 多层配线基板及bvh断线检查方法
CN101466201A (zh) * 2009-01-14 2009-06-24 高德（无锡）电子有限公司 印刷电路板打报废烧断装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155370A (ja) * 1982-03-12 1983-09-16 Hitachi Ltd 導体パタ−ンの傷判定装置
JP2002100845A (ja) * 2000-09-25 2002-04-05 Hitachi Kokusai Electric Inc ブラインドビアホール位置ずれ検査用回路パターン
JP3722760B2 (ja) * 2002-02-15 2005-11-30 日本特殊陶業株式会社 配線基板の配線検査方法および配線基板の製造方法
US7619434B1 (en) * 2004-12-01 2009-11-17 Cardiac Pacemakers, Inc. System for multiple layer printed circuit board misregistration testing
JP2006278762A (ja) * 2005-03-29 2006-10-12 Tdk Corp 多層基板の検査方法および検査装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1920587A (zh) * 2005-08-22 2007-02-28 三美电机株式会社 多层配线基板及bvh断线检查方法
CN101466201A (zh) * 2009-01-14 2009-06-24 高德（无锡）电子有限公司 印刷电路板打报废烧断装置

Also Published As

Publication number Publication date
CN102870505A (zh) 2013-01-09
JP5400823B2 (ja) 2014-01-29
JP2012204803A (ja) 2012-10-22
WO2012133090A1 (fr) 2012-10-04

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Granted publication date: 20150923

Termination date: 20190322