WO2012090540A1 - Procédé de polissage d'une surface de diamant - Google Patents

Procédé de polissage d'une surface de diamant Download PDF

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Publication number
WO2012090540A1
WO2012090540A1 PCT/JP2011/066952 JP2011066952W WO2012090540A1 WO 2012090540 A1 WO2012090540 A1 WO 2012090540A1 JP 2011066952 W JP2011066952 W JP 2011066952W WO 2012090540 A1 WO2012090540 A1 WO 2012090540A1
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WO
WIPO (PCT)
Prior art keywords
polishing
diamond
polishing member
diamond surface
metal
Prior art date
Application number
PCT/JP2011/066952
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English (en)
Japanese (ja)
Inventor
亮蔵 城石
健一 高尾
Original Assignee
東洋製罐株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010292145A external-priority patent/JP5817116B2/ja
Application filed by 東洋製罐株式会社 filed Critical 東洋製罐株式会社
Priority to KR1020137017272A priority Critical patent/KR20130092606A/ko
Priority to BR112013015008-4A priority patent/BR112013015008B1/pt
Priority to CN201180063496.1A priority patent/CN103282157B/zh
Priority to KR1020157023185A priority patent/KR101785183B1/ko
Priority to US13/991,294 priority patent/US9149901B2/en
Priority to EP11852528.6A priority patent/EP2660004B1/fr
Publication of WO2012090540A1 publication Critical patent/WO2012090540A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/22—Single-purpose machines or devices for particular grinding operations not covered by any other main group characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/16—Machines or devices using grinding or polishing belts; Accessories therefor for grinding other surfaces of particular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/02—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a reciprocatingly-moved work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/16—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
    • B24B9/166—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs using heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
    • B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements

Definitions

  • the present invention relates to a method for polishing a diamond surface, and more particularly to a method for polishing the surface of various diamond products.
  • diamond which is a crystal of carbon, is not only extremely hard, has excellent wear resistance, but also has excellent slipperiness and thermal conductivity, and also has a high refractive index, so it can be used in various applications. in use.
  • cutting tools such as cutting tools, end mills, and files, plastic working dies such as punches and dies, sliding members such as valve lifters and bearings, heat radiating members such as heat sinks, optical components such as electronic boards, lenses, and windows.
  • Such a diamond product needs to have a smooth surface by polishing the diamond surface in order to fully exhibit its properties.
  • Patent Document 1 uses a polishing member made of a metal that easily reacts with carbon in a diamond crystal, applies ultrasonic waves to the polishing member, and ultrasonically vibrates the polishing member on the diamond surface.
  • a polishing method in which polishing is performed by pressing is proposed.
  • the metal that easily reacts with carbon include stainless steel containing ⁇ -Fe, titanium (Ti), zirconium (Zr), and tantalum (Ta).
  • Patent Document 2 includes at least one metal element selected from the group consisting of Al, Cr, Mn, Fe, Co, and Ni and a group consisting of Zr, Hf, V, Nb, MO, Ta, and W. There has been proposed a method of polishing by using an intermetallic compound with at least one selected metal element as a grindstone, and pressing the grindstone against a relatively moving diamond surface while heating to 100 to 800 ° C. as necessary. ing.
  • Patent Document 3 proposes a method for polishing a diamond surface by converging and irradiating a laser beam so that the diamond surface becomes a focal point.
  • Patent Document 4 in the diamond film polishing method, the temperature of the contact portion between the metal and diamond is continuously changed in the range of 700 ° C. to 1000 ° C., and the two are relatively slid at the contact portion.
  • a method of polishing by moving it has been proposed.
  • the method proposed in Patent Document 1 uses a frictional heat generated by ultrasonic vibration to perform polishing by causing a metal constituting the polishing member to chemically react with carbon on the diamond surface. Because the frictional heat generated by ultrasonic vibration is used, temperature control must be performed by the frequency and pressing force, which is very difficult to control, and it is difficult to perform stable and constant polishing. is there. Further, since frictional heat is used, its energy efficiency is low, and in order to raise the temperature, it is necessary to press the polishing member against the diamond surface with a considerable pressing force. In addition, the hardness of the metal constituting the polishing member is considerably lower than that of diamond. Therefore, there is a drawback that the abrasive member is extremely worn and its life is short. Furthermore, since it is necessary to press the polishing member against the diamond surface with a considerable pressing force, there is a problem that the polishing machine, in particular, the rigidity around the polishing member has to be increased, and the apparatus becomes large. .
  • Patent Document 2 The method proposed in Patent Document 2 is to perform polishing using a grindstone containing an extremely hard intermetallic compound as an abrasive grain.
  • a special intermetallic compound is used, the cost is extremely high. End up.
  • polishing is performed by pressing a hard intermetallic compound (hardness Hv of 500 to 1000) against the diamond surface, a large amount of abrasion powder is generated due to abrasive wear.
  • the powder surface has high chemical activity, the generation of a large amount of wear powder may cause ignition or explosion.
  • the mechanical polishing is performed by pressing the diamond surface, there is still a problem that the apparatus is enlarged.
  • Patent Document 3 The method proposed in Patent Document 3 is to gasify and polish the carbon on the diamond surface by heating with laser light. However, unless laser light is irradiated so that the convex part on the diamond surface is in focus. In other words, it is extremely difficult to control the laser irradiation. Therefore, there is a problem that it takes an enormous time to polish a substance having a certain large surface area (for example, several tens of square centimeters or more).
  • the temperature of the contact portion between the metal and diamond is continuously changed in the range of 700 ° C. to 1000 ° C., and the two are relatively slid at the contact portion. It is moved and polished.
  • the temperature cannot be changed instantaneously, and there is a restriction on the adjustment of the polishing amount.
  • the polishing member is formed into a spherical shape for the purpose of preventing uneven wear, and is rotated at a low speed. When trying to use a wider surface, it is necessary to make the rotation axis free, and there is a problem that the apparatus is easily complicated.
  • the object of the present invention is that the generation of abrasion powder is small, the life of the polishing member is long, the control thereof is easy, and a surface with high smoothness can be obtained.
  • An object of the present invention is to provide a diamond surface polishing method that can be easily applied to polishing. Another object of the present invention is that it is possible to perform polishing by using a polishing member formed of an inexpensive metal alone without using an expensive material obtained by a special manufacturing method like an intermetallic compound. The object is to provide a method for polishing a diamond surface.
  • a polishing member having a linear, belt-like or rod-like shape and having a surface made of a metal or a carburizable metal that is easily reactive with carbon is used. Polishing the diamond surface with the polishing member while continuously or intermittently changing the polishing surface of the polishing member, and heating the polishing member or the diamond surface prior to polishing by the polishing member, A method for polishing a diamond surface is provided.
  • carbon and an easily reactive metal mean one having a temperature range in which the Gibbs free energy change ( ⁇ G) in the carbide forming reaction is negative, and diamond is preferably carbonized.
  • the free energy change amount ( ⁇ G) of the carbide forming reaction is ⁇ 20 kcal / mol or less.
  • the amount of Gibbs free energy change in the carbide formation reaction in various metals is known, and is described, for example, in Metal Data Book Rev. 4 (Edited by the Japan Institute of Metals, Maruzen).
  • the carburizable metal means a metal that can diffuse and penetrate carbon from the surface.
  • the polishing method of the present invention (1) Prior to polishing with the polishing member, the surface of the diamond is heated by laser light irradiation, and following the laser light irradiation, the polishing member is rubbed against the laser light irradiation portion for polishing. thing, (2) As the polishing member, one having a surface made of a metal easily reactive with carbon is used, and the metal is Zr, Ta, Ti, W, Nb or Al. (3) As the polishing member, one having a surface made of a carburizable metal is used, and the carburizable metal is Fe, Ni or Co. (4) Prior to polishing by the polishing member, heating the diamond surface and heating the polishing member; Is preferred.
  • the surface of the diamond is polished by rubbing the surface of the diamond with the surface of the polishing member.
  • the surface of the polishing member is formed of a metal that is easily reactive with carbon or a carburizable metal.
  • the polishing member or the diamond surface is heated prior to the polishing by the polishing member. Accordingly, during polishing, the carbon on the diamond surface reacts with the easily reactive metal forming the polishing member surface or diffuses and penetrates into the surface layer of the carburizable metal, and as a result, the carbon on the diamond surface is removed, The diamond surface is effectively polished.
  • the polishing member to be used has a linear, belt-like or rod-like shape, and polishing is performed while continuously or intermittently changing the surface of the polishing member formed of the metal material described above. Is done. That is, since the contact portion is changed and the diamond surface is rubbed, the above reaction (reaction between a readily reactive metal and carbon on the diamond surface or diffusion and penetration of the carbon) does not reach a saturated state, or The surface pressure does not change due to wear and always proceeds stably, and as a result, stable polishing can be performed continuously over a long period of time.
  • Zr, Ta, Ti, or Al is preferable as the metal that easily reacts with carbon forming the polishing member surface.
  • All of these metals are soft metals, and their Vickers hardness (Hv) is 200 or less, which is notably lower than that of the diamond surface, but is also an intermetallic compound used in Patent Document 2 described above.
  • the hardness of the whetstone is extremely low even when compared with 500 to 1000. That is, since such a low hardness metal is rubbed against the diamond surface for polishing, the generation of abrasion powder is effectively suppressed as compared with the case of using a high hardness metal or metal compound, and the polishing member The lifetime can be improved, which is a great advantage of the present invention.
  • Fe, Ni, and Co are suitable as the carburizing metal that forms the surface of the polishing member. These metals have the property of diffusing and penetrating carbon from the surface.
  • the diamond surface prior to polishing by laser beam irradiation and polish the laser beam irradiated portion by rubbing with a polishing member.
  • laser light irradiation is simply used to heat to a temperature at which the metal and carbon on the surface of the polishing member can react, or a temperature at which carbon on the diamond surface can be carburized on the surface of the polishing member.
  • laser light is not used to evaporate the carbon on the diamond surface. For this reason, complicated adjustment of polishing conditions is not required, and not only the apparatus can be made compact, but also can be effectively applied to polishing uneven three-dimensional surfaces and curved surfaces. Smoothing can be realized.
  • the diamond surface when the diamond surface is heated by laser light irradiation, the diamond surface is heated in a spot manner, locally and instantaneously. Therefore, when polishing a diamond film formed on a predetermined substrate, there is little risk of film damage due to a difference in thermal expansion between the diamond film and the substrate. Furthermore, since only local heating is required, there is an advantage that the energy utilization efficiency is extremely high. Further, since the intensity of the laser light can be changed instantaneously, the polishing amount can be adjusted by changing the heating temperature. Specifically, by monitoring the surface properties and applying feedback, it is possible to improve surface uniformity or to form minute irregularities on the surface.
  • the polishing member it is preferable to perform both heating of the polishing member and heating of the diamond surface prior to polishing of the diamond surface by the polishing member.
  • This heating when the diamond surface is polished, the reaction between the carbon on the diamond surface and the metal forming the polishing member surface or the carburization of the carbon on the metal surface is further promoted, and polishing can be performed efficiently and in a short time. Can do.
  • polishing member it is not necessary to form a polishing member using a special compound such as an intermetallic compound, and since an existing single metal is used as the polishing member, it is advantageous in terms of cost.
  • polishing method of this invention The conceptual diagram for demonstrating the grinding
  • polishing method of FIG. The diagram which shows the relationship between irradiation energy density and temperature.
  • polishing test of an Example The diagram which shows the change of the surface roughness of the diamond surface in the grinding
  • the present invention is for polishing a workpiece 1 having a diamond surface 1a.
  • This workpiece 1 has a diamond surface 1a made of a single crystal, a polycrystal, a thin film or the like. As long as it is, it may have an arbitrary shape and may have a shape according to its use.
  • the diamond surface 1a of the workpiece 1 is polished by the polishing apparatus 3 provided with the polishing member 3a for rubbing the diamond surface 1a.
  • This is performed by irradiating the surface 1a with the laser beam 5, and polishing the irradiated portion of the laser beam 5 with the polishing apparatus 3 after the irradiation.
  • the polishing apparatus 3 includes a polishing member 3a that rubs against the diamond surface 1a.
  • the polishing member 3a is made of a metal that is easily reactive with carbon or a carburizable metal.
  • the metal that is easily reactive with carbon has a temperature range in which the Gibbs free energy change ( ⁇ G) in the carbide forming reaction is negative.
  • Zr, Ta, Ti, W, Nb and Al can be exemplified, and among these, Zr, Ta, Ti or Al is preferable. That is, as described above, the surface hardness Hv (Vickers hardness) of these metals is extremely low, for example, 100 to 150 for Ta, 120 to 200 for Zr, 100 to 200 for Ti, and 15 to 15 for Al. About 50. Therefore, when polishing is performed with such a soft metal, wear and deformation can be effectively suppressed even when polishing is performed with a sliding force having a small pressing force as described above. In addition to effectively preventing the generation of a large amount of wear powder, it is possible to increase the life of the polishing member 3a and to perform stable and accurate polishing over a long period of time.
  • Zr, Ta or Ti is most suitable. These metals are all in a temperature range where the Gibbs free energy change ( ⁇ G) in the reaction for forming the carbides (ZrC, TaC, TiC) does not exceed the temperature at which diamond is carbonized (750 to 850 ° C.). -20 kcal / mol or less, in particular, about -30 to -45 kcal / mol, which is very low. Therefore, it is very easy to react with carbon on the diamond surface 1a by the rubbing after heating by irradiation with the laser beam 5, and the diamond surface 1a This is because it can be polished. For example, as shown in an experimental result (see FIG.
  • the surface roughness is about 0.8 ⁇ m from a rough surface having a surface roughness Rz (maximum surface roughness) of about 1.5 ⁇ m. Polishing to a smooth surface can be performed for a short time.
  • the polishing member 3a having a surface formed of Ni is preferable. That is, when the polishing member 3a having a surface made of such a carburizing metal is used, carbon atoms on the diamond surface 1a diffuse to the surface of the polishing member 3a when polishing by the polishing member 3a, and polishing of the diamond surface is performed. Can be done effectively.
  • Polishing with the polishing member 3a may be performed by rubbing the laser beam irradiation portion with the polishing member 3a, and there is no need to rub while pressing with a large pressing force.
  • an appropriate pressing force varies depending on the shape and material of the polishing member, it has been confirmed that polishing is possible with a pressing force of about 5 N (0.5 kgf), for example.
  • the pressing force is appropriately determined in consideration of the shape of the work piece, the shape and material of the polishing member corresponding thereto, the device rigidity, etc. Set it.
  • the laser beam 5 is irradiated for locally heating the diamond surface 1a to a temperature at which the metal forming the surface of the polishing member 3a can easily react with carbon.
  • the degree of heating is mainly determined by the energy density of laser irradiation and the energy absorption rate of diamond.
  • setting is performed by appropriately setting the laser output, irradiation width (spot diameter), and processing speed based on the energy absorption rate of diamond with respect to the laser source used for polishing. Actually, it varies depending on the shape, thickness, laser type, etc. As an example, FIG.
  • FIG. 4 shows the relationship between the irradiation energy density and the diamond surface temperature when a 10 ⁇ m thick diamond coated with cemented carbide is irradiated with a carbonic acid laser. Shown in For the temperature measurement, a radiation thermometer (FTK9-R220A-2.5B11) manufactured by Japan Sensor Co., Ltd. was used. According to this, as the irradiation energy density increases, the temperature also rises. However, if the irradiation energy density is increased too much, diamond is carbonized at around 750 to 850 ° C., and the temperature does not increase any more. .
  • the irradiation conditions such as the irradiation energy density of the laser beam should be set so that the diamond surface 1a is heated in a temperature range not exceeding the temperature at which diamond is carbonized (750 to 850 ° C.).
  • an easily reactive metal is used for the polishing member 3a, it is 200 ° C or higher, particularly 220 ° C to 800 ° C, and when a carburizable metal is used, 600 ° C or higher, particularly 700 ° C to 800 ° C is preferable. What is necessary is just to set irradiation conditions so that it may heat within the range and the temperature which does not exceed melting
  • the laser beam 5 is known as the laser beam 5.
  • the laser source is not limited, and any known laser can be used.
  • To perform stable polishing for example, in the field of welding and machining, solid lasers such as YAG and fiber laser are widely used. In the present invention, not only such solid lasers but also gas lasers such as carbon dioxide lasers and excimer lasers are used. You can also
  • the irradiation width (spot diameter) of the laser beam 5 is not particularly limited, but is preferably close to the width where the polishing member 3a and the diamond are in contact with each other in view of the energy efficiency of the laser beam and the polishing efficiency. For example, if the irradiation width is too small compared to the contact width between the two, polishing at a low temperature portion (a portion not irradiated) does not proceed when rubbing, and as a result, the polishing takes time. Also, if the irradiation width is set too large, places that do not need to be heated (not polished) will also be heated, resulting in energy loss, making the laser beam output unnecessarily high, or reducing the processing speed. And so on. Note that the width of contact between the polishing member 3a and the diamond can be roughly estimated using a well-known Hertzian equation.
  • the irradiated portion is polished by the polishing member 3a.
  • the surface temperature of the irradiated portion is the metal of the polishing member 3a and the carbon of the diamond surface 1a. Polishing may be performed while the temperature is maintained at such a level that the reaction (or carburization) proceeds.
  • the thermal conductivity of diamond is extremely high (easy to be cooled), it is desirable that the irradiated portion and the polishing member 3a be brought close to each other as long as the installation space permits to shorten the time.
  • the laser beam 5 and the polishing member 3a provided in the polishing apparatus 3 are arranged concentrically and the processing member 1 is rotated in the laser beam. Polishing is performed by rubbing the diamond surface with the polishing member 3 a while irradiating 5. Further, the entire diamond surface 1a can be polished by moving the polishing device 3 (polishing member 3a) and the irradiation source of the laser beam 5 intermittently or continuously in the radial direction of the diamond surface 1. In addition, instead of rotating the processing member 1, it is possible to polish the irradiated portion of the laser beam 5 by rotating the polishing apparatus 3 (the polishing member 3 a) and the irradiation source of the laser beam 5. It is common to rotate the member 1 without increasing the size of the apparatus. Further, when the polishing is insufficient by one polishing process, the above operation may be repeated a plurality of times to perform further polishing.
  • polishing can be performed by linearly sliding the processing member 1 or the polishing apparatus 3 (polishing member 3 a) and the irradiation source of the laser beam 5.
  • a processing member 35 is fixed on a table 31 slidable on a rail 30, and a laser source 37 is disposed above the table 31, and in parallel with the laser source 37.
  • a polishing apparatus 39 is provided.
  • the polishing device 39 has a polishing member 40 attached to the lower end thereof, and reciprocates the table 31 while irradiating a laser beam 37a, thereby polishing the diamond surface of the processing member 35 by rubbing with the polishing member 40. I do.
  • the processing member 35 can be placed on the support member 33 and the support member 33 can be fixed to the table 31.
  • the shape of the polishing member 3a is used for efficient polishing by reacting carbon atoms on the diamond surface with metals on the polishing surface of the polishing member or by diffusing and penetrating carbon atoms on the diamond surface into the polishing member surface. It is necessary to change the contact portion of the polishing member continuously or intermittently in the shape of a wire (wire shape), a belt shape or a rod shape. That is, the surface (contact portion) of the polishing member that is in contact with the diamond surface always changes, so that the reaction between carbon atoms and metals or the diffusion and penetration of carbon atoms occurs constantly or the surface pressure changes due to wear. Therefore, it always proceeds stably, and as a result, stable polishing can be performed continuously over a long period of time.
  • FIG. 3 shows examples of various shapes of the polishing member 3a used in the present invention.
  • an endless wire 15 is wound around a pulley 13 held by a predetermined support member 10.
  • the wire 15 is a polishing member 3a formed of a metal (or carburizing metal) that is easily reactive with carbon.
  • an endless belt 19 is wound around a roller 17 held by the support member 10, and this endless belt 19 is the polishing member 3a.
  • the rod 21 has penetrated the inside of the sleeve-shaped support member 10, and the diamond surface 1a is rubbed by the lower end surface. That is, this rod 21 is the polishing member 3a.
  • the endless wire 15 and the endless belt 19 described above are polished by rotating the pulley 13 or the roller 17 so that the rubbing surface against the diamond surface 1a is continuously or intermittently changed. It has become. Further, the rod 21 is drawn out continuously or intermittently, whereby polishing is performed. In this way, by performing polishing by driving the polishing member 3a continuously or intermittently, preferably continuously, the contact pressure with the diamond is consumed by polishing, so that the surface pressure changes due to wear. Therefore, it is possible to perform stable polishing continuously for a long period of time.
  • the present invention in particular, it has a linear (endless wire 15) as shown in FIG. 3A and a belt-like (endless belt 19) as shown in FIG. 3B.
  • the rubbing surface between the polishing member 3a and the diamond surface 1a becomes a point or line contact, so that not only high polishing efficiency can be ensured, but also polishing can always be performed on a new surface.
  • the surface pressure change due to wear or the like does not occur, and stable polishing can be performed continuously over a long period of time.
  • a synergistic effect can be aimed at by heating the polishing member 3a in advance.
  • the temperature of the diamond surface can be further increased, and the reaction between the carbon on the diamond surface 1a and the metal on the surface of the polishing member 3a or the carburization (diffusion) of the carbon on the metal surface can be promoted. it can.
  • the output of the laser beam can be kept low.
  • the diamond surface When polishing is performed by heating the polishing member 3a, the diamond surface can be polished to some extent efficiently only by rubbing with the polishing member 3a without irradiating the laser beam.
  • the above heating is such that the diamond surface 1a and / or the surface of the polishing member 3a, or both, is heated to a temperature of 200 ° C. or higher, particularly 220 ° C. or higher, provided that the temperature at which diamond is carbonized is not exceeded. To be done.
  • heating means of the polishing member 3a for example, known heating means such as various heaters, hot air, energization resistance heating, induction heating, and a high energy beam can be adopted according to the form of the polishing member 3a.
  • the heating means as described above can also be employed as a means for heating the diamond surface instead of laser light irradiation.
  • the above-described polishing method of the present invention does not use a polishing member made of a particularly expensive compound, but can perform polishing using a polishing member formed of a single metal, and is easy to control.
  • the present invention is not limited to a simple surface, but can also effectively polish uneven three-dimensional surfaces and curved surfaces, and is therefore applicable to polishing of workpieces having various forms of diamond surfaces.
  • a laser absorber may be applied to the diamond surface before or during polishing to increase the energy absorption efficiency of the diamond.
  • polishing may be performed while blowing oxygen gas or the like.
  • polishing is performed while vacuuming, high-pressure air or a small amount of cleaning liquid is sprayed continuously or intermittently. Also good.
  • the invention is illustrated by the following experimental example.
  • the surface roughness was measured by the following method.
  • Test piece having the schematic structure shown in FIG. 1 was used, and the test piece to be polished was a cemented carbide substrate coated with diamond by a hot filament CVD method.
  • Test piece Shape: 13mm x 13mm flat plate (thickness 5mm)
  • Base material Cemented carbide Alloy Diamond thickness: 10 ⁇ m Maximum height Rz: 1.5 ⁇ m (diamond surface)
  • Laser carbon dioxide laser
  • a Ta wire having a circular cross section and a diameter of 1 mm is attached to the above polishing test machine (see FIG. 3A), and the distance between the laser irradiation position and the contact position between the polishing member and the test piece is 2 mm.
  • the polishing member (Ta wire) was polished by moving the test piece at 72 m / min while irradiating the surface of the test piece with a laser beam with a load of 10 N. Further, each time polishing was completed, the test piece was moved by 0.005 mm perpendicular to the rubbing direction, and this operation was performed a plurality of times (about 100 times) to perform a planar polishing test.
  • Example 9 The polishing test was performed in exactly the same manner as in Experimental Example 1 except that the movement of the test piece was changed as follows, laser irradiation was not performed, and the polishing member was heated to 700 ° C. with a heater. Test piece moving speed: 18m / min Test piece rubbing vertical movement: 0.025mm / rev As the number of times of rubbing increased, the maximum height Rz decreased and it was confirmed that polishing was performed.
  • Example 10 A polishing test was conducted in the same manner as in Experimental Example 9 except that the polishing member was heated to 800 ° C. As a result, it was confirmed that polishing progressed faster than in Experimental Example 9 (700 ° C.).
  • Example 13 A polishing test was conducted in the same manner as in Experimental Example 12 except that the polishing member was heated to 500 ° C. As a result, it was confirmed that the diamond surface was not polished at all.
  • Example 14 A polishing test was performed in exactly the same manner as in Experimental Example 1, except that the polishing member was changed to Ni. As a result, it was confirmed that the polishing progressed faster than Experimental Example 9 (Ta) and Experimental Example 11 (Fe).
  • Example 15 The conditions were changed as follows, and while rotating the test piece, the polishing member was moved from the inner diameter toward the outer diameter at a speed of 0.025 mm / rev. When the end point was reached, the polishing was terminated, After changing the contact portion, the polishing test was performed in exactly the same manner as in Experimental Example 1 except that the operation of starting polishing again from the inner diameter was performed a plurality of times.
  • Test piece Shape: Ring shape with inner diameter of 33mm and outer diameter of 65mm (thickness 12mm)
  • Base material Cemented carbide Alloy Diamond thickness: 20 ⁇ m Maximum height Rz: 1.8 ⁇ m (diamond surface)
  • Peripheral speed 24m / min Polishing member load; 20N Laser irradiation position and distance between contact position of polishing member and test piece; 0.7 mm
  • the maximum height Rz of the polished part was measured every five rubbing times at the same part of the test piece. As a result, as the number of rubbing increases, the maximum height Rz decreases and it was confirmed that polishing was performed. Also, it was confirmed that the polishing progressed more slowly as it went from the polishing start point to the end point.
  • Example 16 A polishing test was performed in exactly the same manner as in Experimental Example 13 except that the Ta wire was continuously fed at 0.5 mm / s and the contact portion was changed. As a result, it was confirmed that the polishing amount was almost constant regardless of the position from the polishing start point.
  • the determination of the result of the polishing test is based on the polishing amount ( ⁇ Rz) after 15 times of rubbing. If less than 0.1 ⁇ m: ⁇ When 0.1 to less than 0.5 ⁇ m: ⁇ In case of 0.5 ⁇ m or more: ⁇ It was.
  • Diamond workpiece 1a Diamond surface 3a: Polishing member 5: Laser light

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Laser Beam Processing (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

L'invention concerne un procédé de polissage d'une surface de diamant dans lequel il est possible de réduire la production de la poudre d'abrasion, d'augmenter la durée de vie d'un élément de polissage, de contrôler facilement ledit élément de polissage, d'obtenir une surface particulièrement lisse, et de polir aisément une surface tridimensionnelle irrégulière. L'invention concerne un procédé de polissage d'une surface de diamant (1a) qui se caractérise en ce que l'élément de polissage (3a) présente une surface formée à partir de carbone et on utilise un métal aisément réactif ou un métal de cémentation, la surface du diamant (1a) est irradiée avec des faisceaux laser (5) avant son polissage avec l'élément de polissage (3a), et on frotte ledit élément de polissage contre une unité de rayonnement de faisceaux laser après émission des faisceaux laser.
PCT/JP2011/066952 2010-02-03 2011-07-26 Procédé de polissage d'une surface de diamant WO2012090540A1 (fr)

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KR1020137017272A KR20130092606A (ko) 2010-12-28 2011-07-26 다이아몬드 표면의 연마 방법
BR112013015008-4A BR112013015008B1 (pt) 2010-12-28 2011-07-26 Método de polimento de uma superfície de diamante
CN201180063496.1A CN103282157B (zh) 2010-12-28 2011-07-26 金刚石表面的研磨方法
KR1020157023185A KR101785183B1 (ko) 2010-12-28 2011-07-26 다이아몬드 표면의 연마 방법
US13/991,294 US9149901B2 (en) 2010-02-03 2011-07-26 Method of polishing the diamond-surface
EP11852528.6A EP2660004B1 (fr) 2010-12-28 2011-07-26 Procédé de polissage d'une surface de diamant

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JP2010292145A JP5817116B2 (ja) 2010-02-03 2010-12-28 ダイヤモンド表面の研磨方法
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US20160228954A1 (en) * 2013-09-13 2016-08-11 Cemecon Ag Tool and Method for Machining Fiber-Reinforced Materials
CN115229647A (zh) * 2022-07-20 2022-10-25 华侨大学 一种飞秒激光辅助抛光金刚石的装置及其抛光方法

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JP6488775B2 (ja) * 2015-03-09 2019-03-27 東洋製罐グループホールディングス株式会社 ダイヤモンド表面の研磨方法およびそれを実施する装置
CN107457616B (zh) * 2017-09-07 2019-07-26 哈尔滨工业大学 一种基于纳米镍粉的金刚石晶体表面机械化学抛光方法
CN110774118B (zh) 2019-10-23 2021-04-30 华侨大学 一种大尺寸单晶金刚石的磨削方法
CN110774153B (zh) * 2019-10-23 2022-02-08 华侨大学 一种大尺寸单晶金刚石的抛光方法
CN114012512B (zh) * 2021-10-29 2022-08-16 哈尔滨工业大学 一种基于激光加热、水浴加热、化学作用共同辅助的小球头磁流变抛光方法

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CN115229647B (zh) * 2022-07-20 2023-08-29 华侨大学 一种飞秒激光辅助抛光金刚石的装置及其抛光方法

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BR112013015008B1 (pt) 2021-04-13
CN103282157A (zh) 2013-09-04
EP2660004B1 (fr) 2021-07-14
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EP2660004A4 (fr) 2017-11-22
KR20130092606A (ko) 2013-08-20

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