WO2012081254A1 - ジエチル亜鉛組成物、熱安定化方法および熱安定化用化合物 - Google Patents
ジエチル亜鉛組成物、熱安定化方法および熱安定化用化合物 Download PDFInfo
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- WO2012081254A1 WO2012081254A1 PCT/JP2011/007019 JP2011007019W WO2012081254A1 WO 2012081254 A1 WO2012081254 A1 WO 2012081254A1 JP 2011007019 W JP2011007019 W JP 2011007019W WO 2012081254 A1 WO2012081254 A1 WO 2012081254A1
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- WIPO (PCT)
- Prior art keywords
- compound
- carbon atoms
- diethylzinc
- diethyl zinc
- additive
- Prior art date
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- HQWPLXHWEZZGKY-UHFFFAOYSA-N diethylzinc Chemical compound CC[Zn]CC HQWPLXHWEZZGKY-UHFFFAOYSA-N 0.000 title claims abstract description 172
- 239000000203 mixture Substances 0.000 title claims abstract description 98
- 150000001875 compounds Chemical class 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 35
- 230000006641 stabilisation Effects 0.000 title claims description 6
- 238000011105 stabilization Methods 0.000 title claims description 6
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 24
- 239000000654 additive Substances 0.000 claims description 53
- 230000000996 additive effect Effects 0.000 claims description 49
- 125000004432 carbon atom Chemical group C* 0.000 claims description 43
- 239000001257 hydrogen Substances 0.000 claims description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims description 19
- 229920006395 saturated elastomer Polymers 0.000 claims description 13
- 125000001424 substituent group Chemical group 0.000 claims description 13
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- 150000002431 hydrogen Chemical group 0.000 claims description 10
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 9
- 125000003545 alkoxy group Chemical group 0.000 claims description 9
- -1 ether compound Chemical class 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 230000000694 effects Effects 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 5
- 150000004945 aromatic hydrocarbons Chemical class 0.000 claims description 4
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 4
- 150000002170 ethers Chemical class 0.000 claims description 2
- 230000000087 stabilizing effect Effects 0.000 claims description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract description 14
- 239000010409 thin film Substances 0.000 abstract description 14
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 11
- 238000003786 synthesis reaction Methods 0.000 abstract description 8
- 239000011787 zinc oxide Substances 0.000 abstract description 7
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000002245 particle Substances 0.000 abstract description 5
- 239000002685 polymerization catalyst Substances 0.000 abstract description 5
- 239000011701 zinc Substances 0.000 abstract description 5
- 229910052725 zinc Inorganic materials 0.000 abstract description 5
- 230000007774 longterm Effects 0.000 abstract 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 abstract 1
- 239000007858 starting material Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 28
- 238000005259 measurement Methods 0.000 description 23
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 22
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 22
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 18
- 238000009835 boiling Methods 0.000 description 18
- QDXQAOGNBCOEQX-UHFFFAOYSA-N 1-methylcyclohexa-1,4-diene Chemical compound CC1=CCC=CC1 QDXQAOGNBCOEQX-UHFFFAOYSA-N 0.000 description 13
- CMSUNVGIWAFNBG-UHFFFAOYSA-N 2,4-dimethylpenta-1,3-diene Chemical compound CC(C)=CC(C)=C CMSUNVGIWAFNBG-UHFFFAOYSA-N 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- HXGDTGSAIMULJN-UHFFFAOYSA-N acetnaphthylene Natural products C1=CC(C=C2)=C3C2=CC=CC3=C1 HXGDTGSAIMULJN-UHFFFAOYSA-N 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 11
- 239000001307 helium Substances 0.000 description 11
- 229910052734 helium Inorganic materials 0.000 description 11
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 11
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 10
- 239000012159 carrier gas Substances 0.000 description 10
- 125000004054 acenaphthylenyl group Chemical group C1(=CC2=CC=CC3=CC=CC1=C23)* 0.000 description 8
- 230000020169 heat generation Effects 0.000 description 8
- 238000009825 accumulation Methods 0.000 description 7
- 238000000354 decomposition reaction Methods 0.000 description 7
- 238000002076 thermal analysis method Methods 0.000 description 7
- YPHHKFWHAPFOFK-UHFFFAOYSA-N 6,6-dimethylhepta-1,3-diene Chemical compound CC(C)(C)CC=CC=C YPHHKFWHAPFOFK-UHFFFAOYSA-N 0.000 description 6
- 125000000753 cycloalkyl group Chemical group 0.000 description 6
- MGNZXYYWBUKAII-UHFFFAOYSA-N cyclohexa-1,3-diene Chemical compound C1CC=CC=C1 MGNZXYYWBUKAII-UHFFFAOYSA-N 0.000 description 6
- 239000000543 intermediate Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- ZXLUFQJSMQSMTR-AATRIKPKSA-N (4e)-2-methylhepta-2,4-diene Chemical compound CC\C=C\C=C(C)C ZXLUFQJSMQSMTR-AATRIKPKSA-N 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- UVJHQYIOXKWHFD-UHFFFAOYSA-N cyclohexa-1,4-diene Chemical compound C1C=CCC=C1 UVJHQYIOXKWHFD-UHFFFAOYSA-N 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000013112 stability test Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- YHQGMYUVUMAZJR-UHFFFAOYSA-N α-terpinene Chemical compound CC(C)C1=CC=C(C)CC1 YHQGMYUVUMAZJR-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- YKFLAYDHMOASIY-UHFFFAOYSA-N γ-terpinene Chemical compound CC(C)C1=CCC(C)=CC1 YKFLAYDHMOASIY-UHFFFAOYSA-N 0.000 description 4
- HVSYSQGJZITGQV-CCAGOZQPSA-N (1Z,3Z)-cyclonona-1,3-diene Chemical compound C1CC\C=C/C=C\CC1 HVSYSQGJZITGQV-CCAGOZQPSA-N 0.000 description 3
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 3
- DNZZPKYSGRTNGK-PQZOIKATSA-N (1z,4z)-cycloocta-1,4-diene Chemical compound C1C\C=C/C\C=C/C1 DNZZPKYSGRTNGK-PQZOIKATSA-N 0.000 description 3
- SZHAWDAGEJWQJK-UHFFFAOYSA-N 1,3,5,5-tetramethylcyclohexa-1,3-diene Chemical compound CC1=CC(C)=CC(C)(C)C1 SZHAWDAGEJWQJK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 238000005481 NMR spectroscopy Methods 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cis-cyclohexene Natural products C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 3
- 238000004821 distillation Methods 0.000 description 3
- 239000003814 drug Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000012770 industrial material Substances 0.000 description 3
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 239000008204 material by function Substances 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 230000001699 photocatalysis Effects 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- HNXYQJYBEOPJOC-PQZOIKATSA-N (1z,4z)-cyclonona-1,4-diene Chemical compound C1CC\C=C/C\C=C/C1 HNXYQJYBEOPJOC-PQZOIKATSA-N 0.000 description 2
- GQVMHMFBVWSSPF-SOYUKNQTSA-N (4E,6E)-2,6-dimethylocta-2,4,6-triene Chemical compound C\C=C(/C)\C=C\C=C(C)C GQVMHMFBVWSSPF-SOYUKNQTSA-N 0.000 description 2
- GWYPDXLJACEENP-UHFFFAOYSA-N 1,3-cycloheptadiene Chemical compound C1CC=CC=CC1 GWYPDXLJACEENP-UHFFFAOYSA-N 0.000 description 2
- HQGYGGZHZWXFSI-UHFFFAOYSA-N 1,4-cycloheptadiene Chemical compound C1CC=CCC=C1 HQGYGGZHZWXFSI-UHFFFAOYSA-N 0.000 description 2
- QMFJIJFIHIDENY-UHFFFAOYSA-N 1-Methyl-1,3-cyclohexadiene Chemical compound CC1=CC=CCC1 QMFJIJFIHIDENY-UHFFFAOYSA-N 0.000 description 2
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- BGVMQLSBQHXEDS-UHFFFAOYSA-N 2,3,5-trimethylhexa-1,3,5-triene Chemical compound CC(=C)C=C(C)C(C)=C BGVMQLSBQHXEDS-UHFFFAOYSA-N 0.000 description 2
- XMWINMVFKPHMJB-UHFFFAOYSA-N 2-Methyl-1,3-cyclohexadiene Chemical compound CC1=CCCC=C1 XMWINMVFKPHMJB-UHFFFAOYSA-N 0.000 description 2
- WSTYNZDAOAEEKG-UHFFFAOYSA-N Mayol Natural products CC1=C(O)C(=O)C=C2C(CCC3(C4CC(C(CC4(CCC33C)C)=O)C)C)(C)C3=CC=C21 WSTYNZDAOAEEKG-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- GQVMHMFBVWSSPF-UHFFFAOYSA-N cis-alloocimene Natural products CC=C(C)C=CC=C(C)C GQVMHMFBVWSSPF-UHFFFAOYSA-N 0.000 description 2
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- 238000000746 purification Methods 0.000 description 2
- 238000000197 pyrolysis Methods 0.000 description 2
- AFVDZBIIBXWASR-AATRIKPKSA-N (E)-1,3,5-hexatriene Chemical compound C=C\C=C\C=C AFVDZBIIBXWASR-AATRIKPKSA-N 0.000 description 1
- TUUPVPTYVPFAKG-UHFFFAOYSA-N 1,2-dimethylcyclohexa-1,3-diene Chemical compound CC1=C(C)C=CCC1 TUUPVPTYVPFAKG-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- PUQJLFYISQDJKP-UHFFFAOYSA-N 1-ethylcyclohexa-1,4-diene Chemical compound CCC1=CCC=CC1 PUQJLFYISQDJKP-UHFFFAOYSA-N 0.000 description 1
- CUAOCFVIXYPQCH-UHFFFAOYSA-N 2,3,4-trimethylpenta-1,3-diene Chemical compound CC(C)=C(C)C(C)=C CUAOCFVIXYPQCH-UHFFFAOYSA-N 0.000 description 1
- MZHWVYRSZJUNKM-UHFFFAOYSA-N 2,4,5,5-tetramethylhexa-1,3-diene Chemical compound CC(=C)C=C(C)C(C)(C)C MZHWVYRSZJUNKM-UHFFFAOYSA-N 0.000 description 1
- RWEVFAKFDRICHV-UHFFFAOYSA-N 2,4-dimethylhepta-1,3-diene Chemical compound CCCC(C)=CC(C)=C RWEVFAKFDRICHV-UHFFFAOYSA-N 0.000 description 1
- FYQWQPVXKQWELA-UHFFFAOYSA-N 2,4-dimethylhexa-1,3-diene Chemical compound CCC(C)=CC(C)=C FYQWQPVXKQWELA-UHFFFAOYSA-N 0.000 description 1
- DVDQIGTWXQUKOA-UHFFFAOYSA-N 2,4-dimethylhexa-1,4-diene Chemical compound CC=C(C)CC(C)=C DVDQIGTWXQUKOA-UHFFFAOYSA-N 0.000 description 1
- HDRASWLEMAGRTB-UHFFFAOYSA-N 2-methylcyclohepta-1,3-diene Chemical compound CC1=CCCCC=C1 HDRASWLEMAGRTB-UHFFFAOYSA-N 0.000 description 1
- LDXWTNBYKFXMDV-UHFFFAOYSA-N 3-methylcyclohexa-1,4-diene Chemical compound CC1C=CCC=C1 LDXWTNBYKFXMDV-UHFFFAOYSA-N 0.000 description 1
- ZNKKYYNWFKHNHZ-UHFFFAOYSA-N 5-methylcyclohexa-1,3-diene Chemical compound CC1CC=CC=C1 ZNKKYYNWFKHNHZ-UHFFFAOYSA-N 0.000 description 1
- UQUVCLBAUMPGQK-UHFFFAOYSA-N 6-methylhepta-1,4-diene Chemical compound CC(C)C=CCC=C UQUVCLBAUMPGQK-UHFFFAOYSA-N 0.000 description 1
- 229910000975 Carbon steel Inorganic materials 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010962 carbon steel Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000012043 crude product Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- QNDQILQPPKQROV-UHFFFAOYSA-N dizinc Chemical compound [Zn]=[Zn] QNDQILQPPKQROV-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000004368 propenyl group Chemical group C(=CC)* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
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- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000005425 toluyl group Chemical group 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F3/00—Compounds containing elements of Groups 2 or 12 of the Periodic Table
- C07F3/06—Zinc compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C11/00—Aliphatic unsaturated hydrocarbons
- C07C11/12—Alkadienes
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C13/00—Cyclic hydrocarbons containing rings other than, or in addition to, six-membered aromatic rings
- C07C13/02—Monocyclic hydrocarbons or acyclic hydrocarbon derivatives thereof
- C07C13/16—Monocyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with a six-membered ring
- C07C13/23—Monocyclic hydrocarbons or acyclic hydrocarbon derivatives thereof with a six-membered ring with a cyclohexadiene ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/12—Saturated oxiranes characterised by the catalysts used containing organo-metallic compounds or metal hydrides
Definitions
- the present invention relates to a diethylzinc composition excellent in thermal stability, a thermal stabilization method, and a thermal stabilization compound.
- Diethyl zinc is conventionally used as a reaction reagent for organic synthesis in polymerization catalyst applications such as polyethylene oxide and polypropylene oxide, and in the production of intermediates such as pharmaceuticals and functional materials, and is known as an extremely useful industrial material. ing.
- MOCVD Metal Organic Chemical Vapor® Deposition
- the zinc oxide thin film obtained by this MOCVD method has various functions in solar cells such as CIGS solar cell buffer layer, transparent conductive film, dye-sensitized solar cell electrode film, thin-film Si solar cell intermediate layer, and transparent conductive film. It is used in various functional films such as films, photocatalytic films, ultraviolet cut films, infrared reflective films, and antistatic films, compound semiconductor light emitting devices, electronic devices such as thin film transistors, etc., and has a wide range of uses.
- Diethyl zinc is known to be gradually decomposed when heat is applied to deposit metal zinc particles (see Non-Patent Document 1, for example). Therefore, handling of diethyl zinc has problems such as a decrease in product purity due to precipitation of metal zinc particles generated by pyrolysis, contamination of storage containers, and blockage of manufacturing equipment piping.
- diethyl zinc is important as a raw material for the production of zinc oxide thin films by MOCVD, and in use, generally, carrier gas such as nitrogen, argon or helium is circulated through diethyl zinc filled in a supply container.
- carrier gas such as nitrogen, argon or helium
- diethyl zinc is present in a carrier gas as a saturated vapor gas to supply it to an external device such as a film forming apparatus.
- Compounds such as anthracene, acenaphthene, and acenaphthylene, which have been known as additives for diethyl zinc have boiling points of 342 ° C. (anthracene), 279 ° C.
- the diethyl zinc composition stabilized by adding anthracene, acenaphthene, and acenaphthylene to diethyl zinc is used in the above manner. Is supplied to an external device or the like for a long period of time, there is a problem that the added anthracene, acenaphthene, acenaphthylene and other compounds accumulate in the diethylzinc remaining in the supply container.
- the present invention improves the thermal stability of diethyl zinc used as a raw material for producing a zinc oxide thin film by a polymerization catalyst, an organic synthesis reagent, MOCVD method, etc.
- An object is to provide an excellent diethyl zinc composition. Furthermore, in the above-mentioned supply over a long period of time in use in a method in which a carrier gas such as nitrogen, argon, helium, etc. is circulated through the diethylzinc composition and diethylzinc is supplied to the external device as a saturated vapor gas, The object is to reduce the accumulation of the added compound in diethylzinc remaining in the middle of the supply in the supply container.
- a carrier gas such as nitrogen, argon, helium, etc.
- the present inventor has found that a compound having a specific carbon-carbon double bond coexisted in diethyl zinc (CAS No. 557-20-0) and In addition, the thermal stability is remarkably improved, and the compound having a specific carbon-carbon double bond having a boiling point close to that of diethyl zinc is selected as a coexisting compound.
- a carrier gas such as nitrogen, argon, helium, etc.
- the diethylzinc composition according to the present invention is a diethylzinc composition in which a compound having a carbon-carbon double bond represented by the following general formula (1) is added as an additive to diethylzinc.
- each R is independently hydrogen, a linear or branched alkyl group having 1 to 8 carbon atoms, a linear or branched alkenyl group having 1 to 8 carbon atoms, or an allyl group having 6 to 14 carbon atoms.
- the compound of the formula (1) includes at least one skeleton composed of carbon of the following general formula (2).
- the diethyl zinc composition according to the present invention is a diethyl zinc composition in which a compound having a carbon-carbon double bond represented by the following general formula (3) is added as an additive to diethyl zinc.
- each R independently represents hydrogen, a linear or branched alkyl group having 1 to 8 carbon atoms, a linear or branched alkenyl group having 1 to 8 carbon atoms, or an allyl group having 6 to 14 carbon atoms.
- the compound of the formula (3) includes at least one skeleton composed of carbon of the following general formula (4).
- the diethylzinc composition according to the present invention is a diethylzinc composition obtained by adding a compound having a carbon-carbon double bond represented by the following general formula (5) as an additive to diethylzinc.
- n is an integer of 1 to 4
- each R is independently hydrogen, a linear or branched alkyl group having 1 to 8 carbon atoms, or a linear or branched group having 1 to 8 carbon atoms.
- the diethylzinc composition according to the present invention is a diethylzinc composition obtained by adding a compound having a carbon-carbon double bond of the following general formula (6) as an additive to diethylzinc.
- n is an integer of 1 to 4, and each R is independently hydrogen, a linear or branched alkyl group having 1 to 8 carbon atoms, or a linear or branched group having 1 to 8 carbon atoms.
- R which is a substituent bonded to the side chain of the compound having a carbon-carbon double bond represented by the general formula (1), (3), (5) or (6), is independently A straight or branched alkyl group having 1 to 8 carbon atoms such as hydrogen, methyl group, ethyl group, propyl group, isopropyl group or butyl group, or a C 1 to 8 carbon group such as vinyl group, propenyl group or isopropenyl group.
- substituents such as linear or branched alkenyl group, phenyl group, toluyl group and other allyl groups having 6 to 14 carbon atoms, such as methoxy group, ethoxy group, isopropoxy group, phenoxy group and alkoxy group. May be.
- the number of substituents present in the side chain may be different from each other, and may be one or two or more.
- Examples of the compound having a carbon-carbon double bond represented by the above general formula (1) or (3) include 2,4-dimethyl-1,3-pentadiene (CAS No. 1000-86-8), 2,4-dimethyl-1,3-hexadiene (CAS No. 10074-39-2), 2,4-dimethyl-1,3-heptadiene (CAS No.
- a carrier gas such as nitrogen, argon, helium or the like is used for the diethyl zinc composition.
- the compound added to the diethyl zinc remaining in the supply container in the supply container for a long period of time is supplied. It is possible to reduce the accumulation of substances extremely, and it is possible to coexist in diethyl zinc at an appropriate concentration.
- the compound of the present invention is a compound in which 1,3-cyclohexadiene, 1,3-cycloheptadiene, 1,3-cyclooctadiene, 1,3-cyclononadiene, and their side chains are substituted with a substituent R It is.
- the prefix number indicating the position of the above-described double bond may be from 1,3- to 2,4-, 3,5-, or 4,6-, but the general formula (5 ) Structure may be included.
- the compound of the present invention is a compound in which 1,4-cyclohexadiene, 1,4-cycloheptadiene, 1,4-cyclooctadiene, 1,4-cyclononadiene and their side chains are substituted with a substituent R It is.
- the prefix number indicating the position of the above-mentioned double bond may be 1,4-to 2,5- or 3,6-, but includes the structure of the general formula (6). It only has to be done.
- Examples of the compound having a carbon-carbon double bond represented by the above general formula (5) or (6) include 1,3-cyclohexadiene, 1,4-cyclohexadiene, 1-methyl-1,4- Cyclohexadiene, 2-methyl-1,4-cyclohexadiene, 3-methyl-1,4-cyclohexadiene, 4-methyl-1,4-cyclohexadiene, 5-methyl-1,4-cyclohexadiene, 1-methyl 1,3-cyclohexadiene, 3-methyl-1,3-cyclohexadiene, 4-methyl-1,3-cyclohexadiene, 5-methyl-1,3-cyclohexadiene, 2-methyl-1,3-cyclo Hexadiene, 2,4-dimethyl-1,4-hexadiene, 1,1-dimethyl-2,5-hexadiene, 1,3-dimethyl-1,3-cyclohexadiene 2-methyl-1,3-cycloheptadiene, 5,5-dimethyl
- a carrier gas such as nitrogen, argon or helium is added to the diethyl zinc composition by MOCVD or the like.
- a carrier gas such as nitrogen, argon or helium
- the compound added to the diethyl zinc remaining in the supply container in the supply container in the above-mentioned supply for a long period of time. It is possible to reduce the accumulation of substances extremely, and it is possible to coexist in diethyl zinc at an appropriate concentration.
- the additive used in the present invention can provide a sufficient effect when added alone, but a plurality of additives may be used in combination.
- the amount of the compound having a carbon-carbon double bond represented by the general formula (1), (3), (5) or (6) of the present invention is such that the performance of diethyl zinc is maintained,
- the stabilizing effect can be obtained, but usually 50 ppm to 20 wt%, preferably 100 ppm to 10 wt%, more preferably 200 ppm to 5 wt% with respect to diethylzinc.
- a diethyl zinc composition having excellent properties can be obtained.
- the amount of the compound having a carbon-carbon double bond represented by the general formula (1), (3), (5) or (6) of the present invention is too small, a sufficient effect of improving the thermal stability can be obtained. In some cases, it may not be obtained, or if it is too much, the effect of increasing the addition amount may not be obtained. Therefore, it is desirable to add an appropriate amount for obtaining the desired effect of thermal stability.
- Diethyl zinc used in the present invention is generally known as an industrial material used as a reaction reagent for organic synthesis in polymerization catalyst applications such as polyethylene oxide and polypropylene oxide, and in the production of intermediates such as pharmaceuticals and functional materials. What is being used can be used.
- a zinc oxide thin film by MOCVD or the like includes a buffer layer for CIGS solar cells, a transparent conductive film, an electrode film for dye-sensitized solar cells, an intermediate layer for thin-film Si solar cells, Various functional films in solar cells such as transparent conductive films, photocatalytic films, ultraviolet cut films, infrared reflective films, various functional films such as antistatic films, compound semiconductor light emitting devices, electronic devices such as thin film transistors, etc. Diethyl zinc having a purity higher than that of industrial materials can also be used.
- diethylzinc is a compound having a carbon-carbon double bond represented by the general formula (1), (3), (5) or (6) of the present invention.
- the method of addition such as adding the aforementioned additive to diethyl zinc.
- a method of adding an additive to diethyl zinc in advance can be used.
- an additive when used in a reaction or the like, an additive can be added to diethyl zinc immediately before use.
- the temperature for preparing the diethylzinc composition of the present invention is preferably 70 ° C. or less, which is less affected by the thermal decomposition of diethylzinc.
- the composition of the present invention can be prepared at -20 ° C to 35 ° C.
- the pressure is not particularly limited. Except for special cases such as reaction, diethylzinc and the composition of the present invention can be usually prepared near atmospheric pressure, such as 0.1013 MPa.
- the equipment used and the atmosphere used in equipment such as storage / transport containers, storage tanks, piping, etc. for the diethyl zinc composition of the present invention can be used as they are.
- the material of the above-mentioned equipment can be a metal such as SUS, carbon steel, titanium, or Hastelloy, or a resin such as Teflon (registered trademark) or fluorine rubber.
- an inert gas such as nitrogen, helium, or argon can be used in the same manner as diethyl zinc.
- the diethylzinc composition of the present invention can be used by dissolving in a known solvent that can be used when diethylzinc is used.
- the solvent include, for example, saturated hydrocarbons such as pentane, hexane, heptane and octane, hydrocarbon compounds such as aromatic hydrocarbons such as benzene, toluene and xylene, diethyl ether, diisopropyl ether, tetrahydrofuran, dioxane and diglyme.
- ether compounds such as
- Examples of the use of the diethylzinc composition of the present invention include use as a polymerization catalyst such as polyethylene oxide and polypropylene oxide, use as a reaction reagent for organic synthesis in the production of intermediates such as pharmaceuticals and functional materials, , Used in a method of forming a zinc oxide thin film by MOCVD method, etc., and CIGS solar cell buffer layer, transparent conductive film, dye-sensitized solar cell electrode film, thin film Si solar cell intermediate layer, transparent conductive film, etc.
- Various functional films such as various functional films, photocatalytic films, ultraviolet cut films, infrared reflective films, antistatic films, etc.
- oxide forming applications such as compound semiconductor light emitting devices, electronic devices such as thin film transistors, etc., ZnS Examples of applications where diethyl zinc has been used so far, such as thin film formation for II-VI electronic devices, etc. It can be.
- the diethylzinc composition to which the compound having a carbon-carbon double bond represented by the general formula (1), (3), (5) or (6) of the present invention is added has excellent thermal stability, and diethylzinc There is very little precipitation of the metal zinc particle which generate
- a carrier gas such as nitrogen, argon, helium or the like
- NMR chart (solvent: CDCl 3) of a mixture containing dimethyl hexadiene is.
- NMR chart (solvent: CDCl 3) of a mixture containing trimethyl-hexadiene is.
- DSC measurement was performed using DSC6200 (manufactured by Seiko Instruments Inc.).
- DSC6200 manufactured by Seiko Instruments Inc.
- 1 H-NMR measurement was synthesized using Gemini-300 (manufactured by Varian)
- GC-MS measurement was synthesized using HP6890 (manufactured by Hured Packard). was analyzed.
- diethyl zinc composition-1 Glass of diethylzinc (Tosoh Finechem Co., Ltd.) and 2,4-dimethyl-1,3-pentadiene (CAS No.1000-86-8) (commercially available reagent) at a predetermined concentration at room temperature in a nitrogen atmosphere Weighed into a container. The additive was dissolved in diethyl zinc to prepare a diethyl zinc composition.
- diethyl zinc composition-2 Diethyl zinc (manufactured by Tosoh Finechem Co., Ltd.) and 1-methyl-1,4-cyclohexadiene (CAS No.4313-57-9) (commercially available reagent) in a glass container at a predetermined concentration at room temperature in a nitrogen atmosphere Weighed out. The additive was dissolved in diethyl zinc to prepare a diethyl zinc composition.
- DSC measurement (Differential Scanning Calorimetry) was performed on the diethylzinc composition prepared by the above-described method, and the thermal stability effect of the additive was evaluated.
- Example 1 [Thermal stability test of diethyl zinc composition by DSC measurement]
- a diethylzinc composition to which 2,4-dimethyl-1,3-pentadiene (CAS No. 1000-86-8), which is a compound of the present invention, was added in a nitrogen atmosphere was mixed with SUS. Weighed and sealed in a DSC cell. The obtained sample was subjected to DSC measurement, and the same thermal analysis measurement as in Reference Example 1 was carried out at a temperature increase rate of 10 ° C./min with a temperature range of 30 to 450 ° C. Table 1 shows the initial heat generation temperature of each sample.
- the initial exothermic temperature of the sample of the diethylzinc composition to which the compound of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the reference example, and the composition of the present invention was a sample of only diethylzinc
- the decomposition start temperature is higher than that. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed. Further, the boiling point of 2,4-dimethyl-1,3-pentadiene, which is the compound of the present invention, is lower than 93 ° C. and 118 ° C. which is the boiling point of diethylzinc, and carriers such as MOCVD method, nitrogen, argon, helium, etc.
- the boiling point of the aforementioned compound is 342 ° C. (anthracene), 279 ° C. (acenaphthene), 265 to 275 ° C. (acenaphthylene) and higher than 118 ° C.
- Example 2 to 6 [Thermal stability test of diethyl zinc composition by DSC measurement] Thermal analysis measurement was performed in the same manner as in Example 1 except that the addition concentration of 2,4-dimethyl-1,3-pentadiene (CAS No. 1000-86-8), which is a compound of the present invention, was changed. . Table 1 shows the initial heat generation temperature of each sample. The initial exothermic temperature of the sample of the diethylzinc composition to which the compound of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the Reference Example even if the concentration of the compound added was lowered. The composition has a higher decomposition onset temperature than the diethylzinc only sample. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed.
- 2,4-dimethyl-1,3-pentadiene CAS No. 1000-86-8
- Example 7 to 14 [Thermal stability test of diethyl zinc composition by DSC measurement]
- the compound of the present invention a mixture containing dimethylhexadiene, a mixture containing trimethylhexadiene, and 2,6-dimethyl-2,4,6-octatriene (CAS No. 673-84-3) are added in various addition amounts.
- the diethyl zinc composition thus obtained was subjected to the same thermal analysis measurement as in Example 1.
- Table 2 shows the initial heat generation temperature of each sample.
- the initial exothermic temperature of the sample of the diethylzinc composition to which the compound of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the Reference Example even if the concentration of the compound added was lowered.
- the composition has a higher decomposition onset temperature than the diethylzinc only sample. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed.
- a mixture comprising dimethylhexadiene and a mixture comprising trimethylhexadiene having a structure effective as an additive of the present invention is a known synthesis for 2,4-dimethyl-1,3-pentadiene (CAS No. 1000-86-8). The synthesis was performed with reference to the method.
- the mixture containing dimethylhexadiene and the mixture containing trimethylhexadiene were each purified by distillation purification. In distillation purification (atmospheric pressure) of the crude product containing the aforementioned mixture, the bottom heating temperature when the distillation fraction containing each mixture is distilled is a mixture containing dimethylhexadiene: 140 ° C., a mixture containing trimethylhexadiene.
- Example 15 [Thermal stability test of diethyl zinc composition by DSC measurement] In the same manner as in Reference Example 1, in a nitrogen atmosphere, diethyl zinc composition to which 1-methyl-1,4-cyclohexadiene (CAS No. 4313-57-9) (commercial reagent) as an additive of the present invention was added The material was weighed and sealed in a SUS DSC cell. The obtained sample was subjected to DSC measurement, and the same thermal analysis measurement as in Reference Example 1 was carried out at a temperature increase rate of 10 ° C./min with a temperature range of 30 to 450 ° C. Table 3 shows the initial heat generation temperature of each sample.
- 1-methyl-1,4-cyclohexadiene CAS No. 4313-57-9
- Table 3 shows the initial heat generation temperature of each sample.
- the initial exothermic temperature of the sample of the diethylzinc composition to which the additive of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the reference example, and the composition of the present invention was composed of only diethylzinc.
- the decomposition start temperature is higher than that of the sample. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed. Further, the boiling point of 1-methyl-1,4-cyclohexadiene, which is the additive of the present invention, is close to 115 ° C. and 118 ° C. which is the boiling point of diethyl zinc, and carrier gases such as MOCVD, nitrogen, argon, helium, etc.
- Examples 16 to 18 The same thermal analysis measurement as in Example 1 was performed by changing the addition concentration of 1-methyl-1,4-cyclohexadiene (CAS No.4313-57-9) (commercially available reagent) which is an additive of the present invention. It was.
- Table 3 shows the initial heat generation temperature of each sample.
- the initial exothermic temperature of the sample of the diethylzinc composition to which the compound of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the Reference Example even if the concentration of the compound added was lowered.
- the composition has a higher decomposition onset temperature than the diethylzinc only sample. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed.
- Examples 19 to 22 Specific examples of the additive of the present invention include 1,4-cyclohexadiene (CAS No. 628-41-1), ⁇ -terpinene (CAS No. 99-86-5), ⁇ -terpinene CAS No. 99-85. -4) and 1,3,5,5-tetramethyl-1,3-cyclohexadiene (CAS No. 4724-89-4) (all commercially available reagents) were used to prepare diethylzinc compositions. Thermal analysis measurement similar to 1 was performed. Table 3 shows the initial heat generation temperature of each sample.
- the initial exothermic temperature of the sample of the diethylzinc composition to which the additive of the present invention was added was higher than the initial exothermic temperature of the sample of only diethylzinc obtained in the reference example, and the composition of the present invention was composed of only diethylzinc.
- the decomposition start temperature is higher than that of the sample. From this result, the high thermal stability of the diethyl zinc composition to which the additive was added was confirmed.
- a carrier gas such as MOCVD method, nitrogen, argon, helium, etc. is circulated through diethyl zinc and supplied to an external device as a saturated vapor gas of diethyl zinc. In the use in the method, the problem that the compound used as an additive accumulates in the diethyl zinc composition remaining in the supply container in the supply container by the above-mentioned supply for a long time is reduced.
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Abstract
Description
これまでジエチル亜鉛の添加剤として知られている、アントラセン、アセナフテン、アセナフチレンといった化合物は、それらの沸点が、342℃(アントラセン)、279℃(アセナフテン)、265~275℃(アセナフチレン)と、いずれの化合物も118℃の沸点を有するジエチル亜鉛に比べて沸点が高いことから、ジエチル亜鉛中にアントラセン、アセナフテン、アセナフチレンを添加することで安定化したジエチル亜鉛組成物を用いて、上記の方法でジエチル亜鉛を長期間外部装置等に供給すると、添加したアントラセン、アセナフテン、アセナフチレンといった化合物が供給容器内に供給途中で残っているジエチル亜鉛中に蓄積していくという課題がある。
例えば、保存安定性の向上を目的する場合においては、あらかじめ、ジエチル亜鉛に添加物を添加する方法を用いることが出来る。
DSC測定は、DSC6200(セイコーインスツルメンツ株式会社製)を用いて行なった。本発明の添加物を合成により得た場合には、1H-NMR測定はGemini-300(バリアン社製)、GC-MS測定をHP6890(ヒューレッド・パッカード社製)それぞれ用いて合成した添加物を解析した。
ジエチル亜鉛(東ソー・ファインケム株式会社製)と、2,4-ジメチル-1,3-ペンタジエン(CAS No.1000-86-8)(市販試薬)とを窒素雰囲気下、室温において所定の濃度でガラス容器に秤量した。添加物をジエチル亜鉛に溶解して、ジエチル亜鉛組成物を調製した。
ジエチル亜鉛(東ソー・ファインケム株式会社製)と、1-メチル-1,4-シクロヘキサジエン(CAS No.4313-57-9)(市販試薬)とを窒素雰囲気下、室温において所定の濃度でガラス容器に秤量した。添加物をジエチル亜鉛に溶解して、ジエチル亜鉛組成物を調製した。
添加物の添加率(重量%)=(添加物重量/(添加物重量+ジエチル亜鉛重量))×100
[ジエチル亜鉛のDSC測定による熱安定性試験]
窒素雰囲気下、ジエチル亜鉛を、SUS製DSCセルに秤収して密閉した。得られたサンプルについてDSC測定を、30~450℃を測定温度範囲として10℃/分の昇温速度で熱分析測定を行なった。それぞれのサンプルの分解温度は、DSC測定の初期発熱温度で観測される。添加物を添加していないジエチル亜鉛のみのサンプルの初期発熱温度を表1に示す。
[ジエチル亜鉛組成物のDSC測定による熱安定性試験]
参考例1と同様にして、窒素雰囲気下、本発明の化合物である、2,4-ジメチル-1,3-ペンタジエン(CAS No.1000-86-8)を添加したジエチル亜鉛組成物を、SUS製DSCセルに秤収して密閉した。得られたサンプルについてDSC測定を、30~450℃を測定温度範囲として10℃/分の昇温速度で参考例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表1に示す。
本発明の化合物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度は、参考例で得られたジエチル亜鉛のみのサンプルの初期発熱温度よりも高く、本発明の組成物は、ジエチル亜鉛のみのサンプルよりも分解の開始温度が高い。本結果より添加物を添加したジエチル亜鉛組成物の高い熱安定性が確認された。また、本発明の化合物である、2,4-ジメチル-1,3-ペンタジエンの沸点は93℃とジエチル亜鉛の沸点である118℃よりも低く、MOCVD法等、窒素、アルゴン、ヘリウム等のキャリアガスをジエチル亜鉛に流通させてジエチル亜鉛の飽和蒸気ガスとして外部装置に供給する方法での使用において、長期間の上記の供給で、供給容器内に供給途中で残っているジエチル亜鉛組成物中に、添加物として使用する化合物が蓄積する問題点が軽減される。
実施例1と同様にして、特許文献1~3に記載の化合物であるアントラセン、アセナフテン、アセナフチレンを添加したジエチル亜鉛組成物について同様の検討を行った。それぞれのサンプルの初期発熱温度を表1に示す。
また、前述の化合物の沸点は、342℃(アントラセン)、279℃(アセナフテン)、265~275℃(アセナフチレン)とジエチル亜鉛の沸点である118℃よりも高く、MOCVD法等、窒素、アルゴン、ヘリウム等のキャリアガスをジエチル亜鉛に流通させてジエチル亜鉛の飽和蒸気ガスとして外部装置に供給する方法での使用において、長期間の上記の供給で、供給容器内に供給途中で残っているジエチル亜鉛組成物中に、これらの化合物が蓄積する問題点が発生する。
[ジエチル亜鉛組成物のDSC測定による熱安定性試験]
本発明の化合物である、2,4-ジメチル-1,3-ペンタジエン(CAS No.1000-86-8)の添加濃度を変えたこと以外は、実施例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表1に示す。
本発明の化合物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度は、化合物の添加濃度を低くしても参考例で得られたジエチル亜鉛のみのサンプルの初期発熱温度よりも高く、本発明の組成物は、ジエチル亜鉛のみのサンプルよりも分解の開始温度が高い。本結果より添加物を添加したジエチル亜鉛組成物の高い熱安定性が確認された。
実施例3と同様にして、特許文献1~3に記載の化合物であるアントラセン、アセナフテン、アセナフチレンを添加したジエチル亜鉛組成物について同様の検討を行った。それぞれのサンプルの初期発熱温度を表1に示す。
これらのサンプルは、本発明の化合物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度よりも低く、既存の添加物の添加した組成物は本発明の組成物よりも熱安定性が劣っていた。
[ジエチル亜鉛組成物のDSC測定による熱安定性試験]
本発明の化合物である、ジメチルヘキサジエンを含む混合物、トリメチルヘキサジエンを含む混合物、2,6-ジメチル-2,4,6-オクタトリエン(CAS No.673-84-3)を種々の添加量で添加したジエチル亜鉛組成物について、実施例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表2に示す。
本発明の化合物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度は、化合物の添加濃度を低くしても参考例で得られたジエチル亜鉛のみのサンプルの初期発熱温度よりも高く、本発明の組成物は、ジエチル亜鉛のみのサンプルよりも分解の開始温度が高い。本結果より添加物を添加したジエチル亜鉛組成物の高い熱安定性が確認された。
本発明の添加物として有効な構造を有する、ジメチルヘキサジエンを含む混合物およびトリメチルヘキサジエンを含む混合物は、2,4-ジメチル-1,3-ペンタジエン(CAS No.1000-86-8)に関する公知の合成手法を参考にして合成を行なった。ジメチルヘキサジエンを含む混合物およびトリメチルヘキサジエンを含む混合物は、それぞれ蒸留精製によって精製した。前述の混合物を含む粗生成物の蒸留精製(大気圧)おいて、各混合物を含む蒸留留分が留出する際の底部加熱温度は、ジメチルヘキサジエンを含む混合物:140℃、トリメチルヘキサジエンを含む混合物:165℃であった。従って、それぞれの混合物の沸点は、底部加熱温度よりも低い。
ジメチルヘキサペンタジエンを含む混合物およびトリメチルヘキサジエンを含む混合物は、それぞれ、1H-NMR測定およびGC-MS測定によって解析した。各混合物のNMRチャート(溶媒:CDCl3)を図1,2に示す。なお、2,6-ジメチル-2,4,6-オクタトリエン(CAS No.673-84-3)は市販試薬を使用した。
[ジエチル亜鉛組成物のDSC測定による熱安定性試験]
参考例1と同様にして、窒素雰囲気下、本発明の添加物である、1-メチル-1,4-シクロヘキサジエン(CAS No.4313-57-9)(市販試薬)を添加したジエチル亜鉛組成物を、SUS製DSCセルに秤収して密閉した。得られたサンプルについてDSC測定を、30~450℃を測定温度範囲として10℃/分の昇温速度で参考例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表3に示す。
本発明の添加物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度は、参考例で得られたジエチル亜鉛のみのサンプルの初期発熱温度よりも高く、本発明の組成物は、ジエチル亜鉛のみのサンプルよりも分解の開始温度が高い。本結果より添加物を添加したジエチル亜鉛組成物の高い熱安定性が確認された。また、本発明の添加物である、1-メチル-1,4-シクロヘキサジエンの沸点は115℃とジエチル亜鉛の沸点である118℃に近く、MOCVD法等、窒素、アルゴン、ヘリウム等のキャリアガスをジエチル亜鉛に流通させてジエチル亜鉛の飽和蒸気ガスとして外部装置に供給する方法での使用において、長期間の上記の供給で、供給容器内に供給途中で残っているジエチル亜鉛組成物中に、添加物として使用する化合物が蓄積する問題点が軽減される。
本発明の添加物である、1-メチル-1,4-シクロヘキサジエン(CAS No.4313-57-9)(市販試薬)の添加濃度を変えて、実施例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表3に示す。
本発明の化合物を添加したジエチル亜鉛組成物のサンプルの初期発熱温度は、化合物の添加濃度を低くしても参考例で得られたジエチル亜鉛のみのサンプルの初期発熱温度よりも高く、本発明の組成物は、ジエチル亜鉛のみのサンプルよりも分解の開始温度が高い。本結果より添加物を添加したジエチル亜鉛組成物の高い熱安定性が確認された。
本発明の添加物の具体例として、1,4-シクロヘキサジエン(CAS No.628-41-1)、α-テルピネン(CAS No.99-86-5)、γ-テルピネンCAS No.99-85-4)、1,3,5,5-テトラメチル-1,3-シクロヘキサジエン(CAS No. 4724-89-4)(すべて市販試薬)をそれぞれ用いてジエチル亜鉛組成物を調製し、実施例1と同様の熱分析測定を行なった。各サンプルの初期発熱温度を表3に示す。
また、これら本発明の化合物は、公知の化合物よりも沸点が低いため、MOCVD法等、窒素、アルゴン、ヘリウム等のキャリアガスをジエチル亜鉛に流通させてジエチル亜鉛の飽和蒸気ガスとして外部装置に供給する方法での使用において、長期間の上記の供給で、供給容器内に供給途中で残っているジエチル亜鉛組成物中に、添加物として使用する化合物が蓄積する問題点が軽減される。
Claims (15)
- 一般式(1)または(3)で表される炭素-炭素2重結合を有する化合物において、置換基Rが水素や炭素数が3以下であるアルキル基またはアルケニル基から構成される化合物で総炭素数が6~10である、請求項1または請求項2に記載のジエチル亜鉛組成物。
- ジエチル亜鉛への添加物の添加率が50ppm~20wt%である、請求項1~請求項3のいずれかに記載のジエチル亜鉛組成物。
- ジエチル亜鉛の熱安定性を向上させる方法とて、添加物として請求項1~3のいずれかに記載の化合物を用い、請求項4の添加率で添加することを特徴とする、ジエチル亜鉛の熱安定化の方法。
- ジエチル亜鉛の熱安定性を向上させる添加物として、請求項1~3のいずれかに記載の構造を有することを特徴とする化合物。
- 請求項1~4のいずれかに記載のジエチル亜鉛組成物において、ジエチル亜鉛組成物を構成する添加物とは異なる種類の炭素数5~25の飽和及び/または不飽和炭化水素及び炭素数6~30の芳香族炭化水素化合物あるいはエーテル系化合物が共存する、請求項1~4のいずれかに記載のジエチル亜鉛組成物。
- 請求項5記載のジエチル亜鉛の安定化方法において、ジエチル亜鉛に熱安定性に効果のある添加物とは異なる種類の炭素数5~25の飽和及び/または不飽和炭化水素及び炭素数6~30の芳香族炭化水素化合物あるいはエーテル系化合物がジエチル亜鉛に共存する、請求項5記載のジエチル亜鉛の熱安定化の方法。
- 請求項6記載のジエチル亜鉛において、ジエチル亜鉛の熱安定性を向上させる添加物とは異なる種類の炭素数5~25の飽和及び/または不飽和炭化水素及び炭素数6~30の芳香族炭化水素化合物あるいはエーテル系化合物が共存する場合におけるジエチル亜鉛の熱安定性を向上させる添加物として、請求項6記載の構造を有することを特徴とする化合物。
- 一般式(5)または(6)で表される炭素-炭素2重結合を有する化合物において、置換基Rが水素や炭素数が3以下であるアルキル基またはアルケニル基から構成される化合物で総炭素数が6~10である、請求項10または請求項11に記載のジエチル亜鉛組成物。
- ジエチル亜鉛への添加物の添加率が50ppm~20wt%である、請求項10~請求項12のいずれかに記載のジエチル亜鉛組成物。
- ジエチル亜鉛の熱安定性を向上させる方法とて、添加物として請求項10~12記載の化合物を用い、請求項13の添加率で添加することを特徴とする、ジエチル亜鉛の熱安定化の方法。
- ジエチル亜鉛の熱安定性を向上させる添加物として、請求項10~12記載の構造を有することを特徴とする化合物。
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