WO2012046944A1 - Film coating apparatus for semiconductor process - Google Patents

Film coating apparatus for semiconductor process Download PDF

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Publication number
WO2012046944A1
WO2012046944A1 PCT/KR2011/004771 KR2011004771W WO2012046944A1 WO 2012046944 A1 WO2012046944 A1 WO 2012046944A1 KR 2011004771 W KR2011004771 W KR 2011004771W WO 2012046944 A1 WO2012046944 A1 WO 2012046944A1
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WO
WIPO (PCT)
Prior art keywords
roller
film
coating
coating liquid
main roller
Prior art date
Application number
PCT/KR2011/004771
Other languages
French (fr)
Korean (ko)
Inventor
황선오
Original Assignee
주식회사 코엠에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 코엠에스 filed Critical 주식회사 코엠에스
Priority to CN201180047409.3A priority Critical patent/CN103930969B/en
Publication of WO2012046944A1 publication Critical patent/WO2012046944A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/083—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets being passed between the coating roller and one or more backing rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B05C1/04—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length
    • B05C1/08—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line
    • B05C1/0826—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets
    • B05C1/0834—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating for applying liquid or other fluent material to work of indefinite length using a roller or other rotating member which contacts the work along a generating line the work being a web or sheets the coating roller co-operating with other rollers, e.g. dosing, transfer rollers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/265—Selective reaction with inorganic or organometallic reagents after image-wise exposure, e.g. silylation

Definitions

  • the present invention relates to a coating apparatus for an ultraviolet work exposure film of a mask film or a board (Board) of ultraviolet light exposure.
  • the photomask film may be used at every exposure by the close contact between the photomask film and the wiring board. Damage occurred and there was a problem that patterns such as wiring or solder resist were not formed precisely on the wiring board.
  • the film coating apparatus for semiconductor manufacturing in coating the coating liquid so that the exposure mask film is not damaged, the film coating apparatus for semiconductor manufacturing enables to manufacture semiconductors more precisely by applying a uniform amount of protective coating liquid to the entire surface of the film to enable more precise semiconductor production. Is provided.
  • the present invention provides a film coating apparatus comprising: a main roller (10) which is in contact with the other surface of a film;
  • a coating roller 20 which is rotated by the rotating means 90 and provided in parallel with the main roller 10 and in contact with one surface of the film;
  • the coating liquid 20 On the opposite side of the main roller 10 is provided spaced apart in parallel adjacent to the coating roller 20, the coating liquid 20 after the coating liquid is buried in the lower portion of the coating liquid reservoir 39, the coating roller 20 Coating liquid supply roller 30 to be applied to the surface of the);
  • It relates to a film coating apparatus for manufacturing a semiconductor, characterized in that consisting of; conveyor 60 for conveying the film to pass through the curing means 40.
  • the present invention is to provide a film coating apparatus for semiconductor manufacturing that makes the semiconductor coating more precise by applying a uniform amount of the protective coating liquid to the entire surface of the film in applying the coating liquid so that the exposure mask film is not damaged. For sake.
  • FIG. 1 is a side view of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
  • Figure 2 is an enlarged view of the main portion of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
  • FIG 3 is a plan view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
  • Figure 4 is a front view of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
  • Figure 5 is a front view of the coating roller of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
  • FIG. 1 is a side configuration of the film coating apparatus for semiconductor manufacturing according to an embodiment of the present invention
  • Figure 2 (a, b) is an enlarged view of the main part of the film coating apparatus for semiconductor manufacturing according to an embodiment of the present invention
  • Figure 3 4 is a plan view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention
  • FIG. 4 is a front view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention
  • FIG. 5 is a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention. It is a front view of a coating roller.
  • the present invention can be used for the UV coating of the mask film or artwork film used in the ultraviolet exposure process of the flexible substrate (Board) to which the ultraviolet photosensitive film is applied.
  • the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, the main roller 10, the coating roller 20, the coating liquid supply roller 30 and the film guide portion ( 40) and the hardening means 50 and the conveyor 60.
  • the main roller 10 is in contact with the other surface of the film.
  • the coating roller 20 is provided adjacent to the main roller 10 in parallel and is in contact with one surface of the film.
  • the main roller 10 and the application roller 20 are supported as bearings in the body portion.
  • Rotating means 90 for rotating the main roller 10 is further provided.
  • the rotating means 90 is fixed to the drive gear 91 fixed to the body portion, the driven gear 93 fixed to the main roller shaft 11, the drive gear 91 and the main roller shaft 11 It consists of a belt 92 or a chain connecting the driven gear 93.
  • the coating liquid supply roller 30 is provided on the opposite side of the main roller 10 to be spaced apart adjacent in parallel with the coating roller 20, the coating liquid in a state in which the lower portion is locked in the coating liquid reservoir 39 After being buried on the surface, it is applied to the surface of the coating roller 20.
  • the upper portion of the coating liquid reservoir 39 is open to replenish the coating liquid, and the lower portion of the coating liquid supply roller 30 is positioned at the open upper portion.
  • the coating roller 20 and the coating liquid supply roller 30 may be maintained at an interval of 30 ⁇ 300 ⁇ m. If the gap is too small, high precision position control may be required, and failure may result in damage to the equipment. If the gap exceeds 300 ⁇ m, the gap may be too wide so that the coating liquid contained in the coating liquid supply roller 30 is transferred to the coating roller 20 by the surface tension.
  • the film guide portion 40 guides the film into the gap between the main roller 10 and the roller 20.
  • the film guide portion 40 has a curved surface support portion 40a formed in a plate shape wide at the bottom and bent upwards and upwards, and an upper end 40b is disposed between the main roller 10 and the application roller 20. Extends to the bottom of the gap.
  • the hardening means unit 50 is provided with heating means 51 placed on the upper portion of the film through which the film is coated with a high temperature heat while passing between the main roller 10 and the roller for application 20. do.
  • the heating means 51 can use a normal ultraviolet light and an infrared lamp.
  • the conveyor 60 transfers the film to pass through the hardening means portion 40. Conveyor 60 may be applied to a conventional transport system known in the art and a detailed description thereof is omitted.
  • the coating solution impregnating groove 35 may be uniformly formed in a spiral shape on the surface of the coating solution supply roller 30. .
  • the coating solution impregnating groove 35 may be a scratch formed spirally using a metal needle.
  • the vertical direction adjusting means for adjusting the vertical height of one of the coating roller 20 or the coating liquid supply roller 30 ( It is preferably configured to further comprise 70).
  • the vertical direction adjusting means 70 is lifted by the servo motor 71 and the servo motor 71 and the upper end thereof is connected to elevate one of the application roller shaft 21 or the coating liquid supply roller shaft 31.
  • It may be configured to include a first adjustment shaft (72).
  • the first adjustment shaft 72 raises and lowers the coating liquid supply roller 30 to adjust the size of the gap GAP between the coating roller 20 and the coating liquid supply roller 30.
  • the main roller 10 by moving back and forth between the main roller 10 and the coating roller 20, the interval. It further comprises a horizontal direction adjusting means for adjusting the 80.
  • the horizontal direction adjusting means 70 includes a horizontal driving part 81 and a second adjusting shaft 82 which is lifted by the horizontal direction driving part 81 and whose front end advances the main roller shaft 11 back and forth. Can be.
  • the second adjustment shaft 82 may move the main roller shaft 11 forward and backward by applying a force to the transfer block B that is moved back and forth along the guide formed in the body portion.
  • the film passes through the main roller 10 and the application roller 20 by the rotating main roller 10 to cure. It is conveyed to the means 50 and the conveyor 60 assists in the movement of the film.
  • the present invention provides a film coating apparatus comprising: a main roller (10) which is in contact with the other surface of a film;
  • a coating roller 20 which is rotated by the rotating means 90 and provided in parallel with the main roller 10 and in contact with one surface of the film;
  • the coating liquid 20 On the opposite side of the main roller 10 is provided spaced apart in parallel adjacent to the coating roller 20, the coating liquid 20 after the coating liquid is buried in the lower portion of the coating liquid reservoir 39, the coating roller 20 Coating liquid supply roller 30 to be applied to the surface of the);
  • It relates to a film coating apparatus for manufacturing a semiconductor, characterized in that consisting of; conveyor 60 for conveying the film to pass through the curing means 40.
  • the present invention is to provide a film coating apparatus for semiconductor manufacturing that makes the semiconductor coating more precise by applying a uniform amount of protective coating liquid to the entire surface of the film in applying the coating liquid so that the exposure mask film is not damaged. For sake.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The present invention relates to a film coating apparatus. The film coating apparatus includes: a main roller (10) contacting the other surface of a film; a coating roller (20) parallel and adjacent to the main roller (10) to contact one surface of the film; a coating solution supply roller (30) parallel and adjacent and spaced from the coating roller (20) on a side opposite to that of the main roller (10), the coating solution supply roller (30) applying a coating solution on a surface of the coating roller (20) after the coating solution is smeared on a surface of the coating solution supply roller (30) in a state where a lower portion of the coating solution supply roller (30) is immersed into a coating solution reservoir (39); a film guide part (40) guiding the film into a gap between the main roller (10) and the coating roller (20); a curing unit (50) curing the film on which the coating solution is applied while passing through the gap between the main roller (10) and the coating roller (20) at a high temperature; and a conveyor (60) transferring the film to pass through the curing unit (40).

Description

반도체 제조용 필름 코팅장치Film coating equipment for semiconductor manufacturing
본 발명은 자외선 노광용 마스크 필름 또는 기판(Board)의 자외선 노광용 아크워크(artwork) 필름의 코팅장치에 관한 것이다.The present invention relates to a coating apparatus for an ultraviolet work exposure film of a mask film or a board (Board) of ultraviolet light exposure.
주로 자외선 감광막이 도포된 플렉시블한 기판(Board)의 자외선 노광과정에서 사용되는 마스크 필름 또는 아트워크 필름의 UV 코팅 용도로 사용될 것이다. It will be mainly used for the UV coating of the mask film or artwork film used in the ultraviolet exposure process of the flexible board (Board) to which the ultraviolet photosensitive film is applied.
최근에 전자제품의 경량화, 박엽화 및 단소화와 고기능화에 따라 프린트 배선기판은 더욱 더 고정밀도, 고밀도화 되어지고 있으며, 이 때문에 포토레지스트 등의 감광재료를 코팅한 기판의 표면에 소정의 패턴을 노광장치에 의해 감광, 인화한 후, 에칭공정에 의해서 기판 위에 패턴을 형성케 하는 포토리소그래피법이 프린트 배선기판 제조에 이용되고 있다.In recent years, printed circuit boards have become more precise and higher density due to the light weight, thinning, shortening, and high functionality of electronic products. Therefore, a predetermined pattern is exposed on the surface of a substrate coated with a photoresist such as photoresist. The photolithography method which forms a pattern on a board | substrate by the etching process after photosensitive and printing by an apparatus is used for the manufacture of a printed wiring board.
일반적으로 사용되고 있는 포토마스크 필름과 프린트 배선 기판을 밀착시켜 노광을 하게 되는 밀착방식으로 고정밀도, 고밀도의 프린트 배선 기판을 제조하는 경우, 포토마스크 필름과 배선 기판의 밀착에 의해 노광시마다 포토마스크 필름의 손상이 발생하여 배선 기판에 배선이나 솔더레지스트 등의 패턴이 정밀하게 형성되지 않는 문제점이 있었다.When manufacturing a high-precision, high-density printed wiring board in a close contact method in which a photomask film and a printed wiring board which are generally used are exposed to each other, the photomask film may be used at every exposure by the close contact between the photomask film and the wiring board. Damage occurred and there was a problem that patterns such as wiring or solder resist were not formed precisely on the wiring board.
본 발명에 따르는 경우, 노광용 마스크 필름이 손상되지 않도록 코팅액을 도포함에 있어서 필름 전면에 균일한 량의 보호 코팅액을 도포함으로써 보호 코팅층의 두께를 균일하여 보다 정밀한 반도체 제조를 가능하게 하는 반도체 제조용 필름 코팅장치가 제공된다.According to the present invention, in coating the coating liquid so that the exposure mask film is not damaged, the film coating apparatus for semiconductor manufacturing enables to manufacture semiconductors more precisely by applying a uniform amount of protective coating liquid to the entire surface of the film to enable more precise semiconductor production. Is provided.
본 발명은 필름 코팅장치에 있어서, 필름의 타면과 접면되는 메인롤러(10)와;The present invention provides a film coating apparatus comprising: a main roller (10) which is in contact with the other surface of a film;
회전수단(90)에 의해 회전되며 상기 메인롤러(10)와 평행하게 인접하여 구비되고 필름의 일면과 접면되는 도포용 롤러(20)와;A coating roller 20 which is rotated by the rotating means 90 and provided in parallel with the main roller 10 and in contact with one surface of the film;
상기 메인롤러(10)의 반대편에 상기 도포용 롤러(20)와 평행하게 인접하여 이격되어 구비되고, 코팅액 리져버(39)에 하부가 잠긴상태에서 코팅액을 표면에 묻힌 후 상기 도포용 롤러(20)의 표면에 바르는 코팅액 공급롤러(30)와;On the opposite side of the main roller 10 is provided spaced apart in parallel adjacent to the coating roller 20, the coating liquid 20 after the coating liquid is buried in the lower portion of the coating liquid reservoir 39, the coating roller 20 Coating liquid supply roller 30 to be applied to the surface of the);
필름을 상기 메인롤러(10)와 롤러(20) 사이의 틈으로 안내하는 필름 가이드부(40)와;A film guide part (40) for guiding the film into the gap between the main roller (10) and the roller (20);
상기 메인롤러(10)와 도포용 롤러(20) 사이를 통과하면서 코팅액이 도포되는 필름을 가열 경화시키는 경화수단부(50)와;A hardening means unit 50 for heating and curing the film to which the coating liquid is applied while passing between the main roller 10 and the application roller 20;
필름이 경화수단부(40)를 통과하게 이송시키는 컨베이어(60);로 구성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치에 관한 것이다.It relates to a film coating apparatus for manufacturing a semiconductor, characterized in that consisting of; conveyor 60 for conveying the film to pass through the curing means 40.
본 발명은 노광용 마스크 필름이 손상되지 않도록 코팅액을 도포함에 있어서 필름 전면에 균일한 량의 보호 코팅액을 도포함으로써 보호 코팅층의 두께를 균일하여 보다 정밀한 반도체 제조를 가능하게 하는 반도체 제조용 필름 코팅장치를 제공하기 위함이다.The present invention is to provide a film coating apparatus for semiconductor manufacturing that makes the semiconductor coating more precise by applying a uniform amount of the protective coating liquid to the entire surface of the film in applying the coating liquid so that the exposure mask film is not damaged. For sake.
도 1은 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 측면 구성도.1 is a side view of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 측면 주요부 확대도.Figure 2 is an enlarged view of the main portion of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
도 3은 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 평면도.3 is a plan view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
도 4는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 정면도.Figure 4 is a front view of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 중 도포용 롤러 정면도.Figure 5 is a front view of the coating roller of the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention.
이하에서 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치에 대하여 첨부된 도면을 참조하여 상세하게 설명한다. 도 1은 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 측면 구성도, 도 2(a, b)는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 측면 주요부 확대도, 도 3은 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 평면도, 도 4는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 정면도이고, 도 5는 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치 중 도포용 롤러 정면도이다.Hereinafter, a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. 1 is a side configuration of the film coating apparatus for semiconductor manufacturing according to an embodiment of the present invention, Figure 2 (a, b) is an enlarged view of the main part of the film coating apparatus for semiconductor manufacturing according to an embodiment of the present invention, Figure 3 4 is a plan view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, FIG. 4 is a front view of a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, and FIG. 5 is a film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention. It is a front view of a coating roller.
본 발명은 자외선 감광막이 도포된 플렉시블한 기판(Board)의 자외선 노광과정에서 사용되는 마스크 필름 또는 아트워크 필름의 UV 코팅 용도로 사용될 수 있다. The present invention can be used for the UV coating of the mask film or artwork film used in the ultraviolet exposure process of the flexible substrate (Board) to which the ultraviolet photosensitive film is applied.
도 1 내지 도 4에 도시된 바와 같이, 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치는, 메인롤러(10)와 도포용 롤러(20)와 코팅액 공급롤러(30)와 필름 가이드부(40)와 경화수단부(50)와 컨베이어(60)로 구성된다. 1 to 4, the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, the main roller 10, the coating roller 20, the coating liquid supply roller 30 and the film guide portion ( 40) and the hardening means 50 and the conveyor 60.
도시된 바와 같이, 메인롤러(10)는 필름의 타면과 접면된다. 도포용 롤러(20)는 메인롤러(10)와 평행하게 인접하여 구비되고 필름의 일면과 접면된다. 메인롤러(10)와 도포용 롤러(20)는 몸체부에 베어링으로 지지된다. 메인롤러(10)를 회전시키는 회전수단(90)이 더 구비된다. 회전수단(90)은, 몸체부에 고정된 구동기어(91)와, 메인롤러축(11)에 고정된 피동기어(93)와, 상기 구동기어(91)와 메인롤러축(11)에 고정된 피동기어(93)를 연결하는 벨트(92, 또는 체인)로 구성된다. As shown, the main roller 10 is in contact with the other surface of the film. The coating roller 20 is provided adjacent to the main roller 10 in parallel and is in contact with one surface of the film. The main roller 10 and the application roller 20 are supported as bearings in the body portion. Rotating means 90 for rotating the main roller 10 is further provided. The rotating means 90 is fixed to the drive gear 91 fixed to the body portion, the driven gear 93 fixed to the main roller shaft 11, the drive gear 91 and the main roller shaft 11 It consists of a belt 92 or a chain connecting the driven gear 93.
도시된 바와 같이, 코팅액 공급롤러(30)는 메인롤러(10)의 반대편에 도포용 롤러(20)와 평행하게 인접하여 이격되어 구비되고, 코팅액 리져버(39)에 하부가 잠긴상태에서 코팅액을 표면에 묻힌 후 상기 도포용 롤러(20)의 표면에 바른다. 도 2에 도시된 바와 같이, 코팅액 리져버(39)의 상부는 코팅액을 보충할 수 있게 개방되고 개방된 상부로 코팅액 공급롤러(30)의 하부가 위치하게 된다.As shown, the coating liquid supply roller 30 is provided on the opposite side of the main roller 10 to be spaced apart adjacent in parallel with the coating roller 20, the coating liquid in a state in which the lower portion is locked in the coating liquid reservoir 39 After being buried on the surface, it is applied to the surface of the coating roller 20. As shown in FIG. 2, the upper portion of the coating liquid reservoir 39 is open to replenish the coating liquid, and the lower portion of the coating liquid supply roller 30 is positioned at the open upper portion.
도포용 롤러(20)와 코팅액 공급롤러(30)는 30 ~ 300μm 간격으로 유지될 수 있다. 간격이 너무 적은 경우 고정밀도의 위치 제어가 요구될 수 있으며 실패하는 경우 장비의 손상으로 가져올 수 있다. 간격이 300μm를 넘어가는 경우 간격이 너무 넓어 표면장력에 의해 코팅액 공급롤러(30)에 머금은 코팅액이 도포용 롤러(20)로 전달되는데 문제가 발생할 수 있다.The coating roller 20 and the coating liquid supply roller 30 may be maintained at an interval of 30 ~ 300μm. If the gap is too small, high precision position control may be required, and failure may result in damage to the equipment. If the gap exceeds 300μm, the gap may be too wide so that the coating liquid contained in the coating liquid supply roller 30 is transferred to the coating roller 20 by the surface tension.
도 2(a, b)에 도시된 바와 같이, 필름 가이드부(40)는 필름을 메인롤러(10)와 롤러(20) 사이의 틈으로 안내한다. 바람직하게 필름 가이드부(40)는, 하부에 넓적한 판형상으로 형성되고 전방 상향으로 굽어진 곡면지지부(40a)를 구비하고, 상단(40b)은 메인롤러(10)와 도포용 롤러(20) 사이의 틈 하부까지 연장된다. As shown in Fig. 2 (a, b), the film guide portion 40 guides the film into the gap between the main roller 10 and the roller 20. Preferably, the film guide portion 40 has a curved surface support portion 40a formed in a plate shape wide at the bottom and bent upwards and upwards, and an upper end 40b is disposed between the main roller 10 and the application roller 20. Extends to the bottom of the gap.
경화수단부(50)는 메인롤러(10)와 도포용 롤러(20) 사이를 통과하면서 코팅액이 도포되는 필름을 고온의 열로 가열 경화시키며 통과되는 필름의 상부에 우치한 가열수단(51)을 구비한다. 가열수단(51)은 통상의 자외선, 적외선 램프를 사용할 수 있다. 컨베이어(60)는 필름이 경화수단부(40)를 통과하게 이송시킨다. 컨베이어(60)는 당업계에 공지된 통상의 이송 시스템을 적용할 수 있으며 공지된 사항으로 상세한 설명은 생략한다.The hardening means unit 50 is provided with heating means 51 placed on the upper portion of the film through which the film is coated with a high temperature heat while passing between the main roller 10 and the roller for application 20. do. The heating means 51 can use a normal ultraviolet light and an infrared lamp. The conveyor 60 transfers the film to pass through the hardening means portion 40. Conveyor 60 may be applied to a conventional transport system known in the art and a detailed description thereof is omitted.
도 5에 도시된 바와 같이, 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치에 있어서, 코팅액 공급롤러(30)의 표면에 코팅액 함침홈(35)이 나선형상으로 균일하게 형성되게 할 수 있다. 이렇게 하는 경우 코팅액 공급롤러(30)의 외부 표면에 코팅액 공급롤러(30)의 길이방향으로 균일하게 코팅액을 함침 시킬 수 있으며 또한, 코팅액이 균일하게 도포용 롤러(20)로 전달됨을 시제품 테스트 결과 알 수 있었다. 코팅액 함침홈(35)은 금속 침을 이용하여 나선형으로 생성된 스크래치(scrach)일 수 있다. As shown in FIG. 5, in the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, the coating solution impregnating groove 35 may be uniformly formed in a spiral shape on the surface of the coating solution supply roller 30. . In this case, it is possible to impregnate the coating liquid uniformly in the longitudinal direction of the coating liquid supply roller 30 on the outer surface of the coating liquid supply roller 30, and also the prototype test result shows that the coating liquid is uniformly delivered to the application roller 20. Could. The coating solution impregnating groove 35 may be a scratch formed spirally using a metal needle.
도 2에 도시된 바와 같이, 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치는, 도포용 롤러(20) 또는 상기 코팅액 공급롤러(30) 중 하나의 상하 높이를 조절하는 수직방향 조절수단(70)을 더 포함하여 구성됨이 바람직하다. 수직방향 조절수단(70)은, 서보모터(71)와, 상기 서보모터(71)에 의해 승강되고 상단이 도포용 롤러축(21) 또는 코팅액 공급롤러축(31) 중 하나를 승강시키는 연결되는 제1 조절축(72)를 포함하여 구성될 수 있다. 도 2에서 제1 조절축(72)은 코팅액 공급롤러(30)를 승강시켜 도포용 롤러(20)와 코팅액 공급롤러(30) 사이의 갭(GAP)의 크기를 조절한다. As shown in Figure 2, the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, the vertical direction adjusting means for adjusting the vertical height of one of the coating roller 20 or the coating liquid supply roller 30 ( It is preferably configured to further comprise 70). The vertical direction adjusting means 70 is lifted by the servo motor 71 and the servo motor 71 and the upper end thereof is connected to elevate one of the application roller shaft 21 or the coating liquid supply roller shaft 31. It may be configured to include a first adjustment shaft (72). In FIG. 2, the first adjustment shaft 72 raises and lowers the coating liquid supply roller 30 to adjust the size of the gap GAP between the coating roller 20 and the coating liquid supply roller 30.
도 2, 도 6에 도시된 바와 같이, 본 발명의 일실시예에 따른 반도체 제조용 필름 코팅장치는, 메인롤러(10)를 전후진 시킴으로써 상기 메인롤러(10)와 도포용 롤러(20)의 간격을 조절하는 수평방향 조절수단(80)을 더 포함하여 구성된다. 수평방향 조절수단(70)은 수평방향 구동부(81)와, 상기 수평방향 구동부(81)에 의해 승강되고 전단이 메인롤러축(11)을 전후진 시키는 제2 조절축(82)을 포함하여 구성될 수 있다. 도 6에 도시된 바와 같이, 제2 조절축(82)은 몸체부에 형성된 가이드를 따라 전후진되는 이송블럭(B)에 힘을 가함으로써 메인롤러축(11)을 전후진시킬 수 있다. As shown in Figure 2, 6, in the film coating apparatus for manufacturing a semiconductor according to an embodiment of the present invention, the main roller 10 by moving back and forth between the main roller 10 and the coating roller 20, the interval. It further comprises a horizontal direction adjusting means for adjusting the 80. The horizontal direction adjusting means 70 includes a horizontal driving part 81 and a second adjusting shaft 82 which is lifted by the horizontal direction driving part 81 and whose front end advances the main roller shaft 11 back and forth. Can be. As shown in FIG. 6, the second adjustment shaft 82 may move the main roller shaft 11 forward and backward by applying a force to the transfer block B that is moved back and forth along the guide formed in the body portion.
필름을 작업자가 필름 가이드부(40)에 올려놓은 상태에서 필름을 상향으로 더 밀어 넣으면 회전하는 메인롤러(10)에 의해 필름이 메인롤러(10)와 도포용 롤러(20) 사이를 통과하여 경화수단부(50)로 이송되고 이때 컨베이어(60)가 필름의 이동을 보조한다. When the operator puts the film upward while the worker puts the film on the film guide part 40, the film passes through the main roller 10 and the application roller 20 by the rotating main roller 10 to cure. It is conveyed to the means 50 and the conveyor 60 assists in the movement of the film.
본 발명은 상기에서 언급한 바람직한 실시예와 관련하여 설명됐지만, 본 발명의 범위가 이러한 실시예에 한정되는 것은 아니며, 본 발명의 범위는 이하의 특허청구범위에 의하여 정하여지는 것으로 본 발명과 균등 범위에 속하는 다양한 수정 및 변형을 포함할 것이다.Although the present invention has been described in connection with the above-mentioned preferred embodiments, the scope of the present invention is not limited to these embodiments, the scope of the present invention is defined by the claims below and equivalent scope of the present invention It will include various modifications and variations belonging to.
아래의 특허청구범위에 기재된 도면부호는 단순히 발명의 이해를 보조하기 위한 것으로 권리범위의 해석에 영향을 미치지 아니함을 밝히며 기재된 도면부호에 의해 권리범위가 좁게 해석되어서는 안될 것이다.The reference numerals set forth in the claims below are merely to aid the understanding of the present invention, not to affect the interpretation of the scope of the claims, and the scope of the claims should not be construed narrowly.
본 발명은 필름 코팅장치에 있어서, 필름의 타면과 접면되는 메인롤러(10)와;The present invention provides a film coating apparatus comprising: a main roller (10) which is in contact with the other surface of a film;
회전수단(90)에 의해 회전되며 상기 메인롤러(10)와 평행하게 인접하여 구비되고 필름의 일면과 접면되는 도포용 롤러(20)와;A coating roller 20 which is rotated by the rotating means 90 and provided in parallel with the main roller 10 and in contact with one surface of the film;
상기 메인롤러(10)의 반대편에 상기 도포용 롤러(20)와 평행하게 인접하여 이격되어 구비되고, 코팅액 리져버(39)에 하부가 잠긴상태에서 코팅액을 표면에 묻힌 후 상기 도포용 롤러(20)의 표면에 바르는 코팅액 공급롤러(30)와;On the opposite side of the main roller 10 is provided spaced apart in parallel adjacent to the coating roller 20, the coating liquid 20 after the coating liquid is buried in the lower portion of the coating liquid reservoir 39, the coating roller 20 Coating liquid supply roller 30 to be applied to the surface of the);
필름을 상기 메인롤러(10)와 롤러(20) 사이의 틈으로 안내하는 필름 가이드부(40)와;A film guide part (40) for guiding the film into the gap between the main roller (10) and the roller (20);
상기 메인롤러(10)와 도포용 롤러(20) 사이를 통과하면서 코팅액이 도포되는 필름을 가열 경화시키는 경화수단부(50)와;A hardening means unit 50 for heating and curing the film to which the coating liquid is applied while passing between the main roller 10 and the application roller 20;
필름이 경화수단부(40)를 통과하게 이송시키는 컨베이어(60);로 구성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치에 관한 것이다.It relates to a film coating apparatus for manufacturing a semiconductor, characterized in that consisting of; conveyor 60 for conveying the film to pass through the curing means 40.
본 발명은 노광용 마스크 필름이 손상되지 않도록 코팅액을 도포함에 있어서 필름 전면에 균일한 량의 보호 코팅액을 도포함으로써 보호 코팅층의 두께를 균일하여 보다 정밀한 반도체 제조를 가능하게 하는 반도체 제조용 필름 코팅장치를 제공하기 위함이다.The present invention is to provide a film coating apparatus for semiconductor manufacturing that makes the semiconductor coating more precise by applying a uniform amount of protective coating liquid to the entire surface of the film in applying the coating liquid so that the exposure mask film is not damaged. For sake.

Claims (4)

  1. 필름 코팅장치에 있어서,In the film coating apparatus,
    회전수단(90)에 의해 회전되며 필름의 타면과 접면되는 메인롤러(10)와;A main roller 10 rotated by the rotating means 90 and in contact with the other surface of the film;
    상기 메인롤러(10)와 평행하게 인접하여 구비되고 필름의 일면과 접면되는 도포용 롤러(20)와;An application roller 20 provided adjacent to the main roller 10 in parallel and in contact with one surface of the film;
    상기 메인롤러(10)의 반대편에 상기 도포용 롤러(20)와 평행하게 인접하여 이격되어 구비되고, 코팅액 리져버(39)에 하부가 잠긴상태에서 코팅액을 표면에 묻힌 후 상기 도포용 롤러(20)의 표면에 바르는 코팅액 공급롤러(30)와;On the opposite side of the main roller 10 is provided spaced apart adjacent in parallel with the coating roller 20, the coating liquid 20 after the coating liquid is buried in the lower portion of the coating liquid reservoir 39, the coating roller 20 Coating liquid supply roller 30 to be applied to the surface of the);
    필름을 상기 메인롤러(10)와 롤러(20) 사이의 틈으로 안내하는 필름 가이드부(40)와;A film guide part (40) for guiding the film into the gap between the main roller (10) and the roller (20);
    상기 메인롤러(10)와 도포용 롤러(20) 사이를 통과하면서 코팅액이 도포되는 필름을 가열 경화시키는 경화수단부(50)와;A hardening means unit 50 for heating and curing the film to which the coating liquid is applied while passing between the main roller 10 and the application roller 20;
    필름이 경화수단부(40)를 통과하게 이송시키는 컨베이어(60);로 구성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치.Conveyor 60 for transporting the film to pass through the curing means portion 40; Film coating apparatus for semiconductor manufacturing, characterized in that consisting of.
  2. 제1항에 있어서,The method of claim 1,
    상기 코팅액 공급롤러(30)의 표면에 코팅액 함침홈(35)이 나선형상으로 균일하게 형성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치.Film coating apparatus for semiconductor manufacturing, characterized in that the coating liquid impregnating groove 35 is uniformly formed in a spiral shape on the surface of the coating liquid supply roller (30).
  3. 제2항에 있어서,The method of claim 2,
    상기 도포용 롤러(20)와 코팅액 공급롤러(30)는 30 ~ 300μm 간격으로 유지되고,The coating roller 20 and the coating liquid supply roller 30 is maintained at 30 ~ 300μm intervals,
    상기 도포용 롤러(20) 또는 상기 코팅액 공급롤러(30) 중 하나의 상하 높이를 조절하는 수직방향 조절수단(70)을 더 포함하여 구성되고,It further comprises a vertical direction adjusting means for adjusting the vertical height of one of the coating roller 20 or the coating liquid supply roller 30,
    상기 수직방향 조절수단(70)은, 서보모터(71)와, 상기 서보모터(71)에 의해 승강되고 상단이 도포용 롤러축(21) 또는 코팅액 공급롤러축(31) 중 하나를 승강시키는 제1 조절축(72)를 포함하여 구성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치.The vertical direction adjusting means 70 is made of a servo motor 71 and a lifting and lowering by the servo motor 71, the upper end of which raises or lowers one of the coating roller shaft 21 or the coating liquid supply roller shaft 31. A film coating apparatus for manufacturing a semiconductor, characterized in that it comprises a 1 control shaft (72).
  4. 제2항에 있어서,The method of claim 2,
    상기 메인롤러(10)를 전후진 시킴으로써 상기 메인롤러(10)와 도포용 롤러(20)의 간격을 조절하는 수평방향 조절수단(80)을 더 포함하여 구성되고,It further comprises a horizontal direction adjusting means for adjusting the distance between the main roller 10 and the coating roller 20 by advancing the main roller 10 forward and backward,
    상기 수평방향 조절수단(70)은 수평방향 구동부(81)와, 상기 수평방향 구동부(81)에 의해 승강되고 전단이 메인롤러축(11)을 전후진 시키는 제2 조절축(82)을 포함하여 구성되는 것을 특징으로 하는 반도체 제조용 필름 코팅장치.The horizontal direction adjusting means 70 includes a horizontal driving part 81 and a second adjusting shaft 82 which is lifted by the horizontal driving part 81 and whose front end advances the main roller shaft 11. Film coating apparatus for manufacturing a semiconductor, characterized in that the configuration.
PCT/KR2011/004771 2010-10-04 2011-06-29 Film coating apparatus for semiconductor process WO2012046944A1 (en)

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KR101433805B1 (en) * 2013-11-14 2014-09-23 주식회사 코엠에스 Film coating device
CN104168715A (en) * 2014-07-30 2014-11-26 东莞市五株电子科技有限公司 Soft board photosensitive film attaching method
CN104766908A (en) * 2014-12-31 2015-07-08 苏州润阳光伏科技有限公司 Chain type diffusion non-etching face phosphorus coating device
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CN110620065A (en) * 2019-08-26 2019-12-27 石狮市纳傲贸易有限公司 Wafer processing equipment

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