WO2012043320A1 - 水分散性エポキシ樹脂、水性エポキシ樹脂組成物およびその硬化物 - Google Patents
水分散性エポキシ樹脂、水性エポキシ樹脂組成物およびその硬化物 Download PDFInfo
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- WO2012043320A1 WO2012043320A1 PCT/JP2011/071441 JP2011071441W WO2012043320A1 WO 2012043320 A1 WO2012043320 A1 WO 2012043320A1 JP 2011071441 W JP2011071441 W JP 2011071441W WO 2012043320 A1 WO2012043320 A1 WO 2012043320A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
- C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Definitions
- the present invention relates to an aqueous epoxy resin composition useful for paints, adhesives, fiber sizing agents, concrete primers, and the like, and more specifically, corrosion resistance of a work piece obtained without impairing workability and storage stability of varnish,
- the present invention relates to an aqueous epoxy resin composition capable of imparting adhesiveness.
- Epoxy resin compositions are widely used in various fields such as paints, adhesives, laminates, and electrical / electronic parts because the cured products obtained are excellent in mechanical properties, corrosion resistance, adhesion and the like.
- an epoxy resin is often used as a composition diluted in an organic solvent, an aqueous solution has been desired due to environmental problems in recent years.
- an aqueous epoxy resin for example, an epoxy resin emulsion produced by high-speed stirring with a homomixer using a surfactant is known, but the epoxy resin emulsion has a water resistance due to the surfactant. There were problems such as poor adhesion to the substrate or top coating, and poor mechanical stability.
- Patent Document 1 discloses a product obtained by reacting bisdiphenol diglycidyl ether, bisdiphenol, and polyoxyalkylene glycol diglycidyl ether.
- Patent Document 2 discloses a product obtained by reacting diglycidyl ether of bisdiphenol, bisdiphenol, diglycidyl ether of polyoxyalkylene glycol, and diisocyanate.
- Patent Document 3 discloses a condensation product comprising a condensation product composed of a bifunctional or higher functional epoxy resin, a polyhydric phenol, an aliphatic polyol, a bifunctional or higher functional epoxy resin, mono- and polyisocyanate. Has been.
- Patent Document 4 discloses that a polyoxyethylene polyol compound having a molecular weight of 400 to 10,000 and an acid anhydride compound have an acid anhydride group / hydroxyl group equivalent ratio of 1.
- Two or more carboxyl group-containing compounds obtained by reacting at a ratio of 0 to 1.1 and two or more epoxy resins having two or more epoxy groups in the molecule with respect to the carboxyl groups of the carboxyl group-containing compound
- a water-dispersible epoxy resin obtained by reacting the epoxy group having an epoxy group in a range of 0.75 to 1.5.
- Patent Document 4 cannot increase the crosslink density of the cured product because the polyethylene glycol chain is introduced into the main chain. For this reason, coating film strength and corrosion resistance were not sufficient.
- the problem to be solved by the present invention is a water-dispersible epoxy resin that is excellent in water dispersibility, maintains emulsion stability with respect to the epoxy resin, and can obtain a cured product that is more excellent in coating strength and corrosion resistance.
- Another object of the present invention is to provide a cured product having alkali resistance and further excellent coating film strength and corrosion resistance.
- the present inventors can increase the crosslinking density during curing by using a bifunctional water-dispersible epoxy resin having a polyethylene glycol chain introduced as a side chain.
- a bifunctional water-dispersible epoxy resin having a polyethylene glycol chain introduced as a side chain.
- an aqueous epoxy resin composition capable of maintaining excellent water dispersibility and emulsion stability with respect to an epoxy resin, and further, an aqueous epoxy resin excellent in water resistance, alkali resistance, coating strength and corrosion resistance.
- the inventors have found that a cured product of the composition can be provided, and have completed the present invention.
- the present invention reacts a compound (A) having at least two or more carboxy groups in the molecule with an epoxy resin (B) having two or more epoxy groups in the molecule.
- a water-dispersible epoxy resin obtained by mixing the compound (A) with a polyethylene glycol monoalkyl ether (A-1) having a number average molecular weight of 400 to 10,000 and three or four carboxy groups in the molecule.
- a water-dispersible epoxy which is obtained by esterifying a polycarboxylic acid-derived acid anhydride (A-2) having at least two carboxy groups in the molecule Provide resin.
- the present invention is derived from a polyethylene glycol monoalkyl ether (A-1) having a number average molecular weight of 400 to 10,000 and a polyvalent carboxylic acid having 3 or 4 carboxy groups in the molecule.
- A-1 polyethylene glycol monoalkyl ether
- the ratio of the acid anhydride group (—COOCO—) of the acid anhydride (A-2) to the hydroxyl group of the polyethylene glycol monoalkyl ether (A-1) is 1 to 1
- a process for reacting with (B) and a method for producing a water-dispersible epoxy resin.
- the present invention provides 5 to 70 parts by mass of the water-dispersible epoxy resin ( ⁇ ) and an epoxy resin ( ⁇ ) having two or more epoxy groups in the molecule (provided that the water Water-dispersible epoxy resin composition obtained by mixing 30-95 parts by mass) (excluding dispersible epoxy resin ( ⁇ )), and aqueous epoxy resin composition in which the water-dispersible epoxy resin composition is dispersed in an aqueous medium Offer things.
- the present invention provides a cured product obtained by curing the aqueous epoxy resin composition.
- the water-dispersible epoxy resin of the present invention is excellent in water dispersibility and emulsion stability, and can provide a cured product that is superior in coating strength and corrosion resistance. Moreover, the water-dispersible epoxy resin composition of the present invention can provide a cured product excellent in water resistance, alkali resistance, coating film strength and corrosion resistance.
- FIG. 1 is a GPC chart of methoxypolyethylene glycol used as a synthesis raw material in step 1 of Production Example 1.
- FIG. 2 is a GPC chart of the carboxy group-containing compound [(A) -1] obtained in Step 1 of Production Example 1.
- FIG. 3 is an IR chart of the carboxy group-containing compound [(A) -1] obtained in Step 1 of Production Example 1.
- FIG. 4 is a C 13 NMR chart of the water-dispersible epoxy resin (1) obtained in Step 2 of Production Example 1.
- the water-dispersible epoxy resin of the present invention comprises a compound (A) having at least two or more carboxy groups in the molecule (hereinafter sometimes simply referred to as “carboxy group-containing compound (A)”), and the molecule.
- a water-dispersible epoxy resin obtained by reacting with an epoxy resin (B) having two or more epoxy groups, wherein the compound (A) is a polyethylene glycol monoalkyl ether (A) having a number average molecular weight of 400 to 10,000. -1) and a polyvalent carboxylic acid having three or more carboxy groups in the molecule or an acid anhydride (A-2) thereof are esterified so that at least two carboxy groups are present in the molecule. Is obtained. Details will be described below.
- the compound (A) used in the present invention includes a polyethylene glycol monoalkyl ether (A-1) having a number average molecular weight of 400 to 10,000, It is obtained by esterifying a polyvalent carboxylic acid having three or more carboxy groups or an acid anhydride (A-2) thereof so that at least two or more carboxy groups are present in the molecule.
- polyethylene glycol monoalkyl ether (A-1) having a number average molecular weight of 400 to 10,000 used in the present invention, the following general formula (1)
- the polyethylene glycol monoalkyl ether represented by these is mentioned.
- R represents an alkyl group, and more specifically, an alkyl group having 1 to 12 carbon atoms such as a methyl group or an ethyl group, more preferably an alkyl group having 1 to 4 carbon atoms.
- n shows the repeating number of ethylene oxide groups.
- the number average molecular weight of polyethylene glycol of the polyethylene glycol monoalkyl ether used in the present invention is 400 to 10,000, preferably 1000 to 4000.
- the number average molecular weight is a value calculated from the hydroxyl value according to the following (formula 1).
- the acid anhydride (A-2) derived from a polycarboxylic acid having 3 or 4 carboxy groups in the molecule used in the present invention has 3 or 4, preferably 3 carboxy groups in the molecule.
- a conventionally known one such as an aromatic polyvalent carboxylic acid or an acid anhydride derived from a cycloaliphatic polyvalent carboxylic acid should be used without particular limitation.
- acid anhydrides derived from aromatic polycarboxylic acids are preferred.
- Examples of the acid anhydride of the aromatic polyvalent carboxylic acid include trimet acid anhydride, pyromellitic acid anhydride, benzophenone-3,3 ′, 4,4′-tetracarboxylic acid anhydride, and the like. Of these, trimellitic anhydride is preferable.
- Examples of the cyclic aliphatic polycarboxylic acid anhydride include hydrogenated trimellitic acid anhydride and hydrogenated pyromellitic acid anhydride.
- the ratio of the acid anhydride group (—COOCO—) of the acid anhydride (A-2) to the hydroxyl group of the polyethylene glycol monoalkyl ether (A-1) is in the range of 1 to 1.2. More preferably, it is carried out in the range of 1.0 to 1.1.
- the ratio of the acid anhydride group is smaller than 1, it is not preferable because a hydroxyl group remains in the water-dispersible epoxy resin.
- the reaction temperature for the esterification reaction is 40 to 140 ° C., more preferably 80 to 130 ° C. Furthermore, the reaction time of the esterification reaction is 1 to 5 hours, more preferably 1 to 3 hours. In the esterification reaction, a conventionally known catalyst or solvent can be used as necessary.
- water-dispersible epoxy resin of the present invention (hereinafter sometimes referred to as “water-dispersible epoxy resin ( ⁇ )”) has a carboxyl group-containing compound (A) and two or more epoxy groups in the molecule. Obtained by reacting with epoxy resin (B).
- epoxy resin (B) used in the present invention known epoxy resins can be used, and among them, those exemplified below are preferable.
- Preferred epoxy resins (B) include, for example, epoxy resins obtained from epichlorohydrin or ⁇ -methylepichlorohydrin and bisphenol A, bisphenol F or bisphenol sulfone, phenol novolac resins, polyglycidyl ethers of cresol novolac resins, and alkylenes of bisphenol A.
- Polyglycidyl ethers of oxide adducts polyglycidyl ethers of polyhydric alcohols such as polypropylene glycol, 1,6-hexanediol, trimethylolpropane, glycerin, etc.
- polycarboxylic acid polys such as adipic acid, phthalic acid, dimer acid, etc. Examples include glycidyl ester and polyglycidylamine.
- an epoxy resin obtained by modifying the above epoxy resin with a polyphenol such as bisphenol A or bisphenol F or a polycarboxylic acid such as adipic acid or sebacic acid can be preferably used.
- an epoxy resin obtained from epichlorohydrin and a phenol compound having two hydroxyl groups in the molecule specifically, an epoxy resin obtained from bisphenol A or bisphenol F and epichlorohydrin can be used more preferably.
- the epoxy equivalent of these epoxy resins is more preferably 150 to 200.
- the reaction between the carboxy group-containing compound (A) and the epoxy resin (B) having two or more epoxy groups in the molecule is performed by adding 1. the epoxy resin (B) to 1 mol per mol of the carboxy group-containing compound (A). The reaction is carried out at a rate of 5 mol to 2.5 mol, preferably 1.8 mol to 2.2 mol.
- the ratio of the epoxy resin (B) is less than 1.5 mol, the molecular weight of the water-dispersible epoxy resin ( ⁇ ) is increased, which tends to become viscous or poor in solubility, which is not preferable.
- the ratio of the said epoxy resin (B) exceeds 2.5 mol, since there exists a tendency for unreacted epoxy resin (B) to increase and water dispersibility to fall, it is unpreferable.
- a catalyst can be used for the reaction between the carboxy group-containing compound (A) and the epoxy resin (B).
- catalysts include tertiary amines such as triethylamine, tributylamine, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, N-methylpiperazine, and salts thereof; 2-methyl Imidazole, 2-phenylimidazole, 2-undecylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-methylimidazole, 2,4-dicyano-6- [2-methylimidazolyl-1] -ethyl- Imidazoles such as S-triazine, 2-ethyl-4-methylimidazole tetraphenylborate, and salts thereof; 1,5-diazabicyclo [5,4,0] -7-undecane, 1,5-diazabicyclo [4, 3,0] -5
- the use ratio is preferably in the range of 0.01 to 5 parts by mass with respect to 100 parts by mass of the water-dispersible epoxy resin ( ⁇ ).
- the reaction temperature is preferably in the range of 70 to 170 ° C, particularly preferably in the range of 80 to 120 ° C.
- the reaction time is preferably in the range of 3 to 10 hours, particularly preferably in the range of 3 to 8 hours.
- the epoxy equivalent of the water-dispersible epoxy resin ( ⁇ ) obtained by the reaction of the carboxy group-containing compound (A) and the epoxy resin (B) is preferably in the range of 600 to 6000 [g / eq], and 900 to 2500. A range of [g / eq] is particularly preferable. If the epoxy equivalent is 600 [g / eq] or more, the water dispersibility tends to be improved, and if it is 6000 [g / eq] or less, the water resistance tends to be improved.
- R represents an alkyl group having 1 to 12 carbon atoms
- R ′ represents an alkylidene group or sulfonyl group having 1 to 3 carbon atoms
- m and n represent the number of repeating units.
- the water dispersible epoxy resin represented by these is preferable.
- R is an alkyl group having 1 to 4 carbon atoms
- R ′ is a methylene group or a 2,2-propylene group
- m is 1. Is particularly preferred.
- the water-dispersible epoxy resin composition of the present invention comprises an epoxy resin ( ⁇ ) having two or more epoxy groups in the molecule other than the water-dispersible epoxy resin ( ⁇ ) and the water-dispersible epoxy resin ( ⁇ ). (Hereinafter, simply referred to as “epoxy resin ( ⁇ )”). By mixing the water-dispersible epoxy resin ( ⁇ ) with another epoxy resin, a water-dispersible epoxy resin composition exhibiting self-emulsification in an aqueous solvent can be obtained.
- the mixing ratio of the water-dispersible epoxy resin ( ⁇ ) and the epoxy resin ( ⁇ ) in the water-dispersible epoxy resin composition of the present invention is 5 to 70 parts by mass for the former and 95 to 30 parts by mass for the latter. A range of 10 to 50 parts by mass for the former and a range of 90 to 50 parts by mass for the latter are particularly preferred.
- the water-dispersible epoxy resin composition of the present invention exhibits excellent dispersibility in an aqueous solvent.
- the water-dispersible epoxy resin ( ⁇ ) in the water-dispersible epoxy resin composition of the present invention is 5 parts by mass or more, the emulsion stability is good, while when it is 70 parts by mass or less, the water resistance is good. Therefore, it is preferable.
- the epoxy resin (B) can be used as the epoxy resin ( ⁇ ).
- Polyglycidyl ether is particularly preferred.
- the aqueous epoxy resin composition of the present invention contains a water-dispersible epoxy resin composition and an aqueous solvent.
- the aqueous solvent may be water itself or a mixture of a water-soluble solvent and water.
- the water-soluble solvent is particularly limited as long as it is a solvent that uniformly dissolves the water-dispersible epoxy resin ( ⁇ ), epoxy resin ( ⁇ ), and water, which are reaction products, and is inert to these.
- esters such as ethyl acetate, 3-methoxybutyl acetate, methoxypropyl acetate, cellosolve acetate, alcohols such as methanol, ethanol, isopropanol, methyl cellosolve, ethyl cellosolve, propyl cellosolve, butyl cellosolve, isobutyl cello Cellosolves such as solob and tert-butylcellosolve, glymes such as monoglyme, diglyme and triglyme, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monobutyl ether, propylene Examples include propylene glycol monoalkyl ethers such as lenglycol monoisobutyl ether and propylene glycol mono tert-butyl ether, and ketones such as acetone and methyl ethyl ketone.
- the timing of mixing the water-dispersible epoxy resin composition and the aqueous solvent is possible at an arbitrary time.
- the water-dispersible epoxy resin composition of the present invention and the aqueous solvent are mixed in advance before use.
- the water-dispersible epoxy resin composition of the present invention and an aqueous solvent can be mixed at the site of use.
- the aqueous epoxy resin composition of the present invention can be cured at room temperature or low temperature using a conventionally known basic curing agent.
- Examples of the basic curing agent include aliphatic polyamines, alicyclic polyamines, Mannich bases, amine-epoxy addition products, polyamide polyamines, liquid aromatic polyamines, and the like.
- aliphatic polyamine used as the basic curing agent examples include polyalkylene polyamines such as diethylenetriamine, triethylenetriamine, tetraethylenepentamine, 1,4-bis- (3-aminopropyl) piperazine, m-xylenediamine, Examples thereof include p-xylenediamine.
- Examples of the alicyclic polyamine used as the basic curing agent include 1,2-diaminocyclohexane, 1,4-diamino-3,6-diethylcyclohexene, isophoronediamine and the like.
- Mannich bases used as basic curing agents include (1) polyamines such as triethylenetriamine, isophoronediamine, m-xylenediamine, and p-xylenediamine, (2) aldehydes such as formaldehyde, and (3) Examples thereof include condensation reaction products with monovalent or polyvalent cresols and xylenols having at least one aldehyde reactive site in the nucleus, and phenols such as p-tert-butylphenol and resorcin.
- polyamines such as triethylenetriamine, isophoronediamine, m-xylenediamine, and p-xylenediamine
- aldehydes such as formaldehyde
- Examples thereof include condensation reaction products with monovalent or polyvalent cresols and xylenols having at least one aldehyde reactive site in the nucleus, and phenols such as p-tert-butylphenol and resorcin.
- Examples of amine-epoxy addition products used as basic curing agents include (1) (a) polyamines such as triethylenetriamine, tetraethylenepentamine, isophoronediamine, m-xylenediamine, and p-xylenediamine. (B) reaction products with epoxy resins such as glycidyl ethers such as phenyl glycidyl ether, butyl glycidyl ether, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, or (2) the polyamines, A reaction product with glycidyl esters such as “Cardura E” (registered trademark: Yuka Shell Epoxy Co., Ltd.) can be mentioned.
- polyamines such as triethylenetriamine, tetraethylenepentamine, isophoronediamine, m-xylenediamine, and p-xylenediamine.
- epoxy resins such as glycidyl ethers such as
- polyamide polyamine used as the basic curing agent those obtained by the reaction of polyamines with polycarboxylic acids or dimerized fatty acids can be used, for example, reaction products of ethylenediamine and dimer acid, etc. Can be mentioned.
- liquid aromatic polyamines used as basic curing agents include reaction products of aromatic polyamines and glycidyl ethers or glycidyl esters.
- aromatic polyamine include diaminodiphenylmethane and diaminodiphenylsulfone.
- the glycidyl ethers include phenyl glycidyl ether, butyl glycidyl ether, diglycidyl ether of bisphenol A, diglycidyl ether of bisphenol F, and the like.
- glycidyl esters include “Cardura E”.
- the water-dispersible epoxy resin of the present invention is excellent in water dispersibility because it has a hydrophilic group in the side chain.
- the water-dispersible epoxy resin of the present invention since it has an epoxy group in the molecule, it exhibits affinity with other epoxy compounds, so it can be used as a dispersant and self-emulsified in an aqueous solvent. Excellent water dispersibility.
- the water-dispersible epoxy resin, the water-dispersible epoxy resin composition of the present invention and the emulsion composition obtained by emulsifying them can be produced by any known method. Moreover, the obtained emulsion composition etc. can be used by a conventionally well-known suitable method.
- resin components such as other polyester water-based resins and acrylic water-based resins can be used in combination as required, as long as the characteristics are not impaired.
- the aqueous epoxy resin composition of the present invention includes various additives such as a repellency inhibitor, an anti-sagging agent, a spreading agent, an antifoaming agent, a curing accelerator, an ultraviolet absorber, and a light stabilizer as necessary. Can also be blended.
- aqueous epoxy resin composition of the present invention is not particularly limited, and examples thereof include paints, adhesives, fiber sizing agents, concrete primers, and the like.
- the aqueous epoxy resin composition of the present invention When the aqueous epoxy resin composition of the present invention is used for coatings, it is preferable to add various pigments such as rust preventive pigments, colored pigments, extender pigments, and various additives as necessary.
- the antirust pigment include scaly pigments such as zinc powder, aluminum phosphomolybdate, zinc phosphate, aluminum phosphate, barium chromate, aluminum chromate, and graphite.
- the color pigment include Carbon black, titanium oxide, zinc sulfide, bengara, and extender pigments include, for example, barium sulfate, calcium carbonate, talc, kaolin, and the like.
- the blending amount thereof is 10 to 70 parts by mass with respect to 100 parts by mass in total of the water-based epoxy resin composition and the curing agent blended as necessary, such as coating film performance and coating workability. It is preferable from the point.
- the coating method in the case of using the aqueous epoxy resin composition of the present invention for coating is not particularly limited, and may be performed by roll coating, spraying, brushing, spatula, bar coater, dip coating, electrodeposition coating method. it can.
- room temperature drying to heat curing can be performed.
- the heating temperature for heat curing is preferably in the range of 50 to 250 ° C, particularly preferably in the range of 60 to 230 ° C.
- the heating time is preferably in the range of 2 to 30 minutes, particularly preferably in the range of 5 to 20 minutes.
- the water-based epoxy resin composition of the present invention can be used for general purposes such as water-based paints for building interiors, water-based paints for building exteriors and inorganic building materials, iron-part rust-preventing water-based paints, water-based paints for automobile repairs, automobile paints, beverage cans, etc. Used for industrial applications. Among these, since it is excellent in corrosion resistance and dryness to touch, it is suitably used as an iron part rust preventive water-based paint for heavy corrosion prevention of steel structures and bridges, particularly as an iron part rust preventive water-based paint for undercoating.
- the aqueous epoxy resin composition of the present invention when used as an adhesive, it is not particularly limited, and can be performed by applying the sprayed, brushed, or spatula to the base material, and then matching the adhesive surface of the base material.
- the bonding portion can form a strong adhesive layer by fixing or pressing the periphery.
- Steel plates, concrete, mortar, wood, resin sheets, resin films are suitable as the base material, and various surface treatments such as physical treatment such as polishing, electrical treatment such as corona treatment, and chemical treatment such as chemical conversion treatment are performed as necessary. More preferably, it is applied after application.
- the aqueous epoxy resin composition of the present invention when used as a fiber sizing agent, it can be carried out without any particular limitation. For example, it is applied to a fiber immediately after spinning using a roller coater and wound as a fiber strand. Thereafter, a method of drying is mentioned.
- the fiber used is not particularly limited.
- inorganic fibers such as glass fiber, ceramic fiber, asbestos fiber, carbon fiber, and stainless fiber, natural fibers such as cotton and hemp, synthetic fibers such as polyester, polyamide, and urethane.
- Examples of the shape of the base material include short fibers, long fibers, yarns, mats, and sheets.
- the amount used as the fiber sizing agent is preferably 0.1 to 2% by mass as the resin solid content with respect to the fiber.
- water-based epoxy resin composition of this invention when using the water-based epoxy resin composition of this invention as a concrete primer, it is not specifically limited, It can carry out with a roll, a spray, a brush, a spatula, or a scissors.
- GPC -Equipment: HLC-8220 GPC manufactured by Tosoh Corporation, Column: TSK-GEL G2000HXL + G2000HXL + G3000HXL + G4000HXL manufactured by Tosoh Corporation ⁇ Solvent: Tetrahydrofuran ⁇ Flow rate: 1 ml / min ⁇ Detector: RI
- NMR JNM-ECA500 manufactured by JEOL Ltd. Sample concentration: 30% (w / v) Measurement solvent: CDCl 3 ⁇ Number of integration: 8000 times
- FIG. 1 shows a GPC chart of methoxypolyethylene glycol used as a synthesis raw material in Step 1 above
- FIGS. 2 and 3 show a GPC chart and an IR chart of the carboxy group-containing compound [(A) -1] obtained in Step 1 above. Shown respectively.
- n the number of repeating units.
- Step 2> In a glass four-necked flask equipped with a thermometer, a stirrer, a nitrogen introducing tube and a cooling tube, 1096 g of the carboxy group-containing compound [(A) -1] having an acid value of 51 mg KOH / g obtained in the above Step 1 and a bisphenol A type epoxy 376 g of resin [(B)] (“Epiclon 850S” manufactured by DIC Corporation) and 4.4 g of triphenylphosphine are prepared, and the epoxy resin becomes 1.0 mol (2 equivalents of epoxy group) per 1 equivalent of carboxy groups. The reaction was carried out at a rate of 120 ° C. for 8 hours, the reaction was terminated with an acid value of 0 mg KOH / g,
- n the number of repeating units.
- the epoxy equivalent of this water-dispersible epoxy resin (1) was 1474 [g / eq].
- the NMR chart of this water-dispersible epoxy resin (1) is shown in FIG. From the absorption in the vicinity of 65 ppm shown in FIG. 4, the presence of the carbon atom to which the secondary hydroxyl group of the compound represented by the above formula (AE1) is bonded can be confirmed. As a result, the carboxy group obtained in Step 1 Formation of a reaction product of the compound [(A) -1] and the bisphenol A type epoxy resin can be confirmed.
- Step 3> 148 g of the water-dispersible epoxy resin (1) (epoxy equivalent 1474) obtained in Step 2 above and 1000 g of an epoxy resin (“Epiclon 1055” manufactured by DIC Corporation) are mixed, and water is added in 10 portions while stirring. An epoxy resin emulsion (1) was obtained. The properties of the epoxy resin emulsion (1) thus obtained were 59.5% nonvolatile matter and viscosity (B-type viscometer) 2780 mPa ⁇ s.
- Step 3 of Production Example 1 In Step 3 of Production Example 1, except that 148 g of water-dispersible epoxy resin (1) (epoxy equivalent 1474), 1000 g of epoxy resin (“Epiclon 1055”) and 128 g of butyl cellosolve (ethylene glycol mono-n-butyl ether) were mixed, In the same manner as in Production Example 1, an epoxy resin emulsion (2) was obtained. The properties of the resulting epoxy resin emulsion (2) were a non-volatile content of 61.1% and a viscosity of 15000 mPa ⁇ s.
- Step 3 of Production Example 1 148 g of water-dispersible epoxy resin (1) (epoxy equivalent 1474), 1000 g of epoxy resin (“Epiclon 1055”), and 203 g of methyl ethyl ketone were mixed, and after adding water, the pressure was reduced.
- An epoxy resin emulsion (4) was obtained in the same manner as in Production Example 1 except that methyl ethyl ketone was distilled off by distillation.
- the properties of the resulting epoxy resin emulsion (4) were a non-volatile content of 60.1% and a viscosity of 300 mPa ⁇ s.
- the properties of the resulting epoxy resin emulsion (5) were a non-volatile content of 61.3% and a viscosity of 5000 mPa ⁇ s.
- Step 3> (Preparation of curing agent) A four-necked flask equipped with a thermometer, a stirrer, and a nitrogen gas inlet tube was charged with 640 parts of the bisphenol-type epoxy resin solution (K-1) obtained in the above step 1, and the temperature was raised to 90 ° C. 176.3 parts of the aqueous resin intermediate (K-2) obtained in the above was charged and stirred at 100 ° C. for 2 hours. After completion of the stirring, 102.8 parts of butyl cellosolve was charged, 37.3 parts of monoethanolamine was added at 70 ° C., and the mixture was stirred at 100 ° C. for 3 hours.
- aqueous resin composition (K-3) having a nonvolatile content of 34% by mass.
- the weight average molecular weight of the resin component constituting the nonvolatile content of the aqueous resin composition (K-3) was 33,000.
- a water-based resin composition (K-3) and a curing agent (“DOCURE KH-700” manufactured by Kokuto Kogyo Co., Ltd.) are mixed at 604/100 (mass standard) and a mixer (“ARE-310” manufactured by Shinky Corporation) Were mixed to prepare a curing agent.
- Example 1 to 4 and Comparative Example 1 The epoxy resin emulsion (main agent) obtained in Production Examples 1 to 4 and Comparative Production Example 1 was mixed with the curing agent obtained in Production Example 5 in the proportions shown in Table 1 below using a mixer (“ARE-” manufactured by Sinky Corporation). 310 ”) and then applied to a steel plate (" SPCC-SB "compliant with JIS G3141 manufactured by Engineering Test Service, degreased with xylene, and then water-polished with sandpaper # 240) using a bar coater. . The obtained coating film had a film thickness of 50 ⁇ m. After the coating film was cured at 25 ° C. for 1 week, various tests were conducted under the following conditions. The results are shown in Table 1.
- the edge of the cut is completely smooth and there is no peeling to the eyes of any lattice.
- 1 Small peeling of the coating film at the intersection of cuts.
- the cross-cut portion is clearly not affected by more than 5%.
- 2 The coating film is peeled along the edge of the cut and / or at the intersection.
- the cross-cut part is clearly affected by more than 5% but not more than 15%.
- 3 The coating film is partially or completely peeled along the edge of the cut, and / or various parts of the eye are partially or completely peeled off.
- the cross-cut part is clearly affected by more than 15% but not more than 35%.
- 4 The coating film is partially or completely peeled along the edge of the cut, and / or various parts of the eye are partially or completely peeled off.
- the cross-cut part is clearly affected by more than 35% but not more than 65%. 5: When the degree of peeling exceeds 4 above.
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Emergency Medicine (AREA)
- General Chemical & Material Sciences (AREA)
- Epoxy Resins (AREA)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
で表わされる水分散性エポキシ樹脂が好ましい。また、前記一般式(I)において、Rが炭素数1~4のアルキル基であり、R’がメチレン基又は2,2-プロピレン基であり、かつ、mが1である水分散性エポキシ樹脂が特に好ましい。
・装置:東ソー株式会社製 HLC-8220 GPC、カラム:東ソー株式会社製 TSK-GEL G2000HXL+G2000HXL+G3000HXL+G4000HXL
・溶媒:テトラヒドロフラン
・流速:1ml/min
・検出器:RI
・試料濃度:30%(w/v)
・測定溶媒:CDCl3
・積算回数:8000回
<工程1>
温度計、攪拌機、窒素導入管及び冷却管を備えたガラス製4ツ口フラスコに、数平均分子量2000(水酸基価28.0mgKOH/g)のメトキシポリエチレングリコール2000gと無水トリメリット酸192gを仕込み、酸無水物基/水酸基の当量比が1.0にて100℃で5時間反応させて、酸価51mgKOH/gのカルボキシ基含有化合物〔(A)-1〕を得た。
で表わされる化合物であることを確認することができる。
温度計、攪拌機、窒素導入管及び冷却管を備えたガラス製4ツ口フラスコに前記工程1で得た酸価51mgKOH/gのカルボキシ基含有化合物〔(A)-1〕1096gとビスフェノールA型エポキシ樹脂〔(B)〕(DIC株式会社製「エピクロン850S」)376gとトリフェニルホスフィン4.4gとを仕込み、カルボキシ基1当量に対してエポキシ樹脂が1.0モル(エポキシ基2当量)となる割合にて120℃で8時間反応させ、酸価0mgKOH/gで反応を終了させて、式(AE1)
で表わされる水分散性エポキシ樹脂(1)を得た。
前記工程2で得た水分散性エポキシ樹脂(1)(エポキシ当量1474)148gとエポキシ樹脂(DIC株式会社製「エピクロン1055」)1000gとを混合し、撹拌しながら水を10分割で添加して、エポキシ樹脂エマルジョン(1)を得た。このようにして得たエポキシ樹脂エマルジョン(1)の性状は、不揮発分59.5%、粘度(B型粘度計)2780mPa・sであった。
製造例1の工程3において、水分散性エポキシ樹脂(1)(エポキシ当量1474)148gとエポキシ樹脂(「エピクロン1055」)1000gおよびブチルセロソルブ(エチレングリコールモノn-ブチルエーテル)128gとを混合した以外は、製造例1と同様にして、エポキシ樹脂エマルジョン(2)を得た。得られたエポキシ樹脂エマルジョン(2)の性状は、不揮発分61.1%、粘度15000mPa・sであった。
製造例1の工程3において、水分散性エポキシ樹脂(1)(エポキシ当量1474)148gとエポキシ樹脂(「エピクロン1055」)1000gおよびプロピレングリコールモノn-プロピルエーテル128gとを混合した以外は、製造例1と同様にして、エポキシ樹脂エマルジョン(3)を得た。得られたエポキシ樹脂エマルジョン(3)の性状は、不揮発分60.1%、粘度6600mPa・sであった。
製造例1の工程3において、水分散性エポキシ樹脂(1)(エポキシ当量1474)148gとエポキシ樹脂(「エピクロン1055」)1000gおよびメチルエチルケトン203gとを混合したこと、かつ、水を添加した後、減圧蒸留によりメチルエチルケトンを留去したこと以外は、製造例1と同様にして、エポキシ樹脂エマルジョン(4)を得た。得られたエポキシ樹脂エマルジョン(4)の性状は、不揮発分60.1%、粘度300mPa・sであった。
<工程1>
温度計、攪拌機、窒素導入管及び冷却管を備えたガラス製4ツ口フラスコに、数平均分子量2000(水酸基価28.0mgKOH/g)のポリエチレングリコール1000gとヘキサヒドロ無水フタル酸180gを仕込み、酸無水物基/水酸基の当量比が1.02にて100℃で3時間反応させて、酸価49mgKOH/gのカルボキシ基含有化合物〔(A)-2〕を得た。
温度計、攪拌機、窒素導入管及び冷却管を備えたガラス製4ツ口フラスコに、前記工程1で得た酸価49mgKOH/gのカルボキシ基含有化合物〔(A)-2〕1145g、エポキシ樹脂〔(B)-2〕(DIC株式会社製「エピクロン830S」)340g及びトリエタノールアミン3gを仕込み、カルボキシ基1当量に対してエポキシ樹脂が1.0モルとなる割合にて150℃で8時間反応させ、酸価0で反応を終了させて、水分散性エポキシ樹脂(2)を得た。このようにして得た水分散性エポキシ樹脂(2)のエポキシ当量は1485〔g/eq〕であった。
前記工程2で得た水分散性エポキシ樹脂(2)(エポキシ当量1485)150gとエポキシ樹脂(「エピクロン1055」)1000gとを混合し、撹拌しながら水を分割添加し、エポキシ樹脂エマルジョン(5)を得た。得られたエポキシ樹脂エマルジョン(5)の性状は不揮発分61.3%、粘度5000mPa・sであった。
<工程1>(中間体:ビスフェノール型エポキシ樹脂溶液の合成)
温度計、撹拌装置及び窒素ガス導入管を備えた4つ口フラスコに、エポキシ当量188〔g/eq〕のビスフェノールA型エポキシ樹脂(DIC株式会社製「エピクロン850」)300部及びビスフェノールA 87.9部を仕込み、80℃に加熱して均一混合物を得た。前段階で得た均一混合物に、テトラメチルアンモニウムクロライド(50%水溶液)0.1部を添加し、攪拌しながら140℃にて3時間反応させた。その後、ブチルセロソルブ129.3部を添加し、撹拌均一することによって、エポキシ当量480〔g/eq〕、不揮発分75%のエポキシ樹脂溶液(K-1)を得た。
温度計、撹拌装置、窒素ガス導入管を付した4つ口フラスコに、エポキシ当量188〔g/eq〕のビスフェノールA型エポキシ樹脂(「エピクロン850」)188部及びトリレンジイソシアネート(三井武田ケミカル株式会社製「コスモネートT-80」)17.4部を仕込んだ。次に、50℃まで昇温させた後、エチレングリコール1.55部を仕込み、80℃にて2時間反応させた。次に、前記反応混合物に、冷却しながら、ポリ(オキシプロピレン/オキシエチレン)アミン(ハンツマン社製「ジェファーミンM-1000」活性水素当量505g/当量)722部を仕込んだ。その後、100℃にて5時間攪拌した。反応混合物にブチルセロソルブ398部を添加し、攪拌することによって、均一化して不揮発分70%の樹脂(K-2)を得た。
温度計、撹拌装置及び窒素ガス導入管を備えた4つ口フラスコに、前記工程1で得たビスフェノール型エポキシ樹脂溶液(K-1)640部を仕込み90℃に昇温した後、前記工程2で得た水性樹脂中間体(K-2)176.3部を仕込み、100℃にて2時間攪拌した。攪拌終了後、ブチルセロソルブ102.8部を仕込んだ後、70℃にてモノエタノ-ルアミン37.3部を添加し、100℃にて3時間攪拌した。その後、冷却を開始し、イオン交換水928部を4時間かけて滴下した。水滴下時の液温は40~50℃に管理した。次に、スチレン化フェノール系乳化剤(第一工業株式会社製「ノイゲンEA-207D」)28.3部を添加し、攪拌均一することにより不揮発分34質量%の水性樹脂組成物(K-3)を得た。水性樹脂組成物(K-3)の不揮発分を構成する樹脂成分の重量平均分子量は33,000であった。次に、水性樹脂組成物(K-3)と硬化剤(韓国 国都社製「DOCURE KH-700」)を604/100(質量基準)で、ミキサー(株式会社シンキー製の「ARE-310」)を用いて混合して、硬化剤を作製した。
製造例1~4および比較製造例1で得たエポキシ樹脂エマルジョン(主剤)に、製造例5で得た硬化剤を、下表1に記載の割合で、ミキサー(株式会社シンキー製の「ARE-310」)を用いて混合した後、鋼板(エンジニアリングテストサービス社製JIS G3141準拠「SPCC-SB」、キシレンにて脱脂後、サンドペーパー#240で水研磨処理)に、バーコーターを用いて塗布した。得られた塗膜は膜厚50μmであった。この塗膜を25℃で1週間養生した後、下記条件で各種試験を行ない、その結果を表1に示した。
各エポキシ樹脂エマルジョンを100ml容量のマヨネーズ瓶に90g量り取り、室温(25℃)下に保管し、所定の経過時間後に目視にて外観を観察した。
○:沈殿、分離なし。△:分離が見られる。×:凝集物発生。
JIS K-5600-5-3(1999)に準拠し、デュポン式にて、撃心1/2インチ、荷重1000gにて行った。
〇:50cmで亀裂等の発生無し。×:50cmで亀裂等の発生が認められる。
JIS K-5600-5-6(1999)に準拠し、1mm間隔で切れ目を入れ、テープを貼り付け後に引き剥がした後の塗膜状態を目視で観察した。
1:カットの交差点における塗膜の小さなはがれ。クロスカット部分で影響を受けるのは明確に5%を上回ることはない。
2:塗膜がカットの縁に沿って、及び/又は交差点においてはがれている。クロスカット部分で影響を受けるのは明確に5%を超えるが15%を上回ることはない。
3:塗膜がカットの縁に沿って、部分的又は全面的に大はがれを生じており、及び/又は目のいろいろな部分が、部分的又は全面的にはがれている。クロスカット部分で影響を受けるのは明確に15%を超えるが35%を上回ることはない。
4:塗膜がカットの縁に沿って、部分的又は全面的に大はがれを生じており、及び/又は目のいろいろな部分が、部分的又は全面的にはがれている。クロスカット部分で影響を受けるのは明確に35%を超えるが65%を上回ることはない。
5:はがれの程度が上記4を超える場合。
JIS K5600-5-4に準じて、試験塗膜に対し約45゜の角度に鉛筆の芯を当て、芯が折れない程度に強く試験塗膜に押しつけながら前方に均一な早さで約10mm動かした。塗膜が破れなかったもっとも硬い鉛筆の硬度記号を鉛筆硬度とした。
JIS K-5600-5-1(1999)に準拠し、円筒形マンドレル(直径2mm)により折り曲げられた場合の塗膜の割れおよび、基材からの剥れの有無を観察した。
〇:割れ、剥れ発生せず。×:割れ、又は剥れ発生。
各試験板を25℃の5%水酸化ナトリウム水溶液に1週間浸漬した後に外観を観察した。
○:良好で問題ない、×:塗膜にツヤビケ、フクレまたはワレのいずれかが認められる
各試験板を25℃の水中に1週間浸漬を行った後に、外観を観察した。
○:良好で問題ない、×:塗膜にツヤビケ、フクレまたはワレのいずれかが認められる
JIS K-5600-7-1(1999)に準拠して行った。試験片にカッターでクロスカットを入れた後、試験器内に置き、300hr試験を行った後、クロスカット部からの塗膜の膨れ幅を記す。単位はmmである。
Claims (8)
- 分子中に少なくとも2つ以上のカルボキシ基を有する化合物(A)と、分子内に2つ以上のエポキシ基を有するエポキシ樹脂(B)とを反応させて得られる水分散性エポキシ樹脂であって、
前記化合物(A)が、数平均分子量400~10000のポリエチレングリコールモノアルキルエーテル(A-1)と、分子中に3つまたは4つのカルボキシ基を有する多価カルボン酸由来の酸無水物(A-2)を、分子中に少なくとも2つ以上のカルボキシ基が存在するようエステル化反応させて得られるものであることを特徴とする水分散性エポキシ樹脂。 - 前記一般式(I)において、Rが炭素数1~4のアルキル基であり、R’がメチレン基又は2,2-プロピレン基であり、かつ、mが1である請求項2記載の水分散性エポキシ樹脂。
- 数平均分子量400~10000のポリエチレングリコールモノアルキルエーテル(A-1)と、分子中に3つまたは4つのカルボキシ基を有する多価カルボン酸由来の酸無水物(A-2)とを、前記ポリエチレングリコールモノアルキルエーテル(A-1)の水酸基に対する前記酸無水物(A-2)の酸無水物基(-COOCO-)の割合が1~1.2の範囲でエステル化反応させて、分子中に少なくとも2つ以上のカルボキシ基を有する化合物(A)を得る工程、前記化合物(A)と分子内に2個以上のエポキシ基を有するエポキシ樹脂(B)とを反応させる工程、を有することを特徴とする水分散性エポキシ樹脂の製造方法。
- 請求項1に記載の水分散性エポキシ樹脂(α)5~70質量部と、分子内に2個以上のエポキシ基を有するエポキシ樹脂(β)(但し、前記水分散性エポキシ樹脂(α)を除く)30~95質量部とを含有する水分散性エポキシ樹脂組成物。
- 請求項5に記載の水分散性エポキシ樹脂組成物と水性溶剤(γ)とを含む水性エポキシ樹脂組成物。
- 前記水分散性エポキシ樹脂組成物が水性溶媒(γ)に分散している請求項6記載の水性エポキシ樹脂組成物。
- 請求項6又は7に記載の水性エポキシ樹脂組成物を硬化して得られる硬化物。
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JP2013006956A (ja) * | 2011-06-24 | 2013-01-10 | Dic Corp | アミン系硬化剤、アミン系硬化剤を含有するエポキシ樹脂組成物及びその硬化物 |
JP2013166850A (ja) * | 2012-02-15 | 2013-08-29 | Dic Corp | 水性防食塗料および防食塗膜 |
CN104271630A (zh) * | 2012-05-31 | 2015-01-07 | 陶氏环球技术有限公司 | 用于水性分散体的环氧树脂 |
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- 2011-09-21 KR KR1020127025198A patent/KR101385696B1/ko active IP Right Grant
- 2011-09-21 US US13/695,695 patent/US20130090413A1/en not_active Abandoned
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Also Published As
Publication number | Publication date |
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JP4962675B2 (ja) | 2012-06-27 |
CN102933634B (zh) | 2015-04-01 |
CN102933634A (zh) | 2013-02-13 |
TW201221534A (en) | 2012-06-01 |
JPWO2012043320A1 (ja) | 2014-02-06 |
TWI486370B (zh) | 2015-06-01 |
KR20120135287A (ko) | 2012-12-12 |
KR101385696B1 (ko) | 2014-04-17 |
EP2623534A1 (en) | 2013-08-07 |
EP2623534A4 (en) | 2017-01-18 |
US20130090413A1 (en) | 2013-04-11 |
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