WO2012039252A1 - Appareil d'inspection de tranches - Google Patents

Appareil d'inspection de tranches Download PDF

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Publication number
WO2012039252A1
WO2012039252A1 PCT/JP2011/069869 JP2011069869W WO2012039252A1 WO 2012039252 A1 WO2012039252 A1 WO 2012039252A1 JP 2011069869 W JP2011069869 W JP 2011069869W WO 2012039252 A1 WO2012039252 A1 WO 2012039252A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
transport
suction
pair
inspection apparatus
Prior art date
Application number
PCT/JP2011/069869
Other languages
English (en)
Japanese (ja)
Inventor
月本浩明
佐藤裕史
池田早人
藤田大輔
Original Assignee
タツモ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツモ株式会社 filed Critical タツモ株式会社
Priority to JP2012534978A priority Critical patent/JPWO2012039252A1/ja
Publication of WO2012039252A1 publication Critical patent/WO2012039252A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

Cette invention concerne un appareil d'inspection de tranches (1) comprenant principalement un mécanisme de transfert, des mécanismes de détection et un mécanisme d'aspiration/rotation. Ledit mécanisme de transfert transfère une tranche rectangulaire (10) par positionnement de la tranche sur des passages de transfert (2A, 2B). Les mécanismes de détection (4A-4D) sont agencés par paires, le mécanisme de transfert étant disposé entre les paires, et ils détectent l'état de la tranche. Le mécanisme d'aspiration/rotation (5) est doté de quatre plateaux d'aspiration (52A-52D) et il aspire la tranche (10) disposée sur les passages de transfert (2A, 2B) entre les deux paires de mécanismes de détection, puis il repose la tranche sur les passages de transfert (2A, 2B) après l'avoir pivotée de 90°.
PCT/JP2011/069869 2010-09-21 2011-09-01 Appareil d'inspection de tranches WO2012039252A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012534978A JPWO2012039252A1 (ja) 2010-09-21 2011-09-01 ウエハ検査装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010210425 2010-09-21
JP2010-210425 2010-09-21

Publications (1)

Publication Number Publication Date
WO2012039252A1 true WO2012039252A1 (fr) 2012-03-29

Family

ID=45873742

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/069869 WO2012039252A1 (fr) 2010-09-21 2011-09-01 Appareil d'inspection de tranches

Country Status (3)

Country Link
JP (1) JPWO2012039252A1 (fr)
TW (1) TW201214611A (fr)
WO (1) WO2012039252A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169544A1 (fr) * 2012-05-10 2013-11-14 Varian Semiconductor Equipment Associates, Inc. Mécanisme effecteur terminal rotatif à cellules multiples
CN105374723A (zh) * 2015-10-23 2016-03-02 智雅科技温州有限公司 一种蜂鸣片自动化出料装置
EP3091566A1 (fr) * 2015-05-04 2016-11-09 Applied Materials, Inc. Chargeur rotatif de substrat

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113611653B (zh) * 2021-08-13 2023-09-05 苏州隐冠半导体技术有限公司 一种多气路吸附装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012652A (ja) * 1998-06-24 2000-01-14 Sony Corp 半導体ウェハ搬送装置
JP2001315951A (ja) * 2000-05-09 2001-11-13 Fukuyama Tekkosho:Kk 移送部材の回転装置
JP2007234720A (ja) * 2006-02-28 2007-09-13 Mitsubishi Heavy Ind Ltd 太陽電池パネルの検査装置、膜研磨検査方法、及び太陽電池パネルの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000012652A (ja) * 1998-06-24 2000-01-14 Sony Corp 半導体ウェハ搬送装置
JP2001315951A (ja) * 2000-05-09 2001-11-13 Fukuyama Tekkosho:Kk 移送部材の回転装置
JP2007234720A (ja) * 2006-02-28 2007-09-13 Mitsubishi Heavy Ind Ltd 太陽電池パネルの検査装置、膜研磨検査方法、及び太陽電池パネルの製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013169544A1 (fr) * 2012-05-10 2013-11-14 Varian Semiconductor Equipment Associates, Inc. Mécanisme effecteur terminal rotatif à cellules multiples
US20130302126A1 (en) * 2012-05-10 2013-11-14 Varian Semiconductor Equipment Associates, Inc. Multi-cell rotary end effector mechanism
US8920103B2 (en) 2012-05-10 2014-12-30 Varian Semiconductor Equipment Associates, Inc. Multi-cell rotary end effector mechanism with slip ring
KR20150013727A (ko) * 2012-05-10 2015-02-05 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 다중-셀 로터리 엔드 이펙터 메커니즘
KR101640175B1 (ko) 2012-05-10 2016-07-15 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 엔드 이펙터 및 이를 사용하는 작업물 처리 시스템
EP3091566A1 (fr) * 2015-05-04 2016-11-09 Applied Materials, Inc. Chargeur rotatif de substrat
CN106128987A (zh) * 2015-05-04 2016-11-16 应用材料公司 基板旋转装载器
US10403533B2 (en) * 2015-05-04 2019-09-03 Applied Materials, Inc. Substrate rotary loader
CN105374723A (zh) * 2015-10-23 2016-03-02 智雅科技温州有限公司 一种蜂鸣片自动化出料装置

Also Published As

Publication number Publication date
TW201214611A (en) 2012-04-01
JPWO2012039252A1 (ja) 2014-02-03

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