WO2012039106A1 - Appareil de traitement au laser - Google Patents

Appareil de traitement au laser Download PDF

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Publication number
WO2012039106A1
WO2012039106A1 PCT/JP2011/005072 JP2011005072W WO2012039106A1 WO 2012039106 A1 WO2012039106 A1 WO 2012039106A1 JP 2011005072 W JP2011005072 W JP 2011005072W WO 2012039106 A1 WO2012039106 A1 WO 2012039106A1
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WO
WIPO (PCT)
Prior art keywords
workpiece
mounting portion
processing
processing apparatus
laser processing
Prior art date
Application number
PCT/JP2011/005072
Other languages
English (en)
Japanese (ja)
Inventor
義典 佐々木
杉山　勤
学 西原
櫻井　通雄
一知 小寺
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2012512097A priority Critical patent/JP5500248B2/ja
Priority to CN201180004371.1A priority patent/CN102596484B/zh
Publication of WO2012039106A1 publication Critical patent/WO2012039106A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Definitions

  • the present invention relates to a laser processing apparatus that performs processing by irradiating a laser, and in particular, laser processing that provides both blind hole processing (non-through hole processing) and through hole processing (through hole processing) with a single processing apparatus. Relates to the device.
  • FIG. 9 is a side view seen from a cross-section showing the configuration of the mounting portion for mounting the workpiece of the first example of the laser processing apparatus according to the prior art.
  • the movable mounting unit 812 and the outer peripheral mounting unit 816 divided up and down are provided as mounting units.
  • the placement portion is shown in a side view seen from a cross section in which the structures of the movable placement portion 812 and the outer periphery placement portion 816 are understood.
  • An outer peripheral suction hole 814 is formed in the outer peripheral placement portion 816, and a placement portion suction hole 813 is formed in the divided movable placement portion 812.
  • the workpiece 811 is placed on the upper part of the divided movable placing part 812 and outer circumference placing part 816 and is sucked and held.
  • the divided movable mounting portions 812 have a structure that can be individually moved in the vertical direction, and are moved in the vertical direction by a lift drive unit such as an air cylinder.
  • the movable mounting portion 812 is in a state where all the suction portions are raised. Then, the workpiece 811 is sucked and fixed using the entire surface of the mounting portion, and processing is performed. At the time of through-hole processing, as shown in FIG. 9, laser processing is performed in a state where only the divided movable mounting portion 812 corresponding to the lower portion of the portion to be processed of the workpiece 811 is lowered.
  • the thickness of the plate-like workpiece 811 has become thinner and the diameter of the drilled holes has also become smaller.
  • a resin film having a thickness of about 40 ⁇ m to 120 ⁇ m and a metal foil having a thickness of several tens of ⁇ m are objects to be processed.
  • the laser processing is performed in a state where the suction portion corresponding to the lower portion of the portion to be processed of the workpiece 811 is lowered. Nevertheless, the workpiece is not held flat.
  • the mounting portion is not damaged by the laser, in the case of the thin sheet-like or foil-like workpiece 811 as described above, the deflection occurs so that the corresponding portion hangs down by its own weight. To do.
  • the flatness of the processed portion is deteriorated. The deterioration of the flatness causes a shift in the focal point of the laser and a shift in the processing position, and prevents the laser from being narrowed down to the minimum diameter, thereby hindering precise processing.
  • the processing is performed from the processing area at one end of the workpiece 811 and sequentially moved to the adjacent processing area.
  • the first movable mounting portion 812 at the end is lowered. If it does so, it will be hold
  • the reverse direction is sufficiently held by the mounting portion suction holes 813 of all the remaining movable mounting portions 812 other than the outer peripheral suction holes 814 described above.
  • the processing start point side is formed by the outer peripheral suction hole 814 and the placement portion suction hole 813 of the first movable placement portion 812. It will be held by adsorption.
  • the processing area corresponding to the position of the first movable mounting portion 812 since laser processing has already been completed, there are a large number of through holes, and the suction force by vacuuming is weak.
  • the deflection due to the own weight the deflection due to the deviation of the initial position is added, and the deviation of the position in the horizontal direction is caused from the side on the processing start point side.
  • the third movable mounting portion 812 adjacent to the second movable mounting portion 812 is lowered.
  • the movable mounting portion 812 adjacent to the movable mounting portion 812 that has been processed is lowered in accordance with the progress of the processing, but the deflection of the workpiece 811 is also propagated sequentially in accordance with that. Increase. Furthermore, the horizontal deviation increases as it propagates. When these deflections and deviations overlap and a positional deviation occurs on the order of several tens of ⁇ m, the precision of precision processing becomes poor. Therefore, there is a problem that it is difficult to realize precise drilling and high-precision laser machining cannot be performed.
  • the present invention provides a laser processing apparatus that realizes precise drilling and can perform highly accurate laser processing.
  • the laser processing apparatus of the present invention includes a processing head unit for laser processing a workpiece, an outer periphery mounting unit in which suction holes are formed, and a plurality of movable mounting units in which suction holes are formed and moved up and down. , A placement unit that holds the workpiece, an XY table that drives the placement unit in the X-axis direction and the Y-axis direction, and the outer circumferential placement unit, and at least one of the sides of the workpiece A work presser part that is parallel to the longitudinal direction of the movable mounting part and presses one side of the starting point side of the processing.
  • FIG. 1 is a front view showing a schematic configuration of a laser processing apparatus according to an embodiment of the present invention.
  • FIG. 2 is a perspective view showing a detailed configuration around the mounting portion of the laser processing apparatus according to the embodiment of the present invention.
  • FIG. 3 is a side view showing a detailed configuration of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention as seen from the cross section along line 3-3 in FIG.
  • FIG. 4 is a side view showing a detailed configuration and movement of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention, as seen from the section taken along line 3-3 in FIG.
  • FIG. 5 is a perspective view showing an example of the processing area order of the workpiece according to the embodiment of the present invention.
  • FIG. 6 is a side view seen from a cross section taken along line 3-3 showing a first operation state of the mounting portion according to the embodiment of the present invention.
  • FIG. 7 is a side view seen from a cross section taken along line 3-3 showing a second operation state of the mounting portion according to the embodiment of the present invention.
  • FIG. 8 is a side view seen from a cross section taken along line 3-3 showing a third operation state of the mounting portion according to the embodiment of the present invention.
  • FIG. 9 is the side view seen from the cross section which shows the structure of the mounting part of the laser processing apparatus based on a prior art.
  • the same components are denoted by the same reference numerals, and the description thereof may be omitted.
  • the X axis, the Y axis, and the Z axis shown in the drawings are directions orthogonal to each other.
  • the Z axis is the vertical direction corresponding to the top and bottom, and the coordinate axes in each figure are drawn so as to correspond to the directions of the respective fields of view.
  • FIG. 1 is a schematic configuration diagram of a laser processing apparatus 100 according to an example of an embodiment of the present invention.
  • a laser oscillator 102 emits a laser beam 103 by emitting a laser inside.
  • the direction of the emitted laser beam 103 is changed by the optical system 104, and adjustment of the laser density and beam diameter, shaping of the beam shape, and the like are performed.
  • the laser beam 103 that has passed through the optical system 104 is scanned and positioned by a galvano scanner 105 including an X mirror 106 for scanning in the X-axis direction and a Y mirror 107 for scanning in the Y-axis direction.
  • the laser processing apparatus 100 is configured such that the laser beam 103 positioned by the galvano scanner 105 is condensed by the f ⁇ lens 108 and irradiated to the processing point of the workpiece 111.
  • the galvano scanner 105 including the X mirror 106 and the Y mirror 107 and the f ⁇ lens 108 are provided in the processing head unit 109, and the processing head unit 109 is installed in the apparatus main body so as to be movable in the Z-axis direction.
  • a plurality of workpieces 111 are placed on a plurality of movable placement portions 112 and an outer periphery placement portion 114. Furthermore, two sides parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112 among the one side of the workpiece 111 are pressed by the pair of work pressing portions 121.
  • the movable mounting parts 112 are each supported by a pair of cylinders (not shown), and the cylinders are controlled by air pressure, and the individual movable mounting parts 112 can be moved up and down independently.
  • the machining table consists of two large blocks, an X table 131 and a Y table 133.
  • the X table 131 is configured to mount the movable mounting portion 112, the outer peripheral mounting portion 114, and a set of configurations associated therewith, and to move in the X-axis direction.
  • the X table driving unit 132 is driven to rotate the ball screw, and the X table 131 is slid along with the entire set mounted on the ball screw.
  • the Y table 133 is configured to further mount the X table 131 and a set of components mounted thereon and move in the Y-axis direction. For the movement in the Y axis direction, the Y table driving unit 134 is driven to rotate the ball screw, and the Y table 133 is slid along with the entire set mounted thereon.
  • the laser oscillator 102 the galvano scanner 105, a cylinder for moving up and down the movable mounting unit 112, an X table driving unit 132, a Y table driving unit 134, and the like are provided.
  • FIG. 2 is a perspective view showing a detailed configuration around the mounting portion of the laser processing apparatus according to the embodiment of the present invention.
  • a placement portion on which a workpiece (not shown) is placed and held is constituted by a plurality of movable placement portions 112 and an outer periphery placement portion 114.
  • the movable mounting portion 112 is provided with a plurality of mounting portion suction holes 113
  • the outer peripheral mounting portion 114 is also provided with an outer peripheral suction hole 115. The workpiece is sucked and held by evacuating from the placement portion suction hole 113 and the outer periphery suction hole 115.
  • a pair of work presser portions 121 are installed on two sides parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112.
  • the work presser 121 is attached so as to be rotatable by a fulcrum 124 provided on a member installed on the outer periphery mounting part 114, and is opened and closed by a presser part drive cylinder 123.
  • the work pressing part 121 is formed of a long plate-like metal body due to dimensional constraints in the Z-axis direction, and a clamp member 122 is provided on the surface of the work pressing part 121 facing the workpiece.
  • the clamp member 122 is formed of an organic elastic body such as urethane rubber or silicon rubber. Thereby, when it contacts with a workpiece, a pressing force is generated without being damaged, and displacement due to slippage of the workpiece can be prevented.
  • the shape of the clamp member 122 may be continuously swelled linearly as shown in the figure, or may be formed in the shape of dots that are discrete at predetermined intervals. If it is linear, it can be uniformly pressed against the side of the workpiece, and if it is dotted, it can be concentrated and pressed. For example, if the positions formed in the form of dots are arranged in the vicinity of the central portion of the adjacent outer periphery suction holes 115 in relation to the outer periphery suction holes 115, the holding force by suction and pressing can be effectively distributed.
  • the butterfly portion 126 is provided at the center of the long plate-like workpiece pressing portion 121.
  • the hinge portion 126 serves as a fulcrum for the rotation of the opening / closing operation of the work holding portion 121, and the holding portion drive cylinder 123 is provided at both long ends, so that the center portion of the work holding portion 121 is prevented from floating and the pressing force is more uniform. To play a role.
  • FIG. 3 is a side view seen from the cross section (taken along the line 3-3) showing the state of the placing part and the work holding part 121 when the workpiece 111 is mounted, as seen from the Y-axis direction.
  • FIG. 4 is a side view showing a detailed configuration and movement of the work pressing portion of the laser processing apparatus according to the embodiment of the present invention, as seen from the section taken along line 3-3 in FIG.
  • the mounting table In mounting the workpiece 111 on the apparatus, the mounting table is moved to the mounting position of the workpiece 111 by moving the processing table.
  • the mounting portion suction hole 113 and the outer peripheral suction hole 115 are evacuated. It stops and is not adsorbed, and all the movable mounting parts 112 are raised.
  • the work presser part 121 is opened by the presser part drive cylinder 123.
  • the presser part drive link 125 By the two fulcrums 124 and the presser part drive link 125, the vertical movement of the presser part drive cylinder 123 is converted into a rotational action of the work presser part 121 as indicated by an arrow.
  • the mounting portion suction hole 113 and the outer peripheral suction hole 115 are evacuated to start sucking and holding the lower surface of the workpiece 111.
  • the work holding unit 121 is driven from the open state shown in FIG. 3 to the closed state by the holding unit driving cylinder 123.
  • FIG. 4 Such a state is shown in FIG.
  • the workpiece is placed on the outer periphery mounting portion 114 in which the suction holes 115 are formed and the plurality of movable mounting portions 112 (112a, 112b, 112c, 112d) in which the suction holes 113 are formed.
  • 111 is held.
  • a side parallel to the longitudinal direction (Y-axis direction) of the movable mounting portion 112 among the sides of the workpiece 111 is pressed by the work pressing portion 121.
  • a clamp member 122 is provided at a portion in contact with the work piece 111 to generate a pressing force on the work piece 111 and prevent a slippage of the work piece 111.
  • the movement of the machining table is started so as to move the placement unit holding the workpiece 111 to the first machining area.
  • the movement of the machining head at the origin position to the focal position is started.
  • Only the movable mounting portion 112 on the lower surface of the first processing area is switched to blow (positive pressure) for evacuating the mounting portion suction hole 113 provided in the movable mounting portion 112, and the workpiece at the corresponding portion 111
  • the suction holding of the lower surface is stopped, and the movable mounting portion 112 is lowered.
  • FIG. 5 is a perspective view showing an example of the processing area order of the workpiece according to the embodiment of the present invention.
  • an area where numbers 1 to 48 are assigned to the workpiece 111 is a processing area 140.
  • Each processing area 140 is set within the scan range of the galvano scanner 105, and positioning of laser processing in the area is performed by controlling the galvano scanner 105. Note that the illustrated area is merely an example, and is not limited to this figure.
  • one side of the workpiece 111 denoted by reference numeral 142 in the drawing corresponds to the one side 142 parallel to the longitudinal direction of the movable mounting portion and on the machining start side.
  • FIG. 6 is a side view of a state in which holes are drilled in the first processing area 141 as seen from a cross section taken along line 3-3. Hole machining is performed by irradiating the laser beam 103 with the movable mounting portion 112a at a position corresponding to the first machining area 141 lowered.
  • One side (not shown) of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the processing start point side is sucked and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114.
  • one side of the starting point side is pressed by a work pressing portion 121 provided with a clamp member 122. This prevents the workpiece 111 from being bent and misaligned.
  • the processing table is moved in the Y direction in this embodiment to move to the second processing area.
  • the state of laser hole machining in the second machining area (for example, machining area 143) is also as shown in FIG. In this manner, the same operation is repeated until laser processing is completed for all areas where the movable mounting portion 112a is lowered (from the first processing area to the sixth processing area in FIG. 5).
  • the movable mounting part 112a holds the first processing area to the sixth processing area in FIG.
  • the processing table starts to move in the X direction.
  • the movable mounting portion 112a is raised while stopping the blow (positive pressure) of the movable mounting portion 112a that has already been lowered.
  • the placement portion suction hole 113 provided in the movable placement portion 112a is evacuated to suck and hold the workpiece 111 again.
  • the evacuation of the mounting portion suction hole 113 provided in the movable mounting portion 112b at the position corresponding to the next processing area (seventh processing area in FIG. 5) is switched to blow.
  • the movable mounting portion 112b at that location is lowered.
  • FIG. 7 is a side view seen from a cross section taken along line 3-3 showing a second operation state of the mounting portion according to the embodiment of the present invention.
  • FIG. 7 is a partial cross-sectional view of the state in which the processing area is laser drilled as viewed from the Y-axis direction. Hole machining is performed by irradiating the laser beam 103 with the movable mounting portion 112b at a position corresponding to the machining area lowered.
  • One side of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the side of the starting point of processing is sucked and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114 and provided with a clamp member 122.
  • the workpiece is held by the workpiece presser 121.
  • the suction by the movable mounting portion 112a is not strong compared with the suction of other movable mounting portions because the workpiece is drilled, but the deflection and misalignment of the workpiece are due to the configuration of the present invention. It is prevented.
  • the laser beam 103 is irradiated in a state where the movable mounting portion 112c at the position corresponding to the processing area is lowered to perform the hole processing.
  • One side of the workpiece 111 that is parallel to the longitudinal direction of the movable mounting portion and that is on the processing start side is adsorbed and held by the outer peripheral suction hole 115 provided in the outer peripheral mounting portion 114 and provided with a clamp member 122.
  • the workpiece holding part 121 holds the workpiece 111 to prevent the workpiece 111 from being bent and displaced.
  • the above operation is repeated to process all the predetermined areas of the workpiece 111.
  • the following operation is started.
  • the movement of the machining table is started in order to start the movement to the workpiece removal position.
  • the movement of the machining head 109 to the origin is started.
  • the movable mounting part 112 is raised, and when the raising is completed, the mounting part suction hole 113 provided in the movable mounting part 112 is evacuated.
  • the workpiece 111 is held again by suction.
  • the presser unit drive cylinder 123 is operated to open the work presser unit 121, and all the mounting units are moved. Vacuum suction of the suction holes 113 and all the outer peripheral suction holes 115 is stopped. Then, it is confirmed that the workpiece 111 is no longer held by suction, and the workpiece 111 take-out device (not shown) removes the workpiece 111 from the mounting portion and completes the laser hole machining of the workpiece. To do.
  • the laser processing apparatus 100 of the present invention is configured to include the processing head unit 109, the mounting unit, the XY table, and the work pressing unit 121.
  • the processing head unit 109 performs laser processing on the workpiece 111.
  • the mounting portion includes an outer peripheral mounting portion 114 in which the suction hole 115 is formed and a plurality of movable mounting portions 112 in which the suction hole 113 is formed and moves up and down, and holds the workpiece 111.
  • the XY table drives the placement unit in the X-axis direction and the Y-axis direction.
  • the work holding unit 121 is installed on the outer periphery mounting unit 114 and presses at least one side 142 of one side of the workpiece 111 that is parallel to at least the longitudinal direction of the movable mounting unit 112 and that is on the machining start side.
  • a configuration may be provided that includes a pair of work pressing portions 121 that are installed on the outer periphery mounting portion 114 and press at least two sides parallel to the longitudinal direction of the movable mounting portion 112 out of one side of the workpiece 111.
  • the organic elastic body may be formed in a linear shape. With this configuration, it is possible to uniformly press the side of the workpiece, and the holding force by suction and pressing can be effectively distributed.
  • the organic elastic body may be formed in the form of dots that are dispersed at predetermined intervals. With this configuration, it is possible to concentrate and press on the dot-like portion, and to effectively distribute the holding force due to suction and pressing.
  • a configuration may be provided in which a central portion of the work holding portion 121 includes a butterfly portion 126 serving as an opening / closing fulcrum 124 and a pressing portion that presses both ends of the work holding portion 121 toward the workpiece 111.
  • This configuration suppresses the floating of the center portion of the work pressing portion 121 and makes the pressing force more uniform.
  • a specific side of the workpiece 111 is further pressed by the work pressing portion 121 against the laser processing apparatus 100 that holds the workpiece 111 by suction of the plurality of movable mounting portions 112 that are moved up and down.
  • the idea of the invention to do is not easily conceivable.
  • the workpiece 111 is very thin and requires high accuracy for the processing.
  • the movable mounting portion 112 sequentially descends and rises from the processing start side. It can be conceived only when there is a recognition that the deflection and misalignment of the work piece propagates and increases sequentially.
  • the number of processing areas 140 may be determined by design requirements such as the size of the laser processing apparatus 100 and the shape of the workpiece, and is not limited to this example.
  • the laser processing apparatus can realize high processing accuracy by preventing deflection and misalignment of the workpiece in the hole drilling by the laser of the workpiece held by the mounting unit that is divided and moved up and down. It is useful in a laser processing apparatus that performs through-hole processing.

Abstract

La présente invention concerne un appareil de traitement au laser (100) doté de : une section de tête de traitement (109), qui traite au laser un sujet à traiter ; une section de mise en place, qui comprend une section de mise en place circonférentielle externe (114) comportant des orifices d'aspiration formés dedans, et une pluralité de sections de mise en place mobiles (112) comportant des orifices d'aspiration formés dedans, lesdites sections de mise en place mobiles se déplaçant vers le haut et vers le bas, et qui maintient le sujet à traiter ; des tables XY (131, 133), qui entraînent la section de mise en place dans la direction de l'axe X et la direction de l'axe Y ; et une section de maintien de travail (121), qui est disposée sur la section de mise en place circonférentielle externe, et qui maintient, parmi les côtés du sujet à traiter, au moins un côté parallèle à la direction longitudinale de la section de mise en place mobile, ledit côté se trouvant sur le côté du point de départ du traitement.
PCT/JP2011/005072 2010-09-24 2011-09-09 Appareil de traitement au laser WO2012039106A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012512097A JP5500248B2 (ja) 2010-09-24 2011-09-09 レーザ加工装置
CN201180004371.1A CN102596484B (zh) 2010-09-24 2011-09-09 激光加工装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-213506 2010-09-24
JP2010213506 2010-09-24

Publications (1)

Publication Number Publication Date
WO2012039106A1 true WO2012039106A1 (fr) 2012-03-29

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JP (1) JP5500248B2 (fr)
CN (1) CN102596484B (fr)
TW (1) TWI581887B (fr)
WO (1) WO2012039106A1 (fr)

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JP2019147166A (ja) * 2018-02-27 2019-09-05 株式会社リコー 光加工装置及び光加工物の生産方法
WO2020165140A1 (fr) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Dispositif et procédé pour la fabrication de tôles soudées au laser, en particulier pour la synchronisation de telles tôles ainsi qu'utilisation du dispositif et du procédé
WO2023119758A1 (fr) * 2021-12-23 2023-06-29 Ｔｏｗａ株式会社 Dispositif et procédé de traitement destinés à la fabrication d'un article traité

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JP6305212B2 (ja) * 2014-05-28 2018-04-04 株式会社ディスコ 研削装置及び矩形基板の研削方法
CN113275947B (zh) * 2021-05-24 2022-07-26 和县隆盛精密机械有限公司 一种数控机床用工件坐标智能测控工作台及其使用方法

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JP2019147166A (ja) * 2018-02-27 2019-09-05 株式会社リコー 光加工装置及び光加工物の生産方法
WO2020165140A1 (fr) * 2019-02-11 2020-08-20 Theodor Gräbener GmbH & Co. KG Dispositif et procédé pour la fabrication de tôles soudées au laser, en particulier pour la synchronisation de telles tôles ainsi qu'utilisation du dispositif et du procédé
WO2023119758A1 (fr) * 2021-12-23 2023-06-29 Ｔｏｗａ株式会社 Dispositif et procédé de traitement destinés à la fabrication d'un article traité

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JPWO2012039106A1 (ja) 2014-02-03
JP5500248B2 (ja) 2014-05-21

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