WO2012035721A1 - レーザ加工装置およびレーザ加工方法 - Google Patents

レーザ加工装置およびレーザ加工方法 Download PDF

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Publication number
WO2012035721A1
WO2012035721A1 PCT/JP2011/004977 JP2011004977W WO2012035721A1 WO 2012035721 A1 WO2012035721 A1 WO 2012035721A1 JP 2011004977 W JP2011004977 W JP 2011004977W WO 2012035721 A1 WO2012035721 A1 WO 2012035721A1
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Prior art keywords
workpiece
laser processing
processing
laser
movable mounting
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PCT/JP2011/004977
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English (en)
French (fr)
Japanese (ja)
Inventor
一知 小寺
杉山　勤
学 西原
義典 佐々木
櫻井　通雄
Original Assignee
パナソニック株式会社
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Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2012513394A priority Critical patent/JP5691004B2/ja
Priority to CN201180004593.3A priority patent/CN102639282B/zh
Publication of WO2012035721A1 publication Critical patent/WO2012035721A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head

Definitions

  • the present invention relates to a laser processing apparatus that performs processing by irradiating a workpiece with a laser, and more particularly to a laser processing apparatus that performs through-hole processing (through-hole processing).
  • FIG. 10 is a side view showing the configuration of a workpiece placement portion of a first example of a laser processing apparatus according to the prior art.
  • a workpiece 811 is placed on the top of the divided mounting portion 821.
  • the divided mounting portions 821 have a structure that can be individually moved in the vertical direction, and are moved up and down by an elevation driving unit (not shown) such as an air cylinder.
  • the placement unit 821 At the time of blind hole processing, in the placement unit 821, all the suction units are in a raised state. Then, the work 811 is fixed by suction and processed using the entire surface of the mounting portion 821. At the time of through-hole processing, as shown in FIG. 10, laser processing is performed in a state where only the divided mounting portion 821 corresponding to the lower part of the portion 812 to be processed of the workpiece 811 is lowered. .
  • FIG. 11 is a perspective view showing the configuration of a second example of the laser processing apparatus according to the prior art.
  • the chuck 902 holds a thin plate-shaped workpiece 901 formed of a soft member at two opposing sides.
  • a tensile device 903 applies a tensile force to the workpiece 901 held by the chuck 902.
  • the workpiece 901 is held by the chuck 902 and the tension device 903.
  • the moving device 904 moves the workpiece 901.
  • the dust collector 905 is provided on the back side of the surface irradiated with the laser light so as to cover the entire processing area, and has a stop device 906 for stopping the gas flow inside the dust collector 905.
  • the two holding devices 907 respectively hold the side of the workpiece 901 in the direction perpendicular to the side on which the tensile force by the pulling device 903 acts.
  • the adjusting device 908 moves one of the holding devices 907 in a direction perpendicular to the tensile force.
  • the workpiece 901 is pulled by the holding device 903 and the holding device 907 to hold the flat surface while applying a tensile force to the workpiece 901. Then, the workpiece 901 is moved to the processing area while being held by the pulling device 903 and the holding device 907. Thereby, it is possible to perform the laser processing while maintaining a flat surface without contacting the back surface of the through hole processing portion of the workpiece 901 with the mounting portion (see, for example, Patent Document 2).
  • a resin film having a thickness of about 100 ⁇ m and a metal foil having a thickness of several tens of ⁇ m are to be processed.
  • the mounting portion is not damaged by the laser, in the case of a thin sheet-like or foil-like workpiece as described above, a depression is generated so that the corresponding portion may sag by its own weight.
  • the flatness of the processed portion is deteriorated. Deterioration of the flatness causes deviation of the focus of the laser and deviation of the processing position, which hinders precise processing. That is, desired precision processing can not be performed.
  • a flat surface is to be held by pulling two opposing sides of the workpiece.
  • stretching of the material occurs by pulling.
  • the processing position of the workpiece shifts or wrinkles occur, and precise processing is difficult as in the first example.
  • the present invention provides a laser processing apparatus and a laser processing method capable of performing high-precision laser processing even with a sheet-like workpiece having a very thin thickness.
  • a laser processing apparatus includes a processing head unit for laser processing a workpiece, and a mounting unit having a plurality of divided movable mounting units that vertically move up and down to hold the workpiece.
  • the laser processing method of the present invention is a laser processing method for processing a workpiece using the above-described laser processing apparatus, and when moving a processing area of the workpiece with a processing table, the upper surface suction device Method of raising and lowering the laser processing apparatus.
  • the laser processing method of the present invention is a laser processing method for processing a workpiece using the above-described laser processing apparatus, and when moving the processing area of the workpiece with a processing table, a plurality of movable
  • the laser processing method is to perform laser processing in a state in which the upper surface suction device disposed at least in the advancing direction of the processing area is lowered until all the processing area in which one of the mounting parts is lowered is completely laser processed. .
  • the laser processing method of the present invention is a laser processing method for processing a workpiece using the above-described laser processing apparatus, and when moving the processing area of the workpiece with a processing table, a plurality of movable The laser is performed with the upper surface suction device arranged at least in the advancing direction of the processing area being lowered until the laser processing is all done up to the processing area one before the processing area where one of the mounting parts is descending
  • the processing area which performs processing and finally performs laser processing is a laser processing method which performs laser processing in the state which raised the upper surface adsorption
  • the vicinity of the processing area of the workpiece is held above the top surface suction device.
  • FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus according to an example of the first embodiment of the present invention.
  • FIG. 2 is a side view of the laser processing apparatus according to an example of the first embodiment of the present invention as viewed from the Y direction.
  • FIG. 3 is a side view of the laser processing apparatus according to an example of the first embodiment of the present invention as viewed from the X direction.
  • FIG. 4A is a side view showing an elevation state of the top adsorption device according to an example of Embodiment 1 of the present invention.
  • FIG. 4: B is a side view which shows the raising / lowering state of the upper surface adsorption
  • FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus according to an example of the first embodiment of the present invention.
  • FIG. 2 is a side view of the laser processing apparatus according to an example of the first embodiment of the present invention as viewed
  • FIG. 5A is a side view showing a detailed configuration of the top adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 5B is a side view showing the detailed configuration of the top adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 6A is a side view showing the details of the different configuration of the top adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 6B is a side view showing the details of the different configuration of the top adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 7A is a view showing the effect of upper surface adsorption of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 7A is a view showing the effect of upper surface adsorption of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 7B is a diagram showing the effect of upper surface adsorption of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • FIG. 8A is a layout diagram showing an example of setting of a processing area of a workpiece according to Embodiment 2 of the present invention.
  • FIG. 8B is a layout view showing an example of setting of a processing area of a workpiece according to Embodiment 2 of the present invention.
  • FIG. 9A is a side view showing the upper and lower surface adsorption devices according to an example of Embodiment 2 of the present invention in different elevation states.
  • FIG. 9B is a side view showing the upper and lower surface adsorption devices according to an example of the second embodiment of the present invention in different elevation states.
  • FIG. 9C is a side view showing different lifting and lowering states of the top adsorption device according to an example of Embodiment 2 of the present invention.
  • FIG. 10 is a side view showing the configuration of the mounting unit of the laser processing apparatus according to the prior art.
  • FIG. 11 is a perspective view showing the holding state of the workpiece of the laser processing apparatus according to the prior art.
  • FIG. 1 is a perspective view showing a schematic configuration of a laser processing apparatus 100 according to an example of the first embodiment of the present invention.
  • 2 is a side view of the laser processing apparatus 100 as viewed in the Y direction
  • FIG. 3 is a side view of the laser processing apparatus 100 as viewed in the X direction.
  • a laser is oscillated inside and a laser 102 is emitted.
  • the emitted laser 102 can change its traveling direction by the mirror 103.
  • a collimator lens 104 for adjusting the beam diameter of the laser 102 is disposed.
  • a mask 105 for shaping the beam shape of the laser 102 that has passed through the collimator lens 104 and an iris 106 for suppressing miscellaneous light of the laser 102 that has passed through the mask 105 are disposed.
  • the laser 102 which has passed through the iris 106 is processed by the galvano X mirror 109 for swinging in the X-axis direction and the galvano Y mirror 110 for swinging the laser 102 reflected by the galvano X mirror 109 in the Y-axis direction. It is positioned at a desired position on the surface 111. Furthermore, the laser processing apparatus 100 is configured such that the laser 102 reflected by the galvano Y mirror 110 is condensed by the f ⁇ lens 107 and irradiated to the processing point of the workpiece 111.
  • a controller 108 is provided to control the galvano X mirror 109, the galvano Y mirror 110, and the laser oscillator 101.
  • a plurality of workpieces 111 are placed on a plurality of movable mounting portions 121 and an outer peripheral mounting portion 123.
  • the mounting portion 120 is configured of the movable mounting portion 121 and the outer peripheral mounting portion 123.
  • the movable placement portion 121 is provided with a plurality of placement portion suction holes 122, and the outer circumference placement portion 123 is also provided with an outer circumference suction hole 124.
  • the workpiece 111 is suctioned and held by vacuum suction from the lower part of the mounting unit 120 by the mounting unit suction holes 122 and the outer circumference suction holes 124.
  • the movable mounting portions 121 are supported by a pair of movable mounting portion elevating cylinders 125, respectively.
  • the movable mounting unit elevating cylinder 125 uses an air cylinder controlled by air pressure, and can individually move the movable mounting units 121 of the plurality of movable mounting units 121 independently. it can.
  • a space between the movable mounting portion 121 for holding the workpiece 111 and the processing table 115 is a lower dust collecting device 112 as shown in FIG. It has the function of collecting dust generated in the lower part.
  • an upper dust collecting apparatus 130 is installed on the laser irradiation surface side above the workpiece 111.
  • the upper dust collecting apparatus 130 is provided so as to surround the irradiation range of the laser 102 controlled by the galvano X mirror 109 and the galvano Y mirror 110.
  • the upper dust collecting apparatus 130 sucks the internal air from the holes provided in a part of the upper dust collecting apparatus 130 to collect and discharge the machining waste generated on the upper part of the workpiece 111 at the time of the laser processing.
  • the upper dust collecting device 130 is provided with a pair of upper surface suction devices 131 and 132 and a top suction device elevating cylinder 133 for moving the upper surface suction devices 131 and 132 up and down.
  • the upper surface suction device lifting and lowering cylinder 133 is configured to be able to vertically move the respective upper surface suction devices 131 and 132 independently using an air cylinder.
  • the configuration of the laser processing apparatus 100 according to the present embodiment will be described in more detail with reference to FIGS. 2 and 3.
  • the processing table 115 is composed of two large blocks of a Y table 116 and an X table 118.
  • the Y table 116 is configured to place the movable mounting portion 121, the outer peripheral mounting portion 123, the lower dust collecting device 112, and a set of components attached thereto, and to move in the Y direction.
  • the movement in the Y direction is performed by rotating the ball screw by driving the Y-axis moving motor 117 and sliding the Y table 116 for every set placed thereon.
  • the X-table 118 further mounts the Y-table 116 and the configuration set placed thereon, and is configured to move in the X direction.
  • the movement in the X direction is performed by rotating the ball screw by driving the X-axis moving motor 119 and sliding the X-table 118 together with the set placed thereon.
  • the directions of the galvano X mirror 109, the galvano Y mirror 110, and the laser 102 that reflect the laser 102 and control the irradiation position are made perpendicular to the surface of the workpiece 111 and collected.
  • the f ⁇ lens 107 that emits light is installed in the processing head unit 135.
  • the processing head portion 135 is attached to the Z-slider 136, and the Z-slider 136 is movable in the Z direction, that is, in the vertical direction by driving the Z-axis moving motor 137.
  • the Z-slider 136 and the Z-axis movement motor 137 are installed on the main body frame 140.
  • the upper dust collecting device 130 is also fixed to the main body frame 140. Therefore, the positional relationship between the upper dust collecting apparatus 130 and the apparatus main body is fixed.
  • the upper surface adsorption device lifting and lowering cylinder 133 is fixed to the upper surface dust collecting device 130, and can control the air pressure to move the upper surface adsorption devices 131 and 132 up and down.
  • the upper surface adsorption devices 131 and 132 are configured to be able to adsorb the workpiece 111 from the laser irradiation surface side of the workpiece 111, that is, the upper surface.
  • suction holes are provided on the surface in contact with the workpiece 111, and the workpiece 111 is configured to be able to be sucked from the top by performing vacuum suction.
  • the driving unit 150 for vertically moving the upper surface suction devices 131 and 132 up and down includes the upper surface suction device elevating cylinder, the Z slider 136 and the Z axis moving motor 137.
  • the evacuation of the mounting portion adsorption holes 122 and the outer periphery adsorption holes 124 is stopped to prevent the adsorption, and the movable mounting portion 121 and the upper surface adsorption device 131 , Raise all 132.
  • the mounting unit 120 is moved to the mounting position of the workpiece.
  • the mounting portion suction holes 122 and the outer peripheral suction holes 124 are evacuated to hold the lower surface of the workpiece 111 by suction.
  • the movement of the processing table is started in order to move the mounting unit 120 holding the workpiece 111 to the first processing area.
  • the movement of the processing head 135 at the origin position to the focal position is started.
  • the processing head unit 135 moves only along the Z-axis direction. Only for the movable mounting portion 121 on the lower surface of the first processing area, the vacuuming of the mounting portion suction holes 122 provided on the movable mounting portion 121 is switched to blow, and The suction holding is stopped and the movable mounting portion 121 is lowered. Perform these operations in parallel.
  • Each processing area is set within the scan range of the galvano mirror (galvano X mirror 109 and galvano Y mirror 110), and the positioning of the laser processing in the area is performed by controlling the galvano mirror.
  • the upper surface suction devices 131 and 132 are lowered to move the workpiece 111 Adhere to the surface.
  • FIG. 4A and FIG. 4B are side views showing the elevation state of the upper surface adsorption device according to an example of Embodiment 1 of the present invention.
  • FIG. 5A and FIG. 5B are side views showing the detailed configuration of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • 6A and 6B are side views showing the details of different configurations of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • the state shown in FIG. 4A is the state in which the upper surface suction devices 131 and 132 are raised
  • the state shown in FIG. 4B is the state in which the upper surface suction devices 131 and 132 are lowered and in close contact with the surface of the workpiece 111.
  • FIG. 5A is a side view of a state in which the top adsorption devices 131 and 132 are lowered as viewed in the Y direction
  • FIG. 5B is a side view of the state in which the top adsorption devices 131 and 132 are lowered in the X direction.
  • a pair of upper surface adsorption device lifting and lowering cylinders 133 are fixed to the upper dust collecting device 130.
  • the upper surface adsorption device lifting and lowering cylinder 133 is constituted by an air cylinder, and by controlling the air pressure via the air tube 141, the upper surface adsorption devices 131 and 132 can be moved up and down.
  • the upper surface suction devices 131 and 132 are both lowered.
  • the upper surface adsorption devices 131 and 132 are provided with upper surface adsorption holes 142 so that the workpiece 111 can be adsorbed from the surface on the laser irradiation side of the workpiece 111, that is, the upper surface. After the upper surface adsorption devices 131 and 132 are lowered, the workpiece 111 is adsorbed from the upper surface by performing vacuum suction via the air tube 143.
  • suction apparatus 131,132 is provided in the perpendicular
  • the longitudinal direction of the upper surface suction devices 131 and 132 is the X axis direction
  • the longitudinal direction of the movable mounting portion 121 is the Y axis direction.
  • the size in the longitudinal direction of the upper surface suction devices 131 and 132 may be set to be slightly smaller than the width of one movable mounting portion 121. In this way, when the upper surface suction devices 131 and 132 are lowered, the workpiece 111 is not sandwiched between the movable mounting portion 121 and the upper surface suction devices 131 and 132 and deformed or damaged. The surface accuracy around the upper surface suction devices 131 and 132 on the upper surface of the workpiece 111 can be secured.
  • setting slightly small may be set in a range where the workpiece 111 is not damaged due to the driving accuracy of the laser processing apparatus 100 and the thickness and the variation of the workpiece 111.
  • the width of the movable mounting portion 121 is set to 50 mm
  • a range of 47 mm to 49 mm, in particular 48 mm may be set as a reference dimension.
  • suction apparatus 131,132 can also be set larger than the width
  • FIG. In this case, although it is necessary to raise the upper surface adsorption devices 131 and 132 every time the workpiece 111 moves, the upper surface adsorption devices 131 and 132 may be brought into contact with the workpiece 111 without precisely controlling the amount of descent. Lower it to start adsorption. Only in this way, it is possible to secure the surface accuracy around the upper surface suction devices 131 and 132 of the workpiece 111.
  • FIG. 7A and 7B are diagrams showing the effect of upper surface adsorption of the upper surface adsorption device according to an example of the first embodiment of the present invention.
  • the operation of the top adsorbers 131, 132 configured as in FIG. 5A, 5B or 6A, 6B is shown in FIG. 7A.
  • FIG. 7A shows the state of the workpiece 111 when the top adsorption devices 131 and 132 are not present.
  • the workpiece 111 is a sheet-like substrate having a thickness of 100 ⁇ m or less, in which a glass epoxy is sandwiched by a PET (polyethylene terephthalate) film.
  • the width of the movable mounting portion 121 is 50 mm
  • the amount of deformation is on the order of several tens of ⁇ m
  • the focal point shift in the Z-axis direction and the positions in the X-axis and Y-axis directions corresponding to this amount of deformation Deviation has a great effect on precise processing. That is, these focus shifts or misalignments hinder precise processing, resulting in processing defects.
  • the upper surface adsorption devices 131 and 132 adsorb the upper surface of the workpiece 111 in the vicinity of the processing area. Therefore, even if the movable mounting part 121 is absent in the said process area, a deformation
  • the galvano X mirror 109 and the galvano Y mirror 110 are controlled to start irradiation of the laser 102 at the hole processing position.
  • the evacuation of the upper surface adsorption holes 142 is stopped to stop the adsorption and holding of the workpiece 111.
  • the upper surface suction devices 131 and 132 are raised to return to the state shown in FIG. 4A.
  • the processing table 115 is moved in the Y direction in the present embodiment.
  • the procedure of a series of operations leading to the downward movement of the upper surface adsorption devices 131 and 132, adsorption, laser drilling, pause of adsorption, and the elevation of the upper surface adsorption devices 131 and 132 in the second processing area is as described above.
  • the process is repeated until all the processing area in which one movable mounting portion 121 is lowered has been subjected to the laser processing.
  • the vacuum suction of the upper surface suction holes 142 is stopped to hold the workpiece 111 by suction. Stop. Thereafter, the top adsorption devices 131 and 132 are raised to return to the state shown in FIG. 4A.
  • the following operation is started. First, movement of the processing table 115 in the X direction is started to move the mounting unit 120 to the next processing area.
  • the movable mounting portion 121 is raised while stopping the blow of the movable mounting portion 121 that has already been lowered.
  • the mounting portion suction holes 122 provided in the movable mounting portion 121 are evacuated to hold the workpiece 111 again by suction.
  • the evacuation of the mounting portion suction hole 122 provided in the movable mounting portion 121 at the position corresponding to the next processing area is switched to blow.
  • the movable mounting portion 121 at the relevant position is lowered. Perform these operations in parallel.
  • the upper surface suction devices 131 and 132 are lowered to be in close contact with the surface of the workpiece 111 and adsorption of the top surface of the workpiece 111 is started.
  • the galvano X mirror 109 and the galvano Y mirror 110 are controlled, and the irradiation of the laser 102 to the drilling position is started.
  • the above-described operation is repeated to process all of the predetermined processing area of the workpiece 111.
  • the evacuation of the upper surface adsorption holes 142 is stopped to stop the adsorption and holding of the workpiece 111.
  • the top adsorption devices 131 and 132 are raised to return to the state shown in FIG. 4A.
  • the following operation is started.
  • movement of the processing table 115 is started in order to start moving the workpiece 111 to the removal position.
  • the movement of the processing head unit 135 to the origin is started.
  • the movable mounting portion 121 is raised while stopping the blow of the movable mounting portion 121 that has already been lowered.
  • the mounting portion suction holes 122 provided in the movable mounting portion 121 are evacuated to hold the workpiece 111 again by suction. Perform these operations in parallel.
  • the laser processing apparatus 100 of the present invention includes the processing head unit 135, the placement unit 120, the processing table 115, the upper surface suction devices 131 and 132, and the drive unit 150.
  • the processing head unit 135 performs laser processing on the workpiece 111.
  • the placement unit 120 has a plurality of divided movable placement units 121 that move up and down and holds the workpiece 111.
  • the processing table 115 drives the placement unit 120 in the X direction and the Y direction.
  • the upper surface adsorption devices 131 and 132 are located above the workpiece 111 and adsorb the upper surface of the workpiece 111.
  • the drive unit 150 raises and lowers the upper surface suction devices 131 and 132 up and down.
  • a pair of upper surface suction devices 131 and 132 are provided, and are configured to be vertically driven to move up and down independently.
  • the longitudinal direction of the upper surface suction devices 131 and 132 is set to be perpendicular to the longitudinal direction of the movable mounting portion 121, and the size in the longitudinal direction of the upper surface suction devices 131 and 132 is the width of the movable mounting portion 121.
  • the configuration is set largely for
  • the upper surface suction devices 131 and 132 may be formed of an electrostatic chuck that sucks the workpiece 111 by applying a voltage.
  • suction holes are provided on the surfaces of the upper surface suction devices 131 and 132 in contact with the surface of the workpiece 111, and the workpiece 111 is adsorbed by the suctioned air pressure.
  • the movable mounting portion 121 at a position where the penetrated laser 102 can reach is positioned below the other mounting portions and removed from the focusing range of the laser 102.
  • the laser 102 is prevented from being damaged, and the other processing areas are held by suction.
  • the upper surface suction devices 131 and 132 are held upward in the vicinity of the processing area in which the movable mounting portion 121 is lowered. As a result, even with a very thin sheet-like workpiece 111 having a very small thickness, highly accurate laser processing with very low deflection can be performed.
  • the adsorption of the work piece 111 of the upper surface adsorption devices 131 and 132 is realized by evacuating, but can be realized by using different adsorption means.
  • an electrostatic chuck may be used.
  • the upper surface adsorption devices 131 and 132 are formed of a dielectric in which electrodes are embedded, and a voltage is applied to the electrodes, whereby a sheet as a workpiece can be adsorbed through the dielectric.
  • the dielectric any material having high withstand voltage and dielectric constant may be used.
  • ceramic materials such as silicon carbide, alumina, and aluminum nitride are excellent.
  • the electrostatic chuck has a response speed for adsorption / desorption that is significantly faster than adsorption by vacuum suction, and the overall processing time can be shortened by using the electrostatic chuck for the top surface adsorption devices 131 and 132.
  • the upper surface suction devices 131 and 132 are formed of an electrostatic chuck that sucks the workpiece 111 by applying a voltage.
  • the upper surface adsorption devices 131 and 132 may be formed of nitride film-treated stainless steel, and at least the surface in contact with the surface of the workpiece 111 may be polished.
  • the present embodiment is described using a diagram in which six movable mounting portions 121 are installed, the number of movable mounting portions 121 may be determined by design requirements such as the size of the laser processing apparatus 100. However, the present invention is not limited to this example.
  • the upper dust collecting device 130 is provided with a pair of upper surface suction devices 131 and 132 and a top suction device elevating cylinder 133 for moving the upper surface suction devices 131 and 132 up and down.
  • the upper surface suction device lifting cylinder 133 is configured to be able to move the upper surface suction devices 131 and 132 independently up and down by using an air cylinder.
  • FIG. 8A, 8B and 9A to 9C are layout diagrams showing an example of setting of a processing area of the workpiece 111 according to the second embodiment of the present invention.
  • FIG. 9A, FIG. 9B, and FIG. 9C are side views showing different lifting and lowering states of the top adsorption device according to one example of the second embodiment of the present invention.
  • FIGS. 8A and 8B show an example of allocation of the processing area of the workpiece 111, in which the numbers 1, 2,..., 48 are assigned in the order of processing. Although allocated in six rows in the Y direction, this corresponds to the number of divisions of the movable mounting portion 121.
  • the number of processing areas in the six rows and 48 is set for the convenience of description in the second embodiment, and is not limited to this number in actual processing.
  • the workpiece 111 is mounted on the apparatus, and the workpiece 111 is adsorbed and held, and the processing table 115 is moved. Only for the movable mounting portion 121 on the lower surface of the first processing area, the vacuum suction of the mounting portion suction hole 122 provided on the movable mounting portion 121 is switched to blow, and the suction of the lower surface of the workpiece 111 at the corresponding portion The operation of stopping the holding and lowering the movable mounting portion 121 is the same as that of the first embodiment described above.
  • FIG. 9A shows a state in which only the upper surface suction device 132 is in close contact with the surface of the workpiece 111. This corresponds to bringing only the upper surface suction device 132 on the side of the processing travel direction 144 into close contact with the workpiece 111.
  • the suction may be performed by vacuum suction via an air tube as in the first embodiment, or may be held by electrostatic force using an electrostatic chuck.
  • the upper surface adsorption device 132 adsorbs the upper surface of the workpiece 111 in the vicinity of the processing area, thereby preventing deformation of the workpiece 111 even in the absence of the movable mounting portion 121 in the processing area. can do.
  • the hole processing of the first processing area is the same as that of the first embodiment.
  • a different point is that even if all holes in the first processing area are completed, the adsorption holding of the workpiece 111 by the upper surface adsorption device 132 is not stopped and the upper surface adsorption device 132 is kept lowered. It is in.
  • the processing table 115 is moved in the Y direction in the present embodiment.
  • laser drilling is performed.
  • the upper surface suction device 132 is moved to the third processing area while being lowered. As described above, the process is repeated until all the area in which one movable mounting portion 121 is lowered is subjected to the laser processing.
  • the eighth processing area corresponds.
  • the following operation is started. First, movement of the processing table 115 in the X direction is started to move the mounting unit 120 to the next processing area. While stopping the blowout of the movable mounting portion 121 which has already been lowered, the movable mounting portion 121 is lifted, and when the lifting is completed, the mounting portion suction hole 122 provided in the movable mounting portion 121 is evacuated. , Adsorb and hold the workpiece 111 again. The evacuation of the mounting portion suction hole 122 provided in the movable mounting portion 121 at the position corresponding to the next processing area is switched to blow. When holding of the lower surface of the workpiece 111 at the portion is not performed, the movable mounting portion 121 at the portion is lowered. Perform these operations in parallel.
  • the same operation as in the first processing area is performed.
  • the above operation is repeated to process the entire predetermined processing area of the workpiece 111.
  • the adsorption holding of the workpiece 111 by the upper surface suction devices 131 and 132 is stopped. After that, both the top adsorption devices 131 and 132 are returned to the raised state.
  • the laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the above-described laser processing apparatus 100, and the processing area of the workpiece 111 is moved by the processing table 115. And raising and lowering the upper surface adsorption devices 131 and 132.
  • the laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the above-described laser processing apparatus 100, and the case where the processing area of the workpiece 111 is moved by the processing table 115 Think.
  • the upper surface suction devices 131 and 132 disposed at least in the advancing direction 144 of the processing area are lowered until all the processing area in which one of the plurality of movable mounting portions 121 is lowered has been laser processed. It is a laser processing method of performing laser processing in a fixed state.
  • the laser processing method of the present invention is a laser processing method for processing the workpiece 111 using the above-described laser processing apparatus 100, and considers a case where the processing area of the workpiece 111 is moved by the processing table .
  • the laser processing is performed in a state where the suction devices 131 and 132 are lowered.
  • the processing area which performs a laser processing at last is a laser processing method which performs a laser processing in the state which raised the upper surface adsorption
  • the upper surface suction is performed in the vicinity of the processing area where the movable mounting portion 121 is lowered while preventing damage by the penetrating laser 102. Either one of the devices 131 or 132 is held upwards. As a result, even with a sheet-like workpiece 111 having a very small thickness, high-precision processing with very low deflection can be performed.
  • one of the upper surface suction devices 131 and 132 is lowered to move the processing table 115 by moving the processing table 115 while holding the workpiece 111, thereby moving the processing area.
  • the upper surface suction devices 131 and 132 to be lowered are the top surface suction devices 131 and 132 in the traveling direction 144 of the processing area. Therefore, even if the upper surface suction devices 131 and 132 rub the surface of the workpiece 111, they do not damage the surface of the workpiece 111 because they are still unprocessed processing areas.
  • FIG. 1 As one example, stainless steel is used as a base material, and after reducing the surface roughness by buffing, a nitride film treatment is performed. Furthermore, the surface in contact with the surface of the workpiece 111 is buffed to mirror finish. By doing so, the surface rubbing the surface of the workpiece 111 can be made hard and slippery and not cause wear.
  • the example is repeated until all the processing areas in which one movable mounting portion 121 is lowered are completely laser-processed while the upper surface suction devices 131 and 132 on the side of the advancing direction 144 are lowered. .
  • the adsorption holding of the workpiece 111 of the descending upper surface suction devices 131 and 132 is stopped. Thereafter, the workpiece 111 is held between the upper surface adsorbing devices 131 and 132 and the outer peripheral placement portion 123 by raising the lowered upper surface adsorbing devices 131 and 132 and moving to the next processing area. Can be prevented from being deformed or scratched.
  • the outer circumferential placement portion 123 holds the workpiece 111, surface accuracy can be ensured even if the upper surface suction devices 131 and 132 are raised.
  • the laser processing method described in the first embodiment and the laser processing method described in the second embodiment may be selected may be changed depending on the material and thickness of the workpiece.
  • the two upper surface suction devices 131 and 132 can be independently controlled to move up and down, it is possible to select a laser processing method.
  • the processing order of the processing area may be changed to always lower the upper surface suction device in the traveling direction.
  • the laser processing apparatus can realize high processing accuracy by maintaining the flatness of the workpiece while preventing damage to the placement portion in hole processing by laser, and performs laser processing to perform through-hole processing It is useful in an apparatus etc.
  • Reference Signs List 100 laser processing apparatus 101 laser oscillator 102 laser 103 mirror 104 collimator lens 105 mask 106 iris 107 f ⁇ lens 108 controller 109 galvano X mirror 110 galvano Y mirror 111 workpiece 112 lower dust collector 113 air flow 115 processing table 116 Y table 117 Y-axis movement motor 118 X table 119 X-axis movement motor 120 placement unit 121 movable placement unit 122 placement unit suction hole 123 outer circumference placement unit 124 outer circumference adsorption hole 125 movable placement unit elevating cylinder 130 upper dust collecting device 131, 132 Top surface suction device 133 Top surface suction device elevating cylinder 135 Processing head part 136 Z slider 137 Z axis movement motor 140 Body frame 141 Air tube 14 Top suction hole 143 air tube 144 traveling direction 150 driver

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
PCT/JP2011/004977 2010-09-16 2011-09-06 レーザ加工装置およびレーザ加工方法 WO2012035721A1 (ja)

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CN104096979B (zh) * 2014-06-20 2016-01-20 西安交通大学 一种基于静电场辅助的激光加工工艺及其加工装置
DE102017213364A1 (de) * 2017-08-02 2019-02-07 Trumpf Werkzeugmaschinen Gmbh + Co. Kg Funktionseinheit für einen Bearbeitungskopf, Bearbeitungskopf und Funktionselement

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JPWO2012035721A1 (ja) 2014-01-20
CN102639282B (zh) 2015-01-07
TW201223678A (en) 2012-06-16
CN102639282A (zh) 2012-08-15
TWI495531B (zh) 2015-08-11

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