WO2012020968A3 - 오믹 전극 구조체를 갖는 반도체 발광 소자 및 그것을 제조하는 방법 - Google Patents
오믹 전극 구조체를 갖는 반도체 발광 소자 및 그것을 제조하는 방법 Download PDFInfo
- Publication number
- WO2012020968A3 WO2012020968A3 PCT/KR2011/005796 KR2011005796W WO2012020968A3 WO 2012020968 A3 WO2012020968 A3 WO 2012020968A3 KR 2011005796 W KR2011005796 W KR 2011005796W WO 2012020968 A3 WO2012020968 A3 WO 2012020968A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- ohmic electrode
- electrode structure
- emitting diode
- semiconductor light
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000009792 diffusion process Methods 0.000 abstract 4
- 230000002265 prevention Effects 0.000 abstract 4
- 230000006866 deterioration Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0016—Processes relating to electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/405—Reflective materials
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/816,793 US9196796B2 (en) | 2010-08-13 | 2011-08-09 | Semiconductor light emitting diode having ohmic electrode structure and method of manufacturing the same |
CN201180039486.4A CN103069587B (zh) | 2010-08-13 | 2011-08-09 | 具有欧姆电极结构体的半导体发光元件及制造此的方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2010-0078115 | 2010-08-13 | ||
KR1020100078115A KR101731056B1 (ko) | 2010-08-13 | 2010-08-13 | 오믹 전극 구조체를 갖는 반도체 발광 소자 및 그것을 제조하는 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012020968A2 WO2012020968A2 (ko) | 2012-02-16 |
WO2012020968A3 true WO2012020968A3 (ko) | 2012-05-18 |
Family
ID=45568032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/005796 WO2012020968A2 (ko) | 2010-08-13 | 2011-08-09 | 오믹 전극 구조체를 갖는 반도체 발광 소자 및 그것을 제조하는 방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9196796B2 (ko) |
KR (1) | KR101731056B1 (ko) |
CN (1) | CN103069587B (ko) |
WO (1) | WO2012020968A2 (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101317106B1 (ko) * | 2012-08-20 | 2013-10-11 | 전북대학교산학협력단 | 오믹 컨택 제조방법 및 이에 의하여 제조된 오믹 컨택 |
KR101535852B1 (ko) * | 2014-02-11 | 2015-07-13 | 포항공과대학교 산학협력단 | 나노구조체 전사를 이용한 발광다이오드 제조방법과 그 발광다이오드 |
WO2019133624A1 (en) * | 2017-12-27 | 2019-07-04 | Princeton Optronics, Inc. | Semiconductor devices and methods for producing the same |
US11195721B2 (en) * | 2018-01-16 | 2021-12-07 | Princeton Optronics, Inc. | Ohmic contacts and methods for manufacturing the same |
KR102051477B1 (ko) * | 2018-02-26 | 2019-12-04 | 주식회사 세미콘라이트 | 반도체 발광소자의 제조방법 |
CN112447889A (zh) * | 2020-11-27 | 2021-03-05 | 广东省科学院半导体研究所 | 一种led芯片及其制作方法 |
WO2023161632A1 (en) | 2022-02-24 | 2023-08-31 | Purelifi Limited | Optical wireless communication apparatus, system and method |
Citations (5)
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JPH09232632A (ja) * | 1995-12-22 | 1997-09-05 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP2005064485A (ja) * | 2003-07-25 | 2005-03-10 | Showa Denko Kk | 化合物半導体発光素子およびその製造方法 |
KR100551364B1 (ko) * | 1993-04-28 | 2006-02-09 | 니치아 카가쿠 고교 가부시키가이샤 | 질화갈륨계 화합물 반도체 발광소자 및 그 전극형성방법 |
KR100849737B1 (ko) * | 2007-07-06 | 2008-08-01 | (주)더리즈 | 발광 다이오드 소자와 그 제조 방법 |
KR20090115322A (ko) * | 2008-05-02 | 2009-11-05 | 송준오 | 그룹 3족 질화물계 반도체 소자 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4024994B2 (ja) | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
TW488088B (en) * | 2001-01-19 | 2002-05-21 | South Epitaxy Corp | Light emitting diode structure |
KR100550735B1 (ko) * | 2002-11-16 | 2006-02-08 | 엘지이노텍 주식회사 | P형 질화갈륨계 화합물 반도체의 전극 구조 및 전극구조의 형성 방법 |
AU2003301057A1 (en) * | 2002-12-20 | 2004-07-22 | Cree, Inc. | Methods of forming semiconductor mesa structures including self-aligned contact layers and related devices |
KR100585919B1 (ko) | 2004-01-15 | 2006-06-01 | 학교법인 포항공과대학교 | 질화갈륨계 ⅲⅴ족 화합물 반도체 소자 및 그 제조방법 |
US7525122B2 (en) * | 2005-06-29 | 2009-04-28 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
US8766448B2 (en) * | 2007-06-25 | 2014-07-01 | Sensor Electronic Technology, Inc. | Chromium/Titanium/Aluminum-based semiconductor device contact |
JP5401802B2 (ja) * | 2008-02-22 | 2014-01-29 | 日本電気株式会社 | 窒化物半導体装置のオーム性電極 |
KR101459770B1 (ko) * | 2008-05-02 | 2014-11-12 | 엘지이노텍 주식회사 | 그룹 3족 질화물계 반도체 소자 |
JP5190411B2 (ja) * | 2009-05-14 | 2013-04-24 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光装置の製造方法 |
WO2013126828A1 (en) * | 2012-02-23 | 2013-08-29 | Sensor Electronic Technology, Inc. | Ohmic contact to semiconductor |
US8916871B2 (en) * | 2012-09-12 | 2014-12-23 | Avogy, Inc. | Bondable top metal contacts for gallium nitride power devices |
-
2010
- 2010-08-13 KR KR1020100078115A patent/KR101731056B1/ko active IP Right Grant
-
2011
- 2011-08-09 CN CN201180039486.4A patent/CN103069587B/zh active Active
- 2011-08-09 US US13/816,793 patent/US9196796B2/en active Active
- 2011-08-09 WO PCT/KR2011/005796 patent/WO2012020968A2/ko active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100551364B1 (ko) * | 1993-04-28 | 2006-02-09 | 니치아 카가쿠 고교 가부시키가이샤 | 질화갈륨계 화합물 반도체 발광소자 및 그 전극형성방법 |
JPH09232632A (ja) * | 1995-12-22 | 1997-09-05 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP2005064485A (ja) * | 2003-07-25 | 2005-03-10 | Showa Denko Kk | 化合物半導体発光素子およびその製造方法 |
KR100849737B1 (ko) * | 2007-07-06 | 2008-08-01 | (주)더리즈 | 발광 다이오드 소자와 그 제조 방법 |
KR20090115322A (ko) * | 2008-05-02 | 2009-11-05 | 송준오 | 그룹 3족 질화물계 반도체 소자 |
Also Published As
Publication number | Publication date |
---|---|
KR20120015733A (ko) | 2012-02-22 |
WO2012020968A2 (ko) | 2012-02-16 |
KR101731056B1 (ko) | 2017-04-27 |
US20130221324A1 (en) | 2013-08-29 |
CN103069587B (zh) | 2016-09-07 |
CN103069587A (zh) | 2013-04-24 |
US9196796B2 (en) | 2015-11-24 |
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