WO2012019335A1 - 应用于化学机械抛光设备中的硅片定位装载装置 - Google Patents

应用于化学机械抛光设备中的硅片定位装载装置 Download PDF

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Publication number
WO2012019335A1
WO2012019335A1 PCT/CN2010/001805 CN2010001805W WO2012019335A1 WO 2012019335 A1 WO2012019335 A1 WO 2012019335A1 CN 2010001805 W CN2010001805 W CN 2010001805W WO 2012019335 A1 WO2012019335 A1 WO 2012019335A1
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WO
WIPO (PCT)
Prior art keywords
wafer
loading
chassis
positioning
silicon wafer
Prior art date
Application number
PCT/CN2010/001805
Other languages
English (en)
French (fr)
Inventor
高文泉
陈波
王伟
李久芳
Original Assignee
中国电子科技集团公司第四十五研究所
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Application filed by 中国电子科技集团公司第四十五研究所 filed Critical 中国电子科技集团公司第四十五研究所
Priority to CA2806152A priority Critical patent/CA2806152A1/en
Publication of WO2012019335A1 publication Critical patent/WO2012019335A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the present invention relates to the field of silicon wafer chemical mechanical polishing (CMP) equipment and wafer positioning and loading devices.
  • CMP chemical mechanical polishing
  • wafer positioning and loading In the production of integrated circuits, most of the processes involve the process of wafer positioning and loading.
  • the effect of wafer positioning loading has an important impact on wafer processing. Improper handling may result in wafer scrapping or manufacturing.
  • the device performance is poor, stability and reliability are poor. Therefore, the development of a high positioning accuracy and high efficiency wafer positioning loading method is of great significance for both wafer processing and semiconductor device production. Because wafer positioning loading is the most important and most frequent step in semiconductor device manufacturing, and its efficiency will directly affect the yield, performance and reliability of the device, research on wafer positioning and loading technology has been continuously Conducted.
  • CMP Chemical mechanical polishing
  • the wafer positioning and loading device is an important component in chemical mechanical polishing (CMP) equipment.
  • the wafer loading device plays the role of positioning the silicon wafer and accurately transporting the silicon wafer into the carrier (polishing head). Prepare for polishing.
  • the main feature of the silicon wafer loading device is that the silicon wafer is directly loaded by the vacuum adsorption or water suspension of the carrier.
  • These methods also bring some disadvantages when implementing the loading, such as directly controlling the carrier.
  • Vacuum adsorption of silicon wafers is very difficult. A huge system is likely to break up the silicon wafer.
  • When loading a silicon wafer with a relatively large diameter it is necessary to simultaneously use a plurality of injectors to suspend the silicon wafer, which brings about adjustment of each injection.
  • the difficulty of water pressure is also a waste of deionized water in the process of loading, which increases the cost. Therefore, in order to smoothly load the wafer into the carrier and improve the loading efficiency of the wafer, more advanced wafer loading technology is urgently needed.
  • the object of the present invention is to provide a wafer positioning and loading device applied in a chemical mechanical polishing device, which can not only accurately position the silicon wafer and transport it into the carrier for processing; but also has a simple structure and accurate positioning.
  • the utility model has the advantages of safe loading, convenient operation and reliable performance, which is beneficial to realize automatic loading of the silicon wafer and improve the positioning loading and processing efficiency of the silicon wafer. It is especially suitable for wafer loading in chemical mechanical polishing equipment, and can also be applied to wafer loading in various processes of transistor and integrated circuit production.
  • a silicon wafer positioning and loading device applied in a chemical mechanical polishing device, characterized in that it has a substrate, and the substrate is connected to the upper loading guide ring through a strut; A space for inserting the silicon wafer is disposed between the ring and the substrate; a fixing portion of the lifting drive mechanism is mounted on the substrate, and a telescopic portion on the lifting drive mechanism is fixedly coupled to the upper wafer holder; the wafer holder and the wafer guiding ring outside thereof are connected The wafer holder and the wafer guiding ring together form a recess for receiving the silicon wafer from the robot; the wafer holder and the wafer guiding ring are located at a lower middle portion of the loading guide ring; the loading guide ring is provided with a wafer carrier docking guiding mechanism, and the silicon wafer
  • the top guiding mechanism; the lower part of the substrate or the lifting drive mechanism is provided with an automatic displacement adjusting mechanism and an automatic resetting
  • the automatic displacement adjustment mechanism enables automatic adjustment of the displacement of the entire wafer positioning loading device when the alignment is aligned in the X and Y directions.
  • the automatic reset mechanism can automatically return to the original position after the automatic adjustment of the displacement of the entire wafer positioning and loading device; the next loading cycle is to be performed.
  • connection of the wafer holder to the wafer guide ring on the outside thereof is preferably a flexible connection having a certain elastic space.
  • One has a buffering effect, and the second is more convenient to continue to rise and slowly dock, and the safety is higher.
  • connection between the wafer holder and the outer wafer guiding ring is a flexible connecting structure having a certain elastic space: the wafer holder passes through the middle of the wafer guiding ring, and the wafer holder passes at least the flange structure thereon The three tension springs are connected to the spring springs on the wafer guide ring.
  • the docking guide mechanism of the silicon wafer carrying device provided on the loading guide ring is preferably rounded and chamfered, and the structure is simple and reliable. It can also have at least 3 sliding surface rail structures; or an outer chamfered joint or the like.
  • the silicon wafer top guiding mechanism is better in round table chamfering, and the structure is simple and reliable. It is also possible to have at least three sliding rail type structures and the like.
  • the lifting drive mechanism may be a cylinder piston type lifting drive mechanism, and the upper end of the piston rod is connected with the upper wafer clip; the outer surface of the piston rod is provided with a telescopic protective cover.
  • the telescopic guard protects the lift drive from contaminants such as water and polishing fluid.
  • the photosensor on the outer side wall surface of the wafer guiding ring is provided with a photoelectric sensor for confirming whether the silicon wafer is positioned, which can facilitate automatic control of the circuit.
  • the automatic displacement adjusting mechanism may be an X, Y two-dimensional displacement mechanism, and the structure thereof comprises: three stacked chassis: a chassis 1, a chassis 2 and a chassis 3; between the chassis 1 and the chassis 2 and at the chassis 2 (Linear rail means perpendicular to each other to permit alignment adjustment of the positioning loading device in the X and Y directions and each pair are respectively mounted between the chassis 3 and each pair enables the loading device to return to the original after loading a biasing return spring at a central position; two ends of the pair of bias return springs are respectively connected to the upper and lower chassis, and a plane formed by the two springs of each pair of bias return springs is parallel to the pair of bias return springs The running direction of the linear guide unit.
  • the linear guide device allows the loading device as a whole to achieve automatic adjustment of the steering alignment displacement in the X and Y directions.
  • the biased return spring allows the loading device to return to its original center position after loading.
  • the biased return spring and linear guide arrangement together allow for a certain amount of misalignment between the loading device and the carrier and between the loading device and the robot.
  • the two springs of each pair of bias return springs are assembled in a V shape. It can also be multiple, non-V-shaped.
  • the X, Y two-dimensional displacement mechanism can have a bracket that supports the entire wafer positioning loading device and can adjust the flatness of the entire device such that its axis is parallel to the carrier axis.
  • the structure of the X, Y two-dimensional displacement mechanism may also be a rocker, a double-slide beam type, a moving block type position adjusting mechanism, or the like; or other automatic displacement adjusting mechanism.
  • the automatic reset mechanism can be a corresponding offset return spring having a different number and arrangement than the above. It is only necessary to reset the automatic shift at the time of alignment.
  • the invention has the following outstanding beneficial effects: Compared with the prior art, it overcomes the defects of inaccurate positioning, poor precision, poor safety, low loading efficiency, etc., and the long-standing existence in the prior art is well solved.
  • the problem that has not been solved the device can not only realize the accurate positioning of the silicon wafer and transport it into the carrier; but also has the advantages of simple structure, accurate positioning, safe loading, convenient operation, reliable performance, and favorable realization of the silicon wafer.
  • Automated loading increases the positioning and processing efficiency of the wafer. It is especially suitable for wafer loading in chemical mechanical polishing equipment, and can also be applied to wafer loading in various processes of transistor and integrated circuit production.
  • the cylinder lifting method and the mechanical self-adjusting positioning structure can conveniently realize the accurate positioning and reliable loading of the silicon wafer, so that the silicon wafer can obtain high accuracy and high efficiency loading effect.
  • the invention is a new structure different from the prior art, and the various technical structures are provided with respective structural advantages, and the invention itself has the advantages of simple structure and convenient assembly and adjustment in addition to the advantages of various technical structures.
  • the overall advantages of positioning and loading are accurate and reliable. Not only can the efficiency of wafer loading be greatly improved, but also a better polishing effect can be obtained. It is a good wafer loading device that can be applied to 300mm silicon wafer chemical mechanical polishing equipment. Using this technology, when the wafer is loaded and loaded for polishing, very accurate wafer positioning and high loading efficiency can be obtained.
  • Figure 1 is a schematic perspective view of a preferred embodiment of the present invention.
  • Fig. 2 is a perspective view showing the structure of the lower portion 1 of Fig. 1.
  • FIG. 3 is a perspective view of the wafer holder assembly 204 of FIG. 1.
  • Figure 4 is a partial cross-sectional view showing the position of the elastic member 404 of Figure 3.
  • Fig. 5 is a perspective view showing the loading guide ring 302 and the strut 301 of Fig. 1.
  • Figure 6 is a partial cross-sectional view of the assembly center axis of Figure 1.
  • Fig. 7 is a block diagram showing the working process of the wafer positioning and loading in conjunction with the carrying device of Fig. 1.
  • the silicon wafer positioning and loading device used in the chemical mechanical polishing apparatus has a substrate 203, and the substrate 203 is connected to the upper loading guide ring 302 through the support rod 301; the loading guide ring 302 and the substrate 203 are interposed.
  • the fixing portion of the lifting drive mechanism 201 is mounted on the substrate 203, and the telescopic portion on the upper and lower driving mechanism 201 is fixedly coupled to the upper wafer holder 401; the wafer holder 401 and the wafer guiding ring 402 on the outer surface thereof
  • the wafer holder 401 and the wafer guiding ring 402 together form a recess for receiving the silicon wafer from the robot; the wafer holder 401 and the wafer guiding ring 402 are located at the lower middle portion of the loading guide ring 302; and the loading guide ring 302 is provided with a wafer carrier
  • the docking guide mechanism and the silicon wafer top guiding mechanism; the fixing portion of the substrate 203 or the lifting drive mechanism 201 is connected to the lower position adjusting mechanism.
  • the connection of the wafer holder 401 and the wafer guiding ring 402 outside thereof is a flexible connection having a certain elastic space.
  • the flexible connecting structure having a certain elastic space is: the wafer holder 401 passes through the middle of the wafer guiding ring 402, and the wafer holder 401 is pulled by the four tension springs 407 and the wafer guiding ring 402 through the flange-type overlapping structure thereon.
  • the spring seat 406 is connected.
  • the convenient wafer carrier docking guide mechanism provided on the loading guide ring 302 is chamfered 501 for rounding.
  • the wafer top guiding mechanism is a round table chamfer 504.
  • the lifting drive mechanism 201 is a cylinder piston type lifting drive mechanism.
  • the upper end of the piston rod is fixedly connected with the upper wafer holder 401, and the telescopic shield 202 is disposed outside the piston rod.
  • a photoelectric sensor 405 for confirming whether the silicon wafer is positioned is provided on the outer side wall surface of the wafer guiding ring 402, a photoelectric sensor 405 for confirming whether the silicon wafer is positioned is provided;
  • the automatic displacement adjusting mechanism is an X, Y two-dimensional displacement mechanism, and the structure is: comprising three stacked chassis: chassis 103, chassis Two 104 and a chassis three 105; between the chassis 103 and the chassis two 104 and between the chassis two 104 and the chassis three 105 are respectively mounted perpendicular to each other to allow alignment of the positioning loading device in the X and Y directions
  • the adjusted linear guide device 101 and each pair of bias return springs 102 capable of returning the loading device to the original center position after loading; the two ends of the pair of
  • the bracket 1 can also be divided into a lower portion including a bracket 4, a position adjustment function, an intermediate portion 2 for achieving a lifting action, and an upper portion 3 for achieving a positioning function, and the bracket 4 is mounted on a main body portion of the silicon wafer chemical mechanical polishing apparatus.
  • the lower portion 1, the intermediate portion 2 and the upper portion 3 are sequentially connected, and the lower portion 1 is mounted on the bracket 4.
  • the lower portion 1 comprises three chassis in a superimposed manner: a chassis 103, a chassis 2 104 and a chassis 3 105, which are mounted between the chassis 103 and the chassis 2 104 and between the chassis 2 104 and the chassis 3 105, respectively.
  • a vertical linear guide device 101 and a pair of offset return springs 102 are mounted between the chassis 103 and the chassis 2 104 and between the chassis 2 104 and the chassis 3 105, respectively.
  • the two ends of the pair of bias return springs 102 are respectively connected to the upper and lower chassis through a cylindrical pin and a spring seat, and are assembled in a V shape, and each pair is biased and reset.
  • the plane formed by the two springs in the spring is parallel to the running direction of the linear guide device corresponding to the pair of biased return springs.
  • a protective cover is provided on the three chassis covers.
  • the linear guide device 101 allows for alignment adjustment of the locating loading device in the X and Y directions, while the biasing return spring 102 enables the loading device to return to its original center position after loading.
  • the lower portion 1 further includes a limit adjustment mechanism 106 for adjusting the linear guide device 101.
  • X, Y linear guides that are perpendicular to each other are also commercially available.
  • the intermediate portion 2 includes a lifting drive mechanism, that is, a lifting cylinder 201, a substrate 203, and a wafer holder assembly 204.
  • the wafer holder assembly 204 is located between the loading guide ring 302 and the substrate 203.
  • the lifting cylinder 201 is connected to the wafer holder assembly 204 through the substrate 203, and the cylinder is lifted.
  • the lower flange of 201 is fixedly coupled to the chassis three 105 in the lower portion 1;
  • the wafer holder assembly 204 includes a wafer holder 401 and a wafer guide ring 402, the wafer holder 401 is located within the wafer guide ring 402, the wafer holder 401 and the wafer guide ring 402 is a flexible connection having a certain elastic space.
  • the wafer holder 401 and the wafer guiding ring 402 are formed together to facilitate receiving a recess of the silicon wafer from the robot. On the outer side wall surface of the wafer guiding ring (402), it is provided to confirm whether the silicon wafer is positioned. Photoelectric sensor (405).
  • the upper flange of the lift cylinder 201 is mounted on a base plate 203 that connects the intermediate portion 2 and the upper portion 3 together, and the piston rod of the lift cylinder 201 is fixedly coupled to the wafer holder 401 through the substrate 203.
  • the intermediate portion 2 should also include a shield 202 disposed outside of the lift drive mechanism 201, which in conjunction with the overall mounting of the positioning loading device can protect the lower portion of the lift cylinder 201 from contaminants such as water and polishing fluid.
  • a lift cylinder anti-sheath 403 is also provided at the center of the wafer holder 401 to protect the piston rod of the lift cylinder 201.
  • the flexible connection structure of the wafer holder 401 and the wafer guiding ring 402 is: the wafer holder 401 and the wafer guiding ring 402 are connected together by an elastic member 404, and the elastic members 404 are disposed at least three and uniformly distributed on the wafer.
  • the elastic member 404 is composed of a spring seat 406 disposed on the wafer guiding ring 402, and a tension spring 407 which is respectively connected to the spring seat 406 and the wafer holder 401, and the tension spring 407 is a wafer.
  • the clip 401 and the wafer guide ring 402 are pressed together.
  • the upper portion 3 includes a loading guide ring 302 and a strut 301.
  • the loading guide ring 302 is divided into an outer ring portion 503 and an inner ring portion 502, and the inner ring portion 502 is disposed in the loading guide ring 302.
  • an outer ring portion 503 that fits the structure of the carrier in the loading guide ring 302 is provided with a rounded table chamfer 501 along the inner edge surface, at the loading guide ring 302
  • the inner ring portion 502 is provided with a round table chamfer 504 at the edge that allows for a certain amount of misalignment between the outer edge of the wafer holder 401, enabling accurate positioning between the wafer and the carrier during cylinder lifting.
  • the loading guide ring 302 is coupled to the substrate 203 by at least three struts 301 disposed at the outer ring edge of the loading guide ring 302.
  • the lifting circuit control can be a manual or automatic control structure; the control circuit can be designed and implemented by a general technician (omitted).
  • the silicon wafer carrying device to be combined with the present invention has a positioning structure coupled therewith, a silicon wafer adsorption structure, and the like.
  • the working process of this embodiment is (refer to FIG. 7): the linear rail device 101 and the bias return spring 102 in the position adjusting device 1 can be adjusted first, so that the wafer positioning loading device is substantially below the carrier.
  • the position if the limit adjustment mechanism 106 is better, the guide rail can be slid in a suitable more accurate range).
  • the robot removes the wafer to be polished from the storage case and places it on the wafer holder assembly 204 between the loading guide ring 302 and the substrate 203.
  • the wafer is in contact with the wafer holder assembly 204 through the edge and is well positioned within the wafer holder assembly 204.
  • the edge of the silicon wafer is in contact with the wafer holder assembly to achieve a pre-loading positioning function. Due to the flexible connection, the wafer holder can continue to move a distance when the wafer guiding ring stops moving.
  • the wafer holder and wafer guide ring are constructed such that the wafer contacts the wafer holder only at the edge of the wafer.
  • the substrate can function to support the loading guide ring, the carrier, and to remove accumulated liquid.
  • the lift drive mechanism retracts the wafer clamp assembly after lifting the wafer into the carrier.
  • the upper portion includes a loading guide ring, a strut, for positioning the carrier loading position.
  • the loading guide ring has a chamfer along the inner edge surface that cooperates with the chamfer of the retaining ring in the carrier to provide an amount of compensation for misalignment between the carrier and the loading device.
  • the carrier is located inside the loading guide ring to facilitate picking up the wafer from the loading device, and the inner protruding step portion of the loading guide ring defines the loading position of the carrier.
  • the alignment between the silicon wafer and the carrier is realized to facilitate the smooth adsorption of the silicon wafer in the carrier.
  • the three struts located between the loading guide ring and the base plate are mainly used to support the loading guide ring and the carrier during loading, and have a simple structure and convenient installation.
  • the carrier begins to descend and is positioned inside the loading guide ring 302 in the positioning loading device.
  • the lift cylinder 201 mounted in the position adjustment device 1 lifts the wafer holder assembly 204 up with the wafer until the wafer enters the carrier recess, at which time the carrier is vacuumed to hold the wafer therein for polishing.
  • the lifting cylinder 201 lowers the wafer holder assembly 204 to the initial position to receive the next silicon wafer to be polished while adsorbing the wafer carrier. Leaving the loading guide ring 302 upwards and moving up to the polishing table for polishing, thus completing a complete process of wafer positioning loading, the efficiency of wafer positioning and loading is significantly improved.
  • Loading devices that are often exposed to chemical agents are typically fabricated from corrosion-resistant materials such as engineering plastics, stainless steel, aluminum, and other related corrosion-resistant materials.

Description

说 明 书 应用于化学机械抛光设备中的硅片定位装载装置 技术领域
本发明涉及硅片化学机械抛光 （CMP) 设备及硅片定位装载装置技 术领域。
背景技术
在集成电路生产中， 绝大多数工序都会涉及到晶圆定位装载这一环 节， 晶圆定位装载效果的好坏对晶圆加工有重要的影响， 处理不当， 可 能使晶圆报废， 或者制造出来的器件性能低劣， 稳定性和可靠性很差。 因此研制出高定位精度、 高效的晶圆定位装载方法， 不管是对于从事晶 圆加工， 还是对于从事半导体器件生产来说都有着重要的意义。 正是由 于晶圆定位装载是半导体器件制造中最重要最频繁的步骤， 而且其效率 将直接影响到器件的成品率、 性能和可靠性， 所以国内外对晶圆定位装 载工艺的研究一直在不断地进行。
化学机械抛光 (CMP)是目前在硅片表面实现全局平坦化的唯一的方 法。 在化学机械抛光过程中， 硅片定位装载装置是化学机械抛光 (CMP) 设备中的重要部件， 硅片装载装置起着定位硅片和将硅片准确的运送到 承载器 (抛光头)内以备抛光的作用。 随着大规模集成电路的发展， 硅片尺 寸的不断增大， 集成度的不断提高等， 对硅片抛光片的表面质量要求也 越来越严格。
在目前的化学机械抛光设备中， 硅片装载装置主要特点是直接采用 承载器真空吸附或水悬浮的方式装载硅片， 这些方式在实现装片的同时 也带来一些弊端， 比如直接控制承载器真空吸附硅片很困难， 庞大的系 统很有可能将硅片弄碎； 当装载直径比较大的硅片时， 必须同时采用多 个喷射器对硅片进行水悬浮， 这就带来调节各喷射器水压的难度， 另外 在装片过程中也浪费了大量的去离子水， 增加了成本。 因此为了顺利的 将硅片装载到承载器内并提高硅片装载效率急需更先进的硅片装载技 术。
发明内容 本发明的目的就在于提供一种应用于化学机械抛光设备中的硅片定 位装载装置， 它不仅能实现硅片的准确定位并将其运送到承载器内以便 加工； 而且其结构简单、 定位准确、 装载安全、 操作方便、 性能可靠， 有利于实现硅片的自动化装载， 提高硅片的定位装载和加工效率。 特别 适用于化学机械抛光设备中的硅片装载， 也可应用于晶体管和集成电路 生产各工序中晶圆的装载。
本发明实现上述发明目的所采用的主要技术方案为： 一种应用于化 学机械抛光设备中的硅片定位装载装置， 其特征在于具有基板， 基板通 过支杆与上面的装载导向环连接； 装载导向环和基板间设有将硅片放入 的空间； 提升驱动机构的固定部装在基板上， 升降驱动机构上面的伸缩 部与上面的晶片夹固定连接； 晶片夹和其外面的晶片引导环连接， 晶片 夹和晶片引导环共同形成方便从机械手接收硅片的凹处； 晶片夹和晶片 引导环位于装载导向环的下中部； 装载导向环上设有硅片承载装置对接 导向机构， 以及硅片顶接导向机构； 基板或升降驱动机构的下部设有自 动位移调整机构及其自动复位机构。
自动位移调整机构可实现在 X和 Y方向上的导向对准时整个硅片定 位装载装置的位移自动调节校正。 自动复位机构可实现整个硅片定位装 载装置的位移自动调节校正后， 能自动回复到原来位置； 以待进行下一 个装载循环。
所述的晶片夹和其外面的晶片引导环的连接为具有一定弹性空间的 柔性连接较好。 一有缓冲作用， 二更方便继续上升缓慢对接， 安全性更 高。
所述的晶片夹和其外面的晶片引导环的连接为具有一定弹性空间的 柔性连接结构较好为： 晶片夹从晶片引导环的中间穿过， 晶片夹通过其 上的法兰式结构用至少 3个拉簧和晶片引导环上的拉簧座连接。
所述的装载导向环上设有的硅片承载装置对接导向机构为倒圆台式 倒角较好， 其结构简单、 可靠。 也可为至少具有 3个滑面导轨式结构； 或为外倒角式接构等。
所述的硅片顶接导向机构为圆台式倒角较好， 其结构简单、 可靠。 也可为至少具有 3个滑面导轨式结构等。
所述的升降驱动机构可为油缸活塞式升降驱动机构， 活塞杆上端与 上面的晶片夹连接； 活塞杆外面设有伸缩式防护罩。 也可为气压式升降 驱动机构， 或电机 -丝缸式升降驱动机构等。 伸缩式防护罩可保护升降驱 动机构不受水和抛光液等污染物得影响。
所述的在晶片引导环外侧壁面上设置有确认硅片是否被定位的光电 传感器， 可便于实现电路的自动控制。
所述的自动位移调整机构可为 X、 Y二维位移机构， 其结构为： 包 括层叠式的三个底盘： 底盘一、 底盘二以及底盘三； 在底盘一和底盘二 之间以及在底盘二 (和底盘三之间分别安装有呈相互垂直的、 允许该定位 装载装置在 X和 Y方向上的对准调节的线性导轨装置和各一对能够使得 该装载装置在装载之后能够返回到原来的中心位置的偏置复位弹簧； 所 述一对偏置复位弹簧的两端分别与上下底盘相连， 每对偏置复位弹簧中 两根弹簧所构成的平面平行于和该对偏置复位弹簧对应的线性导轨装置 的运行方向。
所述线性导轨装置允许装载装置整体可实现在 X和 Y方向上的导向 对准位移自动调节校正。 所述偏置复位弹簧， 可使得装载装置在装载之 后能够返回到原来的中心位置。 该偏置复位弹簧和线性导轨装置一起允 许在装载装置与承载器之间以及装载装置与机械手之间存在一定的未对 准量。
所述每对偏置复位弹簧中两根弹簧装配呈 V字形较佳。也可为多个， 非 V字形布置。
X、 Y二维位移机构可具有支架， 支架可支撑整个硅片定位装载装置 并可以调节整个装置的平面度使其轴线与承载器轴线平行。
所述 X、 Y二维位移机构的结构也可为摇杆、 双滑轨梁式加移动滑 车式位置调整机构等； 或其他自动位移调整机构。 所述自动复位机构可 为相应的可与以上具有不同个数和布置的偏置复位弹簧。 只要能将对准 时的自动移位复位即可。
本发明具有如下突出的有益效果： 和现有技术相比， 它克服了定位 不准、 精度差、 安全性差、 装片效率低等之不足， 很好地解决了上述现 有技术中长期存在且一直未能解决的问题， 利用该装置， 它不仅能实现 硅片的准确定位并将其运送到承载器内； 而且结构简单、 定位准确、 装 载安全、 操作方便， 性能可靠、 有利于实现硅片的自动化装载， 提高硅 片的定位装载和加工效率。特别适用于化学机械抛光设备中的硅片装载， 也可应用于晶体管和集成电路生产各工序中晶圆的装载。 采用气缸提升方式及机械式自调整定位等结构， 可以方便地实现硅 片的准确定位、 可靠装载， 从而使硅片得到高准确度和高效的装载效果。 本发明是不同于现有技术的全新结构， 其各种技术结构的设置都具有各 自的结构优点， 而发明本身在综合了各项技术结构的优点之外， 体现出 其结构简单、 装调方便、 定位装载准确可靠等整体优点。 不仅可大大提 高硅片装载的效率， 而且还可以得到较好的抛光效果， 是一种很好的可 应用于 300mm硅片化学机械抛光设备中的硅片装载装置。采用此项技术 在对硅片进行定位装载以备抛光时， 可获得非常精确的硅片定位和高的 装载效率。
附图说明
图 1为本发明一个较好的实施例的立体结构示意图。
图 2为图 1中下方部分 1的立体结构示意图。
图 3为图 1中晶片夹组件 204的立体结构示意图。
图 4为图 3中弹性构件 404位置的局部剖视图。
图 5为图 1中的装载导向环 302及支杆 301的立体结构示意图。 图 6为图 1的装配中轴线的局部剖视图。
图 7为图 1与承载装置配合进行硅片定位装载工作过程框图。
图中： 下方部分 -1、 中间部分 -2、 上方部分 -3、 支架 -4; 硅片承载装 置 -100;线性导轨装置 -101、偏置复位弹簧 -102、底盘一 -103、底盘二 -104、 底盘三 -105、 限位调整机构 -106; (升降驱动机构） 提升气缸 -201、 气缸 防护套 -202、 基板 -203、 晶片夹组件 -204; 支杆 -301、 装载导向环 -302; 晶片夹 -401、 晶片引导环 -402、 伸缩式防护罩 -403、 弹性构件 -404、 光电 传感器 -405、 拉簧座 -406、 拉簧 -407、 硅片 -408; 倒圆台式倒角 （或称倒 角） -501、 内环部分 -502、 外环部分 -503、 圆台式倒角 （或称圆锥形孔口） -504。
具体实施方式
下面将结合本发明一个较好的实施例及其附图， 对本发明实施例中 的技术方案进行清楚、 完整地描述； 显然， 所描述的实施例仅仅是本发 明部分实施例， 而不是全部实施例； 基于本发明中的实施例， 本领域普 通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例， 都 属于本发明保护的范围。 参见图 1〜图 7，该应用于化学机械抛光设备中的硅片定位装载装置， 具有基板 203， 基板 203通过支杆 301与上面的装载导向环 302连接； 装 载导向环 302和基板 203 间设有将硅片放入的空间； 升降驱动机构 201 的固定部装在基板 203上， 升降驱动机构 201上面的伸缩部与上面的晶 片夹 401固定连接； 晶片夹 401和其外面的晶片引导环 402连接， 晶片 夹 401和晶片引导环 402共同形成方便从机械手接收硅片的凹处； 晶片 夹 401和晶片引导环 402位于装载导向环 302的下中部；装载导向环 302 上设有硅片承载装置对接导向机构以及硅片顶接导向机构； 基板 203或 升降驱动机构 201的固定部与下面的位置调整机构相连。 晶片夹 401和 其外面的晶片引导环 402 的连接为具有一定弹性空间的柔性连接。 具有 一定弹性空间的柔性连接结构为： 晶片夹 401从晶片引导环 402的中间 穿过， 晶片夹 401通过其上的法兰式搭接结构用 4个拉簧 407和晶片引 导环 402上的拉簧座 406连接。 装载导向环 302上设有的方便硅片承载 装置对接导向机构与为倒圆台式倒角 501。硅片顶接导向向机构为圆台式 倒角 504。
升降驱动机构 201 为油缸活塞式升降驱动机构， 活塞杆上端与上面 的晶片夹 401固定连接， 活塞杆外面设有伸缩式防护罩 202。在晶片引导 环 402外侧壁面上设置有确认硅片是否被定位的光电传感器 405 ; 自动位 移调整机构为 X、 Y二维位移机构， 结构为： 包括层叠式的三个底盘： 底盘一 103、 底盘二 104以及底盘三 105; 在底盘一 103和底盘二 104之 间以及在底盘二 104和底盘三 105之间分别安装有呈相互垂直的、 允许 该定位装载装置在 X和 Y方向上的对准调节的线性导轨装置 101和各一 对能够使得该装载装置在装载之后能够返回到原来的中心位置的偏置复 位弹簧 102; 所述一对偏置复位弹簧 102的两端分别与上下底盘相连， 每 对偏置复位弹簧中两根弹簧所构成的平面平行于和该对偏置复位弹簧对 应的线性导轨装置的运行方向。 每对偏置复位弹簧 102 中两根弹簧装配 呈 V字形。
图 1也可分为包括支架 4、 实现位置调整作用的下方部分 1、 实现提 升作用的中间部分 2和实现定位作用的上方部分 3，支架 4安装在硅片化 学机械抛光设备中主体部分上， 下方部分 1、 中间部分 2和上方部分 3依 次连接， 下方部分 1安装在支架 4上。 下方部分 1包括呈叠加状的三个底盘： 底盘一 103、底盘二 104以及 底盘三 105,在底盘一 103和底盘二 104之间以及在底盘二 104和底盘三 105之间分别安装有呈相互垂直的线性导轨装置 101和各一对偏置复位弹 簧 102，所述一对偏置复位弹簧 102的两端分别通过圆柱销和弹簧座与上 下底盘相连， 装配呈 V字形， 每对偏置复位弹簧中两根弹簧所构成的平 面平行于和该对偏置复位弹簧对应的线性导轨装置的运行方向。 在所述 三个底盘外罩设有防护外罩。线性导轨装置 101允许该定位装载装置在 X 和 Y方向上的对准调节， 而偏置复位弹簧 102使得装载装置在装载之后 能够返回到原来的中心位置。 另外， 下方部分 1 还包括用来调节线性导 轨装置 101的限位调整机构 106。 呈相互垂直的 X、 Y线性导轨装置， 也 可用市场销售的。
中间部分 2包括升降驱动机构即提升气缸 201、 基板 203、 晶片夹组 件 204， 晶片夹组件 204位于装载导向环 302和基板 203之间， 提升气缸 201通过基板 203与晶片夹组件 204连接，提升气缸 201的下法兰与下方 部分 1中的底盘三 105固定连接； 所述晶片夹组件 204包括晶片夹 401 和晶片引导环 402， 晶片夹 401位于晶片引导环 402内， 晶片夹 401和晶 片引导环 402采用有一定弹性空间的柔性连接， 晶片夹 401和晶片引导 环 402共同形成以方便从机械手接收硅片的凹处， 在晶片引导环 （402 ) 外侧壁面上设置有确认硅片是否被定位的光电传感器 （405 ) 。 所述提升 气缸 201的上部法兰安装在将中间部分 2和上方部分 3连接到一起的基 板 203上， 提升气缸 201的活塞杆穿过基板 203与晶片夹 401固定连接。 所述中间部分 2还应包括设置在升降驱动机构 201外的防护罩 202，其结 合定位装载装置整体的安装可以实现保护提升气缸 201 以下部分不受水 和抛光液等污染物影响。 在晶片夹 401 下面中央处还设置有提升气缸防 护套 403， 用来防护提升气缸 201 的活塞杆。 在本实施例中所述晶片夹 401和晶片引导环 402的柔性连接结构为： 晶片夹 401和晶片引导环 402 通过弹性构件 404连接在一起， 弹性构件 404设置为至少三个并且均匀 分布在晶片引导环 402上， 该弹性构件 404由设置在晶片引导环 402上 的拉簧座 406， 以及两端分别和拉簧座 406以及晶片夹 401连接的拉簧 407构成， 所述拉簧 407将晶片夹 401和晶片引导环 402压在一起。
上方部分 3包括装载导向环 302、 支杆 301。 所述装载导向环 302分 外环部分 503和内环部分 502，内环部分 502是设置在装载导向环 302内 部突出的用来限定承载器装载位置的台阶状部分； 与承载器的结构相配 在装载导向环 302中的外环部分 503沿内缘表面设有倒圆台式倒角 501， 在装载导向环 302中的内环部分 502边缘设置有圆台式倒角 504，其允许 与晶片夹 401 外边缘之间具有一定的未对准间隙量， 使得气缸提升过程 中实现硅片与承载器之间的准确定位； 装载导向环 302通过设置在装载 导向环 302外环边缘的至少三个支杆 301与基板 203连接。
其升降电路控制可为手动或自动控制等结构； 该控制电路， 一般技 术人员均可设计和实施 （略） 。 与本发明配合的硅片承载装置有与其配 合的定位结构， 以及硅片吸附结构等。
本实施例的工作过程为（参照附图 7 ) ： 可先调节位置调整装置 1中 的线性导轨装置 101和偏置复位弹簧 102，使得该硅片定位装载装置基本 处于承载器的正下方某个位置 （如加限位调整机构 106更好， 可使导轨 滑动在一个合适的更加准确的范围内） 。 机械手将待抛光硅片从储存盒 中取出从装载导向环 302和基板 203间放置在晶片夹组件 204上， 硅片 通过边缘与晶片夹组件 204接触并很好的定位在晶片夹组件 204内， 以 备将硅片装载到承载器内； 硅片边缘与晶片夹组件接触以实现装载前的 定位功能， 由于是柔性连接， 当晶片引导环停止运动时， 晶片夹还可以 继续运动一段距离。 此外， 晶片夹和晶片引导环的结构使得硅片仅在硅 片的边缘接触晶片夹。 所述基板可起支撑装载导向环、 承载器和排除积 蓄液体的作用。 升降驱动机构在将硅片提升到承载器内之后缩回晶片夹 组件。
上方部分包括用来定位承载器装载位置的装载导向环， 支杆。 装载 导向环沿内缘表面具有倒角， 该倒角与承载器中保持环的倒角合作以提 供对承载器和装载装置之间的未对准的补偿量。 装载硅片时承载器位于 装载导向环内部以方便从装载装置中拾取硅片， 装载导向环内部突出台 阶部分限定了承载器的装载位置。 在装载导向环内环边缘设有具收拢作 用的圆锥形孔口 (八字形)，其允许装载导向环与硅片和晶片夹组件之间具 有一定的间隙量， 使得在升降驱动机构提升过程中实现硅片与承载器之 间的对准定位， 以方便将硅片顺利的吸附在承载器内。 位于装载导向环 和基板之间的三个支杆主要用来支撑装载导向环和装载时的承载器， 其 结构简单， 安装方便。 当位于晶片引导环 402边缘的光电传感器 405确认硅片已经被定位 在晶片夹 401 后， 承载器开始下降并定位在定位装载装置中的装载导向 环 302的内部。 安装在位置调整装置 1中的提升气缸 201将晶片夹组件 204和硅片一起向上提升直到硅片进入承载器凹处内，此时承载器通过真 空将硅片吸附在其内部以备抛光。 安装在承载器上面的硅片检测传感器 确认硅片已经存在于承载器内部后， 提升气缸 201将晶片夹组件 204下 降到初始位置以便接收下一个待抛光硅片， 同时吸附有硅片的承载器离 开装载导向环 302 向上提升并运动到抛光台上方准备抛光， 至此完成了 一个硅片定位装载的完整过程， 硅片定位和装载的效率明显得到提高。
经常暴露于化学试剂中的装载装置通常由抗腐蚀性的材料加工制作 而成， 比如工程塑料、 不锈钢、 铝和其它相关的抗腐蚀性材料。
以上所述仅为本发明的较佳实施例而已， 并不用以限制本发明， 凡 在本发明的精神和原则之内所作的任何修改、 等同替换和改进等， 均应 包含在本发明的保护范围之内。

Claims

权 利 要 求 书
1、 一种应用于化学机械抛光设备中的硅片定位装载装置， 其特征在 于具有基板 （203 ) ， 基板 （203 ) 通过支杆 （301 ) 与上面的装载导向环
(302) 连接； 装载导向环 （302) 和基板 （203 ) 间设有将硅片放入的空 间； 升降驱动机构 （201 ) 的固定部装在基板 （203 ) 上， 升降驱动机构
(201 ) 上面的伸缩部与上面的晶片夹 （401 ) 固定连接； 晶片夹 （401 ) 和其外面的晶片引导环（402)连接， 晶片夹（401 )和晶片引导环（402) 共同形成方便从机械手接收硅片的凹处； 晶片夹 （401 ) 和晶片引导环
(402) 位于装载导向环 （302) 的下中部； 装载导向环 （302) 上设有硅 片承载装置对接导向机构， 以及硅片顶接导向机构； 基板 （203 ) 或升降 驱动机构 （201 ) 的下部设有自动位移调整机构及其自动复位机构。
2、 根据权利要求 1所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的晶片夹 （401 ) 和其外面的晶片引导环 （402) 的连接为具有一定弹性空间的柔性连接。
3、 根据权利要求 2所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的晶片夹 （401 ) 和其外面的晶片引导环 （402) 的连接为具有一定弹性空间的柔性连接结构为： 晶片夹 （401 ) 从晶片引 导环 （402) 的中间穿过， 晶片夹 （401 ) 通过其上的法兰式搭接结构用 至少 3个拉簧 （407) 和晶片引导环 （402) 上的拉簧座 （406) 连接。
4、 根据权利要求 1所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的装载导向环 （302) 上的硅片承载装置对接导 向机构为倒圆台式倒角 （501 ) 。
5、 根据权利要求 1所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的硅片顶接导向机构为圆台式倒角 （504) 。
6、 根据权利要求 1所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的升降驱动机构 （201 ) 为油缸活塞式升降驱动 机构， 晶片夹 （401 ) 固定装在活塞杆上端， 活塞杆外面设有伸缩式防护 罩 （202) 。
7、 根据权利要求 1所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于所述的在晶片引导环 （402) 外侧壁面上设置有确认 硅片是否被定位的光电传感器 （405 ) 。
8、 根据权利要求 1、 2、 3、 4、 5、 6或 7所述的应用于化学机械抛 光设备中的硅片定位装载装置， 其特征在于所述的自动位移调整机构为 X、 Y二维位移机构，其结构为：包括层叠式的三个底盘：底盘一（103 )、 底盘二 (104)以及底盘三 (105); 在底盘一 （103 ) 和底盘二 (104)之间以及 在底盘二 (104)和底盘三 (105)之间分别安装有呈相互垂直的、 允许该定位 装载装置在 X和 Y方向上的对准调节的线性导轨装置 （101 ) ； 所述的 自动复位机构为： 在底盘一（103 )和底盘二 (104)之间以及在底盘二 (104) 和底盘三 (105)之间分别安装有一对能够使得该装载装置在装载之后能够 返回到原来的中心位置的偏置复位弹簧 （102) ； 所述一对偏置复位弹簧 ( 102) 的两端分别与上下底盘相连， 每对偏置复位弹簧中两根弹簧所构 成的平面平行于和该对偏置复位弹簧对应的线性导轨装置的运行方向。
9、 根据权利要求 8所述的应用于化学机械抛光设备中的硅片定位装 载装置， 其特征在于： 所述每对偏置复位弹簧 （102) 中两根弹簧装配呈 V字形。
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