WO2012018231A1 - Appareil d'éclairage optique à semi-conducteurs - Google Patents

Appareil d'éclairage optique à semi-conducteurs Download PDF

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Publication number
WO2012018231A1
WO2012018231A1 PCT/KR2011/005715 KR2011005715W WO2012018231A1 WO 2012018231 A1 WO2012018231 A1 WO 2012018231A1 KR 2011005715 W KR2011005715 W KR 2011005715W WO 2012018231 A1 WO2012018231 A1 WO 2012018231A1
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WO
WIPO (PCT)
Prior art keywords
light source
source module
optical semiconductor
fan
housing
Prior art date
Application number
PCT/KR2011/005715
Other languages
English (en)
Korean (ko)
Inventor
김동수
강석진
정민아
Original Assignee
주식회사 포스코아이씨티
주식회사 포스코엘이디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110037792A external-priority patent/KR101248731B1/ko
Priority claimed from KR1020110046902A external-priority patent/KR101216289B1/ko
Application filed by 주식회사 포스코아이씨티, 주식회사 포스코엘이디 filed Critical 주식회사 포스코아이씨티
Priority to EP11814831.1A priority Critical patent/EP2602546A4/fr
Priority to CN201180044878.XA priority patent/CN103124876B/zh
Publication of WO2012018231A1 publication Critical patent/WO2012018231A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F21S8/02—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters
    • F21S8/026—Lighting devices intended for fixed installation of recess-mounted type, e.g. downlighters intended to be recessed in a ceiling or like overhead structure, e.g. suspended ceiling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/78—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with helically or spirally arranged fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/03—Gas-tight or water-tight arrangements with provision for venting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/04—Arrangement of electric circuit elements in or on lighting devices the elements being switches
    • F21V23/0442—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors
    • F21V23/0457—Arrangement of electric circuit elements in or on lighting devices the elements being switches activated by means of a sensor, e.g. motion or photodetectors the sensor sensing the operating status of the lighting device, e.g. to detect failure of a light source or to provide feedback to the device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an optical semiconductor lighting apparatus, and more particularly, to an optical semiconductor lighting apparatus disposed in a workplace such as a factory to generate light.
  • LED devices such as light emitting diodes (LEDs) are employed.
  • the LED device has a number of advantages such as high luminous efficiency, low power consumption and environmentally friendly, the trend of increasing the technical field using the LED device.
  • the lighting device having the LED element may be used as a room light in a home or an office, and may also be used as a factory in a workshop where automobile assembly, steelmaking work, sewing work, and the like are performed.
  • a large number of dusts or foreign matters may exist in the workplace, and the dusts or foreign matters may penetrate into the lighting device, causing failure of the lighting device or being deposited on the surface, thereby reducing luminous efficiency and heat radiation efficiency.
  • the dust or foreign matter sticks to the reflection shade of the lighting device, it may reduce the reflection efficiency and heat radiation efficiency of the reflection shade or damage the appearance.
  • the present invention is to solve the above problems, the problem to be solved by the present invention to prevent dust or foreign matter penetrate into the inside or stick to the reflection shade, etc. to improve the luminous efficiency, heat radiation efficiency, reflection efficiency and maintenance It is to provide an optical semiconductor lighting device that can reduce the cost.
  • An optical semiconductor lighting apparatus includes a housing, a light source module, a fan, and a reflector.
  • the housing includes a first end and a second end opposite the first end and the second end is open.
  • the light source module is disposed inside the housing.
  • the fan is disposed in the housing adjacent to the light source module and rotates in a first direction to blow air toward the light source module.
  • the reflection shade is disposed adjacent to the second end of the housing and determines an irradiation range of light generated by the light source module.
  • a movement path is formed in the housing to allow at least some of the air introduced by the fan to flow out through the light source module.
  • the heat sink may further include a heat sink for dissipating heat generated from the light source module, and the heat sink may include a base plate including a heat sink vent for forming the movement path, and a heat dissipation protrusion protruding from the base plate. have.
  • the light source module may include a printed circuit board having a vent hole forming the movement path and at least one optical semiconductor element mounted on the printed circuit board.
  • the vent may include a central vent formed in the center of the printed circuit board and an edge vent formed at an edge of the printed circuit board.
  • the edge vent may be formed to be inclined toward the inner surface of the reflection shade.
  • At least one side of the housing corresponding to the reflection shade may be formed with an outer vent for moving a portion of the air introduced by the fan to the outer surface of the reflection shade.
  • the outer vent may be inclined along the outer surface of the reflecting shade.
  • the optical semiconductor lighting device may further include a dust collecting module disposed on the reflector to collect dust in the air.
  • the optical semiconductor lighting apparatus may further include an illumination controller for controlling the fan and the light source module.
  • the lighting controller may control the light source module to notify the failure of the fan when the fan does not rotate or rotates at a speed lower than a reference value.
  • the lighting controller may control the fan to rotate in a second direction opposite to the first direction to remove dust accumulated around the air inlet formed in the housing.
  • the housing may include an upper cover coupled to the case body to open and close the upper and lower parts thereof, and to cover the upper part of the case body accommodating the fan and the light source module therein and the upper part of the case body.
  • the upper cover may be formed with an air inlet for moving the outside air into the housing.
  • the upper cover may be spaced apart from the upper end of the case body may be formed a side inlet for moving the outside air into the housing.
  • the outer surface of the case body may be formed with a plurality of stripe grooves or a plurality of stripe protrusions disposed spaced apart from each other.
  • An optical semiconductor lighting apparatus includes a housing, a light source module, a fan, and a reflector.
  • the housing is open at one side.
  • the light source module includes at least one optical semiconductor element.
  • the fan is disposed adjacent to the light source module in the housing and introduces air into the light source module.
  • the reflection shade reflects the light generated from the light source module to determine the irradiation range of the light.
  • the lower end of the housing is disposed spaced apart from at least a portion of the outer surface of the reflection shade so that the air introduced by the fan blows to the outer surface of the reflection shade.
  • the lower end portion of the housing may have a shape disposed to be spaced apart from at least a portion of the outer surface of the reflection shade.
  • the lower end of the housing may have a shape capable of concentrating air introduced by the fan to the outer surface of the reflecting shade and discharging it at a strong pressure.
  • the lower end of the housing may have a shape in which a portion facing the reflecting shade protrudes while overlapping a portion of the upper end of the reflecting shade.
  • the lower end portion of the housing may overlap at least a portion of the reflection shade, and the interval with the outer surface of the reflection shade may be narrowed toward the lower side of the reflection shade.
  • the air introduced into the housing by the fan is transferred to the outer side. It can move along the outer surface of the reflector when it is discharged through the vent, thereby effectively removing dust attached to the outer surface of the reflector.
  • the air flowing out through the outer vent can move from the upper side to the lower side of the outer side of the reflecting shade, so that the outside of the reflecting shade Dust attached to the upper part of the side can be effectively removed.
  • FIG. 1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing the optical semiconductor lighting device of FIG.
  • FIG. 3 is a cross-sectional view illustrating one end surface of the optical semiconductor lighting apparatus of FIG. 1.
  • FIG. 4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.
  • FIG. 5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention.
  • FIG. 8 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fifth embodiment of the present invention.
  • FIG. 9 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a sixth embodiment of the present invention.
  • FIG. 10 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a seventh embodiment of the present invention.
  • FIG. 11 is a cross-sectional view showing an optical semiconductor lighting apparatus according to Embodiment 8 of the present invention.
  • FIG. 12 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a ninth embodiment of the present invention.
  • 13 and 14 are plan views illustrating the arrangement of the heat dissipation protrusions of the heat sink of FIG. 12.
  • FIG. 15 is an enlarged cross-sectional view of part A of FIG. 12.
  • 16 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a tenth embodiment of the present invention.
  • first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
  • the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.
  • FIG. 1 is a perspective view showing an optical semiconductor lighting apparatus according to a first embodiment of the present invention
  • Figure 2 is an exploded perspective view showing an exploded optical semiconductor lighting apparatus of Figure 1
  • Figure 3 is an optical semiconductor lighting apparatus of FIG. It is sectional drawing which shows one end surface.
  • the optical semiconductor lighting apparatus 1000 includes a housing HS, a light source module 500, a fan 400, and a reflector 700. .
  • the light source module 500 includes at least one optical semiconductor element 520.
  • the fan 400 is disposed adjacent to the light source module 500 in the housing HS, and introduces air into the light source module 500.
  • the reflection shade 700 reflects the light generated from the light source module 500 to determine the irradiation range of the light.
  • a movement path may be formed in the housing HS to allow at least some of the air introduced by the fan 400 to flow out through the light source module 500. In this case, the movement path will be described in detail later.
  • the lower end of the housing HS may be spaced apart from at least a portion of the outer surface of the reflector 700 so that air introduced by the fan 400 flows out to the outer surface of the reflector 700. have.
  • the optical semiconductor lighting apparatus 1000 includes a housing HS, a heat sink 300, a fan 400, a light source module 500, a diffusion plate 600, and a sealing member 610. ), The plate fixing unit 620 and the reflection shade 700 may be included.
  • the housing HS has an inner space capable of accommodating the fan 400 and the like. At this time, the lower portion of the housing (HS) is open (open), the upper portion of the housing (HS) is formed with an air inlet 210 for moving the outside air into the inner space.
  • the housing HS may include a case body 100 in which the internal space is formed and an upper cover 200 coupled to the case body 100.
  • the upper and lower portions of the case body 100 are open, and the upper cover 200 is coupled to the case body 100 to cover the upper portion of the case body 100.
  • the case body 100 may be formed in a cylindrical shape as shown in FIG. 1, but may alternatively be formed in a polygonal shape such as a square cylinder, a hexagonal cylinder, or the like.
  • the case body 100 and the upper cover 200 may include a synthetic resin or a metal material, for example, aluminum alloy.
  • the upper cover 200 includes the air inlet 210 through which external air passes.
  • the air inlet 210 includes first inlet holes 212 having a shape extending from the center of the upper cover 200 to the outside, and second inlet holes 214 having a circular or polygonal shape. can do.
  • the first and second inflow holes 212 and 214 may be spaced apart from each other in a radial shape with respect to the center of the upper cover 200.
  • the first and second inlet holes 212 and 214 may be formed in a spiral shape corresponding to the rotation direction of the fan 400 to be described later.
  • the lower end of the case body 100 is formed with an outer vent 110 for moving the air present in the inner space to the outer surface of the reflection shade 700.
  • the case body 100 has a plurality of bottom support parts 120 protruding downwardly to be spaced apart from each other, and as a result, the outer vent 110 may be divided into a plurality of parts by the bottom support parts 120. have.
  • the heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100.
  • the heat sink 300 may be fixed to the bottom support parts 120 of the case body 100.
  • the heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated by the light source module 500 to be released to the outside, for example, aluminum or magnesium.
  • the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside.
  • the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.
  • the base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500. At this time, the edge portion of the base plate 310 may be coupled to the lower support portions 120 of the case body 100 to be fixed.
  • the base plate 310 may be provided with a heat sink vent 312 for moving the air present in the inner space to the lower portion of the heat sink 300, wherein the heat sink vent 312 is the base It may include a central vent (312a) formed in the center of the plate 310.
  • the heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100 and are disposed in the inner space, and receive heat from the base plate 310 to be discharged to the outside. Can be.
  • the heat dissipation protrusions 320 may have various structures and arrangements having excellent heat dissipation efficiency.
  • the heat dissipation protrusions 320 may correspond to the first and second air inlet holes 212 and 214 of the upper cover 200. It may have a layout.
  • the heat dissipation protrusions 320 are radially and helically shaped and spaced apart from each other to correspond to the first and second air inlet holes 212 and 214 with respect to the center of the base plate 310. Can be deployed. That is, the heat dissipation protrusions 320 may be radially and spirally formed and spaced apart from each other to correspond to the rotation direction of the fan 400 about the central vent hole 312a.
  • the outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310.
  • a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330.
  • the central protrusion wall 340 is formed to protrude from the lower surface of the base plate 330, is formed along the edge of the central vent (312a). Therefore, when the central vent 312a is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.
  • the heat dissipation unit may be configured to include at least one of a heat pipe and a heat spreading member, in addition to or separately from the heat sink 300.
  • the fan 400 is disposed in the inner space of the case body 100 to move external air provided through the air inlet 210 to the heat sink 300 to cool the heat flowing from the heat sink.
  • By blowing air downward it is possible to prevent the dust or foreign matter moving along the upward airflow from being deposited on the light source module 500 and the reflection shade 700. That is, by removing the dust and foreign matter deposited on the reflecting surface of the light source module 500 and the reflection shade 700 can improve the utilization efficiency of light, by removing the dust and foreign matter deposited on the upper surface of the reflection shade 700, The heat dissipation efficiency through the reflector can be improved.
  • the fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis.
  • the central axis may coincide with the center of the heat sink 300 and the center of the upper cover 200.
  • the inner surface of the case body 100 may be formed with a fan mounting portion 130 for coupling with the fan case.
  • the fan mounting unit 130 may be a stepped portion formed on the inner surface of the case body 100 as shown in FIG. 3 and coupled to the edge of the fan case.
  • the fan mounting unit 130 may protrude from the inner surface of the case body 100. It may be a support protrusion (not shown) that can be coupled to the heat dissipation case while supporting the edge of the fan case.
  • the light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is disposed adjacent to the bottom surface of the base plate 310. Light is generated in a downward direction with respect to the base plate 310.
  • the light source module 500 includes at least one optical semiconductor element 520 capable of generating light.
  • the optical semiconductor device may include at least one of a light emitting diode (LED), an organic light emitting diode (OLED), and an electroluminescent device (EL).
  • the light source module 500 may further include a printed circuit board 510 and optical cover units 530 in addition to the optical semiconductor elements 520.
  • the printed circuit board 510 is disposed adjacent to the bottom surface of the base plate 310.
  • the printed circuit board 510 is provided with a light source vent 512 corresponding to the heat sink vent 312 formed in the base plate 310.
  • the light source vent 512 includes a substrate central vent 512a formed at the center of the printed circuit board 510 corresponding to the central vent 312a, and protrudes the center from the substrate central vent 512a.
  • the printed circuit board 510 may contact the bottom surface of the base plate 310.
  • the optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510.
  • Each of the optical semiconductor elements 520 may include at least one light emitting diode (LED) for generating light, and the light emitting diode may generate light having various wavelengths according to its purpose, for example, red It can generate light in the yellow, blue or ultraviolet wavelength band.
  • LED light emitting diode
  • the optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light.
  • the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.
  • the diffusion plate 600 is spaced apart from the lower portion of the printed circuit board 510 and diffuses light generated from the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332.
  • the diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510.
  • the plate vent 602 includes a plate central vent 602a formed at the center of the diffusion plate 600 to correspond to the substrate central vent 512a.
  • the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.
  • the sealing member 610 is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 to prevent external moisture and foreign matters. It can be prevented from being applied to the light source module 500 side.
  • the sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 is interposed between the outer sealing ring 612, and the diffusion plate 600 and the central protrusion wall 340.
  • the outer sealing ring 612 and the central sealing ring 614 may be, for example, a rubber ring.
  • the plate fixing unit 620 is disposed along the edge of the diffuser plate 600 at the lower portion of the diffuser plate 600 to surround the diffuser plate 600 with a plurality of coupling screws (not shown). It is fixed to the lower side wall (330). That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit 620 and the diffusion plate 600, the edge of the diffusion plate 600 to the outer lower side wall Can be strongly fixed to the (330). Meanwhile, the central portion of the diffusion plate 600 may be strongly fixed to the central protrusion wall 340 by separate coupling screws. That is, as each of the separate coupling screws penetrates through the diffusion plate 600 and then is coupled to the central protrusion wall 340, the central portion of the diffusion plate 600 is strongly attached to the central protrusion wall 340. Can be fixed
  • the reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light.
  • the reflection shade 700 may be coupled to the side of the heat sink 300, for example, the side of the base plate 310 and fixed.
  • the reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside.
  • a dust prevention film (not shown) may be formed on the surface of the reflection shade 700 to prevent dust or foreign matter from sticking well.
  • the anti-dust coating may be an antifouling coating film such as a nano-green coating film.
  • a plurality of concave-convex shapes may be formed on the surface of the reflection shade 700 to increase the surface area to effectively release the heat absorbed from the light source module 500.
  • a part of the air blown into the heat sink 300 by the fan 400 is provided to the outer surface of the reflector 700 through the outer vent 110 formed at the lower end of the case body 100 again.
  • the dust adhering to the outer surface of the reflection shade 700 may be removed, such as dust and foreign matter.
  • a movement path for moving air blown into the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed. May be formed by the heat sink vent 312, the light source vent 512, and the plate vent 602.
  • the air moving to the lower portion of the light source module 500 through the movement path moves the dust moving from the lower portion of the lighting device 1000 to the light source module 500 side along the upward air flow to the lower portion again.
  • the dust may be prevented from sticking to the outer surfaces of the light source module 500 and the reflection shade 700.
  • FIG. 4 is a block diagram illustrating a driving relationship of the optical semiconductor lighting apparatus of FIG. 1.
  • the optical semiconductor lighting apparatus 1000 may further include a power supply module 810, an lighting controller 820, and a temperature sensor 830.
  • the power supply module 810 provides power to the fan 400 and the light source module 500. Although not shown, power may be provided to the lighting controller 820 and the temperature sensor 830.
  • the power supply module 810 may be disposed outside or inside the housing HS. However, when the power supply module 810 is disposed inside the housing HS, the power supply module 810 is disposed in a space between the upper cover 200 and the fan 400. It is preferable to be.
  • the lighting controller 820 may be electrically connected to the fan 400 and the light source module 500 to control driving of the fan 400 and the light source module 500, respectively.
  • the lighting controller 820 may be disposed on the bottom surface of the printed circuit board 510 in the same manner as the optical semiconductor elements 520, but may be disposed anywhere inside or outside the housing HS. .
  • the lighting controller 820 may notify the fan 400 of the failure.
  • the light source module 500 may be controlled to generate light of a color, for example, red, or may be driven to blink the optical semiconductor elements 520 of the light source module 500.
  • the lighting controller 820 receives the fan rotation speed information from the fan 400 and the fan 400 is broken when the fan 400 does not rotate or rotates at a speed lower than a reference value. You can judge. On the other hand, the operator can determine the failure of the fan 400 through the lighting color of the lighting device 1000 to repair and repair the lighting device 1000.
  • the lighting control unit 820 may remove the dust or foreign matter accumulated around the air inlet 210 of the upper cover 200 at any time, for example, every six hours for 10 minutes.
  • the fan 400 may be controlled to rotate in the reverse direction.
  • the temperature sensor 830 is disposed in the interior space of the housing (HS) to sense the temperature of the interior space.
  • the lighting controller 820 may control the rotation speed of the fan 400 according to the temperature value applied from the temperature sensor 830. That is, when the temperature value detected by the temperature sensor 830 is higher than the reference value, the rotation speed of the fan 400 is increased, and when the temperature value detected by the temperature sensor 830 is lower than the reference value, Reduce the rotational speed of the fan 400.
  • a dust measuring unit (not shown) is further disposed in the housing HS to provide the amount of dust in the housing HS to the lighting control unit 820 in real time or intermittently, and the lighting control unit 820
  • the rotation speed of the fan 400 may be controlled according to the amount of dust and foreign matter measured by a dust measurement unit (not shown).
  • the air moved by the fan 400 primarily absorbs heat of the heat sink 300 and cools the heat sink 300, and a part of the outer vent 110.
  • the other part is the heat sink vent 312, the light source vent 512 and the plate
  • the dust to move to the light source module 500 side by the rising air flow from the lower portion of the illumination device 1000 can be moved again to the lower portion.
  • the fan 400 is rotated in the reverse direction itself every predetermined time, it is possible to remove the dust and foreign matter stuck to the air inlet hole 210 itself.
  • the optical semiconductor lighting apparatus 1000 of the present invention has a self-clearing function, thereby preventing a failure of the lighting apparatus 1000 or deteriorating luminous efficiency and heat radiation efficiency due to dust or foreign matter.
  • the maintenance cost may be reduced as the maintenance period is increased, and the reflection efficiency and the heat radiation efficiency of the reflection shade may be prevented from being lowered by the dust and foreign matter.
  • the operator can easily determine the failure of the fan 400 through the color of the light generated by the lighting device 1000, it is possible to repair, repair and replace the fan 400 in a short time.
  • the temperature of the interior space of the housing (HS) in real time, and determine the rotational speed of the fan 400 according to the measured temperature value, the heat generated from the light source module 500 It can be removed efficiently.
  • FIG. 5 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a second embodiment of the present invention.
  • Exemplary embodiments of the optical semiconductor lighting apparatus 1000 illustrated in FIG. 5 are described with reference to FIGS. 1 to 4 except for some contents of the base plate 310, the printed circuit board 510, and the diffusion plate 600. Since the lighting apparatus 1000 is substantially the same, detailed descriptions of the same components as those of the first embodiment will be omitted, and the same reference numerals as those of the first embodiment will be given.
  • the base plate 310 of the heat sink 300 includes a heat sink vent 312 for moving air blown by the fan 400 to the lower portion of the reflector 700. Is formed.
  • the heat sink vent 312 includes a central vent 312a formed at the center of the base plate 310 and a plurality of edge vents 312b formed at the edge of the base plate 310.
  • the edge vents 312b may be formed to be spaced apart from each other along the edge of the base plate 310.
  • both the edge vents 312b and the central vent 312a may be formed, but only one of them may be formed.
  • a light source vent 512 is formed at a position corresponding to the heat sink vent 312 on the printed circuit board 510 of the light source module 500, and the light source vent 512 is formed at the diffusion plate 600.
  • the plate vent 602 is formed at the position.
  • the light source vent 512 includes substrate edge vents 512b formed at positions corresponding to the center vent vent 512a and the edge vent vents 312b respectively formed at positions corresponding to the central vent 312a.
  • the diffusion plate 600 includes a plate central vent 602a formed at a position corresponding to the substrate central vent 512a and a plate edge vent 602b respectively formed at a position corresponding to the substrate edge vents 512b. ).
  • the air blown into the heat sink 300 by the fan 400 is formed in the reflection shade 700 through the edge vents 312b together with the central vent 312a. It may be provided as a lower side. That is, the air provided to the heat sink 300 by the fan 400 sequentially passes through the edge vents 312b, the substrate edge vents 512b, and the plate edge vents 602b. It may be provided directly to the inner side of the reflection shade 700. The air provided to the inner surface of the reflecting shade 700 may remove the dust and foreign matter that is attached to the inner surface of the reflecting shade 700.
  • FIG. 6 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a third embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 illustrated in FIG. 6 is substantially the same as the lighting apparatus 1000 of the second embodiment described with reference to FIG. 5 except for some contents of the case body 100. Detailed description of the same components will be omitted, and the same reference numerals as those of the second embodiment will be given.
  • an outer vent 112 is formed at a lower end of the case body 100 to move air moved by the fan 400 to an outer surface of the reflection shade 700.
  • the outer vent 112 is formed in a shape in which air moved by the fan 400 can be directly guided to the outer surface of the reflector 700.
  • the outer vent 112 may be formed at an angle inclined from the bottom of the case body 100 to correspond to the position of the outer surface of the reflection shade 700 as shown in FIG.
  • the inclined angle of the outer vent 112 is preferably equal to or slightly larger than the inclined angle of the reflection shade 700.
  • the outer vent 112 is formed in a shape in which air moved by the fan 400 may be directly guided to the outer surface of the reflecting shade 700, the reflecting shade 700 Dust and foreign matter accumulated on the outer surface of the) can be more effectively removed.
  • FIG. 7 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fourth embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 illustrated in FIG. 7 is substantially the same as the lighting apparatus 1000 of Embodiment 3 described with reference to FIG. 6 except for some contents of the heat sink 300 and the case body 100. Therefore, detailed description of the same components as in Embodiment 3 will be omitted, and the same reference numerals as in Embodiment 3 will be given.
  • the outer vent 114 for moving the air moved by the fan 400 to the outer surface of the reflector 700 is different from the outer surface of the reflector 700, unlike FIG. 6. It is formed on the edge portion of the heat sink 300 facing the.
  • the heat sink 300 may further include an outer upper side wall 350 protruding from the upper surface of the base plate 310 toward the case body 100, and the outer upper side wall 350 The outer vent 114 may be formed.
  • the case body 100 is preferably shorter than the case body 100 of FIG. 7 by the length of the outer upper side wall 350 protrudes from the upper surface of the base plate 310.
  • the outer vent 114 is formed at the edge of the heat sink 300 instead of the lower end of the case body 100 to reflect the air moved by the fan 400. It can be moved to the outer side of 700.
  • FIG. 8 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a fifth embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 illustrated in FIG. 8 is a lighting apparatus of Embodiment 4 described with reference to FIG. 7 except for some contents of the heat sink 300, the printed circuit board 514, the diffusion plate 600, and the like. Since substantially the same as 1000, detailed descriptions of the same components as those of the fourth embodiment will be omitted, and the same reference numerals as those of the fourth embodiment will be given.
  • a plurality of edge vents 312c are provided at an edge of the heat sink 300 to directly move air moved by the fan 400 to an inner side surface of the reflection shade 700.
  • each of the edge vents 312c is formed to penetrate the base plate 310 and the outer lower side wall 330, and the air moved by the fan 400 is directed to the inner surface of the reflector 700. It may be formed into a shape that can be directly guided.
  • the edge vents 312c may be formed at an inclined angle to the base plate 310 and the outer lower side wall 330 corresponding to the position of the inner side of the reflector 700 as shown in FIG. 8. Can be. In this case, the inclined angles of the edge vents 312c may be equal to or slightly smaller than the inclined angle of the reflection shade 700.
  • the substrate edge vents 512b and the plate edge vents 602b in FIG. 7 are not formed in the printed circuit board 510 and the diffusion plate 600, respectively.
  • the diffusion plate 600 is disposed on the outer lower side wall 330 so as not to cover the edge vents 312c.
  • the edge vents 52 are formed at the edge of the heat sink 300 in addition to the outer vent 114, the heat sink 300 alone may be used for the reflection shade 700. Dust and foreign matter accumulated on the outer side and inner side can be removed.
  • FIG. 9 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a sixth embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 includes a case body 100, a base plate 310 of a heat sink 300, a printed circuit board 510 of a light source module 500, and a diffusion plate 600. Except for some contents of the reflection shade 700 and the like, since the lighting apparatus 1000 of the second embodiment described with reference to FIG. 5 is substantially the same, detailed descriptions of the same components as those of the first embodiment will be omitted. The same reference numerals as in Example 2 will be given.
  • the lower end portion 100a of the case body 100 is disposed to be spaced apart from at least a portion of an outer surface of the reflection shade 700.
  • the lower end portion 100a of the case body 100 may be covered to a 1/3 or 1/2 position from the upper end of the outer surface of the reflector 700, or unlike the reflector 700 unlike FIG. 9. It can cover all of the sides.
  • the lower end portion 100a of the case body 100 may be formed to have an inclination substantially the same as that of the outer surface of the reflection shade 700 or may be formed to have a slightly larger or smaller inclination.
  • an outer vent 110 is formed between the lower end portion 100a of the case body 100 and the reflection shade 700.
  • a portion of the air blown into the heat sink 300 by the fan 400 is provided to the outer side of the reflector 700 again through the outer vent 110, and is provided on the outer side of the reflector 700. It is possible to remove the dust, ie, dust and foreign matter.
  • the fan A portion of the air blown into the heat sink 300 by 400 may move along the outer surface of the reflector 700 as it exits through the outer vent 110, and consequently of the reflector 700 Dust attached to the outer side can be effectively removed.
  • the reflector 700 As the upper end of the reflector 700 is arranged to match the upper end of the side of the base plate 310 of the heat sink 300, the air flowing out to the outside through the outer vent 110, the reflector 700 It can move to the bottom via the top of the outer surface of the). As a result, the dust attached to the upper end portion of the outer surface of the reflection shade 700 adjacent to the side of the base plate 310 can be more effectively removed.
  • a movement path for moving air blown into the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed. May be formed by the heat sink vent 312, the light source vent 512, and the plate vent 602.
  • the movement path includes a first movement path formed by the central ventilation hole 312a, the substrate central ventilation hole 512a, and the plate central ventilation hole 602a, the edge ventilation holes 312b, and the substrate edge ventilation hole. It may include a second movement path formed by the 512b and the plate edge vents 602b.
  • the air moving to the lower portion of the center of the light source module 500 through the first movement path moves the dust moving from the lower portion of the lighting device 1000 to the light source module 500 to the lower portion again.
  • the dust may be prevented from sticking to the reflection shade 700 or the like.
  • the air moving to the lower portion of the edge of the light source module 500 through the second movement path is moved directly to the inner surface of the reflecting shade 700 to effectively prevent dust stuck to the inner surface of the reflecting shade 700. Can be removed.
  • the present embodiment shows a modification of the second embodiment, but may be applied to other embodiments differently.
  • FIG. 10 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a seventh embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 shown in FIG. 10 is substantially the same as the lighting apparatus 1000 of the sixth embodiment described with reference to FIG. 9 except for the lower end 100a of the case body 100. Detailed description of the same components as in 6 will be omitted, and the same reference numerals as in the sixth embodiment will be given.
  • the lower end portion 100a of the case body 100 is concentrated at the outer surface of the reflection shade 700 by the air flowing into and discharged by the fan 400 to a strong pressure. Some shapes are deformed to move.
  • the lower end portion 100a of the housing 100 is an inner portion facing the upper end of the reflecting shade, ie, the heat sink, in a state overlapping with a portion of the upper portion of the reflecting shade 700.
  • a portion facing the edge of the 300 may have a concave rounded shape. That is, the lower end portion of the housing may have a shape in which a portion facing the reflection shade protrudes while overlapping a portion of the upper end of the reflection shade. Accordingly, the lower end portion 100a of the housing 100 may be discharged at a high pressure by concentrating the air introduced by the fan 400 and discharged to the outside by the concave rounded portion.
  • the lower end portion 100a of the housing 100 overlaps with at least a portion of the reflection shade 700 as shown in FIG. 9, and the distance between the outer surface of the reflection shade 700 and the reflection shade 700 is different. It may be deformed into a shape that narrows toward the lower direction of the. That is, as the interval between the lower end portion 100a of the housing 100 and the outer surface of the reflection shade 700 becomes narrower toward the lower side of the reflection shade 700, the fan 400 is introduced into the outside. The air released can be discharged at high pressure.
  • a portion of the lower end portion 100a of the housing 100 is deformed so that a portion of the lower end portion 100a may move at a high pressure along the outer surface of the reflection shade 700, and thus, the portion may be disposed at the high pressure. Dust accumulated on the outer surface of the reflector 700 may be effectively removed by the air.
  • the present embodiment shows a modification of the sixth embodiment, but may be applied to other embodiments differently.
  • FIG. 11 is a cross-sectional view showing an optical semiconductor lighting apparatus according to Embodiment 8 of the present invention.
  • the optical semiconductor lighting apparatus 100 illustrated in FIG. 11 is the lighting apparatus of Embodiment 6 described with reference to FIG. 9 except for some contents of the heat sink 300, the printed circuit board 514, the diffusion plate 600, and the like. Since substantially the same as 1000, detailed descriptions of the same components as those of the sixth embodiment will be omitted, and the same reference numerals as those of the sixth embodiment will be given.
  • a plurality of edge vents 312c are provided at an edge of the heat sink 300 to directly move air moved by the fan 400 to an inner side surface of the reflection shade 700. Are spaced apart from each other.
  • each of the edge vents 312c is formed to penetrate the base plate 310 and the outer lower side wall 330, and the air moved by the fan 400 is directed to the inner surface of the reflector 700. It may be formed into a shape that can be directly guided.
  • the edge vents 312c may be formed at an inclined angle to the base plate 310 and the outer lower side wall 330 corresponding to the position of the inner side of the reflector 700 as shown in FIG. 5. Can be.
  • the inclined angles of the edge vents 312c may be equal to or slightly smaller than the inclined angle of the reflection shade 700.
  • edge vent 312b, the substrate edge vents 512b, and the plate edge vents 602b shown in FIG. 9 are not shown in FIG. 11, but may be formed in some cases.
  • the diffusion plate 600 is disposed on the outer lower side wall 330 so as not to cover the edge vents 312c.
  • the edge vents 312c are formed at the edge of the heat sink 300, only the heat sink 300 effectively removes dust accumulated on the inner surface of the reflection shade 700. You can.
  • FIG. 12 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a ninth embodiment of the present invention
  • Figures 13 and 14 are plan views for explaining the arrangement of the heat radiation projections of the heat sink of Figure 12
  • Figure 15 is Is an enlarged cross-sectional view of portion A of the apparatus.
  • the optical semiconductor lighting apparatus 1000 includes a housing HS, a heat sink 300, a fan 400, a light source module 500, and a diffusion plate 600. ), A sealing member, a plate fixing unit, a reflection shade 700 and a dust collecting module 900.
  • the housing HS includes at least a case body 100 having an inner space therein, an upper cover 250 disposed on the case body 100, and an upper cover 250 coupled to the case body 100.
  • One cover coupling portion 260 may be included.
  • the upper and lower portions of the case body 100 are open and accommodate the fan 400 and the like.
  • the case body 100 may be formed in a cylindrical shape or a polygonal shape such as a square cylinder, a hexagonal cylinder, or the like.
  • the case body 100 may be formed of a synthetic resin.
  • the inner surface of the case body 100 has a plurality of inner support parts disposed to be spaced apart from each other to be combined with the fan mounting portion 132 and the heat sink 300 to be described later (to be described later) 140 is formed.
  • an outer vent 110 is formed at a lower end of the case body 100 to move air existing in the inner space to an outer surface of the reflection shade 700 to be described later.
  • the outer surface of the case body 100 may be formed with a plurality of stripe grooves 150 are spaced apart from each other in the upper and lower portions of the case body 100.
  • a plurality of stripe protrusions may be formed on the outer surface of the case body 100 instead of the stripe grooves 150.
  • the stripe grooves 150 or the stripe protrusions may increase a frictional force with the hand of the worker so that the worker does not drop and damage the lighting device 1000 during transportation.
  • the upper cover 250 is spaced apart from the upper end of the case body 100 to cover the upper portion of the case body 100.
  • side inlets 252 are formed between the upper cover 250 and the upper end of the case body 100 to allow the outside air to move into the case body 100.
  • external dust may be accumulated to prevent the side inlet 252 from being blocked.
  • the air inlets 210 in the above embodiments may be formed to be exposed to the upper portion to be clogged by dust and foreign matter falling from the upper portion, as in the present embodiment, is formed through the upper cover 250
  • the side inlet 252 has a reduced risk of being clogged by dirt and debris.
  • An installation ring 254 may be formed on the upper side of the upper cover 250 so that the lighting device 1000 may be installed on a ceiling of a factory or a workshop, and at this time, the installation ring 254 may be formed at a portion of the upper cover 250. Certain grooves may be formed.
  • the upper cover 200 may be formed of a synthetic resin or a metal material, for example, aluminum alloy.
  • the cover coupling part 260 is disposed between the upper cover 250 and the case body 100 to fix the upper cover 250 to the case body 100.
  • the plurality of cover coupling parts 260 may be spaced apart from each other between a lower side surface of the upper cover 250 and an upper side surface of the fan mounting portion 132 formed on the case body 100.
  • 250 may be fixed to the case body 100.
  • the cover coupling portion 260 may be formed to be separated from the inner surface of the upper cover 250 or the case body 100, as shown in the drawing, otherwise, the upper cover 250 or the case body ( It may be formed integrally with the inner surface of the 100).
  • the heat sink 300 is disposed to cover the lower portion of the case body 100 and is coupled to the case body 100.
  • the heat sink 300 may be coupled to and fixed to the inner support parts 140 of the case body 100.
  • the heat sink 300 may be formed of a metal alloy including a material capable of absorbing heat generated from the light source module 500 to be described later to be released to the outside, for example, aluminum or magnesium.
  • the heat sink 300 may be formed in a structure capable of well dissipating heat absorbed from the light source module 500 to the outside.
  • the heat sink 300 may include a base plate 310, a plurality of heat dissipation protrusions 320, an outer lower side wall 330, and a central protruding wall 340.
  • the base plate 310 may be disposed to cover a lower portion of the case body 100, coupled to the case body 100, and may receive heat directly from the light source module 500.
  • the base plate 310 may be provided with a heat sink vent 312 for moving the air present in the housing (HS) to the lower portion of the heat sink 300, wherein the heat sink vent 312 is It may be formed in the center of the base plate 310.
  • the heat dissipation protrusions 320 are formed on an upper surface of the base plate 310 facing the case body 100, are disposed in the housing HS, and receive heat from the base plate 310 to the outside. Can be released.
  • some of the heat dissipation protrusions 320 are coupled to the lower ends of the inner support parts 140 formed on the inner side surface of the case body 100, thereby connecting the heat sink 300 to the case body 100.
  • the inner support parts 140 protrude toward some of the heat dissipation protrusions 320, and a protrusion for being coupled to the inner support parts 140 to some of the heat dissipation protrusions 320. Steps 322 may be formed, respectively.
  • the heat sink 300 may be coupled to the case body 100 by a portion other than the heat dissipation protrusions 320.
  • the heat dissipation protrusions 320 may have various structures and arrangements with excellent heat dissipation efficiency.
  • the heat dissipation protrusions 320 may have radial and spiral shapes with respect to the center of the base plate 310 and may be spaced apart from each other.
  • the heat dissipation protrusions 320 may be spaced apart from each other and have radial and spiral shapes corresponding to the rotation direction of the fan 400 around the heat sink vent 312 as shown in FIG. 13. have.
  • the heat dissipation protrusions 320 may include first protrusions 320a and second protrusions 320b as shown in FIG. 14.
  • the first protrusions 320a have radial and helical shapes with respect to the heat sink vent 312 and are spaced apart from each other.
  • the second protrusions 320b have radial and spiral shapes with respect to the heat sink vent 312, and are disposed between the first protrusions 320a on the outer side of the first protrusions 320a. .
  • the outer lower side wall 330 protrudes from a lower surface of the base plate 310 facing the upper surface on which the heat dissipation protrusions 320 are formed, and is disposed along an edge of the lower surface of the base plate 310.
  • a light source accommodating groove 332 is formed in the lower portion of the base plate 310 to accommodate the light source module 500 by the outer lower side wall 330.
  • the central protrusion wall 340 protrudes from the bottom surface of the base plate 330 and is formed along an edge of the heat sink vent 312. Therefore, when the heat sink vent 312 is formed in a circular shape as shown in the drawing, the central protrusion wall 340 may be formed in the same cylindrical shape.
  • the fan 400 is disposed in the inner space of the case body 100 to move external air provided through the air inlet 210 to the heat sink 300 to cool the heat flowing from the heat sink.
  • the fan 400 may include a fan case in which upper and lower portions are open, a central axis disposed in the center of the fan case, and a plurality of rotary blades disposed in the fan case and rotating based on the central axis.
  • the central axis is preferably coincident with the center of the heat sink 300 and the center of the upper cover 250.
  • the fan case may be mounted and fixed to the fan mounting portion 132 formed on the inner surface of the case body 100.
  • the light source module 500 is accommodated in the light source receiving groove 332 formed in the lower portion of the base plate 310 by the outer lower side wall 330, and is disposed adjacent to the bottom surface of the base plate 310. Light is generated in a downward direction with respect to the base plate 310.
  • the light source module 500 may include a printed circuit board 510, a plurality of optical semiconductor elements 520, and optical cover units 530.
  • the printed circuit board 510 is disposed adjacent to the bottom surface of the base plate 310.
  • the printed circuit board 510 is provided with a light source vent corresponding to the heat sink vent 312 formed in the base plate 310.
  • the light source vent may be formed at the center of the printed circuit board 510 corresponding to the heat sink vent 312.
  • the printed circuit board 510 may be disposed adjacent to the bottom surface of the base plate 310 while the light source vent is inserted into the central protrusion wall 340.
  • the optical semiconductor elements 520 are spaced apart from each other on the bottom surface of the printed circuit board 510 and generate light by a driving voltage provided from the printed circuit board 510.
  • Each of the optical semiconductor elements 520 includes at least one light emitting device (LED) for generating light.
  • the light emitting diode may generate light in various wavelength bands according to its use, for example, light in red, yellow, blue or ultraviolet light bands.
  • the optical cover units 530 may cover each of the optical semiconductor elements 520 to improve optical characteristics of light generated by each of the optical semiconductor elements 520, for example, brightness uniformity of light.
  • the optical cover units 530 may cover and protect each of the optical semiconductor elements 520 and may diffuse light generated from each of the optical semiconductor elements 520.
  • the diffusion plate 600 is spaced apart from the lower portion of the printed circuit board 510 and diffuses light generated from the optical semiconductor elements 520. Specifically, the diffusion plate 600 is disposed on the lower surface of the outer lower side wall 330 and the central protruding wall 340 to cover the light source receiving groove 332.
  • the diffusion plate 600 is provided with a plate vent 602 corresponding to the light source vent 512 formed on the printed circuit board 510. In this case, the plate vent 602 is formed in the center of the diffusion plate 600 to correspond to the light source vent 512.
  • the diffusion plate 600 may be made of, for example, polymethylmethacrylate (PMMA) resin or polycarbonate (PC) resin.
  • the sealing member is interposed between the diffusion plate 600 and the outer lower side wall 330 or between the diffusion plate 600 and the central protruding wall 340 so that external moisture, foreign matter, etc. are stored in the light source module ( 500) can be prevented from being applied to the side.
  • the sealing member includes an outer sealing ring interposed between the diffusion plate 600 and the outer lower side wall 330, and a central sealing interposed between the diffusion plate 600 and the central protrusion wall 340. It may include a ring.
  • the outer sealing ring and the central sealing ring may be, for example, a rubber ring.
  • the plate fixing unit is disposed along the edge of the diffusion plate 600 at the bottom of the diffusion plate 600 to fix the diffusion plate 600 to the outer lower side wall 330 through a plurality of coupling screws. . That is, as each of the coupling screws is coupled to the outer lower side wall 330 through the plate fixing unit and the diffusion plate 600, the edge of the diffusion plate 600 is the outer lower side wall 330 Strongly fixed to
  • the reflection shade 700 is disposed under the case body 100 to reflect the light generated by the light source module 500 and diffused by the diffusion plate 600 to determine the irradiation range of the light.
  • the reflection shade 700 may be coupled to the side of the heat sink 300, for example, the side of the base plate 310 and fixed. Meanwhile, a dust collecting module support part 710 for supporting the dust collecting module 900 to be described later may be formed at a lower end of the reflecting shade 700.
  • the reflection shade 700 may be made of a metal material, for example, aluminum alloy so as to absorb the heat generated by the light source module 500 to be emitted to the outside.
  • a dust prevention film (not shown) may be formed on the surface of the reflection shade 700 in order to prevent dust or foreign matter from sticking well.
  • the anti-dust coating may be an antifouling coating film such as a nano-green coating film.
  • the dust collecting module 900 is disposed on the outer surface of the reflection shade 700 so as to correspond to the outer vent 110, and serves to filter out dust contained in the air.
  • the dust collecting module 900 may be disposed and fixed on the dust collecting module support 710.
  • the dust collecting module 900 is a dust filter 910 for filtering and collecting the dust contained in the air
  • the filter fixing unit for fixing the dust filter 910 on the dust collecting module support 710 920 may be included.
  • the filter fixing unit 920 may be formed, for example, in a c-shaped cross section for accommodating the dust filter 910, and spaced apart from each other to allow air passing through the dust filter 910 to pass therethrough. It may have a plurality of filter ventilation holes 922 formed.
  • the dust collecting module 900 may be formed on the inner side of the reflector 700 as well as the outer surface of the reflector 700 to filter and collect dust contained in the air in the inner side of the half gas chamber 700.
  • the dust collecting module 900 may extend up and down based on the reflection shade 700 or may have a shape bent in the L-shape at the lower end of the reflection shade 700.
  • the dust collecting module 900 may be capable of adjusting the height according to the shape of the lower end portion (100a) of the housing 100 or the position of the outer vent (110).
  • air introduced into the case body 100 through the side inlet 252 formed between the upper cover 250 and the upper end of the case body 100 is transferred to the heat sink by the fan 400. Blowing).
  • the heat sink 300 absorbs heat generated from the light source module 500, and the air blown into the heat sink 300 receives heat from the heat sink 300 to receive the heat sink ( 300) can be reduced.
  • a part of the air blown into the heat sink 300 by the fan 400 is provided to the outer surface of the reflector 700 through the outer vent 110 formed at the lower end of the case body 100 again. Pass through the dust collecting module 900.
  • dust included in the air or stuck to the outer surface of the reflector 700 that is, dust and foreign matters, may be collected and removed by the dust collecting module 900.
  • the dust collecting module 900 may purify the air in the factory or the workplace by removing dust contained in the air.
  • a movement path for moving a part of the air blown to the heat sink 300 by the fan 400 to the lower portion of the light source module 500 is formed in the housing HS.
  • the movement path may be formed by the heat sink vent 312, the light source vent 512, and the plate vent.
  • 16 is a cross-sectional view showing an optical semiconductor lighting apparatus according to a tenth embodiment of the present invention.
  • the optical semiconductor lighting apparatus 1000 illustrated in FIG. 16 is substantially the same as the lighting apparatus 1000 of the ninth embodiment described with reference to FIGS. 12 to 15 except for some contents of the case body 100 and the reflection shade 700. Since the same elements as in Embodiment 9 are not described in detail, the same reference numerals as in Embodiment 9 will be omitted.
  • the lower end portion 100a of the case body 100 is disposed to be spaced apart from at least a portion of an outer surface of the reflection shade 700.
  • the lower end portion 100a of the case body 100 may be covered to a 1/3 or 1/2 position from the upper end of the outer surface of the reflector 700, or unlike the reflector 700 unlike FIG. 16. It can cover all of the sides.
  • the lower end portion 100a of the case body 100 may be formed to have an inclination substantially the same as that of the outer surface of the reflection shade 700 or may be formed to have a slightly larger or smaller inclination.
  • an outer vent 110 is formed between the lower end portion 100a of the case body 100 and the reflection shade 700.
  • the reflection shade 700 is coupled to and fixed to the side of the base plate 310, the upper end of the reflection shade 700 may be disposed to match the upper end of the side of the base plate (310).
  • the lower end portion 100a of the case body 100 is disposed to be spaced apart from each other so as to overlap at least a part of the outer surface of the reflection shade 700 to form the outer vent 110. Accordingly, when a part of the air blown by the fan 400 to the heat sink 300 is discharged through the outer vent 110, it may move along the outer surface of the reflector 700, and as a result Dust attached to the outer surface of the reflector 700 may be effectively removed.
  • the reflector 700 As the upper end of the reflector 700 is arranged to match the upper end of the side of the base plate 310 of the heat sink 300, the air flowing out to the outside through the outer vent 110, the reflector 700 It can move to the bottom via the top of the outer surface of the). As a result, the dust attached to the upper end portion of the outer surface of the reflection shade 700 adjacent to the side of the base plate 310 can be more effectively removed.

Abstract

La présente invention concerne un appareil d'éclairage optique à semi-conducteurs susceptible d'accroître l'efficacité d'un rayonnement de chaleur et l'efficacité d'une isolation de vibrations. L'appareil d'éclairage optique à semi-conducteurs comprend : un logement ayant un côté ouvert ; un module de source de lumière situé à l'intérieur du logement et comprenant au moins un dispositif optique à semi-conducteurs ; un ventilateur qui est situé à côté du module de source de lumière et qui souffle de l'air en direction du module de source de lumière ; et un écran réfléchissant qui réfléchit la lumière émise par le module de source de lumière et détermine une plage de rayonnement de la lumière. A l'intérieur du logement est définie une trajectoire de déplacement suivant laquelle l'air soufflé par le ventilateur est partiellement évacué vers l'extérieur par l'intermédiaire du module de source de lumière. Par conséquent, la présente invention peut prévenir le déplacement de particules externes vers le module de source de lumière en évacuant partiellement l'air soufflé par le ventilateur en direction du module de source de lumière suivant la trajectoire de déplacement depuis l'intérieur du logement vers l'extérieur.
PCT/KR2011/005715 2010-08-06 2011-08-04 Appareil d'éclairage optique à semi-conducteurs WO2012018231A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP11814831.1A EP2602546A4 (fr) 2010-08-06 2011-08-04 Appareil d'éclairage optique à semi-conducteurs
CN201180044878.XA CN103124876B (zh) 2010-08-06 2011-08-04 光学半导体照明设备

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20100076098 2010-08-06
KR10-2010-0076098 2010-08-06
KR1020110037792A KR101248731B1 (ko) 2010-08-06 2011-04-22 광반도체 조명장치
KR10-2011-0037792 2011-04-22
KR10-2011-0046902 2011-05-18
KR1020110046902A KR101216289B1 (ko) 2011-05-18 2011-05-18 광반도체 조명장치

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EP (1) EP2602546A4 (fr)
JP (2) JP5073118B2 (fr)
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WO (1) WO2012018231A1 (fr)

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CN103124876B (zh) 2016-02-03
US20120033419A1 (en) 2012-02-09
JP2013016520A (ja) 2013-01-24
CN103124876A (zh) 2013-05-29
EP2602546A1 (fr) 2013-06-12
US20130128588A1 (en) 2013-05-23
CN104748095A (zh) 2015-07-01
JP5073118B2 (ja) 2012-11-14
JP5367898B2 (ja) 2013-12-11
EP2602546A4 (fr) 2015-01-14
US8894247B2 (en) 2014-11-25
US8801231B2 (en) 2014-08-12

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