WO2012016460A1 - 一种微波毫米波电路 - Google Patents

一种微波毫米波电路 Download PDF

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Publication number
WO2012016460A1
WO2012016460A1 PCT/CN2011/073724 CN2011073724W WO2012016460A1 WO 2012016460 A1 WO2012016460 A1 WO 2012016460A1 CN 2011073724 W CN2011073724 W CN 2011073724W WO 2012016460 A1 WO2012016460 A1 WO 2012016460A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
circuit
millimeter wave
boss
module
Prior art date
Application number
PCT/CN2011/073724
Other languages
English (en)
French (fr)
Inventor
罗兵
佛朗哥·马可尼
Original Assignee
华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to BR112012015573-3A priority Critical patent/BR112012015573B1/pt
Priority to RU2012126952/28A priority patent/RU2500052C1/ru
Priority to EP11814043.3A priority patent/EP2490255B1/en
Publication of WO2012016460A1 publication Critical patent/WO2012016460A1/zh
Priority to US13/478,324 priority patent/US8988891B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate

Definitions

  • an existing MMW (Micro and Millimeter Waves) circuit includes: a circuit board (for example, a PCB), the circuit board is located on a thermal substrate (a metal block having thermal conductivity, For example, on a copper block or an aluminum block, the circuit board is provided with a window, and a chip is placed in the window and located on the thermal substrate.
  • a circuit board for example, a PCB
  • the circuit board is located on a thermal substrate (a metal block having thermal conductivity, For example, on a copper block or an aluminum block, the circuit board is provided with a window, and a chip is placed in the window and located on the thermal substrate.
  • the chip is bonded to the thermal substrate by a conductive material such as silver paste, so that the chip and the thermal substrate have better thermal and electrical connection.
  • the chip is electrically connected to the conductor layer on the surface of the board by a bonding wire. In this configuration, the chip, the bonding wires, and the reference ground of the microstrip lines on the board are all hot substrates.
  • the inventors have found that at least the following problems exist in the prior art: Since the circuit board used in the existing MMW circuit is provided with only one layer of conductor, the design of a large-scale circuit cannot be realized.
  • Embodiments of the present invention provide a microwave millimeter wave circuit to achieve the design of a larger scale circuit.
  • a microwave millimeter wave circuit comprising: a multilayer circuit board, a thermal substrate, a circuit module, the multilayer circuit board is provided with a window, the thermal substrate comprises a base, and the multilayer circuit board is placed on the a susceptor, the thermal substrate further comprising a boss extending from the pedestal into a window of the multilayer circuit board; the circuit module being embedded in the window and located on the boss, The circuit module is electrically connected to an outer conductor layer of the multilayer circuit board.
  • a communication device comprising: a circuit package module, the circuit package module comprises a microwave millimeter wave circuit, the microwave millimeter wave circuit comprises: a multilayer circuit board, a thermal substrate, a circuit module,
  • the multilayer circuit board is provided with a window, the thermal substrate includes a pedestal, the multi-layer circuit board is attached to the pedestal, and the thermal substrate further includes the multi-layer circuit board from the pedestal a boss extending in the window; the circuit module is embedded in the window and located on the boss, and the circuit module is electrically connected to an outer conductor layer of the multilayer circuit board.
  • the circuit module is supported by providing a boss on the base of the thermal substrate, so that the multi-layer circuit board
  • the conductor layer can be arranged in two layers or even more layers, and more layers of the conductor layer can carry more wiring, so that a larger-scale circuit design can be realized on the circuit board with a large number of layers.
  • FIG. 1 is a schematic view of an embodiment of a microwave millimeter wave circuit of the present invention
  • FIG. 2 is a schematic view of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 3 is a schematic view of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 4 is a schematic diagram of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 5 is a schematic diagram of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 6 is a schematic diagram of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 7 is a schematic diagram of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 8 is a schematic diagram of another embodiment of a microwave millimeter wave circuit of the present invention.
  • FIG. 9 is a schematic diagram of a conventional microwave millimeter wave circuit. detailed description
  • the present invention provides an embodiment of a microwave millimeter wave circuit, comprising: a multilayer circuit board, a thermal substrate 3, and a circuit module 2, the multilayer circuit board having a window, the thermal lining
  • the bottom 3 includes a base 32 to which the multilayer circuit board is attached, and the thermal substrate 3 further includes a boss 31 extending from the base toward the window of the multilayer circuit board.
  • the circuit module 2 is embedded in the window And located on the boss 3, the circuit module 2 is electrically connected to the outer conductor layer 1-1 of the multilayer circuit board.
  • the circuit module 2 is supported by providing a boss 31 on the base 32 of the thermal substrate 3 so that the conductor layer in the multilayer circuit board It can be set to two layers, or even more layers, and more layers of conductor layers can carry more PCB layout, so that a larger-scale circuit design can be realized on a circuit board with a large number of layers.
  • a multilayer circuit board having two conductor layers is exemplified.
  • 1-a is an insulating layer a of a multilayer circuit board
  • 1 - 2 is a conductor layer inside a multilayer circuit board.
  • 1 - b is the insulating layer b of the multilayer circuit board;
  • 8 - 1 is a via connecting the outer conductor layer to the inner conductor layer;
  • 8 - 3 is an outer conductor layer connecting the multilayer circuit board, An inner conductor layer, and a via of the thermal substrate.
  • the thermal substrate may include a metal block having a heat conducting and conducting function, such as a copper block; or an aluminum block; or a combination of a copper block and an aluminum block.
  • the circuit module may include a module provided with a circuit, for example, the circuit module may include a chip (for example, a chip), or an integrated circuit or the like. In the above embodiment of the present invention, the height of the boss can support the circuit module.
  • the boss can support the circuit module, so that the circuit module is located substantially The height of the outer conductor layer of the multilayer circuit board is flush, or the circuit module is slightly protruded beyond the outer conductor layer of the multilayer circuit board, or the circuit module is slightly lower than The outer conductor layer of the multilayer circuit board.
  • the height of the boss may be flush with the conductor layer where the reference strip of the microstrip line of the multilayer circuit board is located, or the boss is higher than the microstrip line of the multilayer circuit board
  • the conductor layer on which the reference is located, or the conductor is lower than the conductor layer of the reference ground of the microstrip line of the multilayer circuit board.
  • the microstrip line of the multilayer circuit board may be located on the outer conductor layer of the multilayer circuit board, then the reference layer of the microstrip line is the second from the outer conductor layer Layer conductor layer.
  • the reference layer may be located in the third conductor layer from the outer conductor layer, and so on.
  • the side wall of the window may be stepped to form a stepped surface 10, and the stepped surface 104 is connected to the top surface of the boss.
  • the manner in which the circuit module is electrically connected to the outer conductor layer 1-1 of the multilayer circuit board may be:
  • the manner in which the circuit module is electrically connected to the thermal substrate may be:
  • the circuit module can be bonded and fixed by a conductive material such as silver paste to ensure a good electrical connection between the circuit module and the thermal substrate, and a function of realizing heat conduction.
  • a conductive material such as silver paste
  • the conductor layer of the microstrip line of the multi-layer circuit board is electrically connected to the side surface of the boss, or a plurality of layer circuit boards: a conductor layer on which the reference ground of the microstrip line of the circuit is located, and a side surface or a top surface of the boss may be electrically connected: after the contact, the electrical connection; or, by the multilayer A conductive material (for example, silver paste) is electrically connected to the contact surface between the conductor layer of the microstrip line of the circuit board and the side or top surface of the boss.
  • a conductive material for example, silver paste
  • the reference ground of the circuit module and the microstrip line of the multi-circuit is the thermal substrate.
  • the reference ground is a completely continuous structure, which reduces the reflection problem caused by the discontinuity of the reference ground.
  • the height of the boss is not lower than the conductor layer where the reference ground of the microstrip line of the multilayer circuit board is located. The height is such that the boss is in contact with the conductor layer where the reference strip of the microstrip line of the multilayer circuit board is located, and electrical connection can be achieved.
  • a groove may be formed in a top surface of the boss, and the circuit module 2 may be embedded in the groove.
  • a recess may be provided at an edge of a top surface of the boss, and a conductor layer of a reference strip of the microstrip line of the multilayer circuit board abuts On the recess, an electrical connection to the boss is achieved.
  • a conductive PP (Pre-Preg, prepreg) may be disposed on one side of the boss, and the edge of the conductive PP is provided with a groove, and the plurality of layers A conductor layer on which the reference ground of the microstrip line of the circuit board is located abuts on the IHJ slot to achieve electrical connection with the boss.
  • Conductive PP has fluidity under high temperature and high pressure, and can be on the microstrip line of the multilayer circuit board The processing error of the conductor layer where the reference line of the microstrip line of the multilayer circuit board is located.
  • the conductive PP may be disposed in an annular shape and sleeved on the boss.
  • a contact surface between the top surface of the land and the conductor layer where the reference line of the microstrip line of the multilayer circuit board is located may be Bonding using a conductive paste of a type such as silver paste, for example, may be applied to a portion of the boss that is in contact with the conductor layer where the reference strip of the microstrip line of the multilayer circuit board is located before the PCB laminate is fabricated.
  • a layer of conductive glue Since the conductive paste has the effect of stretching deformation, it can compensate for the height error of the boss.
  • An embodiment of the present invention further provides a communication device, including: a circuit package module, the circuit package module includes a microwave millimeter wave circuit, and an embodiment of a microwave millimeter wave circuit, including: a multilayer circuit board, a thermal substrate, and a circuit a module, the multi-layer circuit board is provided with a window, the thermal substrate includes a pedestal, the multi-layer circuit board is attached to the pedestal, and the thermal substrate further includes from the pedestal to the a boss extending in the window of the multilayer circuit board; the circuit module is embedded in the window and located on the boss, and the circuit module is electrically connected to the outer conductor layer of the multilayer circuit board.
  • a communication device including: a circuit package module, the circuit package module includes a microwave millimeter wave circuit, and an embodiment of a microwave millimeter wave circuit, including: a multilayer circuit board, a thermal substrate, and a circuit a module, the multi-layer circuit board is provided with a window, the thermal substrate includes a pedestal, the multi-layer circuit board
  • the circuit package module is a module packaged with a circuit.
  • the circuit package module may be a chip package module, or a multi-chip module MCM (Multi-Chip Moudli), or a system-in-package module SIP (System In Package).
  • MCM Multi-Chip Moudli
  • SIP System In Package
  • the communication device can be a base station, or a router, or the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Transmitters (AREA)

Description

一种微波毫米波电路 技术领域 本发明涉及通信技术领域， 尤其涉及一种微波毫米波电路。 背景技术 如图 9所示， 现有的 MMW ( Micro and Millimeter Waves, 微波毫米波） 电路， 包括： 电路板（例如： PCB ), 所述电路板位于热衬底（具有导热性能 的金属块， 比如铜块或铝块等）上， 所述电路板开设有窗口， 棵芯片放置于 所述窗口内， 并且位于所述热衬底上。
所述棵芯片通过银浆等导电材料粘接在热衬底上， 使得棵芯片和热衬底 之间具有较好的导热和导电连接。 所述棵芯片通过键合线与所述电路板表面 的导体层电连接。 在这种结构下， 棵芯片、 键合线以及位于电路板上的微带 线的参考地都是热衬底。
在实现本发明过程中， 发明人发现现有技术中至少存在如下问题： 由于现有的 MMW电路釆用的电路板仅设置有一层导体， 因此无法实现 较大规模电路的设计。
发明内容
本发明的实施例提供了一种微波毫米波电路， 以实现较大规模电路的设 计。
本发明实施例提供如下方案：
一种微波毫米波电路， 包括： 多层电路板， 热衬底， 电路模块， 所述多 层电路板开设有窗口， 所述热衬底包括基座， 所述多层电路板贴置于所述基 座， 所述热衬底还包括自所述基座向所述多层电路板的窗口内延伸的凸台； 所述电路模块嵌入所述窗口内并且位于所述凸台上， 所述电路模块与所述多 层电路板的外层导体层电连接。
一种通信设备， 包括： 电路封装模块， 所述电路封装模块包括微波毫米 波电路， 所述微波毫米波电路包括： 多层电路板， 热衬底， 电路模块， 所述 多层电路板开设有窗口， 所述热衬底包括基座， 所述多层电路板贴置于所述 基座， 所述热衬底还包括自所述基座向所述多层电路板的窗口内延伸的凸台； 所述电路模块嵌入所述窗口内并且位于所述凸台上， 所述电路模块与所述多 层电路板的外层导体层电连接。
由上述本发明的实施例提供的技术方案可以看出， 通过在所述热衬底的 基座上面设置凸台的形式， 对所述电路模块进行支撑， 以使得所述多层电路 板中的导体层可以设置为二层， 甚至更多层， 更多层的导体层能够承载更多 的布线， 这样， 可以在该层数很多的电路板上实现较大规模电路的设计。 附图说明 为了更清楚地说明本发明实施例的技术方案， 下面将对实施例描述中所 需要使用的附图作简单地介绍， 显而易见地， 下面描述中的附图仅仅是本发 明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动性的 前提下， 还可以根据这些附图获得其他的附图。
图 1为本发明一种微波毫米波电路的实施例的示意图；
图 2为本发明另一种微波毫米波电路的实施例的示意图；
图 3为本发明另一种微波毫米波电路的实施例的示意图；
图 4为本发明另一种微波毫米波电路的实施例的示意图；
图 5为本发明另一种微波毫米波电路的实施例的示意图；
图 6为本发明另一种微波毫米波电路的实施例的示意图；
图 7为本发明另一种微波毫米波电路的实施例的示意图；
图 8为本发明另一种微波毫米波电路的实施例的示意图；
图 9为一种现有的微波毫米波电路的示意图。 具体实施方式
为便于对本发明实施例的理解， 下面将结合附图以几个具体实施例为例
如图 1所示， 本发明提供一种微波毫米波电路的实施例， 包括： 多层电路 板， 热衬底 3, 以及电路模块 2, 所述多层电路板开设有窗口， 所述热衬底 3包 括基座 32, 所述多层电路板贴置于所述基座 32, 所述热衬底 3还包括自所述基 座向所述多层电路板的窗口内延伸的凸台 31 ; 所述电路模块 2嵌入所述窗口内 并且位于所述凸台 3上， 所述电路模块 2与所述多层电路板的外层导体层 1 -1电 连接。
在本发明的上述实施例中，通过在所述热衬底 3的基座 32上面设置凸台 31 的形式， 对所述电路模块 2进行支撑， 以使得所述多层电路板中的导体层可以 设置为二层， 甚至更多层， 更多层的导体层能够承载更多的 PCB布线， 这样, 可以在该层数很多的电路板上实现较大规模电路的设计。
在图 1中， 是以具有两层导体层的多层电路板为例进行说明的， 图中 1 -a 为 多层电路板的绝缘层 a; 1 -2 为多层电路板内部的导体层； 1 -b 为多层电 路板的绝缘层 b; 8-1 为连接外层的导体层到内部的导体层的过孔； 8-3 为 连接所述多层电路板的外层导体层， 内层导体层， 以及所述热衬底的过孔。
在本发明的上述实施例中， 多层电路板与所述基座 32之间还可以设置其 他部件， 例如： 起垫高作用的部件等。 在本发明的上述实施例中， 所述热衬底可以包括具有导热和导电功能的 金属块， 例如铜块； 或者铝块； 或者铜块和铝块的结合体。 在本发明的上述实施例中， 所述电路模块可以包括设置有电路的模块， 例如： 所述电路模块可以包括芯片 （例如： 棵芯片） ， 或者集成电路等等。 在本发明的上述实施例中， 所述凸台的高度能够对所述电路模块起到支 撑作用就可以了， 例如， 所述凸台可以支撑所述电路模块， 使得所述电路模 块位于大致与所述多层电路板的外层导体层平齐的高度， 或者， 使得所述电 路模块略突出所述多层电路板的外层导体层之外， 或者， 使得所述电路模块 略低于所述多层电路板的外层导体层。
进一步地， 所述凸台的高度可以与所述多层电路板的微带线的参考地所 在的导体层平齐， 或者， 所述凸台高于所述多层电路板的微带线的参考地所 在的导体层， 或者所述凸台低于所述多层电路板的微带线的参考地所在的导 体层。 其中， 所述多层电路板的微带线可以位于所述多层电路板的外层导体 层， 那么， 所述微带线的参考层为自所述外层导体层往里数的第二层导体层。 另外， 如果自所述外层导体层往里数的第二层导体层被挖空的话， 所述参考 层可以位于自所述外层导体层往里数的第三层导体层， 依次类推。 如图 1所示， 在本发明的上述实施例中， 所述窗口的侧壁可以为台阶状， 形成台阶面 10 , 所述台阶面 104氐接在所述凸台的顶面上。 在本发明的上述实施例中， 所述电路模块与所述多层电路板的外层导体 层 1 -1电连接的方式可以为：
通过键合线电连接（如图 1中所示） ， 也可以通过连接器实现电连接。 在本发明的上述实施例中， 所述电路模块与所述热衬底电连接的方式可 以为：
所述电路模块可以通过银浆等导电材料进行粘接固定， 保证电路模块与 热衬底之间具有较好的电连接， 以及实现导热的功能。 如图 2及图 7所示， 在本发明的上述实施例中， 所述多层电路板的微带线 的参考地所在的导体层与所述凸台的侧面电连接， 或者， 所述多层电路板的 多:电路 的微带线的参考地所在的导体层， 与， 所述凸台的侧面或顶面电 连接的方式可以是： 接触后电连接； 或者， 通过在所述多层电路板的微带线 的参考地所在的导体层， 与， 所述凸台的侧面或顶面之间的接触面上涂覆导 电材料（例如： 银浆） 实现电连接。 接， 电路模块以及位^所述多 电路 的微带线的参考地都为所述热衬底。 在这样的情况下， 参考地是一个完全连续的结构， 减小了因为参考地不连续 引起的反射问题。 进一步地， 如图 2及图 4所示， 在本发明的上述实施例中， 所述凸台的高 度不低于所述多层电路板的微带线的参考地所在的导体层所位于的高度， 使 得所述凸台在侧面与所述多层电路板的微带线的参考地所在的导体层有接 触， 可以实现电连接。
如图 3所示， 在本发明的实施例中， 可以在所述凸台的顶面开设凹槽， 所 述电路模块 2可以嵌入所述凹槽内。
如图 5所示， 在本发明的上述实施例中， 可以在所述凸台的顶面的边缘设 置凹陷， 所述多层电路板的微带线的参考地所在的导体层抵接在所述凹陷上， 实现与所述凸台的电连接。
如图 6所示， 在本发明的上述实施例中， 可以在所述凸台的一侧设置导电 PP ( Pre-Preg , 半固化片） ， 所述导电 PP的边缘设置有凹槽， 所述多层电路 板的微带线的参考地所在的导体层抵接在所述 IHJ槽上， 实现与所述凸台的电 连接。 导电 PP在高温高压下具有流动性， 可以在所述多层电路板的微带线的 所述多层电路板的微带线的参考地所在的导体层的加工误差。
其中， 所述导电 PP可以设置为环状， 套设在所述凸台上。
如图 8所示， 在本发明的实施例中， 可以在所述凸台的顶面， 与， 所述多 层电路板的微带线的参考地所在的导体层之间的接触面上， 使用银浆等类型 的导电胶进行粘接， 例如， 可以在进行 PCB层压制作之前， 先在凸台与所述 多层电路板的微带线的参考地所在的导体层接触的部分涂覆一层导电胶。 由 于导电胶具有延展变形的作用， 可以弥补对凸台高度误差。
本发明的实施例还提供一种通信设备， 包括： 电路封装模块， 所述电路 封装模块包括微波毫米波电路， 微波毫米波电路的实施例， 包括： 多层电路 板， 热衬底， 以及电路模块， 所述多层电路板开设有窗口， 所述热衬底包括 基座， 所述多层电路板贴置于所述基座， 所述热衬底还包括自所述基座向所 述多层电路板的窗口内延伸的凸台； 所述电路模块嵌入所述窗口内并且位于 所述凸台上， 所述电路模块与所述多层电路板的外层导体层电连接。
所述电路封装模块为封装有电路的模块。
所述电路封装模块可以为芯片封装模块，或多芯片模块 MCM ( Multi-Chip Moudli,多芯片封装模块）， 或系统级封装模块 SIP ( System In Package，系统 级封装模块 ) 。
所述通信设备可以为基站， 或路由器等。
以上所述， 仅为本发明较佳的具体实施方式， 但本发明的保护范围并不 局限于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可 轻易想到的变化或替换， 都应涵盖在本发明的保护范围之内。 因此， 本发明 的保护范围应该以权利要求的保护范围为准。

Claims

权 利 要 求 书
1、 一种微波毫米波电路， 其特征在于， 包括： 多层电路板， 热衬底， 以及 电路模块， 所述多层电路板开设有窗口， 所述热衬底包括基座， 所述多层电路 板贴置于所述基座， 所述热衬底还包括自所述基座向所述多层电路板的窗口内 延伸的凸台； 所述电路模块嵌入所述窗口内并且位于所述凸台上， 所述电路模 块与所述多层电路板的外层导体层电连接。
2、 如权利要求 1所述的微波毫米波电路， 其特征在于， 所述电路模块包括 棵芯片或集成电路。
3、 如权利要求 1所述的微波毫米波电路， 其特征在于， 所述窗口的侧壁为 台阶状， 形成台阶面， 所述台阶面 4氐接在所述凸台的顶面上。
4、 如权利要求 1所述的微波毫米波电路， 其特征在于， 所述多层电路板的
' 5、""如权 ί要求 4所述的微波毫米波电路， 其特征在于,、所述凸台的高度不 低于所述多层电路板的微带线的参考地所在的导体层所位于的高度， 使得所述 凸台在侧面与所述多层电路板的微带线的参考地所在的导体层有接触， 实现电 连接。
6、 如权利要求 4所述的微波毫米波电路， 其特征在于， 在所述凸台的顶面 的边缘设置凹陷， 所述多层电路板的微带线的参考地所在的导体层抵接在所述 凹陷上。
7、 如权利要求 4所述的微波毫米波电路， 其特征在于， 在所述凸台的顶面， 电胶进行粘接。
8、 如权利要求 1所述的微波毫米波电路， 其特征在于， 在所述凸台的一侧 设置导电半固化片， 所述导电半固化片的边缘设置有凹槽， 所述多层电路板的 微带线的参考地所在的导体层抵接在所述凹槽上。
9、 一种通信设备， 其特征在于， 包括： 电路封装模块， 所述电路封装模块 包括微波毫米波电路， 所述微波毫米波电路包括： 多层电路板， 热衬底， 以及 电路模块， 所述多层电路板开设有窗口， 所述热衬底包括基座， 所述多层电路 板贴置于所述基座， 所述热衬底还包括自所述基座向所述多层电路板的窗口内 延伸的凸台； 所述电路模块嵌入所述窗口内并且位于所述凸台上， 所述电路模 块与所述多层电路板的外层导体层电连接。
10、 如权利要求 9所述的通信设备， 其特征在于， 所述电路封装模块为： 芯 片封装模块， 或多芯片封装模块， 或系统级封装模块。
PCT/CN2011/073724 2010-07-31 2011-05-06 一种微波毫米波电路 WO2012016460A1 (zh)

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