BR112012015573A2 - "circuito de ondas micrométricas e milimétricas e dispositivo de comunicação" - Google Patents

"circuito de ondas micrométricas e milimétricas e dispositivo de comunicação"

Info

Publication number
BR112012015573A2
BR112012015573A2 BR112012015573A BR112012015573A BR112012015573A2 BR 112012015573 A2 BR112012015573 A2 BR 112012015573A2 BR 112012015573 A BR112012015573 A BR 112012015573A BR 112012015573 A BR112012015573 A BR 112012015573A BR 112012015573 A2 BR112012015573 A2 BR 112012015573A2
Authority
BR
Brazil
Prior art keywords
circuit board
micrometric
wave circuit
communication device
base
Prior art date
Application number
BR112012015573A
Other languages
English (en)
Other versions
BR112012015573B1 (pt
Inventor
Luo Bing
Franco Marconi
Original Assignee
Huawei Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Tech Co Ltd filed Critical Huawei Tech Co Ltd
Publication of BR112012015573A2 publication Critical patent/BR112012015573A2/pt
Publication of BR112012015573B1 publication Critical patent/BR112012015573B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6605—High-frequency electrical connections
    • H01L2223/6627—Waveguides, e.g. microstrip line, strip line, coplanar line
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Transmitters (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

patente de invenção:"circuito de ondas milimétricas e micrométricas". as modalidades da presente invenção referem-se a um circuito de onda milimétricas e micrométricas, incluindo: um painel de circuitos de múltiplas camadas, um substrato térmico, e um módulo do circuito. o painel de circuitos de múltiplas camadas é aberto com uma janela. o substrato térmico inclui uma base. o painel de circuitos de múltiplas camadas é anexado à base. o substrato adicionalmente inclui uma parte de projeção que se estende da base à janela do painel de circuitos de múltiplas camadas. o módulo do circuito é recebido janela e colocado sobre a parte de projeção. o módulo do circuito é conectado eletricamente com uma camada de condução extrena do painel de circuitgos de múltiplas camadas.
BR112012015573-3A 2010-07-31 2011-05-06 circuito de ondas micrométricas e milimétricas e dispositivo de comunicação BR112012015573B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201010241422.X 2010-07-31
CN201010241422XA CN101937900B (zh) 2010-07-31 2010-07-31 一种微波毫米波电路
PCT/CN2011/073724 WO2012016460A1 (zh) 2010-07-31 2011-05-06 一种微波毫米波电路

Publications (2)

Publication Number Publication Date
BR112012015573A2 true BR112012015573A2 (pt) 2018-05-29
BR112012015573B1 BR112012015573B1 (pt) 2020-11-17

Family

ID=43391130

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012015573-3A BR112012015573B1 (pt) 2010-07-31 2011-05-06 circuito de ondas micrométricas e milimétricas e dispositivo de comunicação

Country Status (6)

Country Link
US (1) US8988891B2 (pt)
EP (1) EP2490255B1 (pt)
CN (1) CN101937900B (pt)
BR (1) BR112012015573B1 (pt)
RU (1) RU2500052C1 (pt)
WO (1) WO2012016460A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101937900B (zh) 2010-07-31 2013-01-09 华为技术有限公司 一种微波毫米波电路
US9337522B2 (en) * 2013-10-30 2016-05-10 Infineon Technologies Ag Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias
CN112714539A (zh) * 2019-10-24 2021-04-27 伟创力有限公司 电子组件及制造电子组件的方法
CN111491489B (zh) * 2020-04-10 2022-11-15 深圳国人无线通信有限公司 一种印制板组件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5012386A (en) * 1989-10-27 1991-04-30 Motorola, Inc. High performance overmolded electronic package
US5379187A (en) * 1993-03-25 1995-01-03 Vlsi Technology, Inc. Design for encapsulation of thermally enhanced integrated circuits
CN1072395C (zh) * 1997-04-18 2001-10-03 庄晴光 双重模式微波/毫米波集成电路封装
US6292374B1 (en) * 1998-05-29 2001-09-18 Lucent Technologies, Inc. Assembly having a back plate with inserts
CA2308943A1 (en) * 1999-05-20 2000-11-20 Robert John Sletten Surface mount millimeter wave ic package
US6683795B1 (en) * 2002-04-10 2004-01-27 Amkor Technology, Inc. Shield cap and semiconductor package including shield cap
US6625028B1 (en) * 2002-06-20 2003-09-23 Agilent Technologies, Inc. Heat sink apparatus that provides electrical isolation for integrally shielded circuit
US7018494B2 (en) * 2002-08-28 2006-03-28 Kyocera Corporation Method of producing a composite sheet and method of producing a laminate by using the composite sheet
US7514684B2 (en) * 2006-08-28 2009-04-07 L-3 Communications Corporation Surface mounted infrared image detector systems and associated methods
EP1923950A1 (en) * 2006-11-17 2008-05-21 Siemens S.p.A. SMT enabled microwave package with waveguide interface
RU2329568C1 (ru) * 2006-12-05 2008-07-20 Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") Корпус интегральной схемы
CN101415297B (zh) 2007-10-19 2010-07-07 华为技术有限公司 一种印制板组件及其加工方法
CN101937900B (zh) 2010-07-31 2013-01-09 华为技术有限公司 一种微波毫米波电路

Also Published As

Publication number Publication date
EP2490255A1 (en) 2012-08-22
EP2490255A4 (en) 2014-10-08
RU2500052C1 (ru) 2013-11-27
EP2490255B1 (en) 2016-04-06
US8988891B2 (en) 2015-03-24
WO2012016460A1 (zh) 2012-02-09
CN101937900B (zh) 2013-01-09
CN101937900A (zh) 2011-01-05
BR112012015573B1 (pt) 2020-11-17
US20120243185A1 (en) 2012-09-27

Similar Documents

Publication Publication Date Title
ATE532400T1 (de) Wärmeleitendes montageelement zur anbringung einer bestückten leiterplatte an einem kühlkörper
BR112016002093A2 (pt) ligação de componentes eletrônicos para condutores transparentes de nanofios dotados de um padrão
ATE549378T1 (de) Halogenfreie flammenhemmende harzzusammensetzung und prepreg, laminat und laminat für leiterplatte daraus
TW201130172A (en) Light emitting device
BR112013028710A2 (pt) diodo de emissão de luz revestido de silicone
BRPI0906179A2 (pt) "método para fabricar uma placa de circuito impresso, utilização de um método para fabricar uma placa de circuito impresso e laminado que contém padrões de circuito condutor ou parte de um laminado"
GB2475658B (en) Mainboard assembly including a package overlying a die directly attached to the mainboard
EP2086294A3 (en) Printed circuit board, backlight unit having the printed circuit board, and liquid crystal display device having said printed circuit board
BR112013028049A2 (pt) painel com um elemento de conexão elétrico
BR112012015573A2 (pt) "circuito de ondas micrométricas e milimétricas e dispositivo de comunicação"
WO2011031417A3 (en) Electronic device submounts with thermally conductive vias and light emitting devices including the same
ATE530443T1 (de) Grossflächiger schaltkreis mit applikationen
BR122020013215B8 (pt) Substrato tendo uma estrutura condutora
ATE453311T1 (de) Leiterplatte mit zusätzlichen funktionalen elementen sowie herstellverfahren und anwendung
BR112012025157A2 (pt) dissipadores de calor leves e lâmpadas de led empregando os mesmos
WO2009001850A1 (ja) 樹脂組成物及びその樹脂組成物を用いて得られる樹脂付銅箔
EP2546883A3 (en) Composite Semiconductor Device with a SOI Substrate Having an Integrated Diode
WO2008066834A3 (en) A light device having led illumination and an electronic circuit board
BR112014029731A2 (pt) vidro com um elemento de conexão elétrica
BR112013028717A2 (pt) condutor elétrico resistente à corrosão
AR071329A1 (es) Conector electrico con lazos de compensacion
WO2008143138A1 (ja) 配線基板、半導体パッケージ及び電子機器
EP2076104A3 (en) Flexible film and display device comprising the same
EA201592282A1 (ru) Сверхтонкий светодиодный световой прибор
US20160159037A1 (en) Heat dissipating sheet and heat dissipating structural body using same

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according art. 34 industrial property law
B06U Preliminary requirement: requests with searches performed by other patent offices: suspension of the patent application procedure
B09A Decision: intention to grant
B16A Patent or certificate of addition of invention granted

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 06/05/2011, OBSERVADAS AS CONDICOES LEGAIS.